Sheet) Graphite Sheet

Transcription

1 PGS(Pyrolytic Graphite Sheet) Graphite Sheet Panasonic Electronic Device Co.,Ltd Panasonic Electronic Device Hokkaido Co.,Ltd

2 PGS Graphite Sheet PGS (Pyrolytic Highly Oriented Graphite Sheet) is made of graphite with a structure that is close to a single crystal. This is achieved by highly-oriented polymer film sheet, a process which has never been implemented before. PGS is a heat sink sheet with high thermal conductivity and high flexibility. Characteristics Thickness Density Thermal conductivity Electrical conductivity Tensile strength a-b plane c axis Specifications / 600 to 800 / Approx. 15 / / 19.6 c axis a-b plane

3 The conduction of thermal Thermal spread Heat source (MPUs, PAs, graphics chips, etc.) Heat sink Heat source The decrease in Thermal resistance and Thermal spread Heat sink Package Heat sink Package Heat source Without PGS PGS inserted Surface temperature of the package

4 Thermal Transfer (1) [ Heater ON ] after 10 sec

5 Thermal Transfer (2) [ Heater OFF ] after 20 sec

6 Thermal Transfer (3) measuring method at after 30 minutes Aluminum Copper PGS Graphite Sheet

7 The conduction of thermal Thermal spread Heat source (MPUs, PAs, graphics chips, etc.) Heat sink Heat source The decrease in Thermal resistance and Thermal spread Heat sink Heat sink Package Package Heat source Without PGS PGS inserted Surface temperature of the package

8 Sample Measurement of thermal resistance at high pressure Transistor Heat Radiator Screw (M3) Thermocouple Measuring ; Transistor method The sample is placed between the transistor and the heat radiator. And voltage loaded to transistor under pressure. Then voltage loaded to transistor, with adding pressure by driving the screw. The thermal resistance (R) is calculated from temperature difference between transistor (temperature t 1 ) and radiator (temperature t 2 ). -Specimen size ;S= 3.00 cm 2 -Transistor ; MTO-3P(Shin Dengen) calculating equation ; R=( t 1 - t 2 ) x S / W (c cm 2 /W) -Radiator ; 100 x 40 x 22 mm -Wattage ; V x 20 A = 6.82 W -Measuring temperature ; thermocouples Thermal Interface PGS Graphite Sheet Low resistance PGS Silicon Grease Silicon sheet Ordinary Graphite Phase change

9 PGS Graphite Sheet application development Adhesive type Insulation type Multilayered type Type PGS only Double-sided adhesive tape attached type Double-sided adhesive tape attached type Acrylic adhesion attached type Polyester tape attached type Polyimide tape attached type Conductive adhesive tape attached type Silicon layered One-sided type Silicon layered Double-sided type Separating paper Separating paper Separating paper Structure Acrylic double-sided adhesive tape Acrylic double-sided adhesive tape Acrylic adhesive Polyester tape Polyimide tape Conductive adhesive tape Separating paper Silicon Silicon Features Usable up to 400 C Low thermal resistance Conductivity Insulation Strong adhesion Low thermal resistance Low thermal resistance Thin adhesive Insulation High mechanical strength High insulation High heat resistance High mechanical strength Conductivity Cushioning properties One-side insulation Cushioning properties Both-side insulation Thickness Thermal conductivity Withstand temperature Standard sample Part No.

10 Application examples

11 1. 1. Optical Pick-Up for DVD Heat Release from Laser Diode and Control IC DVD Drive (Reading&Writing) Graphite Sheet *** mm mm Each Graphite Sheet carries the heat generated in the laser unit to the metal chassis. Optical Pick -Up Attaching PGS Graphite Sheet Metal Chassis Laser Unit(contains Laser Diode and Control IC) Attaching PGS Graphite Sheet

12 Small Size and Light Weight Type Mobile Phone [ Non- graphite Sheet ] Cross Section The heat spot cool 8 or 9 C. The heat spot of the case can go down by Graphite sheet attached to the backside of the case. CASE (Heat Source) Circuit Board Case Isolator (Heat Source) Graphite Sheet PGS Surface Temperature under the normal working (while calling [ Non- graphite Sheet ] [ Graphite Sheet Attached ] The Temp. on the outside surface of the case Rise of 18.81deg Rise of 9.23deg

13 3. 3. Semiconductor manufacturing equipment Sputtering Cooling plate PGS Graphite Sheet Plasma Backing plate Target [ Target temperature rise ] Substrate Without PGS PGS inserted after 2.5hours 90 degrees Celsius or higher 65 to 70 degrees Celsius after 5.0hours 90 degrees Celsius or higher 70 to 75 degrees Celsius PGS can efficiently cool sputtering targets. It can be easily replaced and reused.