PRECISION TEMPERATURE MEASUREMENT

Size: px
Start display at page:

Download "PRECISION TEMPERATURE MEASUREMENT"

Transcription

1 PRECISION TEMPERATURE MEASUREMENT Herbert Chelner, CEO and Chief Scientist Dr. Robert A. Mueller, President and General Manager Abstract Micron Instruments is best known for its world-class semiconductor strain gages and pressure transducers. Micron also sells an extremely small and highly accurate semiconductor temperature sensing element, made from the same materials but doped differently than the strain gage. As such, the semiconductor temperature sensing element offers many of the compelling benefits as the semiconductor strain gage. The ST N ( is a Silicon Semiconductor "N"-doped bulk type Temperature Sensing element that develops a large resistive change with temperature. This thermo-resistive device is etched from a solid piece of doped material and has a minimum of molecular slippages and/or dislocations resulting in a highly reliable device. When used as recommended, a signal resolvable to F is possible. Semiconductor Strain and Temperature Gages Semiconductor strain gages were discovered during the transistor era and became commercially available early in the 1950's. These gages may be homogeneous or diffused or silicon on sapphire (SoS) deposited. Diffused gages have a variety of problems that limit useful life and affect performance. SoS deposited gages have a much lower gage factor and are less corrosion resistant. There are two main elements from which semiconductor gages are made. These elements are Geranium and Silicon and they can be P or N doped. At Micron Instruments, the P doped (Boron) Silicon gage is selected for the basic strain sensing element, and the N doped Silicon is used for the temperature sensing element. Silicon gages have been proven to be more stable, more sensitive, and more corrosion resistant than Geranium gages. Micron Instruments Miniature N-doped Silicon Semiconductor Temperature Sensing element

2 Micron s homogeneous silicon temperature sensing element, the ST N, is a thermo-resistive device that has an ultra-fast response time. Further, the ST N s silicon composition offers high reliability, corrosion resistance, and a high measurement output. This N doped crystal is only long, wide, and thick (0.9mm by 0.1mm by 0.01 mm). This small mass allows the sensing element to have a very fast response to temperature even in a poor thermal transmitter and heat capacity fluid like air. The ST N has a very large change in resistance of 20 ohms per F (36 ohms per C) about ambient. With a repeatable resistance versus temperature curve, represented by a second order polynomial, it can be used with a microprocessor to read temperature accurately, or used in a resistive bridge configuration, and produce a linear change with temperature of as much as 10 millivolts per degree F (18 millivolts per degree C) between -65 F and 185 F (-80 C and 75 C). Figure 1. The ST N has a gage factor of less than 10. When bonded to a material that has an expansion of ten micro inches per inch, the ST N will change the linear output by about 2.0%, or two degrees per hundred degrees. The output will still be repeatable and, if in a bridge circuit, will still be linear assuming the modulus of elasticity is relatively linear. 2

3 Figure 2. Precision Temperature Measurement Applications Like the thermistor, the ST N is a device that changes its electrical resistance with temperature. However, unlike typical thermistors, the silicon semiconductor temperature (SST) device is capable of large changes in resistance for a small change in temperature high output. In applications requiring very fast response time, the small mass of the ST N makes it an alternative, for some applications, to other Resistance Temperature Devices (RTDs). The ST N is an excellent choice for the manufacturing of heat loss flow meters, measuring hot spots in circuit board or the temperature of components during operation, as a feedback control for heaters or coolers such as air conditioners or temperature chambers and etc. 3

4 A recommended Wheatstone bridge completion circuit for the ST N is shown below in Figure 3. Figure 3. Wireless Measurement With an ambient resistance of 5,000 Ω, the ST N is an excellent choice for use in wireless systems, requiring minimum energy to activate data acquisition and communication for passive RFID transceivers. Gaging Services Applying a gage as small as the ST N can be challenging. If you have a precise temperature measurement application and would like assistance gaging and verifying some prototype articles, contact us to get started. Contact Us. Micron Instruments has already worked with innovative companies on optimal selection, placement, and processing of semiconductor strain gages and temperature devices for high frequency, high pressure, and high-temperature applications. If you d like to discuss 4

5 your application or design, please contact us for a free, confidential consultation either by (Sensors@MicronInstruments.com) or phone ( ). 5

ADVANCED INSTRUMENTATION FOR OPTIMIZING SEMICONDUCTOR STRAIN GAGE PERFORMANCE

ADVANCED INSTRUMENTATION FOR OPTIMIZING SEMICONDUCTOR STRAIN GAGE PERFORMANCE mailto:sensors@microninstruments.com http://www.microninstruments.com ADVANCED INSTRUMENTATION FOR OPTIMIZING SEMICONDUCTOR STRAIN GAGE PERFORMANCE Herbert Chelner, CEO and Chief Scientist Robert A. Mueller,

More information

BAR STRAIN GAGE DATA SEMICONDUCTOR BAR STRAIN GAGES DATA SHEET

BAR STRAIN GAGE DATA SEMICONDUCTOR BAR STRAIN GAGES DATA SHEET SEMICONDUCTOR BAR STRAIN GAGES DATA SHEET BAR STRAIN GAGE DATA BAR GAGE SCHEMATIC See Table for X, Y & Z dimensions X=Overall Length Y= Active Area Z= Width BAR SEMICONDUCTOR STRAIN GAGES Part Number Lead

More information

Basic advantages of the anisotropic etched, transverse gage pressure transducer. Technical paper 277

Basic advantages of the anisotropic etched, transverse gage pressure transducer. Technical paper 277 Basic advantages of the anisotropic etched, transverse gage pressure transducer Technical paper 277 Basic advantages of the anisotropic etched, transverse gage pressure transducer Introduction Endevco

More information

APPLICATION NOTE: AN-100. Selecting Strain Gages Silicon vs Metal Foil

APPLICATION NOTE: AN-100. Selecting Strain Gages Silicon vs Metal Foil APPLICATION NOTE: AN-100 Selecting Strain Gages Silicon vs Metal Foil (General Strain Measurement) Alex A. Ned, Senior Vice President Sensor Operations Joe VanDeWeert, Technical Director Miniature Transducers

More information

Passive TCF Compensation in High Q Silicon Micromechanical Resonators

Passive TCF Compensation in High Q Silicon Micromechanical Resonators Passive TCF Compensation in High Q Silicon Micromechanical Resonators A.K. Samarao, G. Casinovi and F. Ayazi IEEE International Conference on Micro Electro Mechanical Systems pp. 116 119, January 2010

More information

CMOS Technology. Flow varies with process types & company. Start with substrate selection. N-Well CMOS Twin-Well CMOS STI

CMOS Technology. Flow varies with process types & company. Start with substrate selection. N-Well CMOS Twin-Well CMOS STI CMOS Technology Flow varies with process types & company N-Well CMOS Twin-Well CMOS STI Start with substrate selection Type: n or p Doping level, resistivity Orientation, 100, or 101, etc Other parameters

More information

R Sensor resistance (Ω) ρ Specific resistivity of bulk Silicon (Ω cm) d Diameter of measuring point (cm)

R Sensor resistance (Ω) ρ Specific resistivity of bulk Silicon (Ω cm) d Diameter of measuring point (cm) 4 Silicon Temperature Sensors 4.1 Introduction The KTY temperature sensor developed by Infineon Technologies is based on the principle of the Spreading Resistance. The expression Spreading Resistance derives

More information

HOMEWORK 4 and 5. March 15, Homework is due on Monday March 30, 2009 in Class. Answer the following questions from the Course Textbook:

HOMEWORK 4 and 5. March 15, Homework is due on Monday March 30, 2009 in Class. Answer the following questions from the Course Textbook: HOMEWORK 4 and 5 March 15, 2009 Homework is due on Monday March 30, 2009 in Class. Chapter 7 Answer the following questions from the Course Textbook: 7.2, 7.3, 7.4, 7.5, 7.6*, 7.7, 7.9*, 7.10*, 7.16, 7.17*,

More information

Figure 16.31: Two-dimensional representations of (a) a quartz crystal and (b) a quartz glass.

Figure 16.31: Two-dimensional representations of (a) a quartz crystal and (b) a quartz glass. Figure 16.31: Two-dimensional representations of (a) a quartz crystal and (b) a quartz glass. Figure 16.28: The p orbitals (a) perpendicular to the plane of th carbon ring system in graphite can combine

More information

OMEGADYNE, INC. REVOLUTIONIZES SILICON PRESSURE TRANSDUCERS

OMEGADYNE, INC. REVOLUTIONIZES SILICON PRESSURE TRANSDUCERS OMEGADYNE, INC. REVOLUTIONIZES SILICON TRANSDUCERS A new line of Micro-Machined Silicon pressure transducers, the MM Series from Omegadyne, Inc., Sunbury, OH, promises to revolutionize a product category

More information

Thomas M. Adams Richard A. Layton. Introductory MEMS. Fabrication and Applications. Springer

Thomas M. Adams Richard A. Layton. Introductory MEMS. Fabrication and Applications. Springer Thomas M. Adams Richard A. Layton Introductory MEMS Fabrication and Applications Springer Contents Preface xiü Part I Fabrication Chapter 1: Introduction 3 1.1 What are MEMS? 3 1.2 Why MEMS? 4 1.2.1. Low

More information

Development of High Temperature Pressure Sensor for Oil and Gas Field Based on SOI

Development of High Temperature Pressure Sensor for Oil and Gas Field Based on SOI 3rd International Conference on Material, Mechanical and Manufacturing Engineering (IC3ME 2015) Development of High Temperature Pressure Sensor for Oil and Gas Field Based on SOI Yong Chen 1, a *, Xiaohong

More information

Weight Measurement Technology

Weight Measurement Technology Weight Measurement Technology 1 Definition of Terms Millivolt 0.001 volts: the unit of measure of output from sensors PSI Pounds per Square Inch: Unit of measurement of stress used in the application of

More information

A discussion of crystal growth, lithography, etching, doping, and device structures is presented in

A discussion of crystal growth, lithography, etching, doping, and device structures is presented in Chapter 5 PROCESSING OF DEVICES A discussion of crystal growth, lithography, etching, doping, and device structures is presented in the following overview gures. SEMICONDUCTOR DEVICE PROCESSING: AN OVERVIEW

More information

Automotive air or oil temperature Appliances cooking temperature. MOUNTING DIMENSIONS (for reference only)

Automotive air or oil temperature Appliances cooking temperature. MOUNTING DIMENSIONS (for reference only) TD Series FEATURES Interchangeable without sensor-tosensor recalibration Very small thermal mass for fast response Air or liquid temperature sensing Linear temperature sensitivity Proven thin film processing

More information

VLSI Technology. By: Ajay Kumar Gautam

VLSI Technology. By: Ajay Kumar Gautam By: Ajay Kumar Gautam Introduction to VLSI Technology, Crystal Growth, Oxidation, Epitaxial Process, Diffusion Process, Ion Implantation, Lithography, Etching, Metallization, VLSI Process Integration,

More information

MEHRAN UNIVERSITY OF ENGINEERING AND TECHNOLOGY, JAMSHORO Sensors & Actuator for Automatic Systems LAB # 01 RESISTIVE TEMPERATURE TRANSDUCERS

MEHRAN UNIVERSITY OF ENGINEERING AND TECHNOLOGY, JAMSHORO Sensors & Actuator for Automatic Systems LAB # 01 RESISTIVE TEMPERATURE TRANSDUCERS MEHRAN UNIVERSITY OF ENGINEERING AND TECHNOLOGY, JAMSHORO Sensors & Actuator for Automatic Systems LAB # 01 RESISTIVE TEMPERATURE TRANSDUCERS Roll No: Checked by: Date: Grade: 1. Objectives: To determine

More information

1 HRL Laboratories, LLC, Malibu, California, Baskin School of Engineering, University of California, Santa Cruz, CA *

1 HRL Laboratories, LLC, Malibu, California, Baskin School of Engineering, University of California, Santa Cruz, CA * High Cooling Power Density of SiGe/Si Superlattice Microcoolers Gehong Zeng, Xiaofeng Fan, Chris LaBounty, John E. Bowers, Edward Croke, James Christofferson, Daryoosh Vashaee, Yan Zhang, and Ali Shakouri

More information

Change in stoichiometry

Change in stoichiometry Measurement of Gas Sensor Performance Gas sensing materials: 1. Sputtered ZnO film (150 nm (Massachusetts Institute of Technology) 2. Sputtered SnO 2 film (60 nm) (Fraunhofer Institute of Physical Measurement

More information

Instructor: Dr. M. Razaghi. Silicon Oxidation

Instructor: Dr. M. Razaghi. Silicon Oxidation SILICON OXIDATION Silicon Oxidation Many different kinds of thin films are used to fabricate discrete devices and integrated circuits. Including: Thermal oxides Dielectric layers Polycrystalline silicon

More information

PROCESS FLOW AN INSIGHT INTO CMOS FABRICATION PROCESS

PROCESS FLOW AN INSIGHT INTO CMOS FABRICATION PROCESS Contents: VI Sem ECE 06EC63: Analog and Mixed Mode VLSI Design PROCESS FLOW AN INSIGHT INTO CMOS FABRICATION PROCESS 1. Introduction 2. CMOS Fabrication 3. Simplified View of Fabrication Process 3.1 Alternative

More information

EFFECT OF CRYSTALORIENTATIONIN OXIDATION PROCESS OF VLSI FABRICATION

EFFECT OF CRYSTALORIENTATIONIN OXIDATION PROCESS OF VLSI FABRICATION International Journal of Research in Engineering, Technology and Science, Volume VII, Special Issue, Feb 2017 www.ijrets.com, editor@ijrets.com, ISSN 2454-1915 EFFECT OF CRYSTALORIENTATIONIN OXIDATION

More information

Thermal Mass Flow Meters Help Reduce Energy Costs and Enhance Emissions Monitoring Systems

Thermal Mass Flow Meters Help Reduce Energy Costs and Enhance Emissions Monitoring Systems Thermal Mass Flow Meters Help Reduce Energy Costs and Enhance Emissions Monitoring Systems Fox Thermal Instruments, Inc. Rich Cada 399 Reservation Rd. Vice President of Sales & Marketing Marina, CA 93933

More information

Understanding Extrusion

Understanding Extrusion Chris Rauwendaal Understanding Extrusion 2nd Edition Sample Chapter 2: Instrumentation and Control ISBNs 978-1-56990-453-4 1-56990-453-7 HANSER Hanser Publishers, Munich Hanser Publications, Cincinnati

More information

Applications of High-Performance MEMS Pressure Sensors Based on Dissolved Wafer Process

Applications of High-Performance MEMS Pressure Sensors Based on Dissolved Wafer Process Applications of High-Performance MEMS Pressure Sensors Based on Dissolved Wafer Process Srinivas Tadigadapa and Sonbol Massoud-Ansari Integrated Sensing Systems (ISSYS) Inc., 387 Airport Industrial Drive,

More information

RTD CHARACTERISTICS TRAINER

RTD CHARACTERISTICS TRAINER RTD CHARACTERISTICS TRAINER (Model No : ITB - 06CE) User Manual Version 1.0 Technical Clarification /Suggestion : / Technical Support Division, Vi Microsystems Pvt. Ltd., Plot No :75,Electronics Estate,

More information

Residual Stress Distribution and Adhesive Interface Strength Analysis of Thermosetting Resin Molding

Residual Stress Distribution and Adhesive Interface Strength Analysis of Thermosetting Resin Molding Residual Stress Distribution and Adhesive Interface Strength Analysis of Thermosetting Resin Molding GANBE, Tatsuya ASAI, Tatsuhiko OKAMOTO, Kenji ABSTRACT The number of products sealed with a thermosetting

More information

TOWARD MEMS!Instructor: Riadh W. Y. Habash

TOWARD MEMS!Instructor: Riadh W. Y. Habash TOWARD MEMS!Instructor: Riadh W. Y. Habash Students are presented with aspects of general production and manufacturing of integrated circuit (IC) products to enable them to better liaise with and participate

More information

Chapter 3 Silicon Device Fabrication Technology

Chapter 3 Silicon Device Fabrication Technology Chapter 3 Silicon Device Fabrication Technology Over 10 15 transistors (or 100,000 for every person in the world) are manufactured every year. VLSI (Very Large Scale Integration) ULSI (Ultra Large Scale

More information

Fabrication of phosphorus doped polysilicon thinfilm strain gauges using a 50 microns silicon substrate thickness

Fabrication of phosphorus doped polysilicon thinfilm strain gauges using a 50 microns silicon substrate thickness Journal of Physics: Conference Series Fabrication of phosphorus doped polysilicon thinfilm strain gauges using a 50 microns silicon substrate thickness To cite this article: A L Siarkowski et al 2013 J.

More information

The Effect of Annealing on Resistivity Measurements of TiSi 2 and TiN Using the collinear Four Point Probe Technique

The Effect of Annealing on Resistivity Measurements of TiSi 2 and TiN Using the collinear Four Point Probe Technique The Effect of Annealing on Resistivity Measurements of TiSi 2 and TiN Using the collinear Four Point Probe Technique Eman Mousa Alhajji North Carolina State University Department of Materials Science and

More information

Making of a Chip Illustrations

Making of a Chip Illustrations Making of a Chip Illustrations 22nm 3D/Trigate Transistors Version April 2015 1 The illustrations on the following foils are low resolution images that visually support the explanations of the individual

More information

Thermal-Tab and Thermal-Ribbon Sensors

Thermal-Tab and Thermal-Ribbon Sensors Thermal-Tab and Thermal-Ribbon Sensors Install these compact sensors anywhere for accurate point sensing and fast response. All Thermal-Tab modules use a thin-film RTD element. All Thermal-Ribbon models

More information

CHAPTER 4 EXPERIMENTAL ANALYSIS FOR A 2 IN, SCHEDULE 10 PIPE

CHAPTER 4 EXPERIMENTAL ANALYSIS FOR A 2 IN, SCHEDULE 10 PIPE CHAPTER 4 EXPERIMENTAL ANALYSIS FOR A 2 IN, SCHEDULE 10 PIPE To validate the results of theoretical and numerical analysis, three cases of experimental analysis were conducted. Two types of pipe-bend test

More information

Adjustments To Aegis CHP Thermal Data at The Schwab House

Adjustments To Aegis CHP Thermal Data at The Schwab House Adjustments To Aegis CHP Thermal Data at The Schwab House On January 28, 2 the temperature sensors measuring CHP system glycol loop temperatures were replaced. The existing sensors (Mamac Systems TE-211Z

More information

Czochralski Crystal Growth

Czochralski Crystal Growth Czochralski Crystal Growth Crystal Pulling Crystal Ingots Shaping and Polishing 300 mm wafer 1 2 Advantage of larger diameter wafers Wafer area larger Chip area larger 3 4 Large-Diameter Wafer Handling

More information

Technical Specifications

Technical Specifications Technical Specifications Dimafix is a smart adhesive that varies its adherence properties according to the temperature, in the range usually used for 3D printing. Figure 1 shows how Dimafix increases adherence

More information

A diffused silicon pressure transducer with stress concentrated at transverse gages. Technical paper 267

A diffused silicon pressure transducer with stress concentrated at transverse gages. Technical paper 267 A diffused silicon pressure transducer with stress concentrated at transverse gages Technical paper 267 A diffused silicon pressure transducer with stress concentrated at transverse gages Many Meggitt

More information

Instrumentation & Data Acquisition Systems

Instrumentation & Data Acquisition Systems Instrumentation & Data Acquisition Systems Section 2 - Temperature Robert W. Harrison, PE Bob@TheHarrisonHouse.com Made in USA Measure Temperature of Material in a Vacuum Oven What sensors can be used?

More information

Thermistor vs RTD Temperature Accuracy

Thermistor vs RTD Temperature Accuracy Overview Thermistors and RTDs are devices used to measure temperature in modern Heating, Ventilating, Air Conditioning and Refrigeration (HVAC/R) systems. The electrical resistance of both devices is determined

More information

Advances in Printing nano Cu and Using Existing Cu Based Manufacturing Processes. Michael J. Carmody Chief Scientist, Intrinsiq Materials

Advances in Printing nano Cu and Using Existing Cu Based Manufacturing Processes. Michael J. Carmody Chief Scientist, Intrinsiq Materials Advances in Printing nano Cu and Using Existing Cu Based Manufacturing Processes Michael J. Carmody Chief Scientist, Intrinsiq Materials Why Use Copper? Lower Cost than Silver. Print on Numerous Substrates.

More information

4 RESISTANCE THERMOMETRY

4 RESISTANCE THERMOMETRY 4.1 4 RESISTANCE THERMOMETRY PRINCIPLES AND APPLICATIONS OF RESISTANCE THERMOMETERS AND THERMISTOR Resistance thermometers and Thermistor are temperature sensors, which changes there electrical resistance

More information

200mm Next Generation MEMS Technology update. Florent Ducrot

200mm Next Generation MEMS Technology update. Florent Ducrot 200mm Next Generation MEMS Technology update Florent Ducrot The Most Exciting Industries on Earth Semiconductor Display Solar 20,000,000x reduction in COST PER TRANSISTOR in 30 years 1 20x reduction in

More information

HX Performance Testing

HX Performance Testing Nuclear Division HX Performance Testing FSRUG January 26, 2016 1 February 3, 2016 2014 Curtiss-Wright Agenda Why Heat Exchanger Performance Testing (HXPT) is required GL 89-13 Overview Typical HXPT Methodology

More information

Why silicon? Silicon oxide

Why silicon? Silicon oxide Oxidation Layering. Oxidation layering produces a thin layer of silicon dioxide, or oxide, on the substrate by exposing the wafer to a mixture of highpurity oxygen or water at ca. 1000 C (1800 F). Why

More information

Gold Wire Bondable Chip Resistor for Hybrid Circuits and High Temperature Applications up to +240 C, Long-Term Stability of 0.05%

Gold Wire Bondable Chip Resistor for Hybrid Circuits and High Temperature Applications up to +240 C, Long-Term Stability of 0.05% Ultra High Precision Ultra Z1 High Foil Technology Precision Z1 Gold Foil Wire Technology Bondable Chip Resistor Gold Wire Bondable Chip Resistor for Hybrid Circuits and High Temperature Applications up

More information

FABRICATION OF GaAs DEVICES

FABRICATION OF GaAs DEVICES FABRICATION OF GaAs DEVICES by Albert G. Baca and Carol I. H. Ashby Sandia National Laboratories Albuquerque, NM, USA CONTENTS Acknowledgment Abbreviations xiii 1 Introduction to GaAs devices 1 1.1 Scope

More information

5. A round rod is subjected to an axial force of 10 kn. The diameter of the rod is 1 inch. The engineering stress is (a) MPa (b) 3.

5. A round rod is subjected to an axial force of 10 kn. The diameter of the rod is 1 inch. The engineering stress is (a) MPa (b) 3. The Avogadro's number = 6.02 10 23 1 lb = 4.45 N 1 nm = 10 Å = 10-9 m SE104 Structural Materials Sample Midterm Exam Multiple choice problems (2.5 points each) For each problem, choose one and only one

More information

MATTHEW A. WICKHAM 5th Year Microelectronic Engineering Student Rochester Institute of Technology ABSTRACT

MATTHEW A. WICKHAM 5th Year Microelectronic Engineering Student Rochester Institute of Technology ABSTRACT ION IMPLANTATION TO ADJUST NMOS THRESHOLD VOLTAGES MATTHEW A. WICKHAM 5th Year Microelectronic Engineering Student Rochester Institute of Technology INTRODUCTION ABSTRACT NMOS processes require a variety

More information

A novel measuring system for the metrological characterization of piezoresistive films at high temperature

A novel measuring system for the metrological characterization of piezoresistive films at high temperature P1.1 A novel measuring system for the metrological characterization of piezoresistive films at high temperature Damiano Crescini, and Marco Romani Dipartimento di Elettronica per l'automazione Facoltà

More information

EECS130 Integrated Circuit Devices

EECS130 Integrated Circuit Devices EECS130 Integrated Circuit Devices Professor Ali Javey 9/13/2007 Fabrication Technology Lecture 1 Silicon Device Fabrication Technology Over 10 15 transistors (or 100,000 for every person in the world)

More information

Radiation Tolerant Isolation Technology

Radiation Tolerant Isolation Technology Radiation Tolerant Isolation Technology Background The following contains a brief description of isolation technologies used for radiation hardened integrated circuits. The technologies mentioned are junction

More information

VAR. Vishay Foil Resistors FEATURES INTRODUCTION

VAR. Vishay Foil Resistors FEATURES INTRODUCTION Ultra High Precision, Z-Foil Audio Resistor Minimizes Noise and Distortion in the Signal Path with TCR of ± 0.05 ppm/ C, Tolerance to ± 0.005 % and High Linearity or Low Voltage Coefficient of Resistance

More information

High-sensitivity Silicon Resonant Strain Sensor

High-sensitivity Silicon Resonant Strain Sensor High-sensitivity Silicon Resonant Strain Sensor Takeru Samejima *1 Yoshitaka Suzuki *1 Nobuyuki Hamamatsu *1 Hiroshi Yokouchi *1 Takashi Yoshida *1 Silicon resonant sensors, which are used in the DPharp

More information

MONITORING OF CONCRETE CURING USING NANOTECHNOLOGY/MEMS DEVICES

MONITORING OF CONCRETE CURING USING NANOTECHNOLOGY/MEMS DEVICES MONITORING OF CONCRETE CURING USING NANOTECHNOLOGY/MEMS DEVICES Mohamed Saafi and Peter Romine Alabama A&M University USA Abstract Early age concrete properties and strength gain are mainly related to

More information

Research of Structure and Technology for the Micro- Machined Airflow Inclinometer

Research of Structure and Technology for the Micro- Machined Airflow Inclinometer Available online at www.sciencedirect.com Physics Procedia 22 (2011) 397 402 2011 International Conference on Physics Science and Technology (ICPST 2011) Research of Structure and Technology for the Micro-

More information

This Appendix discusses the main IC fabrication processes.

This Appendix discusses the main IC fabrication processes. IC Fabrication B B.1 Introduction This Appendix discusses the main IC fabrication processes. B.2 NMOS fabrication NMOS transistors are formed in a p-type substrate. The NMOS fabrication process requires

More information

Processing of Semiconducting Materials Prof. Pallab Banerjee Department of Material Science Indian Institute of Technology, Kharagpur

Processing of Semiconducting Materials Prof. Pallab Banerjee Department of Material Science Indian Institute of Technology, Kharagpur Processing of Semiconducting Materials Prof. Pallab Banerjee Department of Material Science Indian Institute of Technology, Kharagpur Lecture - 35 Oxidation I (Refer Slide Time: 00:24) Today s topic of

More information

Advances in Printing nano Cu and Using Existing Cu Based Manufacturing Processes. Michael J. Carmody Chief Scientist, Intrinsiq Materials

Advances in Printing nano Cu and Using Existing Cu Based Manufacturing Processes. Michael J. Carmody Chief Scientist, Intrinsiq Materials Advances in Printing nano Cu and Using Existing Cu Based Manufacturing Processes Michael J. Carmody Chief Scientist, Intrinsiq Materials Why Use Copper? Lower Cost than Silver. Print on Numerous Substrates.

More information

User s Guide OM240. Linear & Polynomial Conversion. Shop online at omega.com SM

User s Guide OM240. Linear & Polynomial Conversion. Shop online at omega.com SM User s Guide Shop online at omega.com SM e-mail: info@omega.com For latest product manuals: www.omegamanual.info OM240 Linear & Polynomial Conversion 01 TABLE OF CONTENTS U.S.A. Headquarters: omega.com

More information

VAR. Vishay Foil Resistors FEATURES INTRODUCTION

VAR. Vishay Foil Resistors FEATURES INTRODUCTION Ultra High Precision, Z-Foil Audio Resistor Minimizes Noise and Distortion in the Signal Path with TCR of ± 0.05 ppm/ C, Tolerance to ± 0.005 % and High Linearity or Low Voltage Coefficient of Resistance

More information

477 kcmil, 3M Brand Composite Conductor Mechanical Properties, Volume 1 Tensile and Stress-Strain Tests

477 kcmil, 3M Brand Composite Conductor Mechanical Properties, Volume 1 Tensile and Stress-Strain Tests 477 kcmil, 3M Brand Composite Conductor Mechanical Properties, Volume 1 Tensile and Stress-Strain Tests Minnesota Mining and Manufacturing (3M) Company Purchase Order 0000227040 NEETRAC Project Number:

More information

MAE 171A MECHANICAL ENGINEERING LABORATORY Materials Testing Laboratory Week 1 - LINEAR ELASTIC FRACTURE MECHANICS

MAE 171A MECHANICAL ENGINEERING LABORATORY Materials Testing Laboratory Week 1 - LINEAR ELASTIC FRACTURE MECHANICS MAE 171A MECHANICAL ENGINEERING LABORATORY Materials Testing Laboratory Week 1 - LINEAR ELASTIC FRACTURE MECHANICS Objective: To gain an appreciation and understanding of the basic principles of fracture

More information

CONNECTORS & CORDS: Laser Lays it On

CONNECTORS & CORDS: Laser Lays it On Page 1 of 7 CONNECTORS & CORDS: Laser Lays it On By Mary Lowe February 1, 2006 Simpler method improves potential for molded interconnect devices. Molded interconnect devices allow designers to create more

More information

International Journal of Advance Engineering and Research Development

International Journal of Advance Engineering and Research Development Scientific Journal of Impact Factor (SJIF): 4.72 International Journal of Advance Engineering and Research Development Volume 4, Issue 12, December -2017 e-issn (O): 2348-4470 p-issn (P): 2348-6406 Performance

More information

EE40 Lec 22. IC Fabrication Technology. Prof. Nathan Cheung 11/19/2009

EE40 Lec 22. IC Fabrication Technology. Prof. Nathan Cheung 11/19/2009 Suggested Reading EE40 Lec 22 IC Fabrication Technology Prof. Nathan Cheung 11/19/2009 300mm Fab Tour http://www-03.ibm.com/technology/manufacturing/technology_tour_300mm_foundry.html Overview of IC Technology

More information

Ultrasonic Micromachining in the fabrication of MEMS Micro-sensors

Ultrasonic Micromachining in the fabrication of MEMS Micro-sensors Ultrasonic Micromachining in the fabrication of MEMS Micro-sensors Jamil Akhtar Professor AcSIR New Delhi Chief Scientist & Head, CSIR-CEERI, Pilani, INDIA CEERI, Pilani A constituent laboratory of CSIR,

More information

Optimizing Strain Gage Excitation Levels

Optimizing Strain Gage Excitation Levels Micro-Measurements Strain ages and Instruments Tech Note TN-502 Optimizing Strain age Excitation Levels Introduction A common request in strain gage work is to obtain the recommended value of bridge excitation

More information

Ajay Kumar Gautam [VLSI TECHNOLOGY] VLSI Technology for 3RD Year ECE/EEE Uttarakhand Technical University

Ajay Kumar Gautam [VLSI TECHNOLOGY] VLSI Technology for 3RD Year ECE/EEE Uttarakhand Technical University 2014 Ajay Kumar Gautam [VLSI TECHNOLOGY] VLSI Technology for 3RD Year ECE/EEE Uttarakhand Technical University Page1 Syllabus UNIT 1 Introduction to VLSI Technology: Classification of ICs, Scale of integration,

More information

Ultra High Precision, Surface Mount Metal Strip Resistor with Increased Power to 5W (40A max), Resistance Values from 3 m, and TCR to ± 15 ppm/ C

Ultra High Precision, Surface Mount Metal Strip Resistor with Increased Power to 5W (40A max), Resistance Values from 3 m, and TCR to ± 15 ppm/ C Ultra High Precision, Surface Mount Metal Strip Resistor with ncreased Power to 5W (40A max), Resistance Values from 3 m, and TCR to ± 15 ppm/ C NEW NTRODUCTON The CSM3637P is a low value current sense

More information

Temperature Measuring Instrumentation. M H Joshipura Chemical Engineering Department IT, NU

Temperature Measuring Instrumentation. M H Joshipura Chemical Engineering Department IT, NU Temperature Measuring Instrumentation M H Joshipura Chemical Engineering Department IT, NU Why Measuring Temperature in Chemical Industry is Important? Temperature A measure of a substance s internal kinetic

More information

Micro-Electro-Mechanical Systems (MEMS) Fabrication. Special Process Modules for MEMS. Principle of Sensing and Actuation

Micro-Electro-Mechanical Systems (MEMS) Fabrication. Special Process Modules for MEMS. Principle of Sensing and Actuation Micro-Electro-Mechanical Systems (MEMS) Fabrication Fabrication Considerations Stress-Strain, Thin-film Stress, Stiction Special Process Modules for MEMS Bonding, Cavity Sealing, Deep RIE, Spatial forming

More information

Microelectronics. Integrated circuits. Introduction to the IC technology M.Rencz 11 September, Expected decrease in line width

Microelectronics. Integrated circuits. Introduction to the IC technology M.Rencz 11 September, Expected decrease in line width Microelectronics Introduction to the IC technology M.Rencz 11 September, 2002 9/16/02 1/37 Integrated circuits Development is controlled by the roadmaps. Self-fulfilling predictions for the tendencies

More information

Advanced Manufacturing Choices

Advanced Manufacturing Choices Advanced Manufacturing Choices Table of Content Mechanical Removing Techniques Ultrasonic Machining (USM) Sputtering and Focused Ion Beam Milling (FIB) Ultrasonic Machining In ultrasonic machining (USM),

More information

Characterisation of Fe-Ni amorphous thin films for possible magnetostrictive sensor applications

Characterisation of Fe-Ni amorphous thin films for possible magnetostrictive sensor applications Characterisation of Fe-Ni amorphous thin films for possible magnetostrictive sensor applications Contents 9.1 Introduction 9.2 Experiment 9.3 Results and Discussions 9.4 Conclusion 9.1 Introduction Magnetostrictive

More information

Contents. From ControlsWiki. Video lecture available for this section! Authors: (14 September 2006) Ardemis Boghossian, James Brown, Sara Zak

Contents. From ControlsWiki. Video lecture available for this section! Authors: (14 September 2006) Ardemis Boghossian, James Brown, Sara Zak Temperature Sensors From ControlsWiki Note: Video lecture available for this section! Authors: (14 September 2006) Ardemis Boghossian, James Brown, Sara Zak Stewards: (11 September 2007) Arthur L. Edge

More information

BONDING OF MULTIPLE WAFERS FOR HIGH THROUGHPUT LED PRODUCTION. S. Sood and A. Wong

BONDING OF MULTIPLE WAFERS FOR HIGH THROUGHPUT LED PRODUCTION. S. Sood and A. Wong 10.1149/1.2982882 The Electrochemical Society BONDING OF MULTIPLE WAFERS FOR HIGH THROUGHPUT LED PRODUCTION S. Sood and A. Wong Wafer Bonder Division, SUSS MicroTec Inc., 228 SUSS Drive, Waterbury Center,

More information

HERMETIC SEALING USING LOW IMPEDANCE PROJECTION WELDING. By T.E.Salzer

HERMETIC SEALING USING LOW IMPEDANCE PROJECTION WELDING. By T.E.Salzer HERMETIC SEALING USING LOW IMPEDANCE PROJECTION WELDING By T.E.Salzer Over many years, various studies, articles, and inventions have been published relating the dynamics of resistance/projection welding

More information

Isolation Technology. Dr. Lynn Fuller

Isolation Technology. Dr. Lynn Fuller ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING Isolation Technology Dr. Lynn Fuller Motorola Professor 82 Lomb Memorial Drive Rochester, NY 14623-5604 Tel (585) 475-2035 Fax (585) 475-5041

More information

Materials Science and Engineering: An Introduction

Materials Science and Engineering: An Introduction Materials Science and Engineering: An Introduction Callister, William D. ISBN-13: 9780470419977 Table of Contents List of Symbols. 1 Introduction. 1.1 Historical Perspective. 1.2 Materials Science and

More information

Doping and Oxidation

Doping and Oxidation Technische Universität Graz Institute of Solid State Physics Doping and Oxidation Franssila: Chapters 13,14, 15 Peter Hadley Technische Universität Graz Institute of Solid State Physics Doping Add donors

More information

Thermal and EMI Shielding Boost Design Reliability

Thermal and EMI Shielding Boost Design Reliability Thermal and EMI Shielding Boost Design Reliability 05/21/2007 Optimal shielding helps meet the challenges of cramming maximum functionality into minimal PCB space. Paul J. Stus Laird Technologies, St.

More information

Si DRIE APPLICATION In Corial 210IL

Si DRIE APPLICATION In Corial 210IL Si DRIE APPLICATION In Corial 210IL CORIAL 210IL ICP-RIE equipment for deep Si etching applications Enlarged functionality with capability to deep etch silicon, silicon carbide, glass, sapphire, and quartz

More information

Laird Engineered Thermal Systems Application Note. Thermoelectric Modules Accelerate PCR Thermal Cycling

Laird Engineered Thermal Systems Application Note. Thermoelectric Modules Accelerate PCR Thermal Cycling Laird Engineered Thermal Systems Application Note Thermoelectric Modules Accelerate PCR Thermal Cycling March 2017 Table of Contents Introduction...3 Polymerase Chain Reaction...3 Thermal Cycling...3 Standard

More information

ELEC 3908, Physical Electronics, Lecture 4. Basic Integrated Circuit Processing

ELEC 3908, Physical Electronics, Lecture 4. Basic Integrated Circuit Processing ELEC 3908, Physical Electronics, Lecture 4 Basic Integrated Circuit Processing Lecture Outline Details of the physical structure of devices will be very important in developing models for electrical behavior

More information

1 Thin-film applications to microelectronic technology

1 Thin-film applications to microelectronic technology 1 Thin-film applications to microelectronic technology 1.1 Introduction Layered thin-film structures are used in microelectronic, opto-electronic, flat panel display, and electronic packaging technologies.

More information

Meteorology 432. Thermometry Spring 2013

Meteorology 432. Thermometry Spring 2013 Meteorology 432 Thermometry Spring 2013 General Temperature impacts every day life. Errors of 2-3 ºC are not uncommon in many networks. Bank thermometers or Car thermometers. Errors of this magnitude are

More information

PDS Products PRODUCT DATA SHEET. BN-975 Wafers. Low Defect Boron Diffusion Systems. Features/Benefits BORON NITRIDE

PDS Products PRODUCT DATA SHEET. BN-975 Wafers. Low Defect Boron Diffusion Systems. Features/Benefits BORON NITRIDE Low Defect Boron Diffusion Systems The purpose of the hydrogen injection process is to increase die yield per wafer. This is accomplished because the effects associated with the hydrogen injection process.

More information

SiC crystal growth from vapor

SiC crystal growth from vapor SiC crystal growth from vapor Because SiC dissolves in Si and other metals can be grown from melt-solutions: Liquid phase epitaxy (LPE) Solubility of C in liquid Si is 0.029% at 1700oC high T process;

More information

Lecture 4. Oxidation (applies to Si and SiC only) Reading: Chapter 4

Lecture 4. Oxidation (applies to Si and SiC only) Reading: Chapter 4 Lecture 4 Oxidation (applies to Si and SiC only) Reading: Chapter 4 Introduction discussion: Oxidation: Si (and SiC) Only The ability to grow a high quality thermal oxide has propelled Si into the forefront

More information

Model LMM-H03 Mass Air Flow Sensor

Model LMM-H03 Mass Air Flow Sensor Hot Film Anemometer Component Highly reliable and long term stable Bi-directional airflow measurement Fast reaction time Manufactured according ISO TS16949 Can be adapted to various flow channel geometries

More information

MSC Solutions for Additive Manufacturing Simufact Additive

MSC Solutions for Additive Manufacturing Simufact Additive MSC Solutions for Additive Manufacturing Simufact Additive 15.01.2018 Simufact Product Portfolio Cold Forming Hot Forging Sheet Metal Forming Mechanical Joining Powder Bed Fusion Arc Welding Laser Beam

More information

Smart Sensing Technology for Infrastructure Monitoring

Smart Sensing Technology for Infrastructure Monitoring Smart Sensing Technology for Infrastructure Monitoring Supported by FHWA and USDOT Nizar Lajnef, Imen Zaabar, Shantanu Chakrabartty and Neeraj Buch Michigan State University Moore s Law and Structural

More information

MICRO HEAT EXCHANGER BY USING MEMS IMPINGING JETS

MICRO HEAT EXCHANGER BY USING MEMS IMPINGING JETS MICRO HEAT EXCHANGER BY USING MEMS IMPINGING JETS S. Wu, J. Mai*, Y.C. Tai, and C.M. Ho* Electrical Engineering 136-93, California Institute of Technology, Pasadena, CA 91125 * MAE Dept., UCLA, Los Angeles,

More information

BOROFLOAT 33 & Functional Coatings: A Union of Inspiration & Quality

BOROFLOAT 33 & Functional Coatings: A Union of Inspiration & Quality BOROFLOAT 33 & Functional Coatings: A Union of Inspiration & Quality The sum of its properties is what makes it unique. More than years ago, SCHOTT set up the first micro-float production line for what

More information

EE6303 LINEAR INTEGRATED CIRCUITS AND APPLICATIONS 2 MARK QUESTIONS WITH ANSWERS UNIT I IC FABRICATION

EE6303 LINEAR INTEGRATED CIRCUITS AND APPLICATIONS 2 MARK QUESTIONS WITH ANSWERS UNIT I IC FABRICATION SRI VENKATESWARA COLLEGE OF ENGINEERING AND TECHNOLOGY TIRUPACHUR DEPARTMENT OFELECTRICAL AND ELECTRONICS ENGINEERING EE6303 LINEAR INTEGRATED CIRCUITS AND APPLICATIONS 1. Define an Integrated circuit.

More information

SiGeC Cantilever Micro Cooler

SiGeC Cantilever Micro Cooler Mat. Res. Soc. Symp. Proc. Vol. 793 2004 Materials Research Society S11.3.1 SiGeC Cantilever Micro Cooler Gehong Zeng, Ali Shakouri 1 *, Edward Croke 2, Yan Zhang 1, James Christofferson 1 and John E.

More information

Semiconductor Technology

Semiconductor Technology Semiconductor Technology from A to Z Oxidation www.halbleiter.org Contents Contents List of Figures List of Tables II III 1 Oxidation 1 1.1 Overview..................................... 1 1.1.1 Application...............................

More information

Note Application of Screen Printing in Flexible Miniature Thermocouple Process Development

Note Application of Screen Printing in Flexible Miniature Thermocouple Process Development Int. J. Electrochem. Sci., 10 (2015) 3082-3087 Note Application of Screen Printing in Flexible Miniature Thermocouple Process Development International Journal of ELECTROCHEMICAL SCIENCE www.electrochemsci.org

More information

Manufacturing Technologies for MEMS and SMART SENSORS

Manufacturing Technologies for MEMS and SMART SENSORS 4 Manufacturing Technologies for MEMS and SMART SENSORS Dr. H. K. Verma Distinguished Professor (EEE) Sharda University, Greater Noida (Formerly: Deputy Director and Professor of Instrumentation Indian

More information