Transcription

1 軟性印刷電路板的應用及發展趨勢 演講人 : 張漢茂 hunschang@microcosm.com.tw 律勝科技股份有限公司 (MICROCOSM TECHNOLOGY CO.,LTD)

2 Contents.Introduction of FPC (I). Material (II). Process (III). Application.Introduction of Polyimide (I). Sputtering/Plating process (II). Casting process (III). Lamination process.future Development

3 Introduction of FPC Introduction of Polyimide

4 Introduction of FPC Material FCCL (3-layer) Coverlayer FCCL (2-layer) PI film Adhesive Copper foil

5 Introduction of FPC Process Laminating Stripping UV Exposure Etching Developing

6 Introduction of FPC Structure

7 Introduction of FPC Quick Press

8 Introduction of FPC Application

9 Introduction of FPC Application 應用於照相頭 應用於面板 應用於彎曲部線路板 應用於記憶卡 應用於按鍵

10 Introduction of FPC Application

11 Introduction of FPC Application

12 Sputtering/Plating process Process introduction UW RW UW RF treatment Sputter Cathode RW Copper plating Sputtering seed layer

13 Sputtering/Plating process Pretreatment of polyimide film

14 Sputtering/Plating process Characteristic of polyimide film

15 Sputtering/Plating process Structure of sputtering 2-layer Plating Cu 2~8um Sputter Seed Layer 0.1~0.4um Sputter tie layer 5nm~50nm PI 35um (25um) Carrier Film

16 Sputtering/Plating process Roughness of Microflex

17 Sputtering/Plating process Initial peel strength of substrates with tiecoat metal Tiecoat(Thickness) Peeling Strength(lb/in) 5µm copper 12µm copper Microflex(100Å) Cr(150Å) NiCr(100Å) NiCr(200Å) Monel(100Å) None

18 Sputtering/Plating process Peel strength after thermal aging in air at 150 Peel(lb/in) Time(hours) Microflex(100Å) NiCr(200Å) Cr(150Å) NiCr(100Å) Monel(100Å) None

19 Sputtering 2-layer(PSTC1081) of Microcosm Peel strength IPC-TM kgf/cm Sample 1 Sample 2 Sample 3 Sample 4 Sample 5 AVE 原始拉力

20 Sputtering 2-layer(PSTC1081) of Microcosm Surface resistance IPC TM Sample E+16Ω Sample E+15Ω Sample E+16Ω Sample E+16Ω Sample E+15Ω Sample E+15Ω Sample E+15Ω Sample E+16Ω

21 Sputtering 2-layer(PSTC1081) of Microcosm Dimensional stability IPC-FC-241/2 CLASS1 Method B A B AB AB + 2 C D CD CD 100 % Sample 1 Sample 2 Sample 3 Sample 4 Sample 5 Sample 6 AVE TD (%) MD (%)

22 Sputtering 2-layer(PSTC1081) of Microcosm IPC Test

23 Sputtering 2-layer(PSTC1081) of Microcosm MIT Test

24 Sputtering 2-layer(PSTC1081) of Microcosm Peel Strength Reliability (kgf/cm) Test Item PCT: pressure cooker test TCT: thermal cycle test HTA: High temperature aging PCT TCT HTA Condition %RH. 1 & 7atm.100Hr -40 & 85. Steady Temperature. 50cycle Original Value (kgf/cm) Reliability (kgf/cm) Hr

25 Sputtering 2-layer(PSTC1081) of Microcosm Ionmigration Test Pitch:30um > 1010 hrs( 全部測試時間 :1010 小時 ) 10 8 Log(R) Microcosm T-Comany 30um Pitch Time(Hr) Testing condition:85 / 85%RH / 60V

26 Sputtering 2-layer(PSTC1081) of Microcosm Smaller pitch line without side etching 30um Pitch Circuit: 45um Pitch Circuit:

27 Casting process Varnish preparation Dianhydride Diamine Polyamic acid varnish Stirring reaction

28 Casting process Casting & Drying Polyamic acid varnish Drying heater Cu Foil UW RW

29 Casting process Thermal imidization Temp. Polyimide Time Polyamic acid varnish -H 2 O

30 Casting process Monomer Dianhydride / Diamine = 1 PMDA + BPDA > 60wt% dianhydride PDA > 50wt% diamine

31 Casting process Roughness of copper foil

32 Introduction of Copper foil Treatment of surface

33 Introduction of Copper foil Roughness of Matte side

34 Casting process Crystal orientation of copper foil

35 Casting process Crystal orientation of copper foil

36 Casting process Compare with ED and RA 資料來源 : 三井金屬

37 Casting 2-layer of Microcosm Hinge of clamshell mobile phone Multi-Flex with 5 layers Category Item no. FCCL Structure Coverlay Cycles 2-layer PSTI 0912 ½ oz RA Cu Single sided ½ mil PI ½ mil PI 15 um AD 150~160 K 3-layer (standard RA) PSBR1209 ½ oz RA Cu Single sided ½ mil PI ½ mil PI 15um AD 50~60K

38 Lamination process Compare PI & TPI 差異性種類 高分子結構 加工性 單體價格 耐熱性 PI O O C N C O C N C No Cheap excellent O O n TPI O O O C N C CF 3 C CF 3 O C N C Yes Expensive fair O O n PI (Polyimide): High Tg and Tm>Td, hard to work. TPI (Thermoplastic Polyimide): Td>Tm (300~380 ),work between Td and Tm.

39 Lamination process Process introduction-film type Heat Pressure Roll Cu Pre-heating UW TPI Annealing Cu W-helical Roller RW

40 Lamination process Process introduction-casting Type PAA 1 st layer PAA coating Drying heater UW Cu Foil RW TPAA 2 nd layer TPAA coating Drying heater UW Cu Foil RW

41 材料種類Future Development PSPI 自身感光性環氧系 自身感光性壓克力系 非感光性聚亞醯胺系 感光性聚亞醯胺系 Du-Pont PC1000 Tg= 45 Resolution: 50 μm 材料耐熱性 Nippon Steel SFP Tg= 330 Resolution: 100 μm Nippon polytech/roger Tg= 90 Resolution: 50 μm Mitsui OSR-100 Tg= 200 Resolution: 100 μm

42 Future Development Heat Conduction Dielectric Layer

43 ~ Thank you. ~ Microcosm Technology Co., Ltd.