Low CTE / High Tg FR-4 with High Heat Resistance

Transcription

1 Low CTE / High Tg FR-4 with High Heat Resistance Laminate: EM-827 Prepreg: EM-827B 1

2 Features Tg(DSC) > 170 Z direction CTE < 3.0% (50~260 ) High thermal degradation temperature: Td > 340 Excellent thermal stability: T 300 > 15 min. Moisture absorption rate < 0.5% (by PCT treated 5 Hr.) 2

3 Z CTE Performance 1.6 mm unclad 3

4 Thermal Degradation by TGA mm unclad EM EM Weight (%) Temperature () EM-827 increased thermal degradation resistance 4

5 T 288 by TMA 1.6 mm unclad Material EM-220 Dicy Tg 170 EM-827 Time (min.)

6 T 300 by TMA T 300 : 17min. 6

7 Comparison of Water Absorption 0.80 Regular FR-4 (EM-220) 1.6 mm unclad Moisture Absorption (%) Tg 150 Dicy Cured (EM-220 (5)) Tg 170 Dicy Cured (N Company) Tg 150 PN Cured (EM-320(5)) Tg 170 PN Cured (EM-320) Tg 150 PN Cured with Filler (EM-825) PCT Treated Time (Hr.) Tg 170 PN Cured with Filler (EM-827) 7

8 Typical Laminate Properties (1) Items Tg (DSC ) CTE ( Z-axis, TMA ) Decomposition ( TGA ) Solder Dip Solder dip ( clad ) PCT Water absorption Water absorption Unit ppm / ppm / % Cycle min Hrs % % Condition IPC-TM C Tg Tg 50 ~ W.L 288 / 10 sec D-288 DEL dip 288 / 20 PCT 2 atm/2hrs E-1/105 + D-24/23 EM > ~ mm unclad EM-320 EM > 10 > ~ ~

9 Typical Laminate Properties (2) 1.6mm unclad Items Unit Condition EM-220 EM-320 EM-827 Peel strength ( Cu 1 oz ) Lb / in As received 11 ~ 13 8 ~ 10 8 ~ 10 Dielectric constant ( HP-4291 ) 1 MHz 1 GHz C-40/23/ Dissipation factor ( HP-4291 ) 1 MHz 1 GHz C-40/23/ Volume resistivity M-cm C-96/35/90 > > > Surface resistivity M C-96/35/90 > > >

10 Recommend Press Cycle for EM-827 Kiss pressure: 3.5 ~ 7 kgf / cm 2 Heat rate: 1.8 ~ 2.2 / min Full pressure : 25 ~ 32 kgf / cm 2 Apply full pressure at: 80 ~ 100 Curing condition: >190 / 60 min (Minimum peak temperature with curing condition: 210) *The heating rate higher will be better for peeling strength and inner layer pattern filling, while the lower will be better for press flow. Please contact us for setting suitable press cycle if necessary. 10

11 Recommend PCB Process for EM-827 Process Condition Surface Clean Std. Practice A.O.I. Std. Practice Oxide treatment Std. Black or Brown Oxide Bake min Stress relief ( high layers count ) Bake ~ 3 hrs Hole diameter ( mm ) Spindle Speed ( Krpm ) In Feed ( inch / min ) Chip Load ( mil / rev ) Number of Hits Sweller ( Uyemura ) Vertical 80 for 8 min. KMnO 4 ( Uyemura ) Vertical 80 for 15 min. 11

12 Additional Suggestion during Processing For improving material moisture absorbed in processing, post-baked treated would be suggested as several processing: 1. Finished board before packing 1-1 HASL: 150 degree C for 4 hours 1-2 ENIG finished: 120 degree C for 4 hours 1-3 Before OSP: 150 degree C for 4 hours 2. Solder mask re-work or WIP over 2 weeks 150 degree C for 4 hours 12

13 Test Results of Drilling -Construction- - Test result- 0.5 oz 7628* /1 (7628*5) 7628*1 0.5 oz Layer count 4 Thickness 1.6 mm Drill diameter Ø 0.3 mm Roughness < 1.0 mil 13

14 Test Results of Desmear Before After No smear on glass fiber 1.6 mm unclad Weight loss control at 0.05 ~ 0.20 mg/cm 2 14

15 IR-Reflow Test for High Layer Count Construction of Specimen 18µm Copper 7628 Core t 0.1 1/ Core t 0.1 1/ Core t 0.1 1/ Core t 0.1 1/ Core t 0.1 1/ µm Copper Layer count 12 Thickness 1.9 mm Drill diameter Ø 0.3 mm No Delamination 15

16 Lead-Free IR-Reflow Profile 16

17 Lead-Free IR-Reflow Test Result / - 0 Peak Temperature Profile Laminate IR Hole to Hole ( mm ) Delamination ( N = 30 ) % EM % 0 % % % EM % 0 % % 17

18 Test Result 18

19 PCB Field Evaluation 8 layers, 1.0mm multilayer 19

20 PCB Field Evaluation Evaluation Test Item x 10s x 3 cycles 2. Lead- free of IR Reflow (250 peak) x 1 cycle 3. Lead- free of IR Reflow (250 peak) x 3 cycle 20

21 Test Result Test Item Thermal Stress Lead-free IR Reflow Lead-free IR Reflow Condition 288/ 10s/ 3 times 255 Peak/ 1 cycle 255 Peak/ 3 cycle Test Result No Delam/ No crack No Delam/ No crack 1.0mm BGA Hole Pitch Pass 0.8mm BGA Hole Pitch Crack 0.8mm BGA Hole Pitch Crack No Delam/ No Crack after 3 cycle IR Reflow with 1.0 BGA Hole Pitch 21

22 Applications Tg ( DSC ) Low CTE LCD Automobile Lead Free Items Back panel High thermal resistance Normal FR EM Excellent: ; Acceptable: ; poor: 22

23 Product Line-up Laminate ~ ( Sheet or Panel form ) CCL Sheet 36 x x 48 Size 42 x 48 Copper Foil 12 to 175 um HTE 12 to 70 um RSTF Prepreg Roll or Panel form Glass Type etc. 23