E u R O p A. C L I p p E R. Radiation Effects in Components and Systems Bremen, Germany September 19, 2016
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1 E u R O p A C L I p p E R.! M I S S I O N!! C O N C E P T!! R E V I E W!.! Radiation Effects in Components and Systems Bremen, Germany September 19, California Institute of Technology. Government sponsorship acknowledged Reference herein to any specific commercial product, process, or service by trade name, trademark, manufacturer, or otherwise, does not constitute or imply its endorsement by the United States Government or the Jet Propulsion Laboratory, California Institute of Technology. Pre- Decisional Information For Planning and Discussion Purposes Only
2 Overview Mission Comparison Electronic Parts Approach EEE Parts Radiation Testing Results Materials Approach Materials Radiation Program Summary 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 2
3 Mission Comparison Planned Issue Mission Overview Total Ionizing Dose Radiation 300 Environment KRads 50 KRadsSummary 150 krad System Hardening 5E11 eq. Approach 1E11 Displacement Damage Electronic Neutrons Parts Approach Neutrons EEE Parts 99% Radiation Testing Results Acceptance Criteria Materials Confidence Approach Selected Mostly Materials new Radiation Performance Electronics Approach Summary Europa Clipper 1MeV Probability 0.9 Rad Hard design or upgrade Juno Galileo Comments 1MeV 99% Probability 0.9 Confidence Heritage Design with shielding 1E11 1MeV Neutrons 3 sigma Mostly new Rad Hard design or upgrade In vault (Including RDF) In vault (Including RDF) 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 3
4 Clipper Design Approach Most electronics inside Vault (150krad)) Subsystems and Instruments Majority new design to 300 krad Heritage modified to 300 krad Some heritage shielded to 100 krad or below Design for environment minimize shielding 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 4
5 EEE Parts Radiation Hardness Assurance Strategy Maximize use radiation hardened EEE parts Preferred Parts Selection List (PPSL) Vendor guarantied and approved to 300 krad Characterized and functional/design-worthy to 300 krad or more Development of Rad Hard parts is avoided Worst Case Data Sheets Common Buy for PPSL Parts Coordinated Characterization and Lot Test Activities Test methods addressing environment 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 5
6 EEE Parts Plan Requirements Radiation Requirements Refer to JPL DocID D Effect TID, ELDRS Displacement Damage SEL Requirement Refer to Environmental Requirements Document (ERD) for shielded environment. Parametric 90% confidence w/ 99% probability of success at part level or greater post irradiation specification limits Refer to ERD for shielded environment. Parametric 90% confidence w/ 99% probability of success at part level or greater post irradiation specification limits Linear Energy Transfer (LET)th >75 MeV-cm²/mg SEGR/SEB SEU LETth >37 fully-off voltages or by application analysis LETth >75 MeV-cm²/mg or <10-10 per bit per day or by application analysis LETth >75 MeV-cm²/mg or <10 SEFI Application Analysis determined by Single Event -3 events/yr or by application Effects Analysis (SEEA) analysis SET LETth >75 MeV-cm²/mg or by application analysis 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 6
7 Radiation Lot Acceptance Testing (RLAT) Radiation Lot Acceptance Testing (Dose and Displacement) Parametric acceptance 99% probability / 0.90 confidence level (99/90) Sample size is 5 per wafer lot per test condition Minimum for characterization or investigation is case-by-case Effects of displacement damage and dose are additive Slow BJTs, Photonics, and low-doped devices may require lot test Testing for DDD and TID will be done on the same lot Reliability Engineering concurrence on acceptance criteria Test readiness reviews (TRR) Use of annealing for CMOS - Dose rate 100 mrad(si)/s 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 7
8 Radiation Requirements (Dose and Displacement Damage) Enhanced Low Dose Rate Sensitivity (ELDRS) Recommend both high and low dose rate irradiation Both biased and unbiased condition tested if worst case is unknown MIL-STD-883, Method 1019 Condition B, C, or D as needed Low dose rate 10 mrad/s to 100 krad 45 mrad/s to 300 krad Displacement Damage (DD) 5E11 (1MeV eq. Neutrons, 2X) inside vault Dominated by electrons Parts for test will be determined case by case Electron-proton equivalency tests have been performed 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 8
9 Preferred Parts Selection List (PPSL) PPSL Selected from commonly used devices PPSL Characterization complete Verified 300 krad requirement May require RLAT of flight lot Active devices only Candidate List (PPCL) Likely capable of meeting radiation requirement Candidate List Require characterization ELDRS required in many cases Presently > 375 devices on each list 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 9
10 Radiation Effects Evaluations EEE Parts Volatile Memory Non-Volatile Memory Power Subsystem devices Avionics devices Optocouplers ELDRS Testing Field Programmable Gate Arrays 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 10
11 Volatile Memory - Significant Findings SDRAM DDR2 DDR3 All tested devices limited to 100 krad or less 100 krad guaranteed can be < 100 krad Worst case condition - refresh on Existing data validate capability to 200 to 300 krad RLAT required Test results support TID capability to 200 to 300 RLAT required All devices are prone to SEFI/SEU events and require mitigation, though none latch (no SEL) 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 11
12 Volatile Memory Radiation Test Status Part# DDR3 Supplier Size (GB) Width TID (krad) Comments MT41J128M8JP Micron 1 x8 >200 Functional >300 krad with stuck bits K4B1G0446G Samsung 1 x4 >250 DDR2 IMXS108D2DEBG IS43DR81280 SDRAM Intelligent Memory 3DPlus- ISSI TBD x8 TBD Functional >300 krad with stuck bits 1 x8 >200 RLAT to > 300 krad Planned IS42S86400B ISSI 0.5 x with stuck bits, refresh on is worst case 3DPlus- EDS5104ABTA ISSI 0.5 x4 50 Used on Juno UT8SDMQ64M48 Aeroflex 3 x Actual performance in refresh mode may be less SDRAM limited to < 100 krad DDR2/3 ~ 300 krad 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 12
13 Non-Volatile Memory Spacecraft requires > 1 Tb memory storage Driven by science data requirements Need to hold data until opportunity to transmit No radiation hardened devices large enough Commercial devices were evaluated A single device was found suitable Samsung 8Gb SLC Version M NAND flash > 500 flight devices in X8 modules Significant system level mitigation required Error Detection/Correction, Voting, Erase and Rewrite 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 13
14 Non-Volatile Memory Device TID/DD (krad) Micron 4Gb <100 Micron 32Gb 55 Micron 32Gb enand 10 Samsung 8Gb Rev A Samsung 8Gb Rev M Samsung 8Gb Rev D Samsung 8Gb Rev E Samsung V-NAND 128 Gb >200 >200 Comments Not recommended for Europa 3/8 DUT non-functional after 100krad Not recommended for Europa 3/5 DUTs fail to erase Not recommended for Europa Non functional at 50 krad 1% BER at 40krad Erase still possible after 600krad Not an ECM candidate due to SEE 5E-5 50krad, 10% BER at 200krad, write-able. Tested to 300 krad with Erase/Rewrite in 25 krad steps >200 Functional test only <100 ~ 20 krad (~200 krads array) Not recommended for Europa Unrecoverable page errors at 100krad Control circuitry limiting factor 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 14
15 Optocoupler Displacement Damage Tests Device Equivalent Neutron (1 MeV) Fluence Current Transfer Ratio Isolink OLH249 <5E11 CTR<20% Isocom IS49 >2E12 CTR ~60% Isocom CSM141A >2E12 CTR ~70% Isolink OLS049 <5E11 CTR<20% Avago HCPL-5700 >2E12 CTR ~80% Micropac <2E12 CTR<40% Micropac <2E12 CTR~60% Micropac >2E12 CTR ~75% Several acceptable to Europa Displacement Damage Levels Pre- Decisional Information For Planning and Discussion Purposes Only
16 Power System Radiation Test Part# Supplier Function TID (krad) SEE Comments MSK5063RH MSK Buck Regulator 300 Destructive SEE at Vin > rad(si)/s MSK5055RH MSK Buck Regulator 300 No rad(si)/s MSK196RH MSK Current Sense Amplifier In work Not Planned Alternate parts being reviewed MSK6000RH MSK Current limiting switch: Dual High Side Driver 300 Not rad(si)/s MSK5800RH MSK Linear Regulator In planning Not Planned Alternate parts being reviewed DAC121S101QM Texas Instr. 12- bit DAC Converter 300 Pending rad(si)/s LTC2977 LTC PMBus Controller <20 krad(si) Selected RH power devices can meet 300 krad 2/25/15 Pre- Decisional Information For Planning and Discussion Purposes Only 16
17 Avionics Device Testing Part Desc Manufacturer TID (krad) Isolator IL611 Isolator NVE 300 >75 Isolator IL715T Isolator NVE 300 >75 SELth Comments AD9283S A/D ADI N/A Destruct Si8642EA Isolator SilLab N/A Destruct SI8600AB Isolator SilLab N/A Destruct UT8ER512K32 SRAM Aeroflex 300 > 100 UT8R4M39 SRAM Aeroflex 300 > 110 UT200 Spacewire Aeroflex >400 > 109 SRAM/Spacewire were 100 krad Vendor rated - Tested at 0.1 R/s Tested at 0.1 R/s Tested at 0.1 R/s 09/19/16 Functional to Pre- Decisional 300 krad Information when For Planning tested and Discussion Purposes at 0.1 Only R/s - Annealing 17
18 FPGA Radiation Tests and Evaluation Device Manufacturer TID/DD (krad) SEL (MeV-cm²/mg) Comments Virtex V4QV Xilinx >300 > 75 Considered obsolete Virtex V5 Xilinx >500 >75 Non-SEE hardened Virtex V5QV Xilinx >1000 > 75 Preferred part 7-series Xilinx >1000 < 20 (some versions) Not recommended for Europa RTAX 250/1000/ 2000/4000 Microsemi 200 to 300 > 117 Preferred part Static current increases, rise/file time degrades at 300 krad. Aeroflex UT6325 Cobham/ Aeroflex 300 > 120 Preferred part Microsemi RTG4 Microsemi 150 >110 Device will be rated to 100 krad V5QV, RTAX, UT6325 found acceptable However V5 power consumption and RTAX TID are still issues 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 18
19 ELDRS Test Method EHM 11- F5A Trajectory Dose Profile Standard Method 10 mrad/s 1.5E E TStep Dose Cumulative Dose 3.0E E+06 1 Year to 300 krad Take advantage of mission dose profile Most received during flyby 90% of dose in < 90 days Developed accelerated method Validated test method Rad(Si) Dose rate (rads/s) 9.0E E E E Days P mils P mils P mils 2.0E E E E E Hours from Perijove 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 19
20 ELDRS Test Method Test Verification 9 parts from 3 Vendors RH bipolar Comparative Tests: 10 mrad/s 80 mrad/s 25 rad/s Flight Like pulsed rate Findings Constant dose rate method adequately bounded performance Most RH bipolar parts were acceptable 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 20
21 ELDRS Test Method Parts Tested Part Description Manuf. LM124 LM2941 LM136 Operational Amplifier Linear Regulator 2.5 Voltage reference Functional fail Fail specs TID (krad) Capability TI No Yes 300 TI No Yes 300 TI No Yes 300 comments LM139 Comparator TI No Yes 300 REF05 5V voltage reference AD No Yes 300 PM139 Comparator AD No Yes 300 RH117 Linear regulator LT Yes Yes <125 Severely degraded below 100 krad RH1014 Operational amplifier LT No Yes 300 RH V Reference LT No Yes 300 Accelerated ELDRS test developed Test Duration ~90 days 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 21
22 Worst Case Data Sheets Initial tolerance, temperature variation, aging based on manufacturer s spec Radiation variation based on characterization tests Updated based on flight lot test results Basis of device selection Must be used for all Worst- Case analyses 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 22
23 Materials Approach Issues include Degradation of mechanical properties Degradation of dielectric strength Space charging effects and discharge JPL Materials Engineer approval required Significant radiation effects test effort initiated to evaluate common spacecraft materials Project use of Approved Materials List Includes radiation capability Dose to surface materials ~ Giga Rads 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 23
24 Preferred M&P Lists Material Usage Lists Preferred M&P List Results of Materials Testing Reference data for M&P evaluation including Radiation Resistance Represents preferred M&P but does not imply that all materials and processes listed therein are appropriate for any application M&P selections outside of the PMPSL must provide rationale for usage Material Usage Lists M&P selections are documented and submitted for approval PMPSL provides list of preferred materials and processes Approval authority of Material Usage Lists provides final M&P selection control 8/6 7/2015 Pre- Decisional Information For Planning and Discussion Purposes Only 24
25 9/27/16 Materials Testing Radiation Testing of Spacecraft materials Total Ionizing Dose (TID) Mainly polymeric materials, composites, adhesives, lubricants, insulations, etc Structural applications, material allowables Include thermal environment Displacement Damage Dose (TID/DDD) Glasses, thermal control materials Electrostatic Discharge (ESD) Wire insulation, connectors, coatings Example of on- going Materials testing Common Adhesives Electrical Connectors Wire/cable Circuit card material Thermal Control Coatings Multi- layer Insulation Glasses / Optics Composite materials Lubricants Materials testing being conducted to reduce risk associated with extreme radiation The technical data in this document is controlled under the U.S. Export Regulations; release to foreign persons may require an export authorization. 25
26 Materials - Elastomers Elastomers Radiation Dosage Limit Radiation Dosage Limit Material (rad) in Air (rad) in Vacuum Viton 1.0 x x 10 6 Buna N, Nitrile 1.0 x x 10 7 Neoprene 1.0 x x 10 7 Butyl 1.0 x x 10 6 Silicone 1.0 x x 10 8 Kalrez 1045, Chemraz 1.0 x x 10 6 EPDM 1 x x 10 8 EPR 1 x x 10 8 Based on Europa Clipper Approved Material List 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 26
27 Materials - Plastics Plastics Material Radiation Dosage Limit Radiation Dosage Limit (rad) in (rad) in Air Vacuum PTFE 1.5 x x 10 5 FEP Teflon 2.4 x x 10 6 PFA Teflon 5.0 x x 10 6 MFA Teflon 1.5 x x 10 5 Zymaxx (PFA + graphite fibers) 5.0 x x 10 6 Glass Filled PTFE 1.5 x x 10 5 Steel Filled PTFE 1.5 x x 10 5 Carbon Filled PTFE 1.5 x x 10 5 PEEK 450G >1000 Mrad >1000 Mrad Kynar 1.0 x x 10 9 PCTFE (Kel-F 81) 1.0 x x 10 6 Torlon 1.0 x 10 9 > 10 9 Vespel 1.0 x x Based on Europa Clipper Approved Material List 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 27
28 Summary Radiation challenge for Europa is significant System level approach to surviving radiation SEE mitigation in device selection and system design Mission design limits total dose to 3 100mil Al Shielding vault for a majority of electronic systems Subsystem and local shield as required Characterization of parts and materials Use of approved parts and materials lists Selection of parts and materials for radiation tolerance Mission design Shielding RH Parts & Materials Tolerant circuit design 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 28
29 E u R O p A C L I p p E R.! M I S S I O N!! C O N C E P T!! R E V I E W!.! Thank You Pre- Decisional Information For Planning and Discussion Purposes Only
30 Backup Pre- Decisional Information For Planning and Discussion Purposes Only 30
31 Materials & Process Control Project M&P Control Plan establishes M&P Selection Criteria and Control Defines the Materials and Processes (M&P) control program to ensure proper selection and utilization of materials and processes to meet the Europa Project functional, reliability, mission environment, and safety requirements Europa M&P hierarchy Established responsibilities and reporting EMB M&P selection methodology Preferred Materials and Processes M&P approval Material lists requirements JPL M&P JPL modules APL M&P APL modules Process requirements Material property requirements, material traceability, etc. GSE Instruments Material requirements Thermal vacuum stability, planetary protection, corrosion, shelf-life, radiation resistance, electrical discharge characteristics, etc. M&P Requirements Defined All flight materials and process (excluding EEE parts) must comply with the requirements in the Project M&P Control Plan 8/6 7/2015 This document has been reviewed and determined not to contain export controlled technical data. 31
32 Radiation Environment Driving M&P Requirements Europa s orbit resides in a torus of trapped charged particles around Jupiter Total Ionizing Dose for materials external to the vehicle or with little shielding may see doses on the order of greater than 10^10 rad(si) Space charging effects for dielectric materials cannot be ignored Build-up of static charge can result in unwanted discharges that can damage materials or near-by circuits Material radiation testing being conducted to screen common spacecraft material applications Example in Arcylic: Lichtenberg pattern created by the discharge path From Guide to Mitigating Spacecraft Charging Effects Hank Garrett and Albert Whittlesey 8/6 7/2015 This document has been reviewed and determined not to contain export controlled technical data. 32
33 General Radiation Hardening Process Flow for Spacecraft Radiation Hardening of Spacecraft for High Radiation Environments is an Iterative Process 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only 33
34 Europa Mission Radiation Environment TID The total ionizing dose (TID) is a measure of the energy deposited by energetic electrons and protons in materials TID depends on the outside environment, shielding material, and target material The moon encounters are the times with the highest dose rate Transition between Europa anti-jupiter and sub-jupiter hemisphere coverage The small steps correspond to perijove passes (close encounters with the moon) The spacecraft holds a heavily shielded box called vault (~400 mil thick Al) that contains most sensitive electronics The dose inside the vault is reduced to 150 krad compared to the 3 Mrad mission dose cap (behind 100 mil of Al) 9/19/16 Pre- Decisional Information For Planning and Discussion Purposes Only
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