SEMI AUX OVERVIEW GUIDE TO SEMI STANDARD FOR 450 MM WAFERS

Size: px
Start display at page:

Download "SEMI AUX OVERVIEW GUIDE TO SEMI STANDARD FOR 450 MM WAFERS"

Transcription

1 SEMI AUX OVERVIEW GUIDE TO SEMI STANDARD FOR 450 MM WAFERS The information in this Document has been furnished by the 450 mm International Physical Interfaces & Carriers Task Force, operating under the auspices of the SEMI Standards Physical Interfaces & Carriers Committee, for informational use only and is subject to change without notice. The Semiconductor Equipment and Materials International (SEMI ) Standards Program is publishing this information as furnished by the group in the form of Auxiliary Information so that it may be referenced by the industry, as desired. No material in this Document is to be construed as an official or adopted standard. SEMI assumes no liability for the content of this Document, which is the sole responsibility of the authors, nor for any errors or inaccuracies that may appear in this document. SEMI grants permission to reproduce and distribute this Document provided that (1) the Document is maintained in its original form, and (2) this disclaimer and the notice below accompany the Document at all times. NOTICE: By publication of this Document, SEMI takes no position respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned herein. Users of this Document are expressly advised that determination of any such patent rights or copyrights, and the risk of infringement of such rights, are entirely their own responsibility Copyright 2015 by SEMI (Semiconductor Equipment and Materials International, 3081 Zanker Road, San Jose, CA 95134). See above for information on limited rights for reproduction and distribution; all other rights reserved. 1 SEMI AUX SEMI 2015

2 450mm SEMI Standards Overview

3 1) Purpose A purpose of this document is to promote an integrated understanding of the 450mm SEMI Standards. The 450mm standards extend over subjects covered by the following committees: Silicon Wafer Committee Physical Interfaces & Carriers Committee Information & Control Committee Japan Packaging Committee 2

4 2) The List of Published 450mm SEMI Standards Standard Number SEMI M1 SEMI M49 SEMI M52 SEMI M62 SEMI M73 SEMI M74 SEMI M76 SEMI M80 SEMI E83 SEMI E154 SEMI E156 SEMI E158 SEMI E159 SEMI E162 SEMI E166 SEMI G88 SEMI G92 SEMI G95 Title Specification for Polished Single Crystal Silicon Wafers Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 16 nm Technology Generations Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm to 11 nm Technology Generations Specifications for Silicon Epitaxial Wafers Test Methods for Extracting Relevent Characteristics from Measured Wafer Edge Profiles Specification for 450mm Diameter Mechanical Handling Polished Wafer Specification for Developmental 450mm Diameter Polished Single Crystal Wafer Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers Specification for PGV Mechanical Docking Flange Mechanical Interface for 450mm Load Port Mechanical Specification for 450mm AMHS Stocker to Transport Interface Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450mm Wafers (450 FOUP) and Kinematic Coupling Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450mm Wafers (450 MAC) and Kinematic Coupling Mechanical Interface Specification for 450 mm Front-Opening Shipping Box Load Port Specification for 450 mm Cluster Module Interface: Mechanical Interface and Transport Standard Specification for Tape Frame for 450 mm Wafer Specification for Tape Frame Cassette for 450 mm Wafer Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in the Backend Process 3

5 3) Overview of 450mm SEMI Standards E156 (Stocker Interface) Carriers: E158 (450FOUP), E159 (450 MAC), M80 (450 FOSB) M1,M49,M52,M62,M73, M74, M76 (Wafer) E144 (RF Air Interface) E84 (Carrier Hand off Parallel I/O) wafer carrier E166 (Cluster-Tool Module Interface) Status Published No change Same as 300mm tape frame carrier E154 (FOUP & MAC Load Port) or E162 (FOSB Load Port) E84 (Carrier Hand off Parallel I/O) G88 (Tape Frame) G92 (Tape Frame Cassette ) G95 (Load port for Tape Frame Cassettes) E83 (PGV Docking Flange) Exx (SECS/GEM, Software Communication Standards) 4

6 4) 450mm/300mm Comparison Table Item 300mm 450mm Standard Name N/A M74 Mechanical Handling Polished Wafer M1 M1 (Rev) Polished Single Crystal Si Wafer M28 M76 Developmental Polished Single Crystal Si Wafer Wafer M49 Geometry Measurement Systems for Silicon Wafers M52 Scanning Surface Inspection Systems for Silicon Wafers M62 Silicon Epitaxial Wafers M73 Test Methods for Extracting Relevent Characteristics from Measured Wafer Edge Profiles E15.1 Load Port E62 FIMS E63 E154 BOLTS-M Load Port E64 Cart Docking Interface E110 Indicator / Switch Placement E83 E83 (Rev) PGV Docking Flange N/A E162 FOSB Load port G82 G95 Load Port for Tape Frame Cassettes E1.9 Cassette FOUP E47.1 E158 Front Opening Unified Pod Carrier E57 Kinematic Coupling MAC N/A E159 Multi Application Carrier FOSB M31 M80 Front Opening Shipping Box Tape Frame G77 G92 Tape Frame Cassette Stocker Interface E85 E156 Stocker Interface Cluster Tool E21.1 Cluster-Tool Module Interface E166 E22.1 Cluster-Tool End Effector #1) E84 Carrier Hand off Parallel I/O Communication E99 Carrier Reader/Writer Functional E144 RF Air Interface Packaging G74 Tape Frame G88 G87 Plastic Tape Frame NOTE #1: A set of Wafer Transport Plane Exclusion Zone Dimensions example is given as Related Information in E166. 5

7 5) 300mm PIC Related Standards (Reference) E110 (Operator Interface) Carriers: E47.1(FOUP), E1.9(Cassette), M31(FOSB), E103(SWIF), E119(FOBIT) M1, M28 (Wafer) E144 (RF Air Interface) E57 (Kinematic Coupling) E62 (FIMS) E15.1 (Load Port) E84 (Carrier Hand off Parallel I/O) E22.1 (Cluster-Tool End Effector) E72 (Equipment Footprint, Height, and Weight) E21.1 (Cluster-Tool Module Interface) 6 E64 (Cart Docking Interface) and E83 (PGV Docking Flange) E63 (BOLTS-M) and/or E92 (BOLTS-Light) or E131 (IMM) E85 (Stocker Interface) E26.1 (Cluster-Tool Footprint ) and/or E25 (Cluster-Tool Access) 6

SEMI AUX OVERVIEW GUIDE TO SEMI STANDARD FOR 450MM WAFERS

SEMI AUX OVERVIEW GUIDE TO SEMI STANDARD FOR 450MM WAFERS SEMI AUX023-1211 OVERVIEW GUIDE TO SEMI STANDARD FOR 450MM WAFERS The information in this Document has been furnished by the 450 mm International Physical Interfaces & Carriers Task Force, operating under

More information

SEMI AUX mm PIC Interoperability Report

SEMI AUX mm PIC Interoperability Report SEMI AUX033-0617 450mm PIC Interoperability Report The information in this Document has been furnished by the International 450 mm Physical Interfaces & Carriers Task Force, for informational use only

More information

NEW STANDARD: MECHANICAL INTERFACE SPECIFICATION FOR 450 MM LOAD PORT FOR TAPE FRAME CASSETTES IN BACKEND PROCESS

NEW STANDARD: MECHANICAL INTERFACE SPECIFICATION FOR 450 MM LOAD PORT FOR TAPE FRAME CASSETTES IN BACKEND PROCESS Background Statement for SEMI Draft Document 4965C NEW STANDARD: MECHANICAL INTERFACE SPECIFICATION FOR 450 MM LOAD PORT FOR TAPE FRAME CASSETTES IN BACKEND PROCESS Notice: This background statement is

More information

NEW STANDARD: MECHANICAL INTERFACE SPECIFICATION FOR 450 MM LOAD PORT FOR TAPE FRAME CASSETTES IN THE BACKEND PROCESS

NEW STANDARD: MECHANICAL INTERFACE SPECIFICATION FOR 450 MM LOAD PORT FOR TAPE FRAME CASSETTES IN THE BACKEND PROCESS Background Statement for SEMI Draft Document 4965A NEW STANDARD: MECHANICAL INTERFACE SPECIFICATION FOR 450 MM LOAD PORT FOR TAPE FRAME CASSETTES IN THE BACKEND PROCESS Note: This background statement

More information

Advanced Automation based on Standards

Advanced Automation based on Standards Advanced Automation based on Standards How other industries can profit from automation concepts in semiconductor manufacturing 14 th AIS User Conference Dresden June 26 th, 2014 Dr. Martin Schellenberger

More information

Equipment Supplier s Basic Operational Scenarios For Automation

Equipment Supplier s Basic Operational Scenarios For Automation Equipment Supplier s Basic Operational Scenarios For Automation AUX 0013-0705 Foreword Publication of this document as Auxiliary Information independent of any standards was authorized by a 2/3- majority

More information

NOTICE: This Document is a complete rewrite.

NOTICE: This Document is a complete rewrite. Background Statement for SEMI Draft Document 5817 REVISION TO SEMI E72-0600 (REAPPROVED 0305), SPECIFICATION AND GUIDE FOR 300 MM EQUIPMENT FOOTPRINT, HEIGHT, AND WEIGHT WITH TITLE CHANGE TO: SPECIFICATION

More information

SEMI E N/A SEMI 1990, 1998 SPECIFICATION FOR TOOL LOAD PORT

SEMI E N/A SEMI 1990, 1998 SPECIFICATION FOR TOOL LOAD PORT SEMI E15-0698 N/A SEMI 1990, 1998 SPECIFICATION FOR TOOL LOAD PORT 1 Purpose This standard is intended to unify the interface between process/inspection tools and automated wafer carrier transport systems

More information

Background Statement for SEMI Draft Document 4522 NEW DOCUMENT: SPECIFICATION FOR PLASTIC TAPE FRAME FOR 300 mm WAFER

Background Statement for SEMI Draft Document 4522 NEW DOCUMENT: SPECIFICATION FOR PLASTIC TAPE FRAME FOR 300 mm WAFER Background Statement for SEMI Draft Document 4522 NEW DOCUMENT: SPECIFICATION FOR PLASTIC TAPE FRAME FOR 300 mm WAFER Note: This background statement is not part of the balloted item. It is provided solely

More information

450mm PIC Interoperability Report. International 450 mm PIC Task Force PI&C Global Technical Committee

450mm PIC Interoperability Report. International 450 mm PIC Task Force PI&C Global Technical Committee 450mm PIC Interoperability Report International 450 mm PIC Task Force PI&C Global Technical Committee Contents 1. Overview 2. Problem Types and Root Cause 2-A. Kinematic Coupling Functionality 3. Revisit

More information

Background Statement for SEMI Draft Document 5581 REVISION OF SEMI T (Reapproved 1108), SPECIFICATION FOR WAFER BOX LABELS

Background Statement for SEMI Draft Document 5581 REVISION OF SEMI T (Reapproved 1108), SPECIFICATION FOR WAFER BOX LABELS Background Statement for SEMI Draft Document 5581 REVISION OF SEMI T3-0302 (Reapproved 1108), SPECIFICATION FOR WAFER BOX LABELS Notice: This background statement is not part of the balloted item. It is

More information

North America Physical Interfaces & Carriers Committee Meeting Summary and Minutes

North America Physical Interfaces & Carriers Committee Meeting Summary and Minutes North America Physical Interfaces & Carriers Committee Meeting Summary and Minutes Next Committee Meeting N.A. Standards SEMICON West 2013 Meetings Wednesday, 10 July 2013, 9:00 AM 12:00 PM PST in The

More information

Backend Wafer Carrier Global Joint Guidance for 300 mm Semiconductor Factories

Backend Wafer Carrier Global Joint Guidance for 300 mm Semiconductor Factories Backend Wafer Carrier Global Joint Guidance for 300 mm Semiconductor Factories International SEMATECH Technology Transfer # 00023901A-ENG SEMATECH and the SEMATECH logo are registered service marks of

More information

Background Statement for SEMI Draft Document #5295 New Standard: Specification for Coin-Stack Type Tape Frame Shipping Container for 300 mm Wafer

Background Statement for SEMI Draft Document #5295 New Standard: Specification for Coin-Stack Type Tape Frame Shipping Container for 300 mm Wafer Background Statement for SEMI Draft Document #5295 New Standard: Specification for Coin-Stack Type Tape Frame Shipping Container for 300 mm Wafer Notice: This background statement is not part of the balloted

More information

SEMI 5175 NEW STANDARD: GUIDE FOR MULTI-WAFER TRANSPORT AND STORAGE CONTAINERS FOR

SEMI 5175 NEW STANDARD: GUIDE FOR MULTI-WAFER TRANSPORT AND STORAGE CONTAINERS FOR Background Statement for SEMI Draft Document 5175 NEW STANDARD: GUIDE FOR MULTI-WAFER TRANSPORT AND STORAGE CONTAINERS FOR 300 mm, THIN SILICON WAFERS ON TAPE FRAMES Notice: This background statement is

More information

450mm Transition Update

450mm Transition Update SEMICON Japan 2010 Accelerating Manufacturing Productivity 450mm Transition Update SEMICON Japan December 1, 2010 Copyright 2009 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks

More information

WATOM.. Wafer Topography Measurement KOCOS AUTOMATION GMBH [ ENG ]

WATOM.. Wafer Topography Measurement KOCOS AUTOMATION GMBH [ ENG ] KO C O S - T H E T E C H N O L O G Y G R O U P W H E R E P R E C I S I O N M E E T S Q UA L I T Y WATOM.. Wafer Topography Measurement KOCOS AUTOMATION GMBH [ ENG ] C O N T E N T S WATOM... 3 Wafer edge

More information

Background Statement for SEMI Draft Document 4806 New Standard: GUIDE TO DEFECTS FOUND ON MONOCRYSTALLINE SILICON CARBIDE SUBSTRATES

Background Statement for SEMI Draft Document 4806 New Standard: GUIDE TO DEFECTS FOUND ON MONOCRYSTALLINE SILICON CARBIDE SUBSTRATES Background Statement for SEMI Draft Document 4806 New Standard: GUIDE TO DEFECTS FOUND ON MONOCRYSTALLINE SILICON CARBIDE SUBSTRATES NOTICE: This background statement is not part of the balloted item.

More information

Metrics for 300 mm Automated Material Handling Systems (AMHS) and Production Equipment Interfaces: Revision 1.0

Metrics for 300 mm Automated Material Handling Systems (AMHS) and Production Equipment Interfaces: Revision 1.0 Metrics for 300 mm Automated Material Handling Systems (AMHS) and Production Equipment Interfaces: Revision 1.0 SEMATECH and the SEMATECH logo are registered service marks of SEMATECH, Inc. and the logo

More information

The Evaluation of Manual FOUP Handling in 300mm Wafer Fab

The Evaluation of Manual FOUP Handling in 300mm Wafer Fab The Evaluation of Manual FOUP Handling in 300mm Wafer Fab Mao-Jiun J. Wang a *, Hsiu-Chen Chung b, and Hsin-Chieh Wu c a Department of Industrial Engineering and Engineering Management, National Tsing

More information

Eberhard Teichmann (Peer Group) Martin Zennig (Jonas & Redmann) Tino Korner (Q-Cells) Standards Staff:

Eberhard Teichmann (Peer Group) Martin Zennig (Jonas & Redmann) Tino Korner (Q-Cells) Standards Staff: Background Statement for SEMI Draft Document 5388 Revision of SEMI PV34-0712 with Title Change To: PRACTICE FOR ASSIGNING IDENTIFICATION NUMBERS TO PV Si BRICK, WAFER AND SOLAR CELL MANUFACTURERS Notice:

More information

TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT Process) (Bias Resistor built-in Transistor) RN2110, RN2111

TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT Process) (Bias Resistor built-in Transistor) RN2110, RN2111 , TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT Process) (Bias Resistor built-in Transistor), Switching, Inverter Circuit, Interface Circuit and Driver Circuit Applications Built-in bias resistors

More information

ISMI 450mm Industry Briefing

ISMI 450mm Industry Briefing Accelerating Manufacturing Productivity ISMI 450mm Industry Briefing July 14th, 2010 SEMICON West Copyright 2010 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH,

More information

Background Statement for SEMI Draft Document 5320A LINE-ITEM REVISIONS TO SEMI E E, SPECIFICATION FOR EQUIPMENT PERFORMANCE TRACKING

Background Statement for SEMI Draft Document 5320A LINE-ITEM REVISIONS TO SEMI E E, SPECIFICATION FOR EQUIPMENT PERFORMANCE TRACKING Background Statement for SEMI Draft Document 5320A LINE-ITEM REVISIONS TO SEMI E116-0707 E, SPECIFICATION FOR EQUIPMENT PERFORMANCE TRACKING Notice: This background statement is not part of the balloted

More information

H8SX/1650 Series E6000H TFP-120 User System Interface Board User s Manual HS1650ECN61H

H8SX/1650 Series E6000H TFP-120 User System Interface Board User s Manual HS1650ECN61H H8SX/1650 Series E6000H TFP-120 User System Interface Board User s Manual HS1650ECN61H Rev.3.00 2003.10.6 Cautions Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum

More information

1SS427 1SS Applications. 2. Packaging and Internal Circuit Rev.3.0. Start of commercial production

1SS427 1SS Applications. 2. Packaging and Internal Circuit Rev.3.0. Start of commercial production Switching Diodes 1SS427 Silicon Epitaxial Planar 1SS427 1. Applications Ultra-High-Speed Switching 2. Packaging and Internal Circuit 1: Cathode 2: Anode SOD-923 1: Cathode 2: Anode fsc 1 Start of commercial

More information

Linings of Aboveground Petroleum Storage Tank Bottoms API RECOMMENDED PRACTICE 652 FOURTH EDITION, SEPTEMBER 2014

Linings of Aboveground Petroleum Storage Tank Bottoms API RECOMMENDED PRACTICE 652 FOURTH EDITION, SEPTEMBER 2014 Linings of Aboveground Petroleum Storage Tank Bottoms API RECOMMENDED PRACTICE 652 FOURTH EDITION, SEPTEMBER 2014 Special Notes API publications necessarily address problems of a general nature. With respect

More information

TC4W53F/FU

TC4W53F/FU 1 2 3 4 5 RESTRICTIONS ON PRODUCT USE Toshiba Corporation, and its subsidiaries and affiliates (collectively TOSHIBA ), reserve the right to make changes to the information in this document, and related

More information

Specifications for Top Running & Under Running Single Girder Electric Traveling Cranes Utilizing Under Running Trolley Hoist

Specifications for Top Running & Under Running Single Girder Electric Traveling Cranes Utilizing Under Running Trolley Hoist Specifications for Top Running & Under Running Single Girder Electric Traveling Cranes Utilizing Under Running Trolley Hoist Prepared by The Crane Manufacturers Association of America, Inc. 74 CMAA Specification

More information

Reinforced Thermoset Plastic Corrosion-Resistant Equipment

Reinforced Thermoset Plastic Corrosion-Resistant Equipment ASME RTP-1 2007 (Revision of ASME RTP-1 2005) Reinforced Thermoset Plastic Corrosion-Resistant Equipment AN AMERICAN NATIONAL STANDARD Three Park Avenue New York, NY 10016 Date of Issuance: April 9, 2008

More information

CONTAMINATION MANAGEMENT SOLUTIONS. Perfect solutions for airborne molecular contamination management and particle contamination monitoring

CONTAMINATION MANAGEMENT SOLUTIONS. Perfect solutions for airborne molecular contamination management and particle contamination monitoring CONTAMINATION MANAGEMENT SOLUTIONS Perfect solutions for airborne molecular contamination management and particle contamination monitoring CONTAMINATION MANAGEMENT SOLUTIONS Perfect solutions for airborne

More information

CRA Clad or Lined Steel Pipe

CRA Clad or Lined Steel Pipe CRA Clad or Lined Steel Pipe API SPECIFICATION 5LD FOURTH EDITION, MARCH 2015 API MONOGRAM PROGRAM EFFECTIVE DATE: SEPTEMBER 3, 2015 Special Notes API publications necessarily address problems of a general

More information

Background Statement for SEMI Draft Document 4979 New Standard: SPECIFICATION FOR POLISHED MONOCRYSTALLINE GALLIUM NITRIDE WAFERS

Background Statement for SEMI Draft Document 4979 New Standard: SPECIFICATION FOR POLISHED MONOCRYSTALLINE GALLIUM NITRIDE WAFERS Background Statement for SEMI Draft Document 4979 New Standard: SPECIFICATION FOR POLISHED MONOCRYSTALLINE GALLIUM NITRIDE WAFERS NOTICE: This background statement is not part of the balloted item. It

More information

North America 3DS-IC (Three-dimensional Stacked Integrated Circuits) Standards Committee Meeting Summary and Minutes

North America 3DS-IC (Three-dimensional Stacked Integrated Circuits) Standards Committee Meeting Summary and Minutes North America 3DS-IC (Three-dimensional Stacked Integrated Circuits) Standards Committee Meeting Summary and Minutes NA Standards Spring 2011 Meetings 29 March 2011, 1500 1700 Pacific Time SEMI Headquarters

More information

Background Statement for SEMI Draft Document 5945 New Standard: Test Method for Determining Orientation of A Sapphire Single Crystal

Background Statement for SEMI Draft Document 5945 New Standard: Test Method for Determining Orientation of A Sapphire Single Crystal Background Statement for SEMI Draft Document 5945 New Standard: Test Method for Determining Orientation of A Sapphire Single Crystal Notice: This background statement is not part of the balloted item.

More information

This document should be superseded by dimensional specification and technology-specific guidelines for circuit-quality wafers.

This document should be superseded by dimensional specification and technology-specific guidelines for circuit-quality wafers. Background Statement for SEMI Document 4624B (rev. 16) NEW STANDARD: SPECIFICATION FOR DEVELOPMENTAL 450 mm DIAMETER POLISHED SINGLE CRYSTAL SILICON WAFERS Note: This background statement is not part of

More information

PROPERTIES FOR COMPOSITE MATERIALS IN HYDROGEN SERVICE

PROPERTIES FOR COMPOSITE MATERIALS IN HYDROGEN SERVICE Designator: Meta Bold 24/26 Revision Note: Meta Black 14/16 PROPERTIES FOR COMPOSITE MATERIALS IN HYDROGEN SERVICE Date of Issuance: March 19, 2008 This report documents the work sponsored by National

More information

TEL: FAX:

TEL: FAX: Business Philosophy: Business Profile: Company Name : Hybrid Innovative Technologies Pte Ltd Company Registration No : 200718784Z Company Paid Up Capital : S$ 500,000.00/- Company Banker : OCBC Bank Company

More information

WAFER CARRIERS FOR MOCVD

WAFER CARRIERS FOR MOCVD WAFER CARRIERS FOR MOCVD HIGH PURITY COATED GRAPHITE PRODUCT MERSEN in the Semiconductor industry: Beyond the development of the silicon semiconductor industry, the compound semiconductor has opened a

More information

Saphyr System Safety Guide for Saphyr P/N 60325

Saphyr System Safety Guide for Saphyr P/N 60325 Saphyr System Safety Guide for Saphyr P/N 60325 Document Number: 30253 Document Revision: A For Research Use Only. Not for use in diagnostic procedures. Copyright 2019 Bionano Genomics Inc. All Rights

More information

International SEMATECH Technology Transfer # B-XFR

International SEMATECH Technology Transfer # B-XFR 300 mm Equipment Base Software Functionality Requirements Error Handling and Extended Scenarios: Selete/ISMT Computer Integrated Manufacturing (CIM) Base Functionality Requirements Collaboration, Phase

More information

Table of Contents by Topic

Table of Contents by Topic Table of Contents by Topic 0912 NOTICE: Starting with the November 2001 (1101) publishing cycle, a distinction is being made between Standards that have subordinate document designation numbers and require

More information

STP-PT-050 AN INVESTIGATION OF THREE RADIOGRAPHIC ACCESS PORT PLUG GEOMETRIES AND THE SURROUNDING PIPE WALL UNDERGOING CREEP

STP-PT-050 AN INVESTIGATION OF THREE RADIOGRAPHIC ACCESS PORT PLUG GEOMETRIES AND THE SURROUNDING PIPE WALL UNDERGOING CREEP STP-PT-050 AN INVESTIGATION OF THREE RADIOGRAPHIC ACCESS PORT PLUG GEOMETRIES AND THE SURROUNDING PIPE WALL UNDERGOING CREEP STP-PT-050 AN INVESTIGATION OF THREE RADIOGRAPHIC ACCESS PORT PLUG GEOMETRIES

More information

AMC contamination strategy 450mm & advanced nodes M. Davenet

AMC contamination strategy 450mm & advanced nodes M. Davenet AMC contamination strategy 450mm & advanced nodes M. Davenet AMC Management Airborne Molecular Contamination Monitoring Curing and Protecting Preventing Conclusions Introduction: Airborne Molecular Contamination

More information

AEROSPACE MATERIAL SPECIFICATION

AEROSPACE MATERIAL SPECIFICATION AEROSPACE MATERIAL SPECIFICATION Licensed to Juan Rodriguez AMS 5754M Issued MAY 1954 Revised AUG 2007 Superseding AMS 5754L Nickel Alloy, Corrosion and Heat-Resistant, Bars, Forgings, and Rings 47.5Ni

More information

Reinforced Thermoset Plastic Corrosion-Resistant Equipment

Reinforced Thermoset Plastic Corrosion-Resistant Equipment ASME RTP-1 2013 (Revision of ASME RTP-1 2011) Reinforced Thermoset Plastic Corrosion-Resistant Equipment AN AMERICAN NATIONAL STANDARD ASME RTP-1 2013 (Revision of ASME RTP-1 2011) Reinforced Thermoset

More information

Table of Contents by Topic

Table of Contents by Topic Table of Contents by Topic 0114 NOTICE: Starting with the November 2001 (1101) publishing cycle, a distinction is being made between Standards that have subordinate document designation numbers and require

More information

Pipeline Transportation Systems for Liquids and Slurries

Pipeline Transportation Systems for Liquids and Slurries ASME B31.4-2016 (Revision of ASME B31.4-2012) Pipeline Transportation Systems for Liquids and Slurries ASME Code for Pressure Piping, B31 AN AMERICAN NATIONAL STANDARD ASME B31.4-2016 (Revision of ASME

More information

AN Handling and processing of sawn wafers on UV dicing tape. Document information. Sawn wafers, UV dicing tape, handling and processing

AN Handling and processing of sawn wafers on UV dicing tape. Document information. Sawn wafers, UV dicing tape, handling and processing Handling and processing of sawn wafers on UV dicing tape Rev. 2.0 13 January 2009 Application note Document information Info Keywords Abstract Content Sawn wafers, UV dicing tape, handling and processing

More information

Table of Contents by Topic

Table of Contents by Topic Table of Contents by Topic 0614 NOTICE: Starting with the November 2001 (1101) publishing cycle, a distinction is being made between Standards that have subordinate document designation numbers and require

More information

Background Statement for SEMI Draft Document 4697 REAPPROVAL OF SEMI F , GUIDE FOR LIQUID CHEMICAL PIPE LABELING

Background Statement for SEMI Draft Document 4697 REAPPROVAL OF SEMI F , GUIDE FOR LIQUID CHEMICAL PIPE LABELING Background Statement for SEMI Draft Document 4697 REAPPROVAL OF SEMI F34-0998, GUIDE FOR LIQUID CHEMICAL PIPE LABELING Note: This background statement is not part of the balloted item. It is provided solely

More information

Driving Efficiency by Adopting Mechanical Connectors as a Cold-Work Solution for Permanent Pipe Connection

Driving Efficiency by Adopting Mechanical Connectors as a Cold-Work Solution for Permanent Pipe Connection Driving Efficiency by Adopting Mechanical Connectors as a Cold-Work Solution for Permanent Pipe Connection Dale Millward, STATS Group STATS GROUP Slide: 1 CHALLENGE: ON-SITE WELDING Hot Work Disadvantages

More information

Specification for Pipeline Valves

Specification for Pipeline Valves Specification for Pipeline Valves ANSI/API SPECIFICATION 6D TWENTY-THIRD EDITION, APRIL 2008 EFFECTIVE DATE: OCTOBER 1, 2008 CONTAINS API MONOGRAM ANNEX AS PART OF US NATIONAL ADOPTION ISO 14313:2007 (Identical),

More information

Package Mounting Guide BGA

Package Mounting Guide BGA Package Mounting Guide Revision 1.0 2017-03 2017-03-17 1 / 16 Rev. 1.0 2017 Toshiba Corporation Table of Contents Package Mounting Guide Preface... 4 Purpose of this document... 4 Intended Audience...

More information

Guidelines for Avoiding Sulfidation (Sulfidic) Corrosion Failures in Oil Refineries

Guidelines for Avoiding Sulfidation (Sulfidic) Corrosion Failures in Oil Refineries http://www.booksfiles.org/637-api-rp-939-c.html Guidelines for Avoiding Sulfidation (Sulfidic) Corrosion Failures in Oil Refineries Downstream Segment API RECOMMENDED PRACTICE 939-C FIRST EDITION, MAY

More information

STEVAL-IHP005V1. General purpose power line modem module based on the ST7540 PLM and STM32 microcontroller. Features. Description

STEVAL-IHP005V1. General purpose power line modem module based on the ST7540 PLM and STM32 microcontroller. Features. Description General purpose power line modem module based on the ST7540 PLM and STM32 microcontroller Features Databrief Communication interfaces Configurable FSK power line modem interface with an embedded firmware

More information

Package Mounting Guide SOP/QFP

Package Mounting Guide SOP/QFP Package Mounting Guide Revision 1.0 2016-03 2016-03-17 1 / 14 Rev. 1.0 2016 Toshiba Corporation Table of Contents Package Mounting Guide Preface... 4 Purpose of this document... 4 Intended Audience...

More information

Read Me First: Unpacking Express5800/320Ma 3.2 GHz, 3.6 GHz, and Dual-Core Systems

Read Me First: Unpacking Express5800/320Ma 3.2 GHz, 3.6 GHz, and Dual-Core Systems Read Me First: Unpacking Express5800/320Ma 3.2 GHz, 3.6 GHz, and Dual-Core Systems NEC Solutions (America), Inc. NR579-02 Notice The information contained in this document is subject to change without

More information

Background Statement. If you have any questions on this ballot, please contact the following Task Force leaders or SEMI Staff:

Background Statement. If you have any questions on this ballot, please contact the following Task Force leaders or SEMI Staff: Background Statement for SEMI Draft Document 5371 New Standard: Test Method for Tensile Strength Applied to Welded Connections Made by PFA Weld Fitting. Notice: This background statement is not part of

More information

Bruker AXS D8 FABLINE. X-Ray Metrology Solutions. think forward

Bruker AXS D8 FABLINE. X-Ray Metrology Solutions. think forward Bruker AXS D8 FABLINE X-Ray Metrology Solutions think forward XRD & µxrf D8 FABLINE Metrology for Semiconductor Manufacturing The functional units of semiconductor and compound semiconductor devices shrink

More information

IoT for SECS and Non-SECS Equipment in Semiconductor Backend Manufacturing. WOI Teck Khiong (Infineon) Maiko Kenner (PEER Group)

IoT for SECS and Non-SECS Equipment in Semiconductor Backend Manufacturing. WOI Teck Khiong (Infineon) Maiko Kenner (PEER Group) IoT for SECS and Non-SECS Equipment in Semiconductor Backend Manufacturing WOI Teck Khiong (Infineon) Maiko Kenner (PEER Group) Table of Contents - Company Information - Industry Revolution and Status

More information

Atmospheric Transfer Robotics. Cutting-edge robotic solutions for today s advanced semiconductor manufacturers

Atmospheric Transfer Robotics. Cutting-edge robotic solutions for today s advanced semiconductor manufacturers Atmospheric Transfer Robotics Cutting-edge robotic solutions for today s advanced semiconductor manufacturers Razor provides the superior performance, repeatability, and ultra-cleanliness that today s

More information

Comparison of OSRAM OSTAR Headlamp Pro and OSLON Black Flat Application Note

Comparison of OSRAM OSTAR Headlamp Pro and OSLON Black Flat Application Note Comparison of OSRAM OSTAR Headlamp Pro and Application Note Abstract In this application note a new SMD LED type is presented as an alternative to existing LEDs to create multi-chip light sources for diverse

More information

Recommended Practice for Field Testing Oil-based Drilling Fluids

Recommended Practice for Field Testing Oil-based Drilling Fluids Recommended Practice for Field Testing Oil-based Drilling Fluids API RECOMMENDED PRACTICE 13B-2 FIFTH EDITION, APRIL 2014 ERRATA 1, AUGUST 2014 Special Notes API publications necessarily address problems

More information

What is the history of this issue and ballot? It is the first ballot of 5386 which is approved on May of 2012 by Korea I&C committee

What is the history of this issue and ballot? It is the first ballot of 5386 which is approved on May of 2012 by Korea I&C committee Background Statement for SEMI Draft Document 5386 LINE ITEM REVISION TO SEMI E94-032, SPECIFICATION FOR CONTROL JOB MANAGEMENT ENHANCEMENT OF MATERIAL REDIRECTION MODE Notice: This background statement

More information

EWM900. Extended Warehouse Management - Developer Workshop COURSE OUTLINE. Course Version: 17 Course Duration: 3 Day(s)

EWM900. Extended Warehouse Management - Developer Workshop COURSE OUTLINE. Course Version: 17 Course Duration: 3 Day(s) EWM900 Extended Warehouse Management - Developer Workshop. COURSE OUTLINE Course Version: 17 Course Duration: 3 Day(s) SAP Copyrights and Trademarks 2018 SAP SE or an SAP affiliate company. All rights

More information

Calculation of Heater-tube Thickness in Petroleum Refineries API STANDARD 530 SEVENTH EDITION, APRIL 2015

Calculation of Heater-tube Thickness in Petroleum Refineries API STANDARD 530 SEVENTH EDITION, APRIL 2015 Calculation of Heater-tube Thickness in Petroleum Refineries API STANDARD 530 SEVENTH EDITION, APRIL 2015 Special Notes API publications necessarily address problems of a general nature. With respect to

More information

Safety Standard for Pressure Vessels for Human Occupancy

Safety Standard for Pressure Vessels for Human Occupancy ASME PVHO-1 2012 (Revision of ASME PVHO-1 2007) Safety Standard for Pressure Vessels for Human Occupancy AN AMERICAN NATIONAL STANDARD ASME PVHO-1 2012 (Revision of ASME PVHO-1 2007) Safety Standard for

More information

COMMON STRUCTURAL RULES FOR BULK CARRIERS AND OIL TANKERS RULE CHANGE PROPOSAL 1 This proposal contains amendments within the following Parts and chap

COMMON STRUCTURAL RULES FOR BULK CARRIERS AND OIL TANKERS RULE CHANGE PROPOSAL 1 This proposal contains amendments within the following Parts and chap Common Structural Rules for Bulk Carriers and Oil Tankers Draft Rule Change Proposal 1 to 01 JAN 2018 version Notes: (1) These Rule Changes enter into force on 1 st July 2019. Copyright in these Common

More information

Activities in Plasma Process Technology at SENTECH Instruments GmbH, Berlin. Dr. Frank Schmidt

Activities in Plasma Process Technology at SENTECH Instruments GmbH, Berlin. Dr. Frank Schmidt Activities in Plasma Process Technology at SENTECH Instruments GmbH, Berlin Dr. Frank Schmidt The Company Company Private company, founded 1990 80 employees ISO 9001 Location Science & Technology Park,

More information

PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan UC2906DW NRND SOIC DW 16 40 Green (RoHS UC2906DWG4

More information

Reliability Tests Report

Reliability Tests Report Product Name: Package Name: CRS12 SFLAT Reliability Tests Report 1. Thermal tests Peak : 260 deg.c(a moment) Reflow zone : 230 deg.c 30 to 50 s Preheat : 180 to 190 deg.c, 60 to 120 s 3 times Peak : 260

More information

MATERIALS. Silicon Wafers... J 04 J 01. MATERIALS / Inorganics & thin films guide

MATERIALS. Silicon Wafers... J 04 J 01. MATERIALS / Inorganics & thin films guide J MATERIALS SUBSTRATES Silicon Wafers... J 04 J J 01 MATERIALS SUBSTRATES NEYCO has a complete range of crystal substrates for a wide variety of applications, including Semiconductor, Biotechnology, Nanotechnology,

More information

GS1 US Bill of Lading (BOL)

GS1 US Bill of Lading (BOL) GS1 US Bill of Lading (BOL) F R E Q U E N T L Y A S K E D Q U E S T I O N S R 2. 1 O C T 26 2 0 1 5 CONTENTS 1. Can legal statements after the Carrier Information Section be changed/modified by the Shipper?...

More information

STP-PT-052 ALIGN MECHANICAL AND CIVIL-STRUCTURAL EARTHQUAKE DESIGN AND QUALIFICATION RULES FOR ASME B31 PIPING SYSTEMS AND PIPELINES

STP-PT-052 ALIGN MECHANICAL AND CIVIL-STRUCTURAL EARTHQUAKE DESIGN AND QUALIFICATION RULES FOR ASME B31 PIPING SYSTEMS AND PIPELINES ALIGN MECHANICAL AND CIVIL-STRUCTURAL EARTHQUAKE DESIGN AND QUALIFICATION RULES FOR ASME B31 PIPING SYSTEMS AND PIPELINES ALIGN MECHANICAL AND CIVIL-STRUCTURAL EARTHQUAKE DESIGN AND QUALIFICATION RULES

More information

SN54LS670, SN74LS670 4-BY-4 REGISTER FILES WITH 3-STATE OUTPUTS

SN54LS670, SN74LS670 4-BY-4 REGISTER FILES WITH 3-STATE OUTPUTS SN54LS670, SN74LS670 4-BY-4 REGISTER FILES WITH 3-STATE OUTPUTS SDLS193 MARCH 1974 REVISED MARCH 1988 PRODUCTION DATA information is current as of publication date. Products conform to specifications per

More information

NetShelter. Four-Post Rack. Installation and Quick-Start Manual

NetShelter. Four-Post Rack. Installation and Quick-Start Manual NetShelter Four-Post Rack Installation and Quick-Start Manual Contents Product Overview....................................... 1 Product Inventory....................................... 2 Features of the

More information

Hermes Microvision, Inc.

Hermes Microvision, Inc. Hermes Microvision, Inc. Investor Presentation February 2014 I. Introduction to HMI HMI Highlights Company Profile Leading-edge Inspection Tools and Solutions World s leading supplier of EBI tools and

More information

AN Recommendations for PCB assembly of DSN1006. Document information

AN Recommendations for PCB assembly of DSN1006. Document information Recoendations for PCB assembly of DSN1006 Rev. 1 29 July 2015 Application note Document information Info Keywords Abstract Content DSN1006, DSN1006-2, DSN1006U-2, SOD993, SOD995, 0402 package size, reflow

More information

Below-the-Hook Lifting Devices

Below-the-Hook Lifting Devices ASME B30.20-2013 (Revision of ASME B30.20-2010) Below-the-Hook Lifting Devices Safety Standard for Cableways, Cranes, Derricks, Hoist, Hooks, Jacks, and Slings AN AMERICAN NATIONAL STANDARD ASME B30.20-2013

More information

BOOST HEAT DISSIPATION WITH A THERMAL PYROLYTIC GRAPHITE CORE Presentation at 12 th European ATW on Micropackaging and Thermal Management

BOOST HEAT DISSIPATION WITH A THERMAL PYROLYTIC GRAPHITE CORE Presentation at 12 th European ATW on Micropackaging and Thermal Management BOOST HEAT DISSIPATION WITH A THERMAL PYROLYTIC GRAPHITE CORE Presentation at 12 th European ATW on Micropackaging and Thermal Management Wei Fan, Ph.D., Xiang Liu, Ph.D., Creighton Tomek, Dawn Krencisz,

More information

Building Services Piping

Building Services Piping ASME B31.9-2014 (Revision of ASME B31.9-2011) Building Services Piping ASME Code for Pressure Piping, B31 AN AMERICAN NATIONAL STANDARD ASME B31.9-2014 (Revision of ASME B31.9-2011) Building Services Piping

More information

Dave Jarzynka. Brooks Semiconductor Solutions Group

Dave Jarzynka. Brooks Semiconductor Solutions Group Dave Jarzynka Brooks Semiconductor Solutions Group 1 Agenda The business today Growth drivers 2 2016 Brooks Automation, Inc. Proprietary Information Semiconductor Group at a Glance FY15 Revenue Breakdown

More information

Galaxy VM kva 400 V Receiving and Unpacking 06/

Galaxy VM kva 400 V Receiving and Unpacking 06/ Galaxy VM Receiving and Unpacking 06/2016 www.schneider-electric.com Legal Information The Schneider Electric brand and any registered trademarks of Schneider Electric Industries SAS referred to in this

More information

An Introduction to the Serial Shipping Container Code (SSCC)

An Introduction to the Serial Shipping Container Code (SSCC) An Introduction to the Serial Shipping Container Code (SSCC) Release 2.0, Sept 2017 Table of Contents 1 What is a Serial Shipping Container Code?... 4 2 What is an SSCC used for?... 4 3 Key Attributes

More information

ASPICS IPD Companion for ISM Transceiver IC: RF front end part

ASPICS IPD Companion for ISM Transceiver IC: RF front end part IPD Companion for ISM Transceiver IC: RF front end part Rev 1.2 TD Introduction The ASPICS320.606 is an integrated passives device specifically designed for use with the SEMTECH SX1211 868/915MHz ISM/UHF

More information

300 mm Integrated Vision for Semiconductor Factories

300 mm Integrated Vision for Semiconductor Factories Japan 300mm Semiconductor Technology Conference / EIAJ (J300E) 300 mm Integrated Vision for Semiconductor Factories I300I and J300E November 1999 Version 3.0 Table of Contents INDEX OF REVISIONS... 1

More information

Single Post Anchor Part Number Spectrum Lane ~ Missoula MT ~

Single Post Anchor Part Number Spectrum Lane ~ Missoula MT ~ Single Post Anchor Part Number 21700 7100 Spectrum Lane ~ Missoula MT 59808 800.791.8056 ~ www.spectrumproducts.com 21700 Man Rev B You have purchased a Spectrum Aquatics Single Post Anchor. Providing

More information

FeliCa Certified Logotype Logotype Guidelines Logotype Usage Regulations

FeliCa Certified Logotype Logotype Guidelines Logotype Usage Regulations FeliCa Certified Logotype Logotype Guidelines Logotype Usage Regulations Rev. 1.03 August 2018 Sony Imaging Products & Solutions Inc. 1 / 9 Revision History No. Date issued Revised Content Rev. 1.0 2008/11/04

More information

ASME A Standard for Elevator Suspension, Compensation, and Governor Systems

ASME A Standard for Elevator Suspension, Compensation, and Governor Systems ASME A17.6-2010 Standard for Elevator Suspension, Compensation, and Governor Systems A N A M E R I C A N N A T I O N A L S T A N D A R D ASME A17.6-2010 Standard for Elevator Suspension, Compensation,

More information

Steel Pipelines Crossing Railroads and Highways

Steel Pipelines Crossing Railroads and Highways Steel Pipelines Crossing Railroads and Highways API RECOMMENDED PRACTICE 1102 SEVENTH EDITION, DECEMBER 2007 ERRATA, NOVEMBER 2008 ERRATA 2, MAY 2010 ERRATA 3, SEPTEMBER 2012 ERRATA 4, FEBRUARY 2014 ERRATA

More information

ECIA. Publication. Certificates of Conformance for Commercial Electronic Parts NIGP September Electronic Components Industry Association

ECIA. Publication. Certificates of Conformance for Commercial Electronic Parts NIGP September Electronic Components Industry Association ECIA Publication Certificates of Conformance for Commercial Electronic Parts September 2013 Electronic Components Industry Association Industry Guideline NOTICE ECIA Industry Guidelines and Publications

More information

Background Statement for SEMI Draft Document 4651 REVISION OF SEMI F GUIDELINES FOR ULTRAPURE WATER USED IN SEMICONDUCTOR PROCESSING

Background Statement for SEMI Draft Document 4651 REVISION OF SEMI F GUIDELINES FOR ULTRAPURE WATER USED IN SEMICONDUCTOR PROCESSING Background Statement for SEMI Draft Document 4651 REVISION OF SEMI F63-0701 GUIDELINES FOR ULTRAPURE WATER USED IN SEMICONDUCTOR PROCESSING Note: This background statement is not part of the balloted item.

More information

Figure 1 Input power cable (left) and output power cable (right)

Figure 1 Input power cable (left) and output power cable (right) TIDA-00282 Cable Assemblies These cable assemblies are intended for use with the C2000-based Automotive Digitally-controlled Boost Power Supply board described in TI Designs TIDA-00282. Figure 1 Input

More information

IBM storage solutions: Evolving to an on demand operating environment

IBM storage solutions: Evolving to an on demand operating environment May 2003 IBM TotalStorage IBM storage solutions: Evolving to an on demand operating environment Page No.1 Contents 1 e-business on demand 1 Integrated information fuels on demand businesses 2 Integrated

More information

Table of Contents by Volume D-IC. Equipment Automation Hardware

Table of Contents by Volume D-IC. Equipment Automation Hardware Table of Contents by Volume 0912 NOTICE: Starting with the November 2001 (1101) publishing cycle, a distinction is being made between Standards that have subordinate document designation numbers and require

More information

ACS300 Gen2. The coat develop solution from pilot to high volume production

ACS300 Gen2. The coat develop solution from pilot to high volume production ACS300 Gen2 The coat develop solution from pilot to high volume production ACS300 Gen2 The Powerful Coating Solution for 300 mm features and benefits + + Highly flexible resist processing cluster for high-volume

More information

Drain, Waste and Vent (DWV) Internal Cleanout Fittings

Drain, Waste and Vent (DWV) Internal Cleanout Fittings IAPMO IGC 78-20022018 PUBLIC REVIEW DRAFT Drain, Waste and Vent (DWV) Internal Cleanout Fittings IAPMO Standard IAPMO IGC 78 20022018 Published: July 2002 Previous Editions: July 2002, December 2001, April

More information

Standard Specification for Brass Rod, Bar, and Shapes 1

Standard Specification for Brass Rod, Bar, and Shapes 1 Designation: B 2 03 Standard Specification for Brass Rod, Bar, and Shapes This standard is issued under the fixed designation B 2; the number immediately following the designation indicates the year of

More information

Food Service Technology Center

Food Service Technology Center Food Service Technology Center Pearl City P-30 Gas Convection Fryer Test Report FSTC Application of ASTM Standard Test Method F2144-09 April 2013 Prepared by: Adam Cornelius Fisher-Nickel, Inc. Prepared

More information