Adaptec RoHS Process Conversion Qualification Report

Transcription

1 Adaptec RoHS Process Conversion Qualification Report Summarized by Adaptec Customer Quality Engineering

2 Report Contents Section 1 Introduction Section 2 Conclusion Section 3 Adaptec Conversion Strategy Section 4 Adaptec Material Choices Section 5 Adaptec Material Management Section 6 Adaptec Process Choices Section 7 Adaptec Generic PCBA Assembly Process Flow for Double Sided Boards Section 8 Adaptec RoHS Reliability Test Data (RRT, SLT) Section 9 Adaptec Factory RoHS Audit Section 10 Adaptec ASICs in RoHS compliant form Section 11 Adaptec RoHS Product Builds and Qualification test results

3 1.0 Introduction: The RoHS (Restriction of Hazardous Substances) Directive restricts the use and presence of certain hazardous substances in new electrical and electronic products placed on the European Union (EU) market effective July 1, RoHS restricts the use of six substances: cadmium (Cd) mercury (Hg) hexavalent chromium (Cr (VI)) polybrominated biphenyls (PBBs) polybrominated diphenyl ethers (PBDEs) lead (Pb). The directive is in the process of being implemented into the national laws of the 25 EU member states. Adaptec is committed to complying with the RoHS Directive and to producing electronic products supplied into the EU which are fully compliant with national implementing legislation before the RoHS deadline. Other countries outside the EU will follow with similar legislation. 2.0 Conclusion: Adaptec s RoHS compliant manufacturing process is fully capable and internally qualified. Adaptec is preparing to begin manufacturing & shipping of products compliant to the EU RoHS directive as per our previously announced timeline, Q1 CY The change Adaptec is implementing to achieve RoHS product compliance is related to component/material changes, and manufacturing process changes. These changes should not result in any impact to form, fit, functionality, quality or reliability of Adaptec products. This report is intended to provide Adaptec customers with enough information & data to allow customers to accept Adaptec s qualification report to use as their own (allowing customers to perform a paper qual), and therefore begin accepting RoHS compliant products from Adaptec. It should be noted this is a RoHS compliant process report, and not a RoHS product specific qual report. Although several Adaptec RoHS compliant products have been manufactured, tested & reported on, they are simply the test vehicles used to qualify Adaptec s RoHS process capability.

4 3.0 Adaptec Conversion Strategy: Adaptec has been investigating & preparing to meet RoHS compliance for several years. Internal cross-functional teams have been meeting regularly to coordinate the extensive activities required to prepare for, qualify, and begin production manufacturing of RoHS compliant products. Adaptec has actively participated in RoHS related industry groups, such as the Gintic consortium, attended IPC/JEDEC RoHS conferences, and various RoHS training & informational seminars. In addition, Adaptec has held meetings to share our interpretation of the RoHS directive and requirements, as well as processing related information with various major OEM customers, CMs, ODMs, and suppliers to Adaptec. Adaptec has adopted a phase-in approach to converting products over to RoHS compliance. During 2005, Adaptec has been working with our suppliers to begin receiving RoHS compliant & capable components that could be introduced into the current manufacturing process. This was done with the goal of having all RoHS compliant components & materials available in time for Q1 CY 2006, when Adaptec has targeted to convert the PCBA manufacturing process over to RoHS by changing to lead free SMT & PTH processes (Pb-Free solder paste & wave solder). Adaptec s goal is to continue to meet customer needs, and minimize the amount of non-rohs material that would become scrap if not used-up prior to the process conversion. Note: In the case of ball grid array (BGA) devices, due to mixed technology reliability concerns, the soldering materials used and the BGA ball metallurgy will be matched. RoHS compliant BGAs (Lead free balls) will only be used in conjunction with the RoHS compliant solders (SAC). In preparing for the conversion of Adaptec products to RoHS compliance, Adaptec has determined which products will be converted and available as RoHS compliant, and what other products will not be converted (due to factors such as unavailability of critical components that are RoHS compliant, or lack of demand for the Adaptec product). End of life notifications will be provided to customers regarding those Adaptec products that will generally be no longer available after RoHS process conversion. Adaptec products that are RoHS compliant will be clearly identifiable both in the ordering process and on the product & packaging (the ordering part number contains a -R suffix, or ASIC devices will have unique RoHS part numbers).

5 4.0 Adaptec Material Choices: (A) PCB Selection Gintic Consortium Evaluation The search for a suitable PCB and plating type started in June 2000 with AMS joining the Gintic lead-free consortium to make a selection and qualify the RoHS compliance material. The PCB used for the Gintic qualification was FR4 with normal Tg (Glass Transition Temperature) and higher Tg material. The different plating finishes that were used included OSP (Organic Solderability Preservative), NiAu (Electroless Nickel Immersion Gold), ImAg (Immersion Silver) and ImSn (Immersion Tin). The conclusion was drawn that PCB with NiAu and ImAg finishes will still provide reasonable good soldering after exposed to 3 reflows cycles. (See Appendix 1, Extract of Evaluation Summary from Gintic Consortium Report) AMS Evaluations Further evaluation was carried out in AMS to determine the final selection of PCB surfaces finishes between NiAu and ImAg. The evaluation was conducted using one of the Adaptec single sided SCSI card. Comparison was based on the appearances of solder wetting and strength of the joints on both PCB plating types. There was no significant visual difference between the plating while the shear/pull test showed the solder joints on the immersion silver finish is more consistent as compared to NiAu finish PCB. (See Appendix 2, extract of ASC LP Shear/Pull Test Data) PCB materials with a difference in Tg (Normal & High) were also being evaluated based on one of the SCSI cards (16 layers, 1.6mm, double sided). Both boards materials passed the ICT/FCT and Adaptec reliability tests. Results show that differences in Tg on PCB materials for the product are acceptable. Therefore, the PCB material selected for RoHS is based on the PCB material requirement usually indicated in the fab drawing of the product with PCB finishes changed to Immersion Silver. (B) Solder paste/solder bar/soldering wire Concurrently with the above PCB evaluation, an evaluation was carried out using 4 different lead free solder paste alloys from 4 different solder paste suppliers. The alloys were as below: Solder Paste Suppliers /Type Supplier A Supplier B Supplier C Supplier D Solder paste alloy Sn95.5Ag4/Cu0.5 Sn95.8/Ag3.5/Cu0.7 Sn96.5/ Ag3.0/Cu0.5 Sn95.5/Ag3.9/Cu0.6

6 All 4 types of solder pastes were subjected to the reflow profiles which were recommended by the consortium. (See appendix 3, Recommended Reflow Profile from Gintic Lead Free Consortium). In the evaluation, all PCBA builds were subjected to ICT/FCT and in house reliability tests. There was no distinct difference in terms of wetting on the solder joints, which tally with the final report on Round Robin Testing and Analysis of Lead Free Paste with Alloys of Tin, Sliver and Copper by IPC All 4 types of solder pastes were subjected to the same process with standard normal machine set-up and parameters. From Adaptec s observation on the paste print quality, solder pastes A and B showed slightly more solder bridging during paste printing process but this was not the case for solder pastes C and D, as they exhibit better and good respective printing quality even after repeated prints. From the results, solder paste C was slightly better than that of paste D in terms of appearance after reflow. Hence, solder paste C was selected as the primary source of RoHS compliant solder paste and solder paste D as a secondary source. Additionally, solder paste C was subsequently used on another test vehicle to evaluate on a more complex board (double sided, 12 layers boards) and did not show any defect except some minor yellow flux stain on the solder joints. Gintic Consortium An evaluation was done by the consortium on the different solder alloys regarding the wetting time and wetting force. The outcome shows that a higher solder bath temperature will improve the wetting time, and at the same time reduce variation of the wetting force due to PCB finish. (See Appendix 4, Wetting Time and Wetting Force Charts). Though SnCu was acceptable as there was no failure, however there was concern about fillet lifting on the PTH components, hence, SnAgCu was selected as it exhibited a better result during the reliability test, even though it is slightly more expensive. The soldering wire alloy selected for use was the same alloy as the solder paste, to keep the solder joints uniform across the PCBA. 5.0 Adaptec Material Management: Processes and procedures are in place to manage "RoHS" compliant products & materials segregation. Handling requirements are also followed to prevent mixing RoHS lead free products with Non-RoHS (lead containing) products. Controls are in place in all required areas, from raw material storage, manufacturing processes, and finished products storage.

7 Control at Receiving/Incoming/ Material Store RoHS compliant parts from suppliers are clearly labeled or marked on cartons & boxes with RoHS or equivalent identification. If RoHS compliant parts are not marked with RoHS or equivalent identification, IQA will paste Adaptec s internal RoHS label on each carton or box as identification once they have verified the received material is RoHS compliant. Storage locations in Adaptec SOI (Supplier Owned Inventory) will segregate the non- RoHS from RoHS compliant in Stores. When manufacturing requires a RoHS compliant product build, manufacturing will raise a reservation for full RoHS to SOI, who will then issue only RoHS parts. During the issuance of RoHS parts to manufacturing, any breaking of bulk to issue by reels or smaller carton boxes, SOI (or ST01) personnel will paste as needed Adaptec internal RoHS labels on each reel or smaller cartons as RoHS identification. Once Manufacturing receives the RoHS parts, they will be moved to RoHS locations/bins in the MFG RoHS Min Centre (manufacturing storage location). When MFG needs to further break into smaller reels or tubes/trays to issue by line, MFG must paste Adaptec internal RoHS labels on each smaller reel or tubes/trays. Control at Manufacturing SMT There is a designated line used to build the RoHS compliant products. Process Engineering is responsible for the line conversion. All components & parts required for RoHS builds are stored in the cage trolley (with lock) when being issued out from Min Centre. Operators must check the parts to confirm they have a lead free logo on packaging reels before they start the issuing process. If there is no RoHS identification on the packaging, they have to verify with Min Centre personnel or supervisors in charge. Before the build starts, designated operators (qualified RoHS operator) must change to a new set of gloves or finger cots and put on ESD wrist strap. For easy identification, they are required to wear a green color arm band while working on the RoHS compliant process line. All line tools needed for the RoHS build are stored inside a cage trolley (with lock). Operators will draw the following set of items to use: tweezers, small chemical container for solvent, solder wire (lead free type), solder wick & eye loupe, soldering iron & exhaust fan, ESD tray (labeled with RoHS marking) & component bins. These items are

8 only used for RoHS builds, and after the build the tools are returned to the trolley for storage. Upon completion of the SMT process, all RoHS boards will have to be put on a designated ESD tray with RoHS marking. The remaining balance of RoHS materials/components after the SMT built is finished will be put inside the cage trolley (with lock) and returned back to MIN Centre. Control at Backend Operation Operators handling RoHS products must change to a new set of gloves or finger cots. They will need to wear a green color arm band for easy identification. Operators are to use designated RoHS ICT & FCT equipment to perform testing. All line tools needed for the RoHS build are stored inside a cage trolley (with lock). Operators will draw the following set of items to use: tweezers & small chemical container for solvent, eye loupe, ESD tray (labeled with RoHS marking) and screw bits. After the build they need to return these items to the trolley for storage. The remaining balance of RoHS materials after the backend operation is done, have to be put back in the cage trolley (with lock) and returned to MIN Centre. Only a designated trolley and trays are used to hold the RoHS boards. Production is to use a designated pillow pack station for packing all RoHS products. The exterior of the master carton will be affixed with a RoHS sticker. Control at ICT Debug Any boards that fail at ICT station are tagged with a RoHS rework traveller. Failed boards are channelled to ICT Debug room and recorded in the Incoming Record Book. Proper segregation is required for RoHS and non RoHS products. Debug board Use LCR meter to measure Inductor, Capacitor and Resistor, and Oscilloscope to check for signal, voltage and crystal. A separate set of test probes, tools and work station is used for RoHS products. Record the defect code on the Red arrow sticker and paste on to PCBA board defect location. False reject (NDF) boards will be consolidated with Rework Traveller (RoHS) and returned to production line for ICT testing. Component Changing on RoHS board Rework operator removes defective component with the aid of leister blower or soldering iron and de-soldering tool. A separate set of soldering iron tip, tools and work station is use for RoHS products. Reject component is placed into the "ICT Rejected Component" container.

9 Collect replacement RoHS component from the MIN centre to perform rework. Board returns to the line after rework Send for ICT testing with RoHS Rework Traveller Control at Functional Test Debug Boards flow from functional test line. Functional failed boards are tied with RoHS Functional Debug tag. Failed boards are channelled to the debug room and recorded in the Incoming Record Book. Proper segregation is required for RoHS and non RoHS products. Debug board A failed board is retested on the Functional tester to confirm the failure message. Passing boards will be recorded in the Functional Debug database. Board with no soldering rework will return to the production line with RoHS Rework Traveller for functional testing. A failed board will receive troubleshooting with the aid of an oscilloscope to check analog and digital, crystal signal, etc. A Multi-meter is used to check for open, short, component value, etc. A separate set of test probes, tools and work station is used for RoHS products. Write down defects code and component location on the Functional Debug tag and channel for rework. Component Changing on RoHS board A defective component is removed with the aid of Leister blower or soldering iron and de-soldering tool. A separate set of soldering iron tip, tools and work station is used for RoHS products. Collect replacement RoHS component from the MIN centre to perform rework. Board return to production line Passed boards will be tracked in the Functional Debug database. Remove Functional Debug tag. Board with RoHS soldering rework are returned to production for ICT testing. Board with no soldering rework done will return to production with the RoHS Rework Traveller for functional testing. Rejected Component Rejected components are placed into the Functional Rejected Component container, to be sent to "Material Review Board" for disposition. Control For RMA boards: RMA RoHS boards taken from store SAP reservation or MTT (Material Transfer Ticket) is raised to move RoHS boards from store to production WIP.

10 RoHS boards are sorted according to model and revision level. A brown color RMA Traveler Tag is used for RMA RoHS boards to move the RoHS boards from one operation to another. Use a new ESD Tray (labeled with RoHS marking) to hold RMA RoHS boards. Proper segregation is required for RoHS products. Functional /System test done to collect data. Draw RoHS Gold board from Production Engineering section. Use the correct RoHS functional tester and initialize the tester with the RoHS gold board. Test RMA RoHS boards after tester is initialized. Record the board s barcode serial number of the RoHS board that passes the test. Data will be input into SAP database system for Failure Reporting. Tagging of Failed RoHS Boards Write down the functional/system test error code on the RMA yellow tag. White color debug will be used as substitute. Tie the card to the failed RoHS board. Channel the failed boards to RoHS Debug section for repair. RoHS boards are debugged at RoHS Debug station Use the correct RoHS Line or Debug functional tester to debug RoHS boards. Write down the suspected RoHS component that needs to be changed on the card. Note: Use a separate set of test probe, tools and work station for RoHS products. RoHS boards are only reworked at the ROHS rework station Refer to the tag for which component requires rework. Remove the SMT RoHS component using Leister Hot-air blower. Remove PTH RoHS component using solder pot or solder removing tool. Remove the BGA component using SRT BGA machine Put the removed component onto IC tray or into ESD static bag. Check on SAP BOM on the RoHS component part number to be replaced. Clean the area after completing soldering of the RoHS component. Make sure that flux residue is minimized. Do a 100% visual inspection on the surrounding area of the reworked RoHS component. Channel the RoHS board for Functional/System test using RoHS testers only. Note: Use a separate set of soldering station, tools and work station for RoHS Products.

11 6.0 Adaptec Process Choices: Gintic Consortium Selection of the reflow profile was based on the study from the Gintic consortium. The consortium did an exhaustive evaluation on a wide spectrum of reflow profiles using different makes of solder pastes. Based on the evaluated results, the consortium recommended the linear profile. (See Appendix 3, Recommended Reflow Profile from Gintic Lead Free Consortium). With the reference profile received from the consortium, AMS has worked closely with the solder paste supplier C to fine tune the reflow process window according to the solder paste characteristics. In view of the increase in temperature and anticipation that it will take a longer time for the reflow process for the RoHS PCBA builds, AMS has acquired 8 to10 zone reflow ovens, to be RoHS compatible and to ensure the reliability of the soldering joints. It is a normal practice in AMS to do sampling X-ray inspection on BGA product, this requirement applies to both RoHS and non RoHS PCBA. AMS had also updated Adaptec Workmanship standard B-MF-1110 with those criteria for RoHS PCBA that will align with the IPC-A-610 Rev D. SMT/PTH VI operators were trained to inspect the RoHS compliant PCBA based on the new updated Adaptec Workmanship Standard. Adaptec Rework capabilities AMS is capable to carry out the all rework needs on the product, be it SMT or PTH components (e.g. BGA, PTH connector, etc) should there be any fallout from the production or due to engineering requirements. For the SMT or PTH rework, to prevent contamination during the transition period from a SnPb to the RoHS process, AMS has acquired a separate set of tools (e.g. soldering iron and mini solder pot) to ensure products are not contaminated by Pb on the manufacturing floor. For the BGA rework, a rework machine (Metcal APR5000XL) is capable to rework down to micro BGAs. Production operators were trained and certified to carry out the rework tasks with consistent results. X-ray inspection will be carried out on all reworked BGAs, to ensure the rework is done according to Adaptec Workmanship Standards B-MF-1110.

12 RoHS Mini Solder Pot for PTH Rework SMT Rework Soldering Irons (The unit on the left is the existing soldering iron, and the one on the right is the soldering iron used for RoHS PCBA)

13 Metcal, APR 5000XL BGA rework machine Appendix 1 (Extract of Evaluation Summary from Gintic Consortium Report).In terms of PCB finish stabilities after exposure to reflow cycles, Ag and NiAu surfaces were still solderable after 3 cycles in air. OSP was able to support soldering after at least a single reflow exposure in air (Section 8.1) the effects of thermal exposure in an air environment The results of wetting time and wetting force measurements, showed that Ag and NiAu PCB finishes were thermally more stable than immersion Sn and OSP and could be chosen for multiple reflows. Careful evaluation of coating thickness would be needed, if OSP finish was to be used with multiple air reflows and SnAgCu alloy.. (Section 3.3.7)

14 Appendix 2 (Extract form ASC29160LP Shear/Pull Test Data)

15 Appendix 3 (Recommended Reflow Profile from Gintic Lead Free Consortium)..For assessment #1 as shown in Table , test groups assembled with SnAgCu solder paste were grouped. By adding all the ranking scores, reflow profile #5 was found to be the best among all. For assessment #2 as shown in Table , test groups assembled with SnAgCu and SnAgCuBi solder pastes were grouped. Lead-free assemblies in this assessment were reflowed by same set of profile settings, as the melting points of SnAgCu and SnAgCuBi were very close. Again, profile #5 was found to be the best among all. For assessment #3 as shown in Table , test groups assembled with all lead-free solder pastes were considered. In this case, profile #3 was found to be the best followed by profile #5.. (Section )

16 Appendix 4 (Wetting Time and Wetting Force Charts)

17 Appendix 04 (Continue)

18 7.0 Adaptec Generic PCBA Assembly Process Flow for Double-Sided boards Process Raw material issue to production Verify IQA acceptance stamps on material received Pick & Place (Bottomside) SMT Reflow (Bottomside) Visual Inspection/ Touch Up PC2 For BGA Products only Failed X-ray Inspection BGA Rework Pass PC3 (Topside) Screen Printing Laser Barcoding Etching (if any) PC Pick & Place (Topside) PC2 For BGA Products only Screen Printing (Bottomside) PC1 SMT Reflow (Topside) X-ray Inspection Failed BGA Rework Pass Visual Inspection/ Touch Up PC3 A

19 A1 A Manual Insertion Wave Solder PC4 Visual Inspection/ Touch Up PC5 Rework In-Circuit Test (ICT) Yes Debug No Pass? Rework? No Functional Test (FCT) Yes ICT Stamping Debug No Yes Pass? Labeling FCT Stamping B

20 B QA Finished Goods Audit Packing Transfer to Finished Goods Store for customer shipment End

21 8.0 Adaptec RoHS Reliability Test Data (RRT, SLT) Adaptec performs periodic reliability testing on selected board products. With the early introduction of several RoHS compliant products, Adaptec has put five different lots through reliability testing to date with successful results. RRT - ROLLING RELIABILITY TEST To monitor the manufacturability & the ability of the assembly & test process during the product life cycle to identify potential reliability problems. To perform an on-going evaluation of product reliability in terms of defective rate. Temperature 60oC + 5oC Sample size 40 Burn-In for 168-hrs SLT - STRESS LIFE (OR STRIFE TEST) To detect early new product reliability deficiencies by means of stressed life testing Samples size 10, sampling rate quarterly 50 temperature cycles from -40oC to +65oC 2-second power ON/OFF cycling 1 minute at -30oC and at +55oC Test Type Prod Model Assembly Part No Mfg Datecode Sample Size Date Loaded Date Unload RRT ASC-39320A ROHS Nov-05 9-Nov-05 Pass RRT ASC-39320A ROHS Nov Nov-05 Pass SLT ASC-39320A ROHS Nov-05 9-Nov-05 Pass RRT ASC-39320A ROHS Nov Nov-05 Pass Result Test Type Prod Model Assembly Part No Mfg Datecode Sample Size Date On Date Off Result RRT AAR-1420SA ROHS Nov Nov-05 Pass 9.0 Adaptec Factory RoHS Audits: Adaptec s Singapore factory has been audited and certified by several major OEM customers, and found to be in compliance against their RoHS process, system and rework criteria. Adaptec s processes, part storage and segregation, line control & segregation, resources training etc are fully in place and ready for RoHS compliant manufacturing. To mention a few preparations, Adaptec has set up separate areas for storage of RoHS raw materials. Debug & RMA stations are also separated by standard materials vs. RoHS. FMEA & DOE on key processes were also carried out. People who are working on the RoHS compliant manufacturing line are clearly identified, and software was enhanced to effectively manage the issuing of RoHS material. Numerous procedures were also written and awareness training was conducted to ensure the people, processes & documentation were all aligned.

22 10.0 Adaptec ASICs in RoHS Compliant Form: Adaptec ASIC RoHS Product Conversion and Qualification Summary Adaptec s qualified ASIC package assembly suppliers (ASE, Amkor) are fully capable to support full compliance to the EU RoHS directive for shipment of products and packaging materials to Adaptec (for both lead-frame based and ball grid array packages). Adaptec s assembly suppliers have provided Adaptec with Certificate of Conformance and also their analysis reports on banned substances to assure Adaptec that all products and packing materials used for shipment are meeting the EU RoHS directive. Adaptec has conducted package qualifications on Pb-free/RoHS packages using a qualification matrix (see below) of selected products/packages. These are qualification vehicles to best represent both the lead-frame based, and ball grid array package families that are supplied by Adaptec to all its customers. The package qualification testing includes Adaptec s reliability tests such as High temp storage, Preconditioning, Temp cycle, THB and PCT/HAST that are in compliance to JEDEC standards. For each new Pb-free/RoHS compliant ASIC, Adaptec is adopting a new Part Number that will distinguish RoHS compliant devices/products from standard products, and this is clearly identified in the top marking of each device/package. Adaptec s device marking is compliant to JEDEC standard (JESD97). Adaptec s Pb-free/RoHS compliant ASICs are per MSL Level 3 per IPC/JEDEC J-STD- 020 for Moisture/Reflow Sensitivity Classification. Adaptec s Pb-free/RoHS compliant ASICs are per IPC/JEDEC J-STD-033 for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices. Adaptec s AIC Test Operation, FA/Rel Lab, Product Eng, SQE functions are ready to support transition from standard to Pb-free/RoHS compliant products to meet customer s fulfillment demands. Background Back in June 2004, Adaptec ASIC Package Engineering commenced upon gathering Material Technical Data sheets, Suppliers Reliability test data and Suppliers Pbfree/RoHS Roadmaps from Adaptec s ASIC Assembly suppliers for their readiness to comply with EU RoHS directive. The journey for ASICs to become compliant to Pbfree/RoHS was under the leadership of Package Engineering and became a sub-set of the corporate team effort to achieve EU RoHS directive compliance. This effort was supported by team participation from both AIM & AMS, from various functions such as Marketing, Business Units, ASIC Eng, Procurement, Planning, CQE, SQE, Reliability, FA, Product Eng, AIC Test Operations, and well supported by upper management.

23 Adaptec ASIC Conversion Strategy A recommended RoHS package qualification matrix comprising of both lead-frame based QFP/MQFP packages (208L, 28 x 28 x 3.4mm/0.5mm pitch and 128L, 14 x 20 x 2.7mm/0.5mm pitch) and Ball Grid Array packages (35 x 35mm/356 balls/1.27mm pitch/pbga, 35 x 35/596 balls/1.27mm pitch/tepbga-2/hsbga and 35 x 35mm/820 balls/1.00mm pitch TEPBGA-2/HSBGA) were coupled with various Adaptec die from TSMC s 0.6um, 0.18um and 0.13um process devices were selected as Qual vehicles. Adaptec reliability qualification reports including A-RQ-2071, A-RQ-2072, A-RQ-2073, A-RQ-2075 and A-RQ-2076 were released in mid All RoHS ASIC will carry a new part number for traceability and the topside marking will differentiate Pb-free/RoHS compliant from standard parts. Each production released RoHS p/n will be released through Agile with proper documentation and approval. Adaptec Material Choices The BOM (Bill of Materials) for ASIC package assembly are recommended by the ASIC assembly suppliers, and reviewed & approved by Adaptec Package Engineering. These materials include the molding compound, DA epoxy, substrate, and lead/ball finishing. The specific BOM for each ASIC assembly supplier for each ASIC part number is controlled by applicable Assembly/Marking specifications that are documented and released by Adaptec s document control center for controlled specification distribution to each qualified supplier. Adaptec s choice for 2 nd level interconnect terminal finish/material on lead-frame based packages used in board assembly is 100% Tin plated/matte finish. This applies to all QFP/MQFP/TQFP packages. Adaptec s choice for end level interconnect terminal on ball finish/solder on Ball Grid Array packages (including heat sink thermal enhanced packages) is SAC alloy with composition of Sn 96.5%/ Ag 3.0%/ Cu 0.5%. Adaptec Process Flow/Adaptec Generic Mfg Control plans Adaptec s AIC Test Operations has documented all pertinent specifications for manufacturing control plans, handling, processing and packing/shipments of Pbfree/RoHS ASICs to the end customers. Adaptec s process flow for ASIC assembly from each supplier is defined in the Customer Process Flow specifications and are controlled documentation. Any requested changes are reviewed and approved only by Adaptec. Adaptec Factory RoHS Audits All ASIC Assembly suppliers are subjected to periodic site audit by Adaptec s Supplier Quality Engineering. Typically, site audits are carried out once per year. Adaptec Rework capability Adaptec rework capability is limited, and any out-of-spec ASICs are generally scrapped or RMA back to assembly suppliers for rework. Any release of out of spec ASICs that are deemed to have no impact to form, fit, and function (e.g. top marking error) will only be released for shipment through an EDA document that is approved by appropriate authority.

24 ASSEMBLY SUPPLIER - AMKOR ASSEMBLY SUPPLIER - ASE TEST VEHICLES AMKOR - TEBGA-2 AMKOR - PBGA AMKOR - HSBGA AMKOR - MQFP AMKOR - MQFP ASE - HSBGA ASE - HSBGA ASE - PBGA Product Name Rocket (AIC-7942W) Harpoon2B (AIC-7902W) Razor (AIC-9410W) (AIC-3860Q) (AIC-6915BP) Razor (AIC-9410W) Rocket (AIC-7942W) Harpoon2B (AIC-7902W) Body Size mm 35 x x x x x x x x 35 Ball/ Lead Count Ball Pitch/Lead Pitch (mm) Pkg Thickness (mm) Perimeter & Thermal Row Balls Perim + Thermal ball Perim + Thermal ball Perim + Thermal ball N/A N/A Perim + Thermal ball Perim + Thermal ball Perim + Thermal ball Die Size mm 14.0 x x x x x x x x 9.92 Die Thickness (mils) Wire Type/Size (Au/ mil) Au / 1.0 Au / 1.0 Au/0.9 Au / 1.0 Au / 1.2 Au/0.9 Au / 1.0 Au / 1.0 Die Passivation Polyimide Polyimide Polyimide SiN SiN Polyimide Polyimide Polyimide Bond Pad Pitch (um) ~ ~ Die Pad Configuration Staggered (2) In-line In-Line Linear Linear In-Line Staggered (2) In-Line Substrate Thickness (mm) N.A. N.A Substrate No Layer N/A N/A Substrate Material (Core/Solder Mask) E679FGB / AUS308 E679FGB / AUS308 BT832NX/AUS308 Copper etched Copper etched BT832NX/AUS308 BT832NX/AUS308 BT832NX/AUS308 Die Attach Material Able2300 Able2300 Able2300 Ablestik 3230 Ablestik 3230 Able2300 Able2300 Able2300 Molding Cpd Material Sumi G770 Sumi G770 Sumi G770 Sumi G700M Sumi G700M Sumi G770 Sumi G770 Sumi G770 Solder Ball/Lead Finishing 96.5Sn / 3.0Ag / 0.5Cu 96.5Sn / 3.0Ag / 0.5Cu 96.5Sn / 3.0Ag / 0.5Cu 100% Matte Sn 100% Matte Sn 96.5Sn / 3.0Ag / 0.5Cu 96.5Sn / 3.0Ag / 0.5Cu 96.5Sn / 3.0Ag / 0.5Cu Solder Ball Diameter (mm) N/A N/A MRT Class /Temp L3/ 260 C L3/ 260 C L3/ 260 C L3/ 260 C L3/ 260 C L3/ 260 C L3/ 260 C L3/ 260 C RELIABILITY TESTS AMKOR TEST RESULTS ASE TEST RESULTS Wafer Lot # FG FG N BY BY N FH FG0157.4, FG Part Number A. MRT L3 / 260 C Passed Passed Passed Passed Passed Passed Passed Passed (260 C X3 FCR Reflow / 192 hrs) 0/31 0/31, 0/31 0/31 0/31, 0/31, 0/31 0/31, 0/31, 0/31 0/31 0/31 0/31, 0/31 B. Unbiased HAST L3 260 C Passed Passed Passed Passed Passed Passed Passed Passed (130 C / 85% RH / 96 hrs) 0/31 0/31, 0/31 0/31 0/31, 0/31, 0/31 0/30, 0/31, 0/31 0/31 0/31 0/31, 0/31 C. Temp Cycle C precon Passed Passed Passed Passed Passed Passed Passed Passed (-55 C/ 125 C / 1000 cycles) 0/30 0/31, 0/31 0/31 0/31, 0/31, 0/31 0/31, 0/31, 0/31 0/31 1/31 0/31, 0/31 D. High Temp Storage 260 C precon Passed Passed Passed Passed Passed Passed Passed Passed (150 C / 1000 hrs) 0/31 0/31, 0/31 0/31 0/31, 0/31, 0/31 0/31, 0/31, 0/31 0/30 0/31 0/31, 0/31 E. HAST (biased) Passed Passed Passed Passed Passed Passed Passed Passed (130 C / 85% RH/96 hrs) 0/31 0/31, 0/31 0/31 0/30 1/31 0/31, 0/31 F. THB (Temp Humidity Bias) Passed Passed (85 C / 85% RH/1000 hrs) N/A N/A N/A 0/31, 0/31, 0/31 0/31, 0/31, 0/31 N/A N/A N/A Test results shown above are indicative of any confirmed failures specifc only to packaging related issues.

25 11.0 Adaptec RoHS Product Builds (PCBA) and Qualification test results In preparation for the coming transition to manufacturing & processing of RoHS compliant products, Adaptec has run a numbers of evaluation builds to assess factory readiness. During these builds, solder paste with SAC solder alloy, RoHS compliant components, Lead free SMT, and wave-soldering were employed. All the indirect material and equipment (i.e. soldering iron, soldering wire, board carriers, rework tools, etc) were newly purchased and set apart for the RoHS builds. Several early RoHS process builds were conducted and evaluated for products where most (but not 100%) of the components were RoHS compliant. Efforts were made to obtain as many RoHS compliant components as were available at the time. The RoHS processing experience and the evaluation results from these early builds were beneficial to Adaptec as we prepared for the first 100% fully RoHS compliant product builds. The first several 100% RoHS compliant product builds were closely monitored and the boards were subjected to reliability testing and cross sectioning. Refer to the individual Adaptec RoHS product qualification reports for full details on the following products: RoHS-Qualification, ASC-39320A (1) Host Bus Adapter, 3/22/05 RoHS-Qualification, AFW-2100, PCI Host Adapter Card, 4/27/05 RoHS-Qualification, ASC-39320A (2) Host Bus Adapter, 6/20/05