On the Relationship between Semiconductor Manufacturing Volume, Yield, and Reliability
|
|
- Chester Jones
- 6 years ago
- Views:
Transcription
1 On the Relationship between Semiconductor Manufacturing Volume, Yield, and Reliability Microelectronics Reliability & Qualification Working Meeting February 8, 2017 Dr. Jeffrey Siddiqui, Dr. John Ortega, Mr. Brian Albus Reliability Team, Microelectronics Test Branch, Defense Microelectronics Activity (DMEA) 23-Feb-17 Page-1
2 Outline Motivation Defining Volume Reliability Bathtub Curve Reliability and Yield Reliability Best Practices by Volume Conclusions 23-Feb-17 Page-2
3 Motivation Generally accepted: High Volume (HV) High Yield High Reliability Model for semiconductor suppliers to high demand consumer markets Potentially concerning misconception: Low Volume (LV) Low Yield Low Reliability Can incorrectly be concluded if one applies HV practices to a LV line In reality, LV manufacturers have evolved different reliability best practices Reliability Group has been engaged to explore and clarify the links between volume, yield, and reliability Important to educate key decision makers in industry and government so that they can make the most informed decisions with respect to funding and policy 23-Feb-17 Page-3
4 Defining Volume We discuss volume as manufacturing volume or the amount of products that can be generated by a manufacturing line High Volume (HV) Moore s Law High demand commercial electronics market Short market windows Low Volume (LV) Niche Markets Military, Medical, Aerospace, Automotive, etc. Harsh environments Longer lifetimes More critical consequences with respect to reliability failures Both suppliers are required to provide reliable product 23-Feb-17 Page-4
5 Yield Yield is the percentage of product that functions correctly at the conclusion of manufacturing Determined by end-of-line electrical testing (aka yield testing) Yield is limited by defects created during manufacturing Figurative semiconductor wafer (chips failing yield testing highlighted in red) 23-Feb-17 Page-5
6 Reliability: The Bathtub Curve [Adapted from McPherson Reliability Physics and Engineering] Looking for links between reliability, yield, and volume 23-Feb-17 Page-6
7 Bathtub Curve: Early Life Early Life [Adapted from McPherson Reliability Physics and Engineering] Initially high declining failure rate Early life failures which must be addressed before fielding a product Here is where the link between yield and reliability can be found Manipulating this link is where HV and LV manufacturers have evolved different engineering practices 23-Feb-17 Page-7
8 The Link: Defects Early life failures and yield failures have the same root cause Defects: Any non-ideality introduced during the fabrication process Particles, voids, non-uniformity, contamination, misalignments, etc. Particle example below Example: Figurative particles defects [Adapted from Shirley IRPS 1995 ] Defect size density relationships [Adapted from Shirley 1995 and Wakai et al. RAMS 2008] 23-Feb-17 Page-8
9 Qualitative Analysis Yield Failures and Early Life Reliability failures share a common root cause Manufacturing defects Relationship Yield failure defects (D Y ) and Early Life failure defects (D EL ) share common sources while differing in size or impact on the circuit How do you improve yield (product you sell)? How do you improve early life reliability yield (product returns)? Option 1: Reduce the defects (Yield Learning) Option 2: Don t deliver the defects (Screening) 23-Feb-17 Page-9
10 Yield and Early Life Reliability Defects Yield (Y) Function of the density of yield failure causing defects (D Y ) Y = M exp ( D Y A) Early Life reliability (R EL ) Function of the density of early life failure causing defects (D EL ) R EL = exp ( D EL A) 23-Feb-17 Page-10 [Kuper IRPS 1996 ]
11 Early Life Reliability Y = M exp( D Y A) R EL = exp D EL A Link between Y and Y r... α = D EL D Y R EL = Y M α Original wafer before yield learning or screening 23-Feb-17 Page-11
12 Early Life Reliability Y = M exp( D Y A) R EL = exp D EL A Link between Y and Y r... α = D EL D Y R EL = Y M α 23-Feb-17 Page-12
13 Early Life Reliability Y = M exp( D Y A) R EL = exp D EL A Link between Y and Y r... α = D EL D Y R EL = Y M α 23-Feb-17 Page-13
14 Early Life Reliability Y = M exp( D Y A) R EL = exp D EL A They Both Work! Link between Y and Y r... α = D EL D Y R EL = Y M α 23-Feb-17 Page-14
15 High Volume Approach to Early Life Reliability Global consumer electronics business case: maximize saleable product per time when in profit generating market window Yield learning maximizes saleable product per wafer High volume and throughput, required by business case, lead to faster learning cycles and more return on yield learning investment Efforts reduce both D Y and D EL Cost of yield learning recouped by revenue from selling high volume of products through high yield llines In order to meet market window leading edge, screening practices used to sell product from lots with lower yields Minimizing time-to-market and maximizing saleable product are both advantageous HV Manufacturers will use a mix of Yield Learning and Screening, with a preference for Yield Learning 23-Feb-17 Page-15
16 Low Volume Approach to Early Life Reliability With fewer resources, the large investment in yield learning makes less sense The large volumes to learn quickly and efficiently do not exist Yield learning still undertaken, just to less extent than for HV manufacturers Screening instead is the preferred method to deliver product with high early life reliability Screening increases scrap, reduces throughput, and thus increases cost Screening applied on per product basis allowing costs to be charged only to customers willing to pay Product that is delivered early life reliability required by customer Niche market customers are willing to wait and pay for added inspection time and increased cost of screening 23-Feb-17 Page-16
17 Conclusions: Volume, Yield, and Reliability Bathtub curve provides proper context to understand this topic The often referenced link between yield and reliability is between yield and early life reliability The link is defects Defects can be addressed by a mix of yield learning and screening engineering practices Economics and market factors drive HV and LV manufacturers to choose a different mix of engineering resources, which do have an effect on yield and reliability Both HV and LV manufactures can successfully manufacture highly reliable products 23-Feb-17 Page-17
18 The End 23-Feb-17 Page-18
19 Back Matter Appendix A: References 23-Feb-17 Page-19
20 Appendix A: References F. Kuper, J. van der Pol, E. Ooms, T. Johnson, R. Wijburg, W. Koster and D. Johnston, "Relation between yield and reliability of integrated circuits: experimental results and application to continuous early failure rate reduction programs," Reliability Physics Symposium, th Annual Proceedings., IEEE International, pp , N. Wakai, Y. Kobira and H. Egawa, "Consideration of Burn-In Acceleration and Effective Screening Procedure in Latest System LSI," Reliability and Maintainability Symposium, RAMS Annual, pp , J. W. McPherson, Reliability Physics and Engineering, New York: Springer Cham Heidelberg, H. H. Huston and C. P. Clark, "Reliability Defect Detection and Screening During Processing - Theory and Implementation," Reliability Physics Symposium th Annual Proceedings., International, pp , S. Salemi, L. Yang, J. Dai, J. Qin and J. B. Bernstein, Physics-of-Failure Based Handbook of Microelectronic Systems, Reliability Information Analysis Center, C. G. Shirley, "A Defect Model of Reliability," Reliability Physics Symposium 1995, Tutorial. J. van der Pol, E. Ooms, T. van 't Hof and F. Kuper, "Impact of Screening of Latent Defects at Electrical Test on the Yield- Reliability Relation and Application to Burn-in Elimination," International Reliability Physics Symposium, Reno, L. Milor, "A Survey of Yield Modeling and Yield Enhancement Methods," IEEE Transactions on Semiconductor Manufacturing, vol. 26, no. 2, May 2013, pp , C. Weber, "Yield Learning and the Sources of Profitability in Semiconductor Manufacturing and Process Development," IEEE Transactions on Semiconductor Manufacturing, vol. 17, no. 4, November 2004, pp , E. Wang and R. Akella, "Resource Allocation for Yield Learning in Semiconductor Manufacturing," Advanced Semiconductor Manufacturing Conference and Workshop, ASMC 95 Proceedings. IEEE/SEMI 1995, pp , R. Rajsuman, "Iddq Testing for CMOS VLSI," Proceedings of the IEEE, vol. 88, no. 4, April 2000, pp , K. Kim, W. Kuo and W. Luo, " A relation model of gate oxide yield and reliability," Microelectronics Reliability, vol. 44, pp , K. Flamm, "Moore's Law and the Economics of Semiconductor Price Trends," in Productivity and Cyclicality in Semiconductors: Trends, Implications, and Questions -- Report of a Symposium, National Research Council of the National Academies, 2004, pp R. D. J. Heller, " Near Neighbor Sort Yield and Wafer Sort Yield Impact on Product Burn-In and a Time Dependent Reliability Study," in International Reliability Physics Symposium, Pasadena, CA, M. White and J. Bernstein, Microelectronics Reliability: Physics-of-Failure Based Modeling and Lifetime Evaluation, NASA Jet Propulsion Laboratory, Pasadena, Feb-17 Page-20
Improvement of Laser Fuse Processing of Fine Pitch Link Structures for Advanced Memory Designs
Improvement of Laser Fuse Processing of Fine Pitch Link Structures for Advanced Memory Designs Joohan Lee, Joseph J. Griffiths, and James Cordingley GSI Group Inc. 60 Fordham Rd. Wilmington, MA 01887 jlee@gsig.com
More informationElectronic Part Obsolescence Forecasting
Electronic Part Obsolescence Forecasting Pro-Active Approaches to Part Obsolescence Management Understanding that electronic part obsolescence is going to be a significant contributor to system sustainment
More informationProcess Optimization in Post W CMP In-situ Cleaning. Hong Jin Kim, Si-Gyung Ahn, Liqiao Qin CMP, Advanced Module Engineering GLOBALFOUNDRIES, USA
Process Optimization in Post W CMP In-situ Cleaning Hong Jin Kim, Si-Gyung Ahn, Liqiao Qin CMP, Advanced Module Engineering GLOBALFOUNDRIES, USA Contents W CMP process for sub 14nm device W Gate CMP W
More informationCritical Review of US Military Environmental Stress Screening (ESS) Handbook
Critical Review of US Military Environmental Stress Screening (ESS) Handbook Nga Man Li and Dr. Diganta Das Center for Advanced Life Cycle Engineering(CALCE), University of Maryland nmjli2@umd.edu, diganta@umd.edu
More informationOptimizing the Revenue for Ad Exchanges in Header Bidding Advertising Markets
217 IEEE International Conference on Systems, Man, and Cybernetics (SMC) Banff Center, Banff, Canada, October 5-8, 217 Optimizing the Revenue for Ad Exchanges in Header Bidding Advertising Markets Rui
More informationMore Reliable Software Faster and Cheaper An Overview. John D. Musa
More Reliable Software Faster and Cheaper An Overview John D. Musa j.musa@ieee.org Most Important Software Problem 1. Customers demand (in average order): A. More reliable software B. Faster (includes
More informationLecture 22: Integrated circuit fabrication
Lecture 22: Integrated circuit fabrication Contents 1 Introduction 1 2 Layering 4 3 Patterning 7 4 Doping 8 4.1 Thermal diffusion......................... 10 4.2 Ion implantation.........................
More informationMicroelectronics Reliability
Microelectronics Reliability 52 (2012) 2627 2631 Contents lists available at SciVerse ScienceDirect Microelectronics Reliability journal homepage: www.elsevier.com/locate/microrel Investigation on CDM
More informationMining IC Test Data to Optimize VLSI Testing
1 Mining IC Test Data to Optimize VLSI Testing Tony Fountain Thomas Dietterich Bill Sudyka San Diego Supercomputer Center Computer Science Dept. Hewlett Packard Co. University of California, San Diego
More informationAdvanced STI CMP Solutions for New Device Technologies
Advanced STI CMP Solutions for New Device Technologies Jeffrey David, Benjamin A. Bonner, Thomas H. Osterheld, Raymond R. Jin Applied Materials, 3111 Coronado Drive, M/S 1510, Santa Clara, CA 95054 (408)986-3277
More informationCustomizing Processes for Hermetic Assembly Of Devices Designed for Plastic Packages (1 of 3)
Customizing Processes for Hermetic Assembly Of Devices Designed for Plastic Packages (1 of 3) Charlie C. Megia Golden Altos Corporation 402 South Hillview Drive, Milpitas, CA 95035 cmegia@goldenaltos.com
More informationDFR ROI: Calculating ROI When Implementing a DFR Program
PRESENTATION ON DFR ROI: Calculating ROI When Implementing a DFR Program BY Mike Silverman, CRE, Ops A La Carte LLC Agenda Background/Introduction Reliability Program Assessment DFR ROI Calculator Example
More informationDispatching for order-driven FABs with backward pegging
PRODUCTION & MANUFACTURING RESEARCH ARTICLE Dispatching for order-driven FABs with backward pegging Yong H. Chung 1, S. Lee 1 and Sang C. Park 1 * Received: 17 May 2016 Accepted: 04 August 2016 First Published:
More informationChallenges and Future Directions of Laser Fuse Processing in Memory Repair
Challenges and Future Directions of Laser Fuse Processing in Memory Repair Bo Gu, * T. Coughlin, B. Maxwell, J. Griffiths, J. Lee, J. Cordingley, S. Johnson, E. Karagiannis, J. Ehrmann GSI Lumonics, Inc.
More informationWhy Does It Cost How Much? Edwin B. Dean * NASA Langley Research Center Hampton VA
Why Does It Cost How Much? Edwin B. Dean * NASA Langley Research Center Hampton VA Abstract There is great concern for the competitiveness of the aerospace industry today. This paper examines the concept
More informationFast Wafer Level Reliability Program (WLR)
Fast Wafer Level Reliability Program (WLR) Georgetown, TX 78626 sales@reedholm.com Tel: 1.512.876.2268 www.reedholm.com Table of Contents Table of Contents Page Chapter 1: Company Information... 5 Instrumentation
More informationWorkShop Audace. INSA ROUEN 8 juin 2012
WorkShop Audace INSA ROUEN 8 juin 2012 Global Standards for the Microelectronics Industry JEDEC standards for product level qualification Christian Gautier Content JEDEC overview Environmental reliability
More informationIdentification of Rogue Tools and Process Stage Drift by using JMP Software Visualization and Analytical Techniques
September 16 th, 2010 Identification of Rogue Tools and Process Stage Drift by using JMP Software Visualization and Analytical Techniques Jim Nelson Engineering Data Specialist, Freescale Semiconductor,
More informationImpact of Filament Evolution on Reliability Issues of Oxide Electrolyte Based Conductive Bridge Random Access Memory
Impact of Filament Evolution on Reliability Issues of Oxide Electrolyte Based Conductive Bridge Random Access Memory Hangbing Lv, Xiaoxin Xu, Hongtao Liu, Qing Luo, Qi Liu, Shibing Long, Ming Liu* Institute
More informationAustralian Journal of Basic and Applied Sciences. Pb-Free Solder Ball Robustness Comparison under AC and TC Reliability Test
AENSI Journals Australian Journal of Basic and Applied Sciences ISSN:1991-8178 Journal home page: www.ajbasweb.com Pb-Free Solder Ball Robustness Comparison under AC and TC Reliability Test 1,2 Tan Cai
More informationIEOR 130 Methods of Manufacturing Improvement Practice Examination Problems Part I of Course Prof. Leachman Fall, 2017
IEOR 130 Methods of Manufacturing Improvement Practice Examination Problems Part I of Course Prof. Leachman Fall, 2017 1. The thickness of a film deposited on wafers at a particular process step is subject
More informationSimulation-based Smart Operation Management System for Semiconductor Manufacturing
Simulation-based Smart Operation Management System for Semiconductor Manufacturing Byoung K. Choi 1*, and Byung H. Kim 2 1 Dept of Industrial & Systems Engineering, KAIST, Yuseong-gu, Daejeon, Republic
More informationImplementing Advanced Planning and Scheduling (APS) System for. Semiconductor Manufacturing: A Case at Korean Semiconductor. Manufacturing Company
Implementing Advanced Planning and Scheduling (APS) System for Semiconductor Manufacturing: A Case at Korean Semiconductor Manufacturing Company Seung-Kil Lim Division of e-businessit, Sungkyul University,
More informationSignature Failure Analysis-Based Methodology for Customer Failure Analysis
Signature Failure Analysis-Based Methodology for Customer Failure Analysis SEMATECH and the SEMATECH logo are registered service marks of SEMATECH, Inc. and the logo are registered service marks of, Inc.,
More informationVLSI Technology. By: Ajay Kumar Gautam
By: Ajay Kumar Gautam Introduction to VLSI Technology, Crystal Growth, Oxidation, Epitaxial Process, Diffusion Process, Ion Implantation, Lithography, Etching, Metallization, VLSI Process Integration,
More informationIMPACT OF CONTROL PLAN DESIGN ON TOOL RISK MANAGEMENT: A SIMULATION STUDY IN SEMICONDUCTOR MANUFACTURING
Proceedings of the 2011 Winter Simulation Conference S. Jain, R.R. Creasey, J. Himmelspach, K.P. White, and M. Fu, eds. IMPCT OF CONTROL PLN DESIGN ON TOOL RISK MNGEMENT: SIMULTION STUDY IN SEMICONDUCTOR
More informationClustering Based Evaluation of IDDQ Measurements: Applications in Testing and Classification of ICs
Clustering Based Evaluation of IDDQ Measurements: Applications in Testing and Classification of ICs Sri Jandhyala *, Hari Balachandran *, Manidip Sengupta*, Anura P. Jayasumana ** * Texas Instruments Inc.,
More informationGaAs MMIC Space Qualification
GaAs MMIC Space Qualification GaAs MMIC Testing TriQuint Semiconductor has advanced Lot Acceptance Testing (LAT) for High Reliability Applications of GaAs MMICs. A flowchart depicting the entire MMIC processing
More informationReliability Analysis Techniques: How They Relate To Aircraft Certification
Reliability Analysis Techniques: How They Relate To Aircraft Certification Mark S. Saglimbene, Director Reliability, Maintainability and Safety Engr., The Omnicon Group, Inc., Key Words: R&M in Product
More informationCMP challenges in sub-14nm FinFET and RMG technologies
CMP challenges in sub-14nm FinFET and RMG technologies Tae Hoon Lee*, Hong Jin Kim, Venugopal Govindarajulu, Gerett Yocum & Jason Mazzotti Advanced Module Engineering NCCAVS CMPUG Spring Meeting 2016 Contents
More informationStatement of Work (SOW) inemi MEMS Technology MEMS Reliability Methodologies Project (Inertial Sensors)
Statement of Work (SOW) inemi MEMS Technology MEMS Reliability Methodologies Project (Inertial Sensors) Version #2.1 Date: November 1, 2012 Project Leader: TBD Co-Project Leader: TBD inemi Support Staff:
More informationRobustness and Reliability - Facing new Quality Levels for Automotive ICs with Design for Yield
International Cooperation Forum Automotive IC-Design Challenges Strategies Trends Munich, Germany, October 25, 2005 Robustness and Reliability - Facing new Quality Levels for Automotive ICs with Design
More informationDAS Analytics. Using Data Analytics to Achieve Greater Success
Using Data Analytics to Achieve Greater Success Challenges Companies are identifying, collecting and storing more data than ever Storing Unnecessary Information Not Capitalizing on Fleeting Opportunities
More informationNondestructive Internal Inspection. The World s Leading Acoustic Micro Imaging Lab
Nondestructive Internal Inspection The World s Leading Acoustic Micro Imaging Lab Unmatched Capabilities and Extensive Expertise At Your Service SonoLab, a division of Sonoscan, is the world s largest
More informationBOROFLOAT & Glass Wafers: A Union of Inspiration & Quality
Home Tech SCHOTT North America, Inc. 553 Shepherdsville Road Louisville, KY 4228 USA Phone: +1 (52) 657-4417 Fax: +1 (52) 966-4976 Email: borofloat@us.schott.com www.us.schott.com/borofloat/wafer BOROFLOAT
More informationBusiness level strategy SAMSUNG
Business level strategy SAMSUNG From business-level strategies, a competitive advantage of a business can be created over its rivals. Differentiation vs. cost leadership The company has an experience of
More informationEstimation of Reliability and Cost Relationship for Architecture-based Software
International Journal of Automation and Computing 7(4), November 2010, 603-610 DOI: 10.1007/s11633-010-0546-0 Estimation of Reliability and Cost Relationship for Architecture-based Software Hui Guan 1,
More informationNOVEL MATERIALS FOR IMPROVED QUALITY OF RF-PA IN BASE-STATION APPLICATIONS
Novel Material for Improved Quality of RF-PA in Base-Station Applications Co-Authored by Nokia Research Center and Freescale Semiconductor Presented at 10 th International Workshop on THERMal INvestigations
More informationPLUS VALUE STREAM MAPPING
LEAN PRINCIPLES PLUS VALUE STREAM MAPPING Lean Principles for the Job Shop (v. Aug 06) 1 Lean Principles for the Job Shop (v. Aug 06) 2 Lean Principles for the Job Shop (v. Aug 06) 3 Lean Principles for
More informationTin Whiskers Remain A Concern
Tin Whiskers Remain A Concern Michael Osterman, Research Scientist, Center for Advanced Life Cycle Engineering, University of Maryland The elimination of lead in electronic equipment due to governmental
More informationMonopoly Behavior or Price Discrimination Chapter 25
Monopoly Behavior or Price Discrimination Chapter 25 monoply.gif (GIF Image, 289x289 pixels) http://i4.photobucket.com/albums/y144/alwayswondering1/monoply.gif?... Announcement Pre-midterm OH: Grossman
More informationOverview Day One. Introduction & background. Goal & objectives. System Model. Reinforcement Learning at Service Provider
Overview Day One Introduction & background Goal & objectives System Model Reinforcement Learning at Service Provider Energy Consumption-Based Approximated Virtual Experience for Accelerating Learning Overview
More informationUltra High Barrier Coatings by PECVD
Society of Vacuum Coaters 2014 Technical Conference Presentation Ultra High Barrier Coatings by PECVD John Madocks & Phong Ngo, General Plasma Inc., 546 E. 25 th Street, Tucson, Arizona, USA Abstract Silicon
More informationMining IC Test Data to Optimize VLSI Testing
Mining IC Test Data to Optimize VLSI Testing Tony Fountain San Diego Supercomputer Center UCSD, 9500 Gilman Dr. La Jolla, CA 9093 (5) 53-37 fountain@sdsc.edu Thomas Dietterich Oregon State University 303
More informationTECHNICAL COMMITTEE 1 EMC Management
TECHNICAL COMMITTEE 1 EMC Management Date: November 6, 1998 TO: Andrew Podgorski: Technical Advisory Committee Chair TOTAL PAGES INCLUDING THIS PAGE: 5 From: TC-1 Chair FAX No: (248) 208-2018 Voice: (248)
More informationDEPARTMENT OF DEFENSE HANDBOOK DOSE-RATE HARDNESS ASSURANCE GUIDELINES
NOTICE OF CHANGE METRIC MIL-HDBK-815 10 January 2002 DEPARTMENT OF DEFENSE HANDBOOK DOSE-RATE HARDNESS ASSURANCE GUIDELINES TO ALL HOLDERS OF MIL-HDBK-815: 1. THE FOLLOWING PAGES OF MIL-HDBK-815 HAVE BEEN
More informationThe Robustness Of Non-Decreasing Dynamic Pricing Laura van der Bijl Research Paper Business analytics Aug-Oct 2017 Prof.
The Robustness Of Non-Decreasing Dynamic Pricing Laura van der Bijl Research Paper Business Analytics Aug-Oct 2017 The Robustness Of Non-Decreasing Dynamic Pricing Laura van der Bijl Laura.vanderbijl5@gmail.com
More informationAutomotive Industry Solutions
Automotive Industry Solutions Solutions for the Automotive Industry To the machine, give the work. To the people, give the thrill of creation. Kazuma Tateishi, Omron Founder 2 Building excellence in automotive
More informationQ - water 3. Q - water. Q - water. Q - water. A new equimarginal condition. Lecture 21 & 22. A single farmer. A single farmer.
Lecture 21 & 22 A new equimarginal condition First Second The efficient allocation of a resource at one point in time, the case of surface water. Third - The MNB to every user should be equal at the efficient
More informationDistributed Algorithms for Resource Allocation Problems. Mr. Samuel W. Brett Dr. Jeffrey P. Ridder Dr. David T. Signori Jr 20 June 2012
Distributed Algorithms for Resource Allocation Problems Mr. Samuel W. Brett Dr. Jeffrey P. Ridder Dr. David T. Signori Jr 20 June 2012 Outline Survey of Literature Nature of resource allocation problem
More informationSYED ALAM GREG DOUGLASS
SYED ALAM GREG DOUGLASS In 1965, Dr. Gordon Moore suggested that semiconductor companies would double the number of transistors in an integrated circuit every two years. For 50 years or about 40 years
More informationEPOXY FLUX MATERIAL AND PROCESS FOR ENHANCING ELECTRICAL INTERCONNECTIONS
As originally published in the SMTA Proceedings. EPOXY FLUX MATERIAL AND PROCESS FOR ENHANCING ELECTRICAL INTERCONNECTIONS Neil Poole, Ph.D., Elvira Vasquez, and Brian J. Toleno, Ph.D. Henkel Electronic
More informationBayesian Estimation of Defect Inspection Cycle Time in TFT-LCD Module Assembly Process
Bayesian Estimation of Defect Inspection Cycle Time in TFT-LCD Module Assembly Process Chien-wen Shen Abstract The defect inspection station is one of the major processes in module assembly stage of TFT-LCD
More informationDesign and Implementation of Vending Machine using Verilog HDL on FPGA
Design and Implementation of Vending Machine using Verilog HDL on FPGA Abhishek Luthra 1, Akshat Jain 1, Parnika Mishra 2, Vikas Gupta 3, Sunil Aggarwal 4 UG Student, Dept. of ECE, University Institute
More informationALTERNATIVE SPECIAL PROCESSES DOCUMENT LIST. Prepared by: Component: Date:
Document No. A10464 326 IBM Road, Building 862 CAGE Code: 05606 Williston, VT 05495 Revision D 25 June 2010 Revision E 21 December 2010 Revision F 16 March 2012 Revision G 28 August 2012 Revision H 10
More informationJUL 14 Rev B All Paragraphs Revised
Quality Specification 102-32039 22 JUL 14 Rev B All Paragraphs Revised Counterfeit Electronic Parts Detection and Avoidance System 1. PURPOSE 1.1. Content The purpose of this document is to describe the
More informationDallas Semicoductor DS80C320 Microcontroller
Construction Analysis Dallas Semicoductor DS80C320 Microcontroller Report Number: SCA 9702-525 Global Semiconductor Industry the Serving Since 1964 15022 N. 75th Street Scottsdale, AZ 85260-2476 Phone:
More informationAjay Kumar Gautam [VLSI TECHNOLOGY] VLSI Technology for 3RD Year ECE/EEE Uttarakhand Technical University
2014 Ajay Kumar Gautam [VLSI TECHNOLOGY] VLSI Technology for 3RD Year ECE/EEE Uttarakhand Technical University Page1 Syllabus UNIT 1 Introduction to VLSI Technology: Classification of ICs, Scale of integration,
More informationPCTB PC-LAB. Power Cycling Testbench for Power Electronic Modules. Power Cycling Test Laboratory
PCTB Power Cycling Testbench for Power Electronic Modules PC-LAB Power Cycling Test Laboratory Technical Information PCTB power cycling test bench alpitronic has many years of experience in developing
More informationAccenture Architecture Services. DevOps: Delivering at the speed of today s business
Accenture Architecture Services DevOps: Delivering at the speed of today s business What is DevOps? IT delivery supporting the new pace of business Over the last 10 years, the nature of IT delivery has
More informationChanging Test and Data Modeling Requirements for Screening Latent Defects as Statistical Outliers
Latent-Defect Screening Changing Test and Data Modeling Requirements for Screening Latent Defects as Statistical Outliers Ritesh P. Turakhia and W. Robert Daasch Portland State University Joel Lurkins
More informationA PACKAGING PHYSICS OF FAILURE BASED TESTING METHODOLOGY FOR SEMICONDUCTOR IC PART RELIABILITY ASSESSMENT
As originally published in the SMTA Proceedings. A PACKAGING PHYSICS OF FAILURE BASED TESTING METHODOLOGY FOR SEMICONDUCTOR IC PART RELIABILITY ASSESSMENT Jingsong Xie and Ming Sun RelEng Technologies,
More informationIn-situ Sensors for Product Reliability Monitoring
In-situ Sensors for Product Reliability Monitoring Satchidananda Mishra, Michael Pecht * and Douglas L. Goodman ** * CALCE Electronic Products and Systems Center; ** Ridgetop Group, Inc. ABSTRACT Some
More informationBottleneck Detection of Manufacturing Systems Using Data Driven Method
Proceedings of the 2007 IEEE International Symposium on Assembly and Manufacturing Ann Arbor, Michigan, USA, July 22-25, 2007 MoB2.1 Bottleneck Detection of Manufacturing Systems Using Data Driven Method
More informationApproved for public release; distribution is unlimited.
Avoiding Counterfeit Electronic Components NASA Quality Leadership Forum, March 28 & 29, 2007 Counterfeit EEE Parts Panel Henry Livingston, BAE Systems Definitions Counterfeit Electronic Component Equipment
More informationIMPACT OF FIRING TEMPERATURE PROFILES ON LOCAL BSF FORMATION IN PERC SOLAR CELLS
IMPACT OF FIRING TEMPERATURE PROFILES ON LOCAL BSF FORMATION IN PERC SOLAR CELLS S. Mack1, P. Richter2, S. Werner1, F. Clement1, A. Wolf1 1Fraunhofer-Institute for Solar Energy Systems ISE 2BTU International
More informationHow to turn the promises of micro LED displays into reality?
How to turn the promises of micro LED displays into reality? Burkhard Slischka, Co founder and CEO, ALLOS Semiconductors 14th November 2017, Huawei Optical Materials and Processing Forum 2017 Photo by
More informationSupplier handbook Solaris Bus & Coach S.A.
Solaris Bus & Coach S.A. This handbook is the property of Solaris Bus & Coach S.A. Any modification or distribution without written permission is prohibited. Table of Contents 1. Introduction...2 1.1.
More informationPERICOM QUALITY SYSTEM POLICY MANUAL
REV. DCN NO. DATE REVISION HISTORY APPROVED BY DATE -- 0125 11/01/96 Initiate Specification. Ed Mello 01/20/94 A 0294 07/11/94 Completely revise specification, add criteria of ISO-9001. Ed Mello 08/12/94
More informationCHAPTER 6. Inventory Costing. Brief Questions Exercises Exercises 4, 5, 6, 7 3, 4, *14 3, 4, 5, 6, *12, *13 7, 8, 9, 10, 11, 12, 13
CHAPTER 6 Inventory Costing ASSIGNMENT CLASSIFICATION TABLE Study Objectives Brief Questions Exercises Exercises Problems Set A Problems Set B 1. Describe the steps in determining inventory quantities.
More informationRevenue Models for Demand Side Platforms in Real Time Bidding Advertising
27 IEEE International Conference on Systems Man Cybernetics (SMC Banff Center Banff Canada October 5-8 27 Models for Dem Side Platforms in Real Time Bidding Advertising Rui Qin Xiaochun Ni Yong Yuan Juanjuan
More informationIMPACT OF LEAD-FREE COMPONENTS AND TECHNOLOGY SCALING FOR HIGH RELIABILITY APPLICATIONS
IMPACT OF LEAD-FREE COMPONENTS AND TECHNOLOGY SCALING FOR HIGH RELIABILITY APPLICATIONS Chris Bailey, Ph.D. University of Greenwich London, United Kingdom c.bailey@gre.ac.uk ABSTRACT Semiconductor technology
More informationIP qualification of reusable designs
IP qualification of reusable designs Andreas Vörg, Natividad Martínez Madrid, Wolfgang Rosenstiel, Ralf Seepold FZI Forschungszentrum Informatik, Microelectronic System Design Haid-und-Neu-Str. 10-14,
More informationAP Microeconomics. Sample Student Responses and Scoring Commentary. Inside: Free Response Question 3. Scoring Guideline.
2017 AP Microeconomics Sample Student Responses and Scoring Commentary Inside: Free Response Question 3 Scoring Guideline Student Samples Scoring Commentary 2017 The College Board. College Board, Advanced
More informationQuality and Reliability Report
Quality and Reliability Report Product Qualification MASW-007921 2mm 8-Lead Plastic Package QTR-0148 M/A-COM Technology Solutions Inc. 100 Chelmsford Street Lowell, MA 01851 Tel: (978) 656-2500 Fax: (978)
More informationEvaluation of a Simple Proof Test of Planar Ferrite Cores
AEROSPACE REPORT NO. TR-2009(8565)-2 Evaluation of a Simple Proof Test of Planar Ferrite Cores 20 December 2008 Aldrich de la Cruz and David Witkin Space Materials Laboratory Physical Sciences Laboratories
More informationWHITE PAPER. HCL ERP Implementation in the Fabless Semi-conductor Manufacturing Industry
WHITE PAPER HCL ERP Implementation in the Fabless Semi-conductor Manufacturing Industry Table of Contents Introduction 3 Fabless Manufacturing Overview 4 Fabless Model in Semi-conductor Manufacturing 5
More informationCOMPARISON OF BOTTLENECK DETECTION METHODS FOR AGV SYSTEMS. Christoph Roser Masaru Nakano Minoru Tanaka
Roser, Christoph, Masaru Nakano, and Minoru Tanaka. Comparison of Bottleneck Detection Methods for AGV Systems. In Winter Simulation Conference, edited by S. Chick, Paul J Sanchez, David Ferrin, and Douglas
More informationAn Application of Causal Analysis to the Software Modification Process
SOFTWARE PRACTICE AND EXPERIENCE, VOL. 23(10), 1095 1105 (OCTOBER 1993) An Application of Causal Analysis to the Software Modification Process james s. collofello Computer Science Department, Arizona State
More informationFlexibility of Resources in Global After-Sales Service Networks in the Context of Service Individualization
Flexibility of Resources in Global After-Sales Service Networks in the Context of Service Individualization Fabrice Seite, Andreas Nobs, Andre Minkus Center for Enterprise Sciences (BWI), ETH Zurich, 8032
More informationMotorola PC603R Microprocessor
Construction Analysis Motorola PC603R Microprocessor Report Number: SCA 9709-551 Global Semiconductor Industry the Serving Since 1964 17350 N. Hartford Drive Scottsdale, AZ 85255 Phone: 602-515-9780 Fax:
More informationBrian Izzio 5th Year Microelectronic Engineering Student. Rochester Institute of Technology
CAPACITAWZE-VOI~TAGE characterization FOR POLYSILICON GATE MOS CAPACITORS DJTRODUcTION Brian Izzio 5th Year Microelectronic Engineering Student Rochester Institute of Technology ABSTRACT The effects of
More informationRoot Cause Analysis. Where Does It Fit In The Reliability Liability Context?
Root Cause Analysis Where Does It Fit In The Reliability Liability Context? International IEEE Conference on the Business of Electronic Product Reliability and Liability January 13-17, 2003 Hong Kong &
More informationAnalog Semiconductor Leaders Forum. Dongbu HiTek s. Analog Manufacturing Competitiveness. Shaunna Black SVP Manufacturing Division
Analog Semiconductor Leaders Forum Dongbu HiTek s Analog Manufacturing Competitiveness Shaunna Black SVP Manufacturing Division Introduction Dongbu HiTek Manufacturing Division One of the Top 5 Semiconductor
More informationAll-wet stripping process for highly implanted photoresist
All-wet stripping process for highly implanted photoresist Close Executive OVERVIEW A new all-wet stripping process eliminates the need for dry plasma ashing processes in the removal of highly implanted
More informationDevelopment of System in Package
Development of System in Package In recent years, there has been a demand to offer increasingly enhanced performance for a SiP that implements downsized and lower-profile chips at lower cost. This article
More informationPower Electronics Packaging Solutions for Device Junction Temperature over 220 o C
EPRC 12 Project Proposal Power Electronics Packaging Solutions for Device Junction Temperature over 220 o C 15 th August 2012 Page 1 Motivation Increased requirements of high power semiconductor device
More informationFIS Based Speed Scheduling System of Autonomous Railway Vehicle
International Journal of Scientific & Engineering Research Volume 2, Issue 6, June-2011 1 FIS Based Speed Scheduling System of Autonomous Railway Vehicle Aiesha Ahmad, M.Saleem Khan, Khalil Ahmed, Nida
More informationDave Jarzynka. Brooks Semiconductor Solutions Group
Dave Jarzynka Brooks Semiconductor Solutions Group 1 Agenda The business today Growth drivers 2 2016 Brooks Automation, Inc. Proprietary Information Semiconductor Group at a Glance FY15 Revenue Breakdown
More informationRedefining Reliability in Medical Electronic Devices
Redefining Reliability in Medical Electronic Devices A smart, end-to-end approach to the product lifecycle yields devices that patients can count on to work right, every time. AUTHORS Ravi Subrahmanyan,
More informationLatest Reliability Growth Policies, Practices, and Theories for Improved Execution
Latest Reliability Growth Policies, Practices, and Theories for Improved Execution Lou Gullo Raytheon Missile Systems Senior Principal Engineer March 14, 2012 Copyright 2012 Raytheon Company. All rights
More informationRadiation Tolerant Isolation Technology
Radiation Tolerant Isolation Technology Background The following contains a brief description of isolation technologies used for radiation hardened integrated circuits. The technologies mentioned are junction
More informationTechnology Insertion/Infusion
Technology Insertion/Infusion Design Refreshes Rarely will a design refresh just replace an obsolete part. Usually, if a design refresh is to be undertaken, the opportunity will be used to upgrade the
More informationEnabling Asset Integrity Management for the Oil & Gas Industry
Enabling Asset Integrity Management for the Oil & Gas Industry THE CHALLENGE Ensuring operational integrity of critical assets and installations is of paramount importance to oil field operators and the
More informationUsing Argon Plasma to Remove Fluorine, Organic and Metal Oxide Contamination for Improved Wire Bonding Performance
Using Argon Plasma to Remove Fluorine, Organic and Metal Oxide Contamination for Improved Wire Bonding Performance Scott D. Szymanski March Plasma Systems Concord, California, U.S.A. sszymanski@marchplasma.com
More informationBasics of Economics. Alvin Lin. Principles of Microeconomics: August December 2016
Basics of Economics Alvin Lin Principles of Microeconomics: August 2016 - December 2016 1 Markets and Efficiency How are goods allocated efficiently? How are goods allocated fairly? A normative statement
More informationISSN: ISO 9001:2008 Certified International Journal of Engineering Science and Innovative Technology (IJESIT) Volume 2, Issue 2, March 2013
FMEA Analysis for Reducing Breakdowns of a Sub System in the Life Care Product Manufacturing Industry Rakesh.R, Bobin Cherian Jos, George Mathew Abstract This paper provides the use of Failure Mode and
More information21 st Century Ship Lightweighting
21 st Century Ship Lightweighting 1.0 OBJECTIVE. 1.1 The goal of naval architects has always been to build the lightest vessel possible that can survive service and mission requirements. Traditional drivers
More informationProduction Activity Control
Production Activity Control Here the progress of manufacturing operations in the workshop is recorded. Also the material transactions tied to the Open WO s are entered. Open Work Order Maintenance Window
More informationSt.JOHNS COLLEGE OF ENGINEERING AND TECHNOLOGY,
PRESENTED BY S.SRIKANTH REDDY Y.MARUTHI III B.tech III.B.tech Sri.prince087@gmail.com St.JOHNS COLLEGE OF ENGINEERING AND TECHNOLOGY, YERRAKOTA, YEMIGANUR, KURNOOL (Dist), ANDHRA PRADESH. ABSTRACT VLSI
More information