SINGLE LAYER MULTI- LAYER DESIGN LAYOUT GUIDELINES FOR CERAMIC AND QUARTZ DESIGN LAYOUT GUIDELINES MICROWAVE APPLICATIONS

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1 High Density Interconnect Products (HDI) SUBSTRATE CHARACTERISTICS PATTERN CAPABILITIES RESISTOR PARAMETERS SINGLE LAYER PROTECTIVE COATING HIGH CONDUCTANCE POWER LINES LASER MACHINED SHAPES HIGH DENSITY INTERCONNECT LINE WIDTH CONTROL AIR OR POLYIMIDE SUPPORTED BRIDGES BACKSIDE PATTERNING MULTI- LAYER FRONT TO BACK VIA CONNECTION MULTI-LAYER INTERCONNECT METALIZATION HIGH TEMPERATURE APPLICATIONS GENERAL INFORMATION DESIGN LAYOUT GUIDELINES FOR CERAMIC AND QUARTZ DESIGN LAYOUT GUIDELINES MICROWAVE APPLICATIONS DESIGN LAYOUT GUIDELINES FOR iv 42 Revision: 15-Aug-03

2 LEADED NETWORK LEADLESS NETWORK DIP SMD THIN THIN Surface Mount Resistor Networks MOLDED SOT-23 SOT MIL PITCH Body Width Narrow Inches Film Medium Inches Performance MPM Series (NS) MPD Series (NS) OSOP Series (NS) VSSR Series (NK) VTSR Series (NK) Narrow Inches RMKM Series (NE) ORN Series (NS) or NOMC Series (NS) VSOR Series (NK) 50 MIL PITCH Medium Inches TOMC Series (NS) Wide Inches VSOR2000S1 (NK) WOMC Series (NS) SANDWICH 50 MIL PITCH Narrow Inches or CCSO Series (NS) HERMETIC 50 MIL PITCH or CFP Series (NS) LCC/TLCC (NS) MPH (NS) HERMETIC 50 MIL PITCH SLCC (NE) MOLDED 50 MIL PITCH PL340, 341, 342 COATED CSP MULTIPLE PITCH MIL 40 / 53 / 72 PRA (NE) CNW (NE) TRACKING TRACKING TRACKING TRACKING TCR 10 1 TCR 10 2 TCR 25 2 TCR 50 5 TOL TOL TOL TOL STANDARD CUSTOM Document Number: Revision: 15-Aug-03 43

3 DISCRETE DISCRETE TEMPERATURE TURE SENSOR CHIP Surface Mount Resistor Chips HI REL ESA/SCC QPL M Film Performance ESA/SCC, PHR(NE) MILITARY QUALIFIED QPL M55342 M55342 Case sizes M55342, E/H (NS) CECC, RV (NE) DSCC Specifications THIN COMMERCIAL Case sizes TANTALUM NITRIDE P-NS Series (NS) P-NE Series (NE) P-NE Series (NE) PTN Series (NS) LOW Case sizes NICKEL ALLOY or L-NS Series (NS) L-NE Series (NE) HIGH Case sizes Si CHROME CS/P Series (NE) CS/P Series (NE) MILITARY QUALIFIED QPL M55342 M55342 R Failure Rate Case sizes RUTHENIUM M55342 K/M (NS) THICK COMMERCIAL Case sizes RUTHENIUM M Series (NS) THIN COMMERCIAL Case sizes NICKEL TFS Series (NE) PACKAGING Specifications TCR 10 TCR 25 TCR 25 TCR 300 TOL 0.05 TOL 0.1 TOL 0.5 TOL 1.0 STANDARD CUSTOM 44 Revision: 15-Aug-03

4 NETWORK DISCRETE TEMPERATURE TURE SENSORS Through Hole Resistors MOLDED Low Profile Inches Film or (TSP Custom only) Performance CTSP Series (NS) TSP Series (NS) VTF Series (NS) TAS Series (NE) VTF Series (NS) SIP CONFORMAL Standard 0.28 Inches TAS Series (NE) CNS Series (NE) SANDWICH Low Profile 0.20 Inches Decade Divider or Resistor Network Applications CS Series (NS) CNS 471 (NE) Series (NS) MOLDED TDP Series (NS) DIP SANDWICH or CSD Series (NS) or RMKD HD Series (NS) HERMETIC High Temperature RMK HT Series Voltage Divider RMK VD Series RADIAL CONFORMAL CNS020 Series (NE) HVPS Series (NS) Hybrid & Wraparound, Singlein-Line NICKEL TFS Series (NE) TRACKING TRACKING TRACKING TRACKING TCR 10 1 TCR 10 2 TCR 25 2 TCR 50 5 TOL TOL TOL TOL STANDARD CUSTOM Document Number: Revision: 15-Aug-03 45

5 ARRAYS TRACKING TRACKING TCR 10 1 TCR 10 2 TOL TOL TRACKING TRACKING TCR 25 2 TCR 50 5 TOL TOL DISCRETE TCR 10 TCR 25 TOL 0.05 TOL 0.1 TCR 25 TCR 300 TOL 0.5 TOL 1.0 Hybrid Resistors, Wire Bondable Standard Substrate Schematic One Common, Isolated Film Performance RMK 408N, 508N, 48N, 816N, 914N (NE) SIRN Series (NS) ALUMINA One Common, Isolated SRN Series (NS) Custom USER TRIM PATTERNED SUBSTRATES NETWORKS or or or CHROMIUM or UT Series (NS) Custom (NS) Custom (NS, NE) Single Value 20 x x x 50 or CHROMIUM CS 22 (NE) RMK-22 N (NE) CHROMIUM CHROMIUM S20/A20 (NS) TA-22T (NE) RSK-22 N (NE) CS 44 (NE) CS 55 (NE) RMK-55 N (NE) Dual Value User Trim 150 x x x x x 50 Center tap CHROMIUM CHROMIUM or CHROMIUM RMK-515 N (NE) CS (NE) CS-522 N (NE) S30R, A30R / S30V, A30V (NS) TA-33T (NE) CS 33 (NE) RMK-33 N (NE) RSK-33 N (NE) UT Series (NS) STANDARD CUSTOM 46 Revision: 15-Aug-03

6 Termination Network RC NETWORKS TCR TOLERANCE RESISTOR 200 5% TCC TOLERANCE CAPACITOR % TCR TOLERANCE RESISTOR % TCC TOLERANCE CAPACITOR % T-Filter Network Schematic AB 4 Terminal Common Schematic R2 R2 R2 R2 R2 R2 R2 R2 R2 R1 R1 R1 R1 R1 R1 R1 R1 R RC Surface Mount Networks Package Body Width Performance Schematic AB Schematic AC or Schematic MIL PITCH 50 MIL PITCH 3 TERMINAL 25 MIL PITCH SSOP/QSOP Narrow (.150 Inches) TSSOP Medium (.173 Inches) SOIC Wide (.300 Inches) SOT-23 SSOP/QSOP Narrow (.150 Inches) TSSOP Medium (.173 Inches) VSSRC20-AB (MN) VTSRC20-AB (MN) VSORC20-AB (MN) VR (MN) VSSRC1284 (MN) VSSRC20-AC (MN) VTSRC20-AC (MN) 50 MIL PITCH SOIC Wide (.300 Inches) VSORC20-AC (MN) IEEE 1284 Parallel Port Terminator 25 MIL PITCH SSOP Narrow (.150 Inches) QSOP Narrow (.150 Inches) VSSRC1284 (MN) VSSX1284 (MN) 3 TERMINAL SOT-23 VR (MN) Schematic AA 25 MIL PITCH SSOP/QSOP Narrow (.150 Inches) TSSOP Medium (.173 Inches) VSSRC20-AA (MN) VTSRC20-AA (MN) 50 MIL PITCH SOIC Wide (.300 Inches) VSORC20-AA (MN) 3 TERMINAL SOT-23 VR (MN) Schematic AD 25 MIL PITCH SSOP/QSOP Narrow (.150 Inches) TSSOP Medium (.173 Inches) VSSRC20-AD (MN) VTSRC20-AD (MN) 50 MIL PITCH SOIC Wide (.300 Inches) VSORC20-AD (MN) E TABLES Schematic AC 2 Terminal Common Schematic AA Schematic AD C R R STANDARD CUSTOM 2 C 1 R 3 Document Number: Revision: 15-Aug-03 47

7 SINGLE- CHIP RESISTOR Chip Resistors Wire Bondable Single Value SIZE (inch) POWER x mW 10Ω - 24KΩ 40 mw 25Ω - 40KΩ SINGLE- TOP-CONTACT SINGLE- BACK-CONTACT ALUMINA QUARTZ POWER 25mW 1Ω - 1 MEGΩ 25mW 20Ω - 510KΩ x mW 500KΩ - 10 MEGΩ 10Ω - 1 MEGΩ x mW 100Ω - 100KΩ QFM QFN QFX BCR BCM x mW 30Ω - 125KΩ x mW 50Ω - 400KΩ x mW 45Ω - 1 MEGΩ x mW 20Ω -59KΩ 40mW 20Ω - 10KΩ 50mW 10Ω - 10KΩ POWER 1Ω - 1 MEG Ω x Ω - 1 MEGΩ BCP 125mW 20Ω - 510KΩ x mW 510KΩ - 20 MEGΩ POWER x /2 watt 0.3Ω - 1 MEGΩ x watt 10Ω - 20KΩ PWA PWB TCR ± 10ppm/ C TOL ± 0.05% TCR ± 25ppm/ C TOL ± 0.1% x mW 100Ω - 50KΩ TCR ± 50ppm/ C TOL ± 0.5% TCR ± 100ppm/ C TOL ± 1% CC1 CC2 CC3 CC4 CC5 CC6 CC8 SFC SFM SFP SFN SFX SC3 48 Revision: 15-Aug-03

8 DUAL CHIP RESISTORS DUAL TOP-CONTACT USER TRIM Chip Resistors Wire Bondable Dual Value POWER POWER ALUMINA 125mW 25Ω - 35KΩ 125mW 50Ω - 35KΩ x Ω - 1 MEGΩ CTT CTA CCC 1Ω - 9.9Ω 100Ω - 500KΩ 10Ω - 1 MEGΩ CTR (LOW ) Dual Resistor Networks CTN QUARTZ 60mW 10Ω - 1 MEGΩ CTQ 10Ω - 1 MEGΩ CTR ALUMINA 50mW 200Ω - 20KΩ x mW 200Ω - 50KΩ CC7 CCB x mW 200KΩ - 10 MEGΩ CTM x Ω - 50KΩ 100Ω - 20KΩ SCB SC7 TCR ± 10ppm/ C TCR ± 25ppm/ C TCR ± 50ppm/ C TCR ± 100ppm/ C TOL ± 0.05% TOL ± 0.1% TOL ± 0.5% TOL ± 1% Document Number: Revision: 15-Aug-03 49

9 Capacitors MOS/MNOS (Wire Bondable Back Contact) WORKING VOLTAGE 0.5pF - 51pF 40V - 100V NCA 33pF - 160pF 50V - 100V NCB SINGLE x pF - 330pF 25V - 100V NCC x pF - 470pF 50V - 100V NCD CAPACIT ACITORS MOS/MNOS x pF pF 25V - 40V NCE x pF or 15pF TOTAL 4 - S 30V - 100V CBA BINARY MULTI- ARRAY x pF TOTAL 5 - S 75V CBB x pF TOTAL 5 - S 75V CBC TCC + 15 ± 25ppm/ C TOL 5% TCC + 45 ± 25ppm/ C TCC + 45 ± 25ppm/ C TCC + 45 ± 25ppm/ C TOL 5% TOL 10% TOL 25% iv 50 Revision: 15-Aug-03

10 Filter Network Resistor-Capacitor Array (Wire Bondable) R - RANGE C - RANGE THIN FILTER NETWORK RESISTOR/CAP OR/CAPACITOR ARRAY MULTI x , 50 ohms 50, 100, 200, 400pF RCN TCR ± 100ppm/ C TOL ± 10% TCC ± 200ppm/ C TOL ± 10% Document Number: Revision: 15-Aug-03 51

11 Chip Resistor Arrays Wire Bondable DESCRIPTION x Ω - 1MΩ 8 RESISTORS ISOLATED CLA CHIP RESISTOR ARRAYS x Ω - 1MΩ 8 RESISTORS COMMON 400Ω - 240KΩ 13 RESISTORS MULTI-TAP CLB MTR x KΩ - 275KΩ 20 RESISTORS MULTI-TAP MTT TCR ± 10ppm/ C TOL ± 0.1% TCR TOL 1% ± 250ppm/ C TCR ± 100ppm/ C TOL 10% 52 Revision: 15-Aug-03

12 Chip Voltage Dividers VOLTAGE RATIO RANGE CHIP VOLTAGE DIVIDERS MULTI x KΩ TOTAL 1-20 ATA TCR ± 50ppm/ C TOL ± 5% Document Number: Revision: 15-Aug-03 53

13 High TCR Sensor (Wire Bondable Top Contact) Ni SINGLE 51Ω - 24KΩ Pt RTA Pd HIGH TCR SENSOR Ni DUAL 51Ω - 51KΩ Pt RTB Pd TCR ppm/ C TOL 1% TCR ppm/ C TOL 1% TCR ppm/ C TOL 1% 54 Revision: 15-Aug-03

14 Inductor (Wire Bondable) RANGE SINGLE x nH PSC TYPE S INDUCTOR CHIP MULTI- TUNABLE x nH PSC TYPE T 1MHz 0.05 TOLERANCE ±5% 1MHz 0.08 TOLERANCE ± 10% Document Number: Revision: 15-Aug-03 55

15 Metalized Plates SIZE SUBSTRATE MATERIAL METALIZATION S 2 to 4 INCHES ALUMINA, Cu, Ni, TiW Pd, Al, Au 2 to 3 INCHES QUARTZ, Ni, TiW Pd, Al, Au METALIZED PLATES 2 to 4 INCHES ALUMINUM NITRIDE, Cu, Ni, TiW Pd, Au CAPABILITY SHEET 2 to 3 INCHES BERYLLIUM OXIDE, Cu, Ni, TiW Pd, Au 3 to 5 INCHES, Ni, TiW Pd, Al, Au 56 Revision: 15-Aug-03