BUILD TO PERFORMANCE RF Customized Ceramic Thin Film Filters

Transcription

1 Vectron Thin Film Filters BUILD TO PERFORMANCE RF Customized Ceramic Thin Film Filters Anton Buchleitner, Vectron International

2 VECTRON Thin Film Filters bandwidth / MHz Features: L-C Filters Discrete Crystal Filters Monolithic Crystal Filters Prec. High-Loss SAW Loss-Reduced SAW Low-Loss SAW Thin Film Filters , 1, 1, center frequency / MHz Small and mid-volume for e.g. Military & Space applications Extension of VECTRON s filter portfolio up to 35GHz Synergy with VECTRON s SAW-grade process technology Designed & manufactured in Europe 1% ITAR-free

3 VI Thin Film Filters - Strengths Thin Film Filters, Strengths: Small size Temperature stable Excellent design model accuarcy, good first pass success Excellent RF repeatability Excellent to manufacture: batch processed, no tuning of resonators

4 VI Thin Film Filters - Strengths Propietary ceramic substrate: High dielectric permittivityε r Low thermal coefficient of dielectric constant TCε r Improved matching of thermal expansion coefficient with PCB material Material Dielectric constant ε r to alumina based dielectric constant TCε r Size relative Thermal coefficient of filter design /ppmk -1 CF 25, 63% CG 67, 38% Alumina 9,9 1% 12 Material Coefficient of thermal expansion CTE /ppmk -1 CTE to RO 435B /ppmk -1 CF 9, -5, CG 9, -5, Alumina 6,5-7,5 RO 435B 14,

5 VI Thin Film Filters - Strengths Temperature stabilty compared to conventional ceramic substrate Shift of filter center frequency ~ 1x better than with alumina substrate Temperature Measurement: CF Material Temperature Measurement: Alumina -5-5 magnitude [db] C C C 2 C 4 C 6 C 8 C magnitude [db] C C C 2 C 4 C 6 C 8 C frequency [MHz] frequency [MHz]

6 Frontend: Clean room class 1K SAW-grade e-beam deposition technology Metalization systems: Standard Ti/Au Various alternatives qualified Highly accurate photo-lithography processes Excellent film thickness and line-width control and reproducibility No trimming processes required VI Thin Film Filters - Technology

7 VI Thin Film Filters - Technology Backend / Package solutions Customized / application-defined, e.g. Surface-mount: Filter chip is soldermounted and -connected Hybrid assembly: adhesive mounting / wire-bonding Connector- or through-hole type package solutions Shielded CSP-solutions for SMA and wire-bond S21 /db , , , , , ,5 18 frequency /GHz S11 /db

8 VI Thin Film Filters - Design Design techniques Analytical draft Network simulation tools Electromagnetic Simulation Good knowledge of material parameters Dielectric permittivity Anisotropy Metal conductance Filter topologies Interdigital Edge coupled End coupled Edge / end coupled, V-shape Hairpin Dual mode resonator

9 VI Thin Film Filters - Design Design example Band pass filter 5.4 GHz Interdigital topology 7 poles S21 /db BPF 5,4 GHz +/- 7 MHz S11 /db frequency /GHz

10 VI Thin Film Filters - Design Design example Band pass filter 1.6 GHz Interdigital topology 7 poles S21 /db BPF 1,62 GHz ,2 1,3 1,4 1,5 1,6 1,7 1,8 1,9 2 frequency /GHz S11 /db

11 VI Thin Film Filters - Design Design example BPF 4,3 GHz Band pass filter 4.3 GHz Hair pin topology -5 7 poles -15 2nd harmonic supression S21 /db S11 /db ,5 3 3,5 4 4,5 5 5,5 6 6,5 7 7,5 8 8,5 9 9,5 1 frequency /GHz

12 VI Thin Film Filters - Design Design example Band pass filter 14,95 GHz Edge coupled topology V-shape 7 poles I/O 5 Ohm match S21 /db -4 BPF 14,95 GHz S11 /db , , , , , ,5 18 frequency /GHz

13 VI Thin Film Filters - Design Design example Band pass filter 3,5 GHz End coupled topology BPF 3,5 GHz -5 7 poles S21 /db S11 /db frequency /GHz

14 VI Thin Film Filters - Mounting Mounting Techniques: Wire Bond Technique (recommended for frequency > 15 GHz) PC board RF (I/O) RF filter RF (I/O) wirebond housing floor conductive epoxy Filter Top Side Detail A Detail A Filter Top Side I/O bond pad Filter Bottom Side

15 Mounting Techniques (continued) Surface Mount Technology VI Thin Film Filters - Mounting

16 Mounting Techniques (continued) Surface Mount Technology (continued) VI Thin Film Filters - Mounting

17 VI Thin Film Filters - Shielding Filter Packaging and Shielding Printed Wire Board Covers (e.g. Rogers Material), for SMT mounting only Sheet metal cover, for SMT and wire bond technique as well (recessed to expose I/O) Shielding is left to the customer (next level of assembly) Printed wire board cover Sheet metal cover Customer shielding

18 VI Thin Film Filters - Shielding Effect of cover height Cover closer to substrate surface reduces bandwidth and increases insertion loss BPF 4, S21 /db S11 /db ,1 4,2 4,3 4,4 4,5 4,6 4,7 4,8 4,9 5 5,1 5,2 5,3 5,4 5,5 5,6 5,7 5,8 5,9 6 frequency /GHz

19 VECTRON Thin Film Filters Low-pass, high-pass, band-pass and band-stop (notch) filters available Center frequencies:.5 35GHz Relative bandwidth: 1 5% Technological approach similar to DLI s filters use of DLI s ceramic competence Excellent temperature stability: typical <5ppm/ C Extreme aging stability SPACE-grade solutions available ITAR Free! Design and Manufacturing in Germany!