PRODUCT/PROCESS CHANGE NOTICE (PCN)

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PCN #: A0902-04R1 DATE: September 24, 2009 MEANS OF DISTINGUISHING CHANGED DEVICES: Product Affected: 14 mm x 14 mm x 1.4 mm TQFP-100 & 10 mm x 10 mm x 1.

1 PCN #: A R1 DATE: September 24, 2009 MEANS OF DISTINGUISHING CHANGED DEVICES: Product Affected: 14 mm x 14 mm x 1.4 mm TQFP-100 & 10 mm x 10 mm x 1.4 mm TQFP-64 Product Mark Back Mark (RoHS) Date Code Date Effective: June 18, 2009 Other Change in Product Part Number (Refer Attachment 2) Contact: Mary Vesey Attachment: Yes No Title: Director, Product Assurance Phone #: (408) Fax #: (408) Mary.Vesey@.com DESCRIPTION AND PURPOSE OF CHANGE: Die Technology Wafer Fabrication Process Assembly Process Equipment Material Testing Manufacturing Site Data Sheet Other - Package Obsolete Samples: Contact your local samples representative for sample requests. Revision 1: This revised notice is to amend the package thickness on new replacement package, TQFP-100 from 1.0mm to 1.4mm. The PCN effective date remains unchanged. Refer to attachment for a copy of the original PCN, A RELIABILITY/QUALIFICATION SUMMARY: There is no expected change to the product quality or reliability performance. CUSTOMER ACKNOWLEDGMENT OF RECEIPT: records indicate that you require written notification of this change. Please use the acknowledgement below or to grant approval or request additional information. If does not receive acknowledgement within 30 days of this notice it will be assumed that this change is acceptable. reserves the right to ship either version manufactured after the process change effective date until the inventory on the earlier version has been depleted. Customer: Name/Date: Approval for shipments prior to effective date. Address: Title: Phone# /Fax# : CUSTOMER COMMENTS: ACKNOWLEDGMENT OF RECEIPT: RECD. BY: DATE: IDT FRA REV /18/01 REFER TO QCA-1795

2 PCN #: A DATE: March 18, 2009 MEANS OF DISTINGUISHING CHANGED DEVICES: Product Affected: 14 mm x 14 mm x 1.4 mm TQFP-100 & 10 mm x 10 mm x 1.4 mm TQFP-64 Product Mark Back Mark (RoHS) Date Code Date Effective: June 18, 2009 Other Change in Product Part Number (Refer Attachment 2) Contact: Mary Vesey Attachment: Yes No Title: Director, Product Assurance Phone #: (408) Fax #: (408) Mary.Vesey@idt.com DESCRIPTION AND PURPOSE OF CHANGE: Die Technology Wafer Fabrication Process Assembly Process Equipment Material Testing Manufacturing Site Data Sheet Other - Package Obsolete Samples: Contact your local samples representative for sample requests. This notification is to advise our customers that IDT is obsoleting the 1.4 mm thick TQFP- 100 (14 x 14 x 1.4mm) and TQFP-64 (10 x 10 x 1.4mm) packages. These packages will be replaced by 1.0 mm thick TQFP-100 (14 x 14 x 1.0mm) and TQFP-64 (10 x 10 x 1.0mm) packages, respectively. Attachment 1 outlines the qualification plan and results. Attachment 2 shows the affected part numbers and replacement part numbers. Attachment 3 shows the new package drawings. RELIABILITY/QUALIFICATION SUMMARY: There is no expected change to the product quality or reliability performance. CUSTOMER ACKNOWLEDGMENT OF RECEIPT: IDT records indicate that you require written notification of this change. Please use the acknowledgement below or to grant approval or request additional information. If IDT does not receive acknowledgement within 30 days of this notice it will be assumed that this change is acceptable. IDT reserves the right to ship either version manufactured after the process change effective date until the inventory on the earlier version has been depleted. Customer: Name/Date: Approval for shipments prior to effective date. Address: Title: Phone# /Fax# : CUSTOMER COMMENTS: IDT ACKNOWLEDGMENT OF RECEIPT: RECD. BY: DATE: IDT FRA REV /18/01 Page 1 of 8

3 ATTACHMENT 1 - PCN # : A PCN Type: Data Sheet Change: Detail Of Change: Package Obsolete Yes This notification is to advise our customers that IDT is obsoleting the 1.4 mm thick TQFP-100 (14 x 14 x 1.4mm) and TQFP-64 (10 x 10 x 1.4mm) packages. These packages will be replaced by 1.0 mm thick TQFP- 100 (14 x 14 x 1.0mm) and TQFP-64 (10 x 10 x 1.0mm) packages, respectively. Refer to Table 1 for assembly material sets used and qualified assembly locations for these new packages. There is no change to the moisture performance or RoHS compliance. There is no change required to the board land pattern layout as a result of this change. During the transition period, IDT will continue to support customer shipments with inventory build at the existing assembly locations. IDT does not anticipate any impact on the product availability. We request you to acknowledge receipt of this notification within 30 days of the date of this PCN notification. If you require samples to conduct evaluations, please make your sample request within 30 days as samples are not built ahead of the change. You may contact your local sales representative to acknowledge this PCN and request samples. Description Package Dimensions (Width x Length x Thickness) IDT Internal Package Nomenclature Assembly Location Assembly Materials Package Drawing Table 1 DQG100 DKG64 ASAT, Hong Kong (TQFP-100) Amkor, Korea (TQFP-64) Die Attach: 2200 /Ablestik 3230 Wire: Au wire Existing 14 mm x 14 mm x 1.4 mm (TQFP-100) 10 mm x 10 mm x 1.4 mm (TQFP-64) Mold Compound: G700 series Lead Frame: Copper Alloy Plating: Matte 100% Sn (RoHS) PSC-4140 (TQFP-100) PSC-4141 (TQFP-64) Ablestik 3230 Au wire G700 series New 14 mm x 14 mm x 1.0 mm (TQFP-100) 10 mm x 10 mm x 1.0 mm (TQFP-64) EQG100 EDG64 Amkor, Korea Lead Frame: Copper Alloy Plating: Matte 100% Sn (RoHS) PSC-4240 (TQFP-100) PSC-4165 (TQFP-64) Page 2 of 8

4 ATTACHMENT 1 - PCN # : A Qualification Information and Qualification Data: Qualification Test Plans and Results: Qual Vehicle: 14 mm x 14 mm x 1 mm TQFP-100 ( 3 lots ) Test Description * High Accelerated Stress Test (130 C/85% RH, 96 Hrs) * Temperature Cycle (-65 C to +150 C, 500 Cyc) Test Method JESD22-A118 JESD22-A104 Test Results (SS / Rej) 77/0, 77/0, 77/0 77/0, 77/0, 77/0 High Temp. Storage (150 C, 1000 Hrs) JESD22-A103 77/0, 77/0, 77/0 Note: * Test require moisture pre-conditioning sequence per JEDEC J-STD-020 Page 3 of 8

5 ATTACHMENT 2 - PCN #: A Affected Part Number Obsolete Part Number 82V3202DKG 82V3202DKG8 82V3255DKG 82V3255DKG8 82V3280DQG 82V3280DQG8 82V3285DQG 82V3380DQG 82V3380DQG8 82V3380DQGI 82V3380DQGI8 Replacement Part Number 82V3202EDG 82V3202EDG8 82V3255EDG 82V3255EDG8 82V3280EQG 82V3280EQG8 82V3285EQG 82V3380EQG 82V3380EQG8 None None

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PRODUCT/PROCESS CHANGE NOTICE (PCN)

PRODUCT/PROCESS CHANGE NOTICE (PCN) PCN #: I0303-03 DATE: 3/12/2003 MEANS OF DISTINGUISHING CHANGED DEVICES: Product Affected: IDT 79RC32V332-XXXDH/DHI, IDT 79RC32V333-XXXDH/DHI Product Mark Back Mark Y step only Date Code Date Effective: