Study of the Mechanism of "Smile" in High Power Diode Laser Arrays and Strategies in Improving Near-field Linearity
|
|
- Lindsey Johns
- 6 years ago
- Views:
Transcription
1 Study of the Mechanism of "Smile" in High Power Diode Laser Arrays and Strategies in Improving Near-field Linearity Jingwei Wang 1, Zhenbang Yuan 3, Lijun Kang 2, Kai Yang 2, Yanxin Zhang 1, Xingsheng Liu 1,2 1. State Key Laboratory of Transient Optics and Photonics,Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences No. 17 Xinxi Road, New Industrial Park, Xi'an Hi-Tech Industrial Development Zone, Xi'an, Shaanxi, , P.R. China 2. Xi an Focuslight Technologies Co., LTD No. 60 Xibu Road, New Industrial Park, Xi'an Hi-Tech Industrial Development Zone, Xi'an, Shaanxi, , P.R. China 3. School of Chemical Engineering & Technology of Tianjin University No. 92 Weijin Road, Nankai District, Tianjin, , P. R. China Abstract High power diode lasers have found increased applications in pumping of solid state or fiber laser systems for industrial, military and medical applications as well as direct material processing applications. The non-linearity of the near-field of emitters (or the so called smile effect) in a laser diode array poses significant challenges in optical coupling and beam shaping and has become one of the major roadblocks in broader applications of laser arrays. Increasing the near-field linearity of a pumping laser diode array enables the laser system manufacturer to improve the laser system compactness, optical coupling efficiency, power, and beam quality while at the same time reducing manufacture cost in the laser system. Therefore, the near-field linearity of a laser bar is one of the key specifications of laser array products and improving the near field performance is especially important in order to increase production yield, reduce cost and gain competitiveness. In this paper, we will study the mechanism of smile in high power diode laser arrays and discuss the strategies and ways to achieve low smile. Introduction High power diode lasers (HPDLs) offer a variety of applications due to their higher electrical-optical conversion efficiencies, compact sizes and long life-times than the most prominent types of lasers by nearly an order of magnitude. High power semiconductor lasers, including single emitters, arrays, stacks, and two dimension area array stack have found increased applications in pumping of solid state laser systems for industrial, science and technology research, military, antiterrorism, entertainment display and medical applications as well as direct material processing applications such as welding, cutting, and surface treatment [ 1, 2, 3, 4 ]. With continuing improvement of the power, electrical-optical conversion efficiency, reliability, and manufacturability of high power semiconductor lasers, and decreasing manufacturing cost, many new applications of high power semiconductor lasers are being enabled [5]. The three key performance measures of high power semiconductor lasers are power, efficiency, and reliability. For diode laser arrays, the near field linearity is as important as the above three parameters as the near field linearity of a laser array as a pumping source significantly affects power, efficiency, compactness, beam quality and thermal management of a laser system, such as diode pumped solid state lasers and fiber lasers. If near field linearity of a laser array is poor, in other words, the smile is very large, the coupling efficiency of the laser array to a fiber array or micro-optics such as a fast axis collimation lens is very low. A typical 808 nm high power semiconductor laser array in a conduction cooled package has 19 to 49 individual emitters and the typical CW output power ranges from 30W to 80W. Figure 1 is a schematic diagram of a high power semiconductor laser array. To achieve high efficiency and high CW power, Cu is commonly used as the heatsink (anode block) for laser arrays. As it is known, copper has higher thermal conductivity in a variety of heatsink materials, such as Copper-Tungsten alloy, aluminum, etc. Effects of heatsink materials and packaging process on and the smile performance of laser diode array are discussed in more details later in this paper. Figure 1 A schematic diagram of a high power semiconductor laser array (laser bar) Near field non-linearity of laser diode array The individual emitters of high power diode lasers arrays (HPDLAs) are not perfectly aligned linearly because of the coefficient of thermal expansion (CTE) mismatch among the different layers of a bare bar, the packaging process and CTE mismatch between the laser bar and the bonding heat sink. Figure 2 shows a magnified smile image of a typical good diode-laser array. As can be seen from Figure 2, a typical good laser diode array is nearly linear. This is a better emitting light source for beam coupling. Figure 2 Enlarged smile image of a typical good laser diode array The individual emitters form a curvature, which can be concave or convex, corresponding to smile (Figure 3 (a)), /09/$ IEEE Electronic Components and Technology Conference
2 cry (Figure 3 (b)), or other types (Figure 3(c), (d)). Both smile, cry or others are commonly called smile due to historical reason. Due to the significant impact of smile on HPDLAs performance, reliability and cost, it is very important to reduce the smile [6]. (a) (b) (c) (d) Figure 3 Enlarged images of a diode-laser bar with various smile, (a) cry of approx. 2 µm, (b) smile of approx. 2.5 µm, or others (c),(d) Although the near field non-linearity is a common problem in manufacturing laser array products, the root cause or determining factors are not fully understood. As stated above, to achieve high efficiency and high CW power, Cu is commonly used as the anode block material for laser arrays due to its high thermal conductivity. However, Cu has large CTE mismatch with GaAs materials which is the base material for 808nm laser diode arrays. In order to reduce the thermal stress applied on the laser array due to CTE mismatch between the semiconductor laser bar and Cu anode, indium solder is primarily selected for die bonding. Most of the commercially available conduction cooled laser bar/array packages are in this format. The smile in HPLDAs can be originated from two aspects: wafer/bare bar related smile and packaging induced smile. Because the CTE of the copper heatsink is larger than the bare bar, a p-down bonded laser array would have the cry shape if there is no extra stress imposed on the laser arrays in the packaging. However,our study of various packaged laser array products from different suppliers showed that the nearfield of the laser array can be in convex shape or concave shape. This indicates that the packaging process and /or packaging structure design can play an important role in smile effect. For a high power semiconductor laser array, the mismatch between the semiconductor substrate and the metallization on the p-contact layer is the major reason that causes the smile in a wafer. This leads to the convex because the p-metal layer has a lager contraction than the GaAs substrate when wafer is cooled from a high temperature to room temperature during the wafer processing. The smile under this condition is negligibly low, so it will not be discussed here. In this work, finite element numerical analysis was conducted to study the smile of different laser array package structures. Meanwhile, conduction cooled 808nm CW laser array packages with different smile shapes were characterized using near field imaging, automated surface profiler to study the mechanism of smile in high power diode laser arrays. Wafer/bare bar related smile was analyzed and measured, and the smile evolution during the packaging process was studied experimentally and analyzed numerically. Furthermore, the evolution of the smile from a bare bar to the final packaged product was investigated. Numerical simulation and theoretical analysis In order to study the mechanism of the HPDLAs, a typical 808nm conduct cooled high power semiconductor laser manufactured by Xi an Focuslight Technologies Co., LTD was selected as the experimental sample. Figure 4 shows the PVI curve of a typical cooled high power semiconductor laser. Effects of important parameters like the die bonding process, different packaging structure, the thickness of the sub-mount heatsink, and different materials of pick-up tool for die bonding process, such as stainless steel and Tungsten, on smile of HPDL are discussed below. Finite element method was applied to simulate the different die bonding process, the thickness of heat sink, and different materials of pick-up tool for die bonding process. Figure 4 shows the PVI curve of a typical cooled high power semiconductor laser Electronic Components and Technology Conference
3 i. Effects of die bonding process on smile As stated earlier, indium solder is commonly selected for die bonding. However, with the improvement of new solder technology, several companies have adopted the hard solder (AuSn) as their key solder in die bonding process. For a typical 808 nm HPDLAs in conduction cooled package, die bonding process using common indium and hard solder is shown in Figure 5and Figure 6, respectively. N side GaAs based laser diode bar Mounting heatsink With Au finish (P side) T f is the freezing point of the solder, and T s is the temperature at which the stress is measured (operating temperature). For GaAs-based laser chip and copper heat sink, equation 2 describes the stress as follows, E E /( E E )( a a )( T T ) (2) Cu GaAs Cu GaAs Cu GaAs f s and the deformation of the laser diode bar/array is L ( a a )( T T ) L (3) Cu GaAs f s The copper- tungsten is alike; ECuW EGaAs /( ECuW EGaAs )( acuw agaas )( Tf Ts ) (4) and the deformation of the laser diode bar/array is L ( a a )( T T ) L (5) CuW GaAs f s According to the equation (3) and (5), numerical and simulation were conducted to study the deformation curve of laser array in vertical orientation. Figure 7 shows the deformation curve of laser array in vertical orientation as a function of lateral position. Figure 5 A schematic diagram of 808nm conduct cooled high power semiconductor laser with indium packaging process N side GaAs based laser diode bar AuSn solder CuW Mounting heatsink With Au finish (P side) Figure 6 A schematic diagram of 808nm conduct cooled high power semiconductor laser with hard solder (AuSn) packaging process For the indium packaging process, the laser diode bar/array is sandwiched between the cathode connector (nside) and the mounting heat sink with Au finish (p-side), with indium solder bonding them together. In contrast to the indium packaging process, the hard solder packaging process is of difference in bonding heat sink. The Copper-Tungsten alloy was used as heat sink with the chip bonded to it. Replacing indium with AuSn eliminates all problems associated with indium, but in the meantime introduces a new set of challenges to overcome. Foremost among them is the stress in the materials that arise from any differences in CTE between the diode and its sub mount. Equation 1 describes the stress in the region of the joint between two isotropic materials 1 and 2, as a function of CTE and temperature. EE 1 2 ( a1 a2)( Tf Ts ) E1 E (1) 2 Where E is the modulus of elasticity of the materials 1 and 2, α is the coefficient of thermal expansion of materials 1 and 2, Figure 7 The deformation curve of laser array in vertical orientation under indium and gold-tin From the Figure 7, the laser bar deformation using indium packaging process in vertical orientation is five times larger than that using harder solder. Although indium is a sort of very soft solder which can effectively release the stress to some extent, the very large CTE of indium (three times larger than laser bar/array) cause the chip to bend due to the extra thermal stress imposed on laser bar. In addition, Cu is commonly used as the sub mount heat sink material for laser arrays due to its high thermal conductivity. However, the large differences of CTE mismatch between GaAs-based laser diode bar/array and copper anode block make it easier to lead to very large deformation in the cooling process. Pure indium solder has a CTE of /K, however, gold-tin alloy has a lower CTE of /K than it[7]. In contrary to pure indium solder, it is a better mismatch solder material for GaAs-based laser diode bar/array. In addition, the heat sink material is copper tungsten alloy when using AuSn solder, its CTE is about m / and is very close to the laser bar s. The CuW submount serves as a thermal stress buffer layer between the copper heat sink and the laser bar. Therefore, the smile generated will be much lower than that using indium packaging process Electronic Components and Technology Conference
4 ii. Effects of the thickness of heat sink on smile Effects of the thickness of heat sink on smile are simulated using ANSYS tool. The deformations of two 808nm CS high power semiconductor laser arrays with different thickness (4mm and 8mm) of copper anode block were simulated. Assuming under the same condition, such as using indium packaging process, the deformation curve of laser bar in vertical orientation as a function of different thickness of copper heat sink is illustrated in Figure 8. The laser bar deformation in vertical orientation using thicker mounting copper heat sink is lower than that using thinner copper block. If the thickness of copper block heat sink is increased from 4mm to 8mm, the laser bar deformation in vertical position is reduced from 1.41µm to 1µm. The laser array deformation in vertical orientation reduces by 41%. 4mm 8mm Vertical Deformation(µm) Lateral Position (µm) Using Stainless Steel for Die Bonding Using Tungsten for Die Bonding Figure 9 The deformation curve of laser array in vertical orientation using different pick-up tool for die bonding process Experimental results In order to investigate the mechanism of smile effect the smile during each major packaging process step for both reflow oven process and die bonder process was measured for a typical bare bar/indium solder/cu block structure and a bare bar/ausn solder/cuw/ solder/cu block structure. Our study shows that the packaging process can significantly affect the smile of a laser diode array. Figure 8 The deformation curve of laser array in vertical orientation using copper heat sink with different thickness If the thickness of CS copper anode block is thicker, it can release the bulky thermal stress to some extent, caused by the large CTE mismatch between laser chip and CS mounting block heat sink. This makes the curvature smaller. If the thickness of CS copper anode block is thinner, it is very easy to generate warpage during the reflow process, bending together with the bar/array. In this way, a resultant force will be imposed on the bar/array. This leads to bar bending severely. With such thin and mechanically sensitive heat sinks the beam may be seriously degraded due to mechanical deformations which, in turn, lead to large smile. iii. Effects of different materials of pick-up tool for die bonding process on smile The laser bar deformation as a function of different pickup tool for die bonding process was simulated. Figure 9 shows the laser bar deformation in vertical orientation as a function of different materials of pick-up tool for die bonding process. Results from Figure 9 indicate that the laser bar deformation in vertical orientation is significantly different when using materials of pick-up tool. The laser array is concave if Tungsten is used during the die bonding process. The smile observed is less than 0.5µm. In contrary to the tungsten, stainless steel pick-up tool makes the smile larger than tungsten pick-up tool. Its smile is convex and exceeds 2.5µm. These results suggest that tungsten is a better option for the pick-up tool in die bonding process. Figure 10 The block diagram of smile test system Our experimental setup of smile test system is illustrated in Figure 10. The smiles were measured by using a cylindrical lens to image the slow axis onto a screen at a proper distance from the LDAs. In the smile test system, the rays from the LD Bars was fast-axis collimated first (after multiple tests, a fastaxis collimated lens with the smallest smile was selected as a calibrated sample). Then the collimated rays went through the Optical Imaging System, making the real bending shapes imaged onto the photo-sensitive surface of the CCD camera. The signals from the photo-sensitive surface through the image grabbing card were converted to data signals and delivered to the beam analyzing software. Images are captured on a digital camera for a low current. Our experiments exhibit there is more or less smile during packaging process. Figure 11shows an enlarged picture of a diode laser bar with a cry of approximate 2µm. According to the theoretical simulation, most of smiles are in this format due to the large mismatch between the GaAs laser chip and copper anode block. However, a variety of smile shapes, illustrated in the Figure 3 are observed during the packaging process. Study by Liu, et al [8] shows that thermal stress during the packaging process plays a great role on the smile for high Electronic Components and Technology Conference
5 power laser bar/array. Due to the CTE mismatch between the GaAs laser bar and the copper anode block, the extra thermal stress imposes on the chip and makes the chip bend to cry or smile. 3D Plot material. With a CTE difference of ~ / and a temperature difference of ~131 between the indium solder freezing temperature, which is treated as stress free point, and room temperature, there is a ~14 μm of contraction difference between the Cu heatsnik and laser array along the length of the laser array for a standard 10 mm long laser array. Figure 13 shows a simple model to describe the bending process during the cooling from indium solder freezing temperature to room temperature. Figure 13 A schematic diagram of smile formation Figure 11 Top surface profile of a sample with a cry of approx. 2 µm shown in Figure 3 (a). 3D Plot Figure 12 Top surface profile of a sample with a smile of approx. 2.5 µm shown in Figure 3 (b). Further work to test smile performance in details will be conducted in the future. Discussion According to the theoretical simulation, most of curvature of laser diode array on which are imposed extra thermal stress are cry, however, our experiments show that some curvatures of laser diode array are smile. Obviously, these smile curvature are closely related to packaging process. Therefore, packaging process plays an increasingly important role in the non-linearity of the near field of emitters in a semiconductor laser array. The CTE mismatch is a root cause of near field nonlinearity of laser diode array. Due to CTE mismatch, thermal stress is easier to form in the cooling procedure. Thermal stress is an inherent problem with the use of copper heatsink since copper has much larger coefficient of thermal expansion (CTE) than the laser array which is essentially made of GaAs Assuming CTE (a)>cte (b)>cte(c), the temperature in the chamber of reflow oven is dropped down during the reflow process, materials a, b and c are all contracted, but with different contaction magnitude. The material (a) has largest contraction, the material (b) has the second, and the material(c) has the smallest contraction. According to the mechanics theory, material (a) will impose a compress force on material (b), material(c) will impose a tensile force on the material (b), and thus, the upper and lower surfaces of the material (b) are subjected to an asymmetric force. The asymmetric force produces a bending moment on the material (b), as illustrated in the Figure 13. This bending moment leads to material (b) to bend and thus formation of smile. Work in a separate study [8] shows that the laser array was curved up after soldering which leads to thicker solder layer at two ends and thinner solder interface at the central region during the reflow process. To improve near-field linear of high-power semiconductor laser array,two factors need to be considered. 1) Control the CTE mismatch between packaging materials. A suitable heat sink material should be selected to match with the GaAs substrate, such as CuW alloys. It can ensure the mismatch is minimized between the chips and the heat sink. 2) Control the inhomogeneity of thermal stress distribution. First, minimize thermal stress concentration by improving the level of packaging technology to keep the thickness of die bonding layer consistency; Second, keep the consistency in manufacturing the chip and the heat sink with very flat and straight surfaces to avoid extra stress imposed on the laser bar/array. Conclusions Conduction cooled 808nm laser array packages with different packaging processes were characterized using high resolution surface profilers, and optical imaging techniques to study the smile of high power diode laser bar or array. It can be concluded that (1) ideally, the smile of a high power diode laser bar/array caused by indium solder packaging process is about less 1µm; and it is less 0.2µm if AuSn solder is used during the packaging process. (2) The smile of a laser bar/array caused by soldering on a thinner copper heatsink is Electronic Components and Technology Conference
6 larger than that caused by soldering on a thicker copper heatsink. (3) Selection of pick-up tool material of low CTE matched with laser diode array enables the low smile available in die bonding process. Study results suggest that tungsten is a better option for the pick-up tool in die bonding process. (4) The smile of a high power diode laser bar/array is significantly influenced by the packaging process. References [1] Uwe Brauch, Peter Loosen, and Hans Opower, High- Power Diode Lasers for Direct Applications, Springer- Verlag (Berlin Heidelberg ) 2000, pp.1-2. [ 2 ] Brian Faircloth, High-brightness high-power fiber coupled diode laser system for material processing and laser pumping, Proceedings of SPIE Vol. 4973, 2003, pp [3] J Dutta Majumdar and I Manna, Laser processing of materials, Sadhana( India),Vol. 28, Parts 3 & 4, 2003, pp [ 4 ] E. Rugi, P. Mueller, P. Lambelet, Scalable high brightness laser pump for aerospace applications, IEEE, 2003, pp81. [5] Michael A. Bolshov, Yuri A. Kuritsyn, Laser Analytical Spectroscope, Ullmann s Encyclopedia of Introdustrial Chemistry, Six Edition, Wiley (Weinheim, Germany), 2001, pp [6] H. Zhu, I. C. Ruset, and F. W. Hersman, Spectrally narrowed external-cavity high-power stack of laser diode arrays, OPTICS LETTERS, Vol. 30, No. 11, 2005, pp [7] Alan R. Mickelson, Nagesh R. Basavanhally and Yung- Cheng Lee, Optoelectronic packaging, John Wiley& Sons, Inc. (605 Third avenue, New York, NY) 1997,pp60. [8] Xingsheng Liu, Jingwei Wang, and Peiyong Wei, Study of the mechanisms of spectral broadening in high power semiconductor laser arrays, Electronic Components and Technology Conference, IEEE, 2008, pp Electronic Components and Technology Conference
A New Continuous Wave 2500W Semiconductor Laser Vertical Stack
A New Continuous Wave 2500W Semiconductor Laser Vertical Stack Xiaoning Li 1,2, Chenhui Peng 1, Yanxin Zhang 1, Jingwei Wang 1, Lingling Xiong 1, Pu Zhang 1, Xingsheng Liu 1,3 1 State Key Laboratory of
More informationThermal Analysis of High Power Pulse Laser Module
Thermal Analysis of High Power Pulse Laser Module JinHan Ju PerkinElmer Optoelectronics Salem MA 01970 Abstract Thermal management is very critical in laser diode packaging, especially for a high power
More informationDie Bonding of Single Emitter Semiconductor Laser with Nano-Scale Silver Paste
Die Bonding of Single Emitter Semiconductor Laser with Nano-Scale Silver Paste Yi YanI, Xu Chen 1*, Xing Sheng Liu2,3, Guo-Quan Lu4,5 1 School of Chemical Engineering and Technology, Tianjin University,
More informationBONDING OF MULTIPLE WAFERS FOR HIGH THROUGHPUT LED PRODUCTION. S. Sood and A. Wong
10.1149/1.2982882 The Electrochemical Society BONDING OF MULTIPLE WAFERS FOR HIGH THROUGHPUT LED PRODUCTION S. Sood and A. Wong Wafer Bonder Division, SUSS MicroTec Inc., 228 SUSS Drive, Waterbury Center,
More informationMechanical Behavior of Flip Chip Packages under Thermal Loading
Mechanical Behavior of Flip Packages under Thermal Loading *Shoulung Chen 1,2, C.Z. Tsai 1,3, Nicholas Kao 1,4, Enboa Wu 1 1 Institute of Applied Mechanics, National Taiwan University 2 Electronics Research
More informationHigh temperature reliability of power module substrates
High temperature reliability of power module substrates Dean Hamilton, University of Warwick, United Kingdom, d.p.hamilton@warwick.ac.uk Liam Mills, TT Electronics Semelab Ltd, Lutterworth, UK, Liam.Mills@semelab-tt.com
More informationTopography and Deformation Measurement and FE Modeling Applied to substrate-mounted large area wafer-level packages (including stacked dice and TSVs)
Topography and Deformation Measurement and FE Modeling Applied to substrate-mounted large area wafer-level packages (including stacked dice and TSVs) M. Hertl Insidix, 24 rue du Drac, 38180 Grenoble/Seyssins,
More informationAn Advanced Reliability Improvement and Failure Analysis Approach to Thermal Stress Issues in IC Packages
An Advanced Reliability Improvement and Failure Analysis Approach to Thermal Stress Issues in IC Packages Michael Hertl 1, Diane Weidmann 1, and Alex Ngai 2 1 Insidix, 24 rue du Drac, F-38180 Grenoble/Seyssins,
More informationDesign for Plastic Ball Grid Array Solder Joint Reliability. S.-W. R. Lee, J. H. Lau*
Page 1 of 9 Design for Plastic Ball Grid Array Solder Joint Reliability The Authors S.-W. R. Lee, J. H. Lau* S.-W. R. Lee, Department of Mechanical Engineering, The Hong Kong University of Science and
More informationMATERIALS REQUIREMENTS FOR OPTOELECTRONIC PACKAGING -- FIBER SOLDERING
MATERIALS REQUIREMENTS FOR OPTOELECTRONIC PACKAGING -- FIBER SOLDERING Fahong Jin Spring 2003 TABLE OF CONTENTS 1. INTRODUCTION 2. OPTICAL FIBER METALLIZATION 3. SOLDER SELECTION FOR FIBER JOINT 4. FEEDTHROUGH
More informationReliability Evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages
Reliability Evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages Jae-Won Jang* a, Kyoung-Lim Suk b, Kyung-Wook Paik b, and Soon-Bok Lee a a Dept. of Mechanical Engineering, KAIST, 335 Gwahangno
More informationDesign of an Enhanced Sensitivity FBG Strain Sensor and Application in Highway Bridge Engineering
PHOTONIC SENSORS / Vol. 4, No., 4: 6 67 Design of an Enhanced Sensitivity FBG Strain Sensor and Application in Highway Bridge Engineering Litong LI,*, Dongsheng ZHANG,, Hui LIU, Yongxing GUO,, and Fangdong
More informationThermal Behavior of Metal Embedded Fiber Bragg Grating Sensor
Thermal Behavior of Metal Embedded Fiber Bragg Grating Sensor Xiao Chun Li 1, Fritz Prinz 1, and John Seim 2 1. Rapid Prototyping Laboratory, Building 530 Room 226, Stanford University, Stanford, CA94305
More informationBeam Lead Attachment Methods. Application Note 992
Beam Lead Attachment Methods Application Note 992 Introduction This application note gives the first time user a general description of various attachment methods for beam lead devices. The attached table
More informationPoP/CSP Warpage Evaluation and Viscoelastic Modeling
PoP/CSP Warpage Evaluation and Viscoelastic Modeling Wei Lin, Min Woo Lee Amkor Technology 19 S Price Rd, Chandler, AZ 85286 wlin@amkor.com Abstract The purpose of this paper was to evaluate the critical
More informationApplication Note AN 992
Beam Lead Attachment Methods Application Note AN 992 Description This application note gives the first time user a general description of various attachment methods for beam lead devices. The attached
More informationAluminum / Copper oscillation welding with a 500 W direct diode laser
Application Note Issued: 2016-06-01 Aluminum / Copper oscillation welding with a 500 W direct diode laser SUMMARY The performance of the 500 W DirectProcess direct diode laser for oscillating welding by
More informationAnalysis of Phosphor Heat Generation and Temperature Distribution in Remoteplate Phosphor-Converted Light-Emitting Diodes
Proceedings of the Asian Conference on Thermal Sciences 2017, 1st ACTS March 26-30, 2017, Jeju Island, Korea ACTS-P00328 Analysis of Phosphor Heat Generation and Temperature Distribution in Remoteplate
More informationHigh-Power Diode Lasers
Roland Diehl (Ed.) High-Power Diode Lasers Fundamentals, Technology, Applications With Contributions by Numerous Experts With 260 Figures and 20 Tables K@f Springer Contents Introduction to Power Diode
More informationInternational Conference on Information Sciences, Machinery, Materials and Energy (ICISMME 2015)
International Conference on Information Sciences, Machinery, Materials and Energy (ICISMME 25) Simulation Research on Solder Joint Residual Strain Energy of Au8/Sn2 Eutectic Soldering GaAs Chip Yajun Liu,
More informationSealing optical fibers without metallization: design guidelines
Sealing optical fibers without metallization: design guidelines Raymond L. Dietz* Diemat, Inc., 19 Central St., Byfield, MA 01922 ABSTRACT This paper describes an alternative way of sealing an optical
More informationStudy and mechanical characterization of high temperature power electronic packaging
Study and mechanical characterization of high temperature power electronic packaging A. BAAZAOUI a, O. DALVERNY a, J. ALEXIS a, M. KARAMA a a. Université de Toulouse; INP/ENIT; LGP ; 47 avenue d'azereix;
More informationCrack extension research of FR4 substrate embedded 90 bend optical fiber under the random vibration Wei Li 1,a, Dejian Zhou 1,b
4th International Conference on Machinery, Materials and Computing Technology (ICMMCT 2016) Crack extension research of FR4 substrate embedded 90 bend optical fiber under the random vibration Wei Li 1,a,
More informationHeat Transfer Characteristics in High Power LED Packaging
Heat Transfer Characteristics in High Power LED Packaging Chi-Hung Chung 1, Kai-Shing Yang 2,*, Kuo-Hsiang Chien 2, Ming-Shan Jeng 2 and Ming-Tsang Lee 1, 1 Department of Mechanical Engineering, National
More informationStudy of High Power COB LED Modules with Respect to Topology of Chips
Study of High Power COB LED Modules with Respect to Topology of Chips Nikolay Vakrilov 1), Anna Andonova 1), and Nadejda Kafadarova 2) 1) FEET, Technical University of Sofia, Sofia, Bulgaria 2) Faculty
More informationThermal Modeling and Experimental Validation in the LENS Process
The Eighteenth Solid Freeform Fabrication Symposium August 6-8, 6 2007, Austin, Texas Thermal Modeling and Experimental Validation in the LENS Process Liang Wang 1, Sergio D. Felicelli 2, James E. Craig
More informationAgilent Beam Lead Attachment Methods. Application Note. Introduction. Attachment Methods
Agilent Beam Lead Attachment Methods Application Note Figure 1. General setup for attaching beam lead devices Introduction This application note gives the first time user a general description of various
More informationFinite Element Analysis of a High Power Resistor
Barry Industries, Inc. Finite Element Analysis of a High Power Resistor prepared by: Barry Industries, Inc. date: 07 April 1996 . Finite Element Analysis of a High Power Termination Table of Contents Table
More informationEffect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging
Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging Y. W. Pok, D. Sujan, M. E. Rahman, S. S. Dol School of Engineering and Science, Curtin University Sarawak Campus, CDT
More informationOptoelectronic Chip Assembly Process of Optical MCM
2017 IEEE 67th Electronic Components and Technology Conference Optoelectronic Chip Assembly Process of Optical MCM Masao Tokunari, Koji Masuda, Hsiang-Han Hsu, Takashi Hisada, Shigeru Nakagawa, Science
More informationApplication of Controlled Thermal Expansion in Microlamination for the Economical Production of Bulk Microchannel Systems Abstract Introduction
Application of Controlled Thermal Expansion in Microlamination for the Economical Production of Bulk Microchannel Systems Christoph Pluess and Brian K. Paul Department of Industrial and Manufacturing Engineering,
More informationSupporting Information
Copyright WILEY-VCH Verlag GmbH & Co. KGaA, 69469 Weinheim, Germany, 2018. Supporting Information for Adv. Mater., DOI: 10.1002/adma.201704947 Bioinspired, Spine-Like, Flexible, Rechargeable Lithium-Ion
More informationSolder joint reliability of cavity-down plastic ball grid array assemblies
cavity-down plastic ball grid array S.-W. Ricky Lee Department of Mechanical Engineering, The Hong Kong University of Science and, Kowloon, Hong Kong John H. Lau Express Packaging Systems, Inc., Palo Alto,
More informationThickness and composition analysis of thin film samples using FP method by XRF analysis
Technical articles Thickness and composition analysis of thin film samples using FP method by XRF analysis Hikari Takahara* 1. Introduction X-ray fluorescence spectroscopy (XRF) is an elemental quantification
More informationGold Passivated Mechanically Flexible Interconnects (MFIs) with High Elastic Deformation
Gold Passivated Mechanically Flexible Interconnects (MFIs) with High Elastic Deformation Chaoqi Zhang, Hyung Suk Yang, and Muhannad S. Bakir School of Electrical and Computer Engineering Georgia Institute
More informationEV Group 300mm Wafer Bonding Technology July 16, 2008
EV Group 300mm Wafer Bonding Technology July 16, 2008 EV Group in a Nutshell st Our philosophy Our mission in serving next generation application in semiconductor technology Equipment supplier for the
More informationImpact of Heatsink Attach Loading on FCBGA Package Thermal Performance
Impact of Heatsink Attach Loading on FCBGA Package Thermal Performance Sasanka L. Kanuparthi, Jesse E. Galloway and Scott McCann Amkor Technology 1900 S Price Rd, Chandler, AZ, USA, 85286 Phone: (480)
More informationFEM Analysis on Warpage and Stress at the Micro Joint of Multiple Chip Stacking
Hisada et al.: FEM Analysis on Warpage and Stress at the Micro Joint (1/6) [Technical Paper] FEM Analysis on Warpage and Stress at the Micro Joint of Multiple Chip Stacking Takashi Hisada*, Yasuharu Yamada*,
More informationEffects of asymmetric creep-ageing behaviour on springback of AA2050-T34 after creep age forming
Available online at www.sciencedirect.com ScienceDirect Procedia Engineering 207 (2017) 287 292 International Conference on the Technology of Plasticity, ICTP 2017, 17-22 September 2017, Cambridge, United
More informationAutomating Hybrid Circuit Assembly
Automating Hybrid Circuit Assembly Die Attach The demand for hybrid circuits has remained strong as emerging and existing applications continue to rely on this proven technology. Developers of applications
More informationWelding of Thin Foils with Elliptical Beams. Abe, Nobuyuki; Funada, Yoshinori; Tsukamoto, Masahiro.
Title Author(s) Citation Welding of Thin Foils with Elliptical Beams Abe, Nobuyuki; Funada, Yoshinori; Tsukamoto, Masahiro Transactions of JWRI. 37(1) P.27-P.31 Issue Date 2008-07 Text Version publisher
More informationDYNAMIC RESPONSE OF VISCOPLASTIC THIN-WALLED GRIDERS IN TORSION
Stability of Structures XIII-th Symposium Zakopane 1 DYNAMIC RESPONSE OF VISCOPLASTIC THIN-WALLED GRIDERS IN TORSION L. CZECHOWSKI Department of Strength of Materials, Technical University of Lodz Stefanowskiego
More informationThermo-Mechanical Reliability of Through-Silicon Vias (TSVs)
1 Thermo-Mechanical Reliability of Through-Silicon Vias (TSVs) Xi Liu Ph.D. Student and Suresh K. Sitaraman, Ph.D. Professor The George W. Woodruff School of Mechanical Engineering Georgia Institute of
More information, 29, , (1995). ABSTRACT
1 Brodt, M. and Lakes, R. S., "Composite materials which exhibit high stiffness and high viscoelastic damping", adapted from J. Composite Materials, 29, 1823-1833, (1995). ABSTRACT Composite micro-structures
More informationResearch Article Thermal Characteristics of InGaN/GaN Flip-Chip Light Emitting Diodes with Diamond-Like Carbon Heat-Spreading Layers
International Photoenergy, Article ID 829284, 5 pages http://dx.doi.org/1.1155/214/829284 Research Article Thermal Characteristics of InGaN/GaN Flip-Chip Light Emitting Diodes with Diamond-Like Carbon
More informationSMU 2113 ENGINEERING SCIENCE. PART 1 Introduction to Mechanics of Materials and Structures
SMU 2113 ENGINEERING SCIENCE PART 1 Introduction to Mechanics of Materials and Structures These slides are designed based on the content of these reference textbooks. OBJECTIVES To introduce basic principles
More informationA Novel Extrusion Microns Embossing Method of Polymer Film
Modern Mechanical Engineering, 2012, 2, 35-40 http://dx.doi.org/10.4236/mme.2012.22005 Published Online May 2012 (http://www.scirp.org/journal/mme) A Novel Extrusion Microns Embossing Method of Polymer
More informationMicro-tube insertion into aluminum pads: Simulation and experimental validations
Micro-tube insertion into aluminum pads: Simulation and experimental validations A. Bedoin, B. Goubault, F. Marion, M. Volpert, F. Berger, A. Gueugnot, H. Ribot CEA, LETI, Minatec Campus 17, rue des Martyrs
More informationLaser Soldered Eutectic Die-Bonding Processes in LED Packaging
Sensors and Materials, Vol. 28, No. 5 (216) 49 42 MYU Tokyo 49 S & M 1192 Laser Soldered Eutectic Die-Bonding Processes in LED Packaging Te-Ching Hsiao, Ah-Der Lin, 1* and Wei-Yi Chan 2 Department of Mechanical
More information23 rd ASEMEP National Technical Symposium
THE EFFECT OF GLUE BOND LINE THICKNESS (BLT) AND FILLET HEIGHT ON INTERFACE DELAMINATION Raymund Y. Agustin Janet M. Jucar Jefferson S. Talledo Corporate Packaging & Automation/ Q&R STMicroelectronics,
More informationPreparation and Research on Mechanical Properties of a Corrugated-Aluminum Honeycomb Composite Pale
International Journal of Latest Research in Engineering and Management" (IJLREM) ISSN: 2456-0766 www.ijlrem.org Volume 2 Issue 2 ǁ February. 2018 ǁ PP 10-15 Preparation and Research on Mechanical Properties
More informationDesign and fabrication of functionally graded components by selective laser melting. C. N. Sun*#, S. Y. Choy*+, K. F. Leong*+, J.
Solid Freeform Fabrication 216: Proceedings of the 26th 27th Annual International Solid Freeform Fabrication Symposium An Additive Manufacturing Conference Design and fabrication of functionally graded
More informationDevelopment of Pressure Sensor for Oil and Gas Field Based on Sputtered Thin Film
5th International Conference on Advanced Design and Manufacturing Engineering (ICADME 015) Development of Pressure Sensor for Oil and Gas Field Based on Sputtered Thin Film Yong Chen 1, a *, Shuangquan
More informationFlexible Substrates for Smart Sensor Applications
Flexible Substrates for Smart Sensor Applications A novel approach that delivers miniaturized, hermetic, biostable and highly reliable smart sensor modules. AUTHORS Dr. Eckardt Bihler, Dr. Marc Hauer,
More informationSecure Attachment in Pulsed Power Applications
Secure Attachment in Pulsed Power Applications Michael R. Ehlert Director of Process Engineering Dr. Peter Barnwell European Business Manager Ronald H. Schmidt V. P. Engineering and Technology Phillip
More informationFinite Element Modeling of Heat Transfer and Thermal Stresses for Three-dimensional Packaging of Power Electronics Modules
Finite Element Modeling of Heat Transfer and Thermal Stresses for Three-dimensional Packaging of Power Electronics Modules Simon S. Wen and Guo-Quan Lu Center for Power Electronics Systems The Bradley
More informationAdaption to scientific and technical progress under Directive 2002/95/EC
. Adaption to scientific and technical progress under Directive 2002/95/EC Results previous evaluation Exemption No. 13 Lead and cadmium in optical and filter glass (Excerpt from ERA Report 2004) Öko-Institut
More informationSpecimen Preparation Technique for a Microstructure Analysis Using the Focused Ion Beam Process
Specimen Preparation Technique for a Microstructure Analysis Using the Focused Ion Beam Process by Kozue Yabusaki * and Hirokazu Sasaki * In recent years the FIB technique has been widely used for specimen
More informationUltra Fine Pitch Bumping Using e-ni/au and Sn Lift-Off Processes
Ultra Fine Pitch Bumping Using e-ni/au and Sn Lift-Off Processes Andrew Strandjord, Thorsten Teutsch, and Jing Li Pac Tech USA Packaging Technologies, Inc. Santa Clara, CA USA 95050 Thomas Oppert, and
More informationQuantitative thickness measurement of dual layer materials using X-ray absorption-based technique
SIMTech technical reports Volume 8 Number 1 Jan - Mar 7 Quantitative thickness measurement of dual layer materials using X-ray absorption-based technique L. M. Sim and A. C. Spowage Abstract Gray levels
More informationHardening Enhancement for Carbon Steel Using High Power CO 2 Laser
Hardening Enhancement for Carbon Steel Using High 2 Laser Nafie A. Almuslet 1 * and Abd Alsalam Alshake 2 1 Institute of Sudan University of Science and Technology (www.sustech.edu), Khartoum / Republic
More informationPROCEEDINGS OF SPIE. Thin-film polarizer for high power laser system in China
PROCEEDINGS OF SPIE SPIEDigitalLibrary.org/conference-proceedings-of-spie Thin-film polarizer for high power laser system in China Jianda Shao, Kui Yi, Meiping Zhu Jianda Shao, Kui Yi, Meiping Zhu, "Thin-film
More informationFraunhofer IZM Berlin
Fraunhofer IZM Berlin Advanced Packaging for High Power LEDs Dr. Rafael Jordan SIIT Agenda Gluing Soldering Sintering Transient Liquid Phase Bonding/Soldering Thermo Compression Junction Temperature Measurements
More information# 31. Mounting Considerations for High Power Laser Diodes
# 31 Mounting Considerations for High Power Laser Diodes Mounting Considerations for High Power Laser Diodes By: Patrick Gale and Andrew Shull Introduction As the optical power of laser diodes increases
More informationStudy on the thermal protection performance of superalloy honeycomb panels in high-speed thermal shock environments
THEORETICAL & APPLIED MECHANICS LETTERS 4, 021004 (2014) Study on the thermal protection performance of superalloy honeycomb panels in high-speed thermal shock environments Dafang Wu, 1, a) Anfeng Zhou,
More informationBare Die Assembly on Silicon Interposer at Room Temperature
Minapad 2014, May 21 22th, Grenoble; France Bare Die Assembly on Silicon Interposer at Room Temperature W. Ben Naceur, F. Marion, F. Berger, A. Gueugnot, D. Henry CEA LETI, MINATEC 17, rue des Martyrs
More informationBeam Leads. Spider bonding, a precursor of TAB with all-metal tape
Beam Leads The vast majority of chips are intended for connection with thermosonic bonds: all other methods require some modification to the wafer. As early as 1972, Jordan described three gang-bonding
More informationThermomechanical Response of Anisotropically Conductive Film
Thermomechanical Response of Anisotropically Conductive Film Yung Neng Cheng, Shyong Lee and Fuang Yuan Huang Department of Mechanical Engineering National Central University, Chung-li, Taiwan shyong@cc.ncu.edu.tw
More informationThermomechanical Stress Analysis of Packaging Options for VCSEL Arrays
University of New Mexico UNM Digital Repository Mechanical Engineering ETDs Engineering ETDs 7-1-2016 Thermomechanical Stress Analysis of Packaging Options for VCSEL Arrays James Rosprim Follow this and
More information24th European Photovoltaic Solar Energy Conference and Exhibition, September 2009, Hamburg, Germany
A MULTISCALE MODEL OF THE ALUMINIUM LAYER AT THE REAR SIDE OF A SOLAR CELL T. van Amstel 1, V. Popovich 2 and I.J. Bennett 1 ¹ECN Solar Energy, P.O. Box 1, 1755 ZG Petten, The Netherlands ²Department of
More informationEcological Study of Moisture Content of Clay Soil Affecting Compressive Failure of the CEP Pile
Ekoloji 27(106): 905-911 (2018) Ecological Study of Moisture Content of Clay Soil Affecting Compressive Failure of the CEP Pile Yongmei Qian 1*, Xue Feng 1, Wei Tian 1, Ruozhu Wang 1 1 Jilin Jianzhu University,
More informationSurface Plasmon Resonance Analyzer
Surface Plasmon Resonance Analyzer 5 6 SPR System Based on Microfluidics Wide Dynamic Range Kinetic Analysis by Detection of Association /Dissociation of Bio-Molecules Measuring of Mass Change below
More informationYOUR Strategic TESTING ENGINEERING CONCEPT SMT FLIP CHIP PRODUCTION OPTO PACKAGING PROCESS DEVELOPMENT CHIP ON BOARD SUPPLY CHAIN MANAGEMENT
YOUR Strategic TECHNOLOGY PARTNER Wafer Back-End OPTO PACKAGING PROCESS DEVELOPMENT CONCEPT FLIP CHIP PROTOTYping ENGINEERING TESTING SMT PRODUCTION CHIP ON BOARD SUPPLY CHAIN MANAGEMENT Next Level 0f
More informationThe Elimination of Whiskers from Electroplated Tin
The Elimination of Whiskers from Electroplated Tin by Masanobu Tsujimoto, Shigeo Hashimoto, Masayuki Kiso, Raihei Ikumoto,Toshikazu Kano and Genki Kanamori C. Uyemura & Co., Ltd. - Hirakata Japan & Don
More informationREDUCTION OF WARPAGE OCCURRENCE STACK-DIE QFN THROUGH FEA AND STATISTICAL METHOD
REDUCTION OF WARPAGE OCCURRENCE STACK-DIE QFN THROUGH FEA AND STATISTICAL METHOD I. Abdullah, M. Z. M. Talib, I. Ahmad, M. N. B. C. Kamarudin and N. N. Bachok Faculty of Engineering,Universiti Kebangsaan
More informationProcessor Performance, Packaging and Reliability Utilizing a Phase Change Metallic Alloy Thermal Interface System
Processor Performance, Packaging and Reliability Utilizing a Phase Change Metallic Alloy Thermal Interface System Chris G. Macris, Thomas R. Sanderson, Robert G. Ebel, Christopher B. Leyerle Enerdyne Solutions,
More informationReliability of RoHS-Compliant 2D and 3D 1С Interconnects
Reliability of RoHS-Compliant 2D and 3D 1С Interconnects John H. Lau, Ph.D. New York Chicago San Francisco Lisbon London Madrid Mexico City Milan New Delhi San Juan Seoul Singapore Sydney Toronto Foreword
More informationPCB Technologies for LED Applications Application note
PCB Technologies for LED Applications Application note Abstract This application note provides a general survey of the various available Printed Circuit Board (PCB) technologies for use in LED applications.
More informationHardness Tester BHT User Manual ~ 1 ~
Hardness Tester BHT-1800 User Manual ~ 1 ~ 1. Testing Principle and Application 1.1 Testing Principle 2. Schematic Diagram of Product and Impact Device D-type Impact Device It's a dynamic method based
More informationBOROFLOAT & Glass Wafers: A Union of Inspiration & Quality
Home Tech SCHOTT North America, Inc. 553 Shepherdsville Road Louisville, KY 4228 USA Phone: +1 (52) 657-4417 Fax: +1 (52) 966-4976 Email: borofloat@us.schott.com www.us.schott.com/borofloat/wafer BOROFLOAT
More informationCree EZ-p LED Chips Handling and Packaging Recommendations
Cree EZ-p LED Chips Handling and Packaging Recommendations INTRODUCTION This application note provides the user with an understanding of Cree s EZ-p p-pad up (anode up) LED devices, as well as recommendations
More informationPerformance Improvement on Water-cooled Cold-Plate
Proceedings of the 4th WSEAS International Conference on Heat and Mass Transfer, Gold Coast, Queensland, Australia, January 17-19, 2007 104 Performance Improvement on Water-cooled Cold-Plate SHYAN-FU CHOU,
More informationLED Die Attach Selection Considerations
LED Die Attach Selection Considerations Gyan Dutt & Ravi Bhatkal Alpha, An Alent plc Company Abstract Die attach material plays a key role in performance and reliability of mid, high and super-high power
More informationDynamic process of angular distortion between aluminum and titanium alloys with TIG welding
Dynamic process of angular distortion between aluminum and titanium alloys with TIG welding WANG Rui( 王蕊 ), LIANG Zhen-xin( 梁振新 ), ZHANG Jian-xun( 张建勋 ) State Key Laboratory for Mechanical Behavior of
More informationThree-Dimensional Molded Interconnect Devices (3D-MID)
Jörg Frank Three-Dimensional Molded Interconnect Devices (3D-MID) Materials, Manufacturing, Assembly and Applica ons for Injec on Molded Circuit Carriers Sample Pages ISBN 978-1-56990-551-7 HANSER Hanser
More informationPDMS coated grip. Au film. Delamination Zone
P Delamination Zone a a PDMS coated grip t Au film Supplementary Figure S1. A schematic diagram of delamination zone at the interface between the Au thin film specimen under the tensile load, P, and the
More informationPERFORMANCE OF RC BRIDGE COLUMNS SUBJECTED TO LATERAL LOADING
Istanbul Bridge Conference August 11-13, 2014 Istanbul, Turkey PERFORMANCE OF RC BRIDGE COLUMNS SUBJECTED TO LATERAL LOADING S. Sotoud 1 and R.S. Aboutaha 2 ABSTRACT Old existing reinforced concrete bridge
More informationOptimizing Strain Gage Excitation Levels
Micro-Measurements Strain ages and Instruments Tech Note TN-502 Optimizing Strain age Excitation Levels Introduction A common request in strain gage work is to obtain the recommended value of bridge excitation
More informationExperimental and Numerical Study of Tool Effect on Curing Deformation for the Composite Missile Structure
Experimental and Numerical Study of Tool Effect on Curing Deformation for the Composite Missile Structure Experimental and Numerical Study of Tool Effect on Curing Deformation for the Composite Missile
More informationPower Electronics Packaging Solutions for Device Junction Temperature over 220 o C
EPRC 12 Project Proposal Power Electronics Packaging Solutions for Device Junction Temperature over 220 o C 15 th August 2012 Page 1 Motivation Increased requirements of high power semiconductor device
More information3.46 OPTICAL AND OPTOELECTRONIC MATERIALS
Badgap Engineering: Precise Control of Emission Wavelength Wavelength Division Multiplexing Fiber Transmission Window Optical Amplification Spectrum Design and Fabrication of emitters and detectors Composition
More informationWelding Processes. Consumable Electrode. Non-Consumable Electrode. High Energy Beam. Fusion Welding Processes. SMAW Shielded Metal Arc Welding
Fusion Consumable Electrode SMAW Shielded Metal Arc Welding GMAW Gas Metal Arc Welding SAW Submerged Arc Welding Non-Consumable Electrode GTAW Gas Tungsten Arc Welding PAW Plasma Arc Welding High Energy
More informationSherlock 4.0 and Printed Circuit Boards
Sherlock 4.0 and Printed Circuit Boards DfR Solutions January 22, 2015 Presented by: Dr. Nathan Blattau Senior Vice President 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 301-474-0607 www.dfrsolutions.com
More informationNovel Technique for Flip Chip Packaging of High power Si, SiC and GaN Devices. Nahum Rapoport, Remtec, Inc.
Novel Technique for Flip Chip Packaging of High power Si, SiC and GaN Devices Nahum Rapoport, Remtec, Inc. 1 Background Electronic Products Designers: under pressure to decrease cost and size Semiconductor
More informationStudy of Ion Beam Sputtering using Different Materials
ab Journal of Nuclear Science and Applications, 5(), Study of Ion Beam Sputtering using Different Materials H. El-Khabeary Accelerators & Ion Sources Department, Basic Nuclear Science Division, Nuclear
More informationChapter 4 Fabrication Process of Silicon Carrier and. Gold-Gold Thermocompression Bonding
Chapter 4 Fabrication Process of Silicon Carrier and Gold-Gold Thermocompression Bonding 4.1 Introduction As mentioned in chapter 2, the MEMs carrier is designed to integrate the micro-machined inductor
More informationFinite Element Simulation of Molding Process of Cold Bending Pipe
Finite Element Simulation of Molding Process of Cold Bending Pipe Dongshen He 1, Jie Yang 1, Liquan Shen 2, Gehong Liu 1 1 School of Mechanical Engineering, Southwest Petroleum University, Chengdu, 610500,
More informationA Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly
A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly Authored by: Amanda Hartnett, Jacques Matteau, Ronnie Spraker, and Omar Knio Abstract As
More informationEffect of Contact between Electrode and Interconnect on Performance of SOFC Stacks
DOI: 10.1002/fuce.201000176 Effect of Contact between Electrode and Interconnect on Performance of SOFC Stacks W. B. Guan 1, H. J. Zhai 1, L. Jin 1,T.S.Li 1, and W. G. Wang 1 * 1 Ningbo Institute of Material
More information3D-IC Integration using D2C or D2W Alignment Schemes together with Local Oxide Reduction
3D-IC Integration using D2C or D2W Alignment Schemes together with Local Oxide Reduction Gilbert Lecarpentier*, Jean-Stéphane Mottet* SET S.A.S. (Smart Equipment Technology), 131 Impasse Barteudet, 74490
More information