Statement of Work (SOW) inemi Automotive Electronics PCB/PCBA Material Characterization for Automotive Harsh Environments Project

Transcription

1 Versin 1.0 Date: March 23, 2016 Prject Leader: Steve Brwn, Alpha inemi Staff: Steve Payne Backgrund/Cntext Statement f Wrk (SOW) inemi Autmtive Electrnics PCB/PCBA Material Characterizatin fr Autmtive Harsh Envirnments Prject There appears t be n cherent view f specificatins fr autmtive electrnics fr high pwer, high density and high reliability. IPC class 3 (IPC-A-610 Class 3) is the highest IPC classificatin but nt written specifically fr under-the-hd applicatins and is therefre nt always sufficient r apprpriate. Initially a Tier 1 supplier may specify IPC class 3 whereas nw they specify IPC class 3 + JIS + wide range f OEM specific standards, etc. There is a need t review OEM s specificatins and requirements (BMW, VW, HKMC, etc.) and undertake a crss cmparisn. Mst standards mandate thermal cycling between -40C t +125C, with different ramp rates and dwell perids. This is verkill fr sme applicatins (particularly in-cabin electrnics), yet nt satisfactry fr latest generatin under-the-hd applicatins as many OEMs specify additinal criteria such as high-temperature vibratin testing. Operating temperatures in excess f +125C are nw cmmn (such as +140C); with many field failures caused by extreme cnditins. There is als a trend t specify and prcure material and cmpnents that d nt meet any criteria mre than is abslutely needed (gd enugh scenari). Typical Tier 1 s will be serving multiple OEMs requiring multiple validatin cycles while trying t simplify the chice r cmmn suite f materials. This is a challenge fr bth the material suppliers and the users. Scpe f Wrk Prblem: Fr autmtive electrnics used in harsh envirnments there is n unified and accepted suite f material standards that encmpasses all applicatins and envirnmental cnditins. NOTE: All changes t SOW must be apprved by the Technical Cmmittee fr versin cntrl Page 1 f 9

2 Opprtunity: Delineate and understand the range f failure mdes, material requirements and existing standards and specificatins t enable a cmpendium f recmmended standards t be used industry wide fr autmtive materials used in harsh envirnments. Majr Objectives: Define prduct categries fr high pwer/high density (level f miniaturizatin); define terminlgy. Define the main attributes f a material that wuld place it in a specific categry (sme OEMs d have a prprietary categrizatin system). Review f existing standards in cmmn use Industry standard PCB and PCBA requirements, IPC, etc. Identify the suite f tests that can meet a cnsensus f requirements frm Tier 1 and OEMs Material characterizatin tests t mre accurately replicate applicatins Ptentially apply certain existing tests fr specific applicatins int a suite f tests Define varius acceptability levels fr varius categries f autmtive electrnics Determine material perfrmance attributes that need t pass tests fr specific applicatins An example may be a new slder ally r cmpnent may be validated within a PCBA thrugh a high T & vibratin fatigue test a shear test lking fr jint failure n a cmpnent. It is anticipated that Phase 1 f this prject wuld take n mre than 12 mnths. Purpse f Prject The inemi 2015 Radmap and Technical Plan emphasizes the extreme reliability requirements in autmtive electrnics t meet warranty requirements and missin critical applicatins. The harsh envirnment fr autmtive electrnics includes high and lw temperature extremes, vibratin, shck, drp, expsure t dirt and cntaminants, misture, chemicals, radiatin, and gasses. When specifying PCBs and PCBAs, autmtive OEMs nw need t supplement current prcurement standards (e.g., IPC) with their wn specificatins t prvide greater assurance that their reliability requirements will be fulfilled. The purpse f this prject is t: Identify cmmn failure mechanisms in autmtive electrnics and determine hw standards can relate t each. Define a suite f test prcedures fr Tier 1 and material manufacturers that will give a high degree f cnfidence in meeting OEM s requirements. Crrelate the varius standards and prprietary specificatins fr autmtive PCB and PCBA materials fr a range f harsh envirnments t enable a cnsensus fr standardized prcurement categries. NOTE: All changes t SOW must be apprved by the Technical Cmmittee fr versin cntrl Page 2 f 9

3 The benefits f this prject will include: Enable cmmnality in specifying PCB and PCBA within the autmtive supply chain frm materials suppliers thrugh t the OEM. Prvide better assurance fr meeting reliability requirements as material chices widen and the miniaturizatin f PCB designs cntinues. Enable Tier 1 and OEMs t be able t mre easily cmpare material datasheets frm differing suppliers. Reduce csts and assciated timescales in re-qualifying prducts fr each OEM prprietary specificatin. IS / IS NOT Analysis This Prject IS: This Prject IS NOT: PCB/PCBA Material Characterizatin fr Autmtive Harsh Envirnments Prject A PCB, flex circuit & PCBA study fr harsh envirnment autmtive applicatins; harsh cnditin with >100 C cntinuus perating temperature T cllect infrmatin frm OEMs and Tier 1 aut electrnics industries t identify key differences in their requirements and expectatins T define several categries and terminlgy fr high pwer and high density PCBs used in harsh envirnment autmtive applicatins T identify and define cmmn failure mechanisms and perfrmance limitatins f PCB/PCBA used in harsh envirnment autmtive applicatins Will review current PCB and PCBA glbal standards and autmbile OEM requirements and test standards fr autmtive electrnic applicatins Will identify and review Best Knwn Methds/Best Knwn Practices used in reliability assessments fr autmtive PCBA by OEMs Will identify the key attributes and identify measurement methds f PCB/intercnnect materials and PCBA prcesses Nt revising existing r creating new glbal standards Nt develping new reliability test standards/test methds and nt develping Failure Analysis requirements/prcedures Nt develping the rt cause analysis f cmmn failure mechanisms under harsh cnditins in autmtive PCB/PBCA Nt defining the acceptance criteria f failure mdes Nt intended fr In-Cabin applicatins (Inftainment/Instrumentatin/Cmfrt Cnvenience) Nt intended fr nn-autmtive electrnic applicatins Nt biased t any supplier Will recmmend test methds fr PCB/ PCBA mst relevant t harsh autmtive applicatins and decide whether the utput will culminate in a guideline Will be PCB materials (laminate, surface finish) and assembly materials-centric Will define and measure key material prperties t meet the applicatin requirements Will determine if a Phase 2 prject is required t btain empirical evidence frm reliability tests by the recmmended test methds prpsed NOTE: All changes t SOW must be apprved by the Technical Cmmittee fr versin cntrl Page 3 f 9

4 Business Impact The decisin n chice f materials used in harsh envirnment autmtive electrnics requires cnsideratin f high-reliability needs in additin t cst penalties fr ver specifying fr a particular applicatin. By frmulating a cmpendium f material requirements fr harsh envirnment applicatins and crss referencing t a suite f existing standards, a user will be able t specify a categry f materials that will meet the reliability requirements while minimizing excessive csts thrugh ver specificatin. Additinal cst and time savings may be realized by reducing the need fr requalificatin fr all OEM specificatins. The typical cst f a full material apprval cycle is in the rder f $90-120K. If this cycle needs t be cnducted ver multiple OEM test standards, the csts are multiplied. Participating Organizatins The fllwing rganizatins have expressed their interest during the Initiative Phase. inemi member cmpanies: Alpha and Enthne (Alent plc), UL, ISOLA, Hitachi Chemical, Henkel, Interflux Industry as a whle: Cntinental Autmtive, OLIN, ZF-TRW, Elmatica, Vale, Ericssn Outcme f Prject Catalgue f PCBA prducts fr varius autmtive harsh envirnments (Milestne/Deliverable 1): Prduce a catalgue f autmtive electrnic prducts applied within harsh envirnments. Include the range f materials used in bare PCB and PCB assemblies (PCBA) and determine the range and terminlgy t be used t describe and quantify harsh envirnments. Cmpendium f PCB & PCBA material attributes used in autmtive applicatins (Milestne/Deliverable 2): Prduce a cmpendium f key materials used in bare PCB and flex circuit substrates (e.g., laminates and dielectrics, slder mask, surface finishes); and als in PCBA (e.g., slders, cnfrmal cating). The cmpendium shuld detail material attributes assigned t their respective specificatin and standards. Ensure cmpendium has crss referencing capability ideally in sft frm. Directry f related PCB and PCBA standards and tests (Milestne/Deliverable 3): Publish a directry f all PCB and PCBA standards, natinal, internatinal and OEM prprietary specificatins that relate t materials used in autmtive electrnics in harsh envirnments. Include assciated test regimes referred within the specificatins. Identify and crss reference cmmnality in testing methdlgies. Final Reprt: Prpse a cmmn material qualificatin and quality reliability scheme fr use by the glbal autmtive supply chain t include the previusly described, catalgues, cmpendium and directry t define suites f existing tests that meet a cnsensus f supply chain requirements. Disseminatin: T be determined by the prject team. It is prpsed that results will be disseminated thrugh a Final Reprt and thrugh technical presentatins targeted t the autmtive electrnics supply chain. NOTE: All changes t SOW must be apprved by the Technical Cmmittee fr versin cntrl Page 4 f 9

5 Previus Related Wrk Industry rganizatins such as AEC, CEN and IPC have undertaken reviews f PCB requirements acrss a wider industry but have nt specifically encmpassed materials r taken int cnsideratin OEM prprietary specificatins becming mre cmmn in specifying PCB assemblies fr use in harsh autmtive envirnments. The prpsed prject has a high degree f riginality cmbined with evidence frm previus reviews referred t abve, which supprt the necessity and benefit f the prject bjectives. Initial investigative wrk by Alpha and thers suggest that the prject has a high degree f success. Prspective Participants T encmpass the autmtive electrnics supply chain frm OEM t material suppliers and t include Tier 1/ODM cmpanies including PCB assembly facilities, Tier 2, PCB fabricatrs and suppliers f materials fr PCB fabricatin and assembly. Tier 1 suppliers may include Vale, Cntinental, ZF-TRW, Delphi and thers. Material suppliers (fr PCB and PCBA), may include Alpha, Henkel, Enthne, Isla and Hitachi. In additin ther interested rganizatins such as UL and IPC representatives are deemed imprtant t cntribute within the prject. Prject Plan Schedule with Milestnes Nte: Quarters (Q1, Q2, etc.) are frm prject start date and nt Calendar year. Phase 1 Task 1: Define prduct categries Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8 M1 Task 2: Material attributes M2 Task 3: PCB/PCBA standards Task 4: Suite f tests M3 M4 Task 5: Best practice D Phase 2 TENTATIVE (18mnths) M1 Milestne/Deliverable 1, catalgue f PCBA prducts fr varius harsh envirnments M2 Milestne/Deliverable 2, cmpendium f PCB and PCBA material attributes M3 Milestne/Deliverable 3, directry f related PCB and PCBA standards and tests M4 Milestne 4, crss reference classificatin f failure mechanisms and related tests and standards D Final deliverable reprt and presentatin NOTE: All changes t SOW must be apprved by the Technical Cmmittee fr versin cntrl Page 5 f 9

6 Phase 1 Detailed Infrmatin Task 1: Define prduct categries and terminlgy fr high pwer / high density (level f miniaturizatin) Thrugh industry discussin and referral, determine a set f categries fr materials used within a range f prducts at varius degrees f pwer density and envirnmental cnditins. The fllwing matrix prvides an example: Cat. Prduct Grup 1 ECU Applicatin Engine management Level f miniaturizatin Pwer density Max Operating T / C Equilibrium Operating T / C Envirnmental Cnditins Vibratin / milli-g Humidity / RH Chemical Resistance Brake cntrl Resurces: At least 4 individuals are needed. They need t represent bare PCB and assembly material suppliers, Tier 1 and electrnics designers/manufacturers. Autmtive ODM s / OEM s will be extensively cnsulted. This shuld take 3 r 4 mnths including independent research. Materials: Nne. Prcess: Literature search, 1-t-1 interviews with OEMs and Tier 1, cnference calls. Analysis f data received. Deliverables: cnditins. Catalgue f classificatins f PCB and PCBA prducts fr a range f harsh envirnmental Task 2: Define the main attributes f each material that wuld place it in a specific categry Investigate a brad range f materials encmpassing bare PCB and PCB assemblies (PCBA) materials. Catalgue data against crrespnding perfrmance criteria fr a range a pre-defined harsh envirnment cnditins. PCB materials will include laminate (cpper clad) and pre-preg, flexible circuit base materials and adhesive films and cverlay, surface finish including slder mask. The miniaturizatin r density f PCB design features including pads, via hles and track dimensins will als be cnsidered. Standards with relatin t specific cmpnent types shuld be included; e.g., viding standards with respect t critical cmpnents. PCBA materials will include slder allys and may als cnsider cnfrmal catings, underfills, etc. Resurces: At least 3 individuals are needed. They need t represent bare PCB and assembly material suppliers and Tier 1. This shuld take 3 r 4 mnths with sme independent research. Materials: Nne. Prcess: Literature search, interviews with OEMs and Tier 1, cnference calls. Deliverables: Cmpendium f PCB and PCBA material attributes. NOTE: All changes t SOW must be apprved by the Technical Cmmittee fr versin cntrl Page 6 f 9

7 Task 3: Review existing standards fr PCB and PCBA Tabulate & summarize existing standards fr bare PCBs and PCBA (assemblies). Tabulate & summarize existing OEMs (& T1) existing requirements. IPC assembly standards have dne a limited amunt f categrizatin and reference t IPC 3-tier assembly standards, but this is nt cmprehensive and the standard ffers n detailed crss-referencing with the applicatin envirnment. Applicatin IPC Perfrmance Class Bdy Electrnics Class 2 Mtr Management Class 3 ECU withut High Vltage Class 2 Head Lights Class 3 Rear Lights Class 2 High Vltage Class 3 Safety Related Electrnics Class 3 Review, cmpare and cntrast existing standards and tests fr varius and defined criteria such as thermal, sheer tests, etc. Determine cmmnality f material attributes with the bjective f ratinalizatin f range f standards. Resurces: At least 2-3 individuals are needed. They need t represent bare PCB and assembly material suppliers, Tier 1 and EMS prviders. Invlvement frm thse invlved with IPC and ther standards preparatin will be sught, but nt thught t be essential. This shuld take 4 r 5 mnths with sme independent research. This prcess can be undertaken in parallel with Task 2. Materials: Nne. Prcess: Identify & catalgue all relevant standards including IPC, ISO/TS, ASTM, IECQ-IEC, etc. Undertake interviews with OEMs and Tier 1, cnference calls. Prduce detailed catalgue with crss reference cmparisns appertaining t autmtive electrnics applicatins and requirements. Deliverables: Directry f related PCB and PCBA standards and tests. Task 4: Identify the suite f tests that can meet a cnsensus f requirements frm Tier 1 and OEMs Identify cmmn r expected failure mechanisms in varius applicatins experiencing harsh envirnments and crss-reference t testing regimes t meet cmpliance t reliability requirements. Undertake literature search and cnsultatin with industry peers and experts. Investigate previus wrk undertaken n suitability f particular test regimes fr specific envirnmental cnditins in particular (but nt exclusively) in autmtive applicatins. NOTE: All changes t SOW must be apprved by the Technical Cmmittee fr versin cntrl Page 7 f 9

8 Investigate and identify the range f tests that may be cnsidered fr all harsh envirnment categries. Determine which tests are mst cmpatible with particular failure mechanisms; btain a cnsensus fr which tests mst clsely resemble actual in-life experiences. Prpse a suite f tests fr each envirnmental categry. Present initial prpsal f suite f tests fr each categry t a wide range f T1 and OEM/ODMs and slicit feedback. Determine need fr a Phase 2 t btain empirical data t demnstrate suitability fr each suite f tests. Resurces: At least 4 individuals are needed. They need t represent bare PCB and assembly material suppliers, Tier 1 and electrnics designers/manufacturers. This shuld take 4 mnths with sme independent research. Materials: Nne. Prcess: Literature search, interviews with OEMs and Tier 1, cnference calls. Milestnes: Crss reference classificatin f failure mechanisms and related tests and standards. Task 5: Publish best practice guide Disseminatin f deliverables thrugh publicatin f technical paper (s) including assciated presentatins n the recmmendatins t adpt a set f standard categries fr materials used in PCB & PCBA prducts fr a range f autmtive applicatins that experience harsh envirnments. Determine need fr Phase 2: Prpse pssible experimental methdlgy fr a Phase 2. Resurces: All members f cnsrtium t be invlved. They need t represent bare PCB and assembly material suppliers, Tier 1 and electrnics designers/manufacturers. This shuld take 3 r 4 mnths with sme independent research. Materials: Nne. Prcess: Literature search, interviews with OEMs and Tier 1, cnference calls. Deliverables: 1. Disseminatin f results thrugh publicatin f final reprt and presentatins. 2. Determine need fr Phase 2; draft prpsal fr Phase 2 tasks. Phase 2 Detailed Infrmatin As part f Task 4 the prject team will assess the need fr the fabricatin and testing f samples t demnstrate the validity f the prpsed cmmn material qualificatin and quality reliability scheme thrugh the evidence f empirical data. Prject Mnitring Plans Ensure pen lines f cmmunicatin amng participants. Review all prject requirements with participants befre the prject begins. Prject participants will meet bi-weekly t review varius aspects f the prject and make plans fr next phases f the prject. NOTE: All changes t SOW must be apprved by the Technical Cmmittee fr versin cntrl Page 8 f 9

9 Meeting minutes prvided thrugh . Fllw-up with individuals n an as-needed basis. Wrkshps and face-t-face meetings as determined by the prject team. Prgress reprts will be prvided upn request fr presentatin at regularly scheduled inemi meetings (e.g., a shrt series f PwerPint slides shwing the wrk in prgress at member cuncil meetings). Track and dcument apprximate man-mnths per quarter per team member (this will require the active members f the team t prvide estimates). Track and dcument apprximate number f peple n the prject per quarter (this can be tracked thrugh inemi's WebEx accunt.) General and Administrative Guidelines fr this prject and all ther inemi Prjects are dcumented at NOTE: All changes t SOW must be apprved by the Technical Cmmittee fr versin cntrl Page 9 f 9