From Chip to System the demanding challenges for power semiconductor producers

Transcription

1 From Chip to System the demanding challenges for power semiconductor producers

2 In this talk we want to: Look at the market trends Tell you what demands they are placing on semiconductor producers Show you the technological challenges and solutions we have up to now Show you how far we ve come

3 Challenges imposed by the market Our application expertise The challenging technological demands we face How far we ve come Enabling Technology

4 Energy demand: challenges and opportunities By 2030 global energy demand increases 50% over today (2% p.a.) Europe is a forerunner in modern energy and climate policy, and Germany a prime example of the use of new energy technologies to reduce CO 2 emissions by 14% by 2020 (vs 2005) the regenerative energy share is to be more than doubled to 30% (70% by 2050)

5 Renewable energy: Rising demand - Reducing cost Political requirements & financial incentives drive the market Photovoltaics still regarded as most expensive renewable source, but falling in cost By end 2010 price drops to 1/Watt (down from 3.5) are expected Price/kWh of solar electricity will move into the range of conventional production Single converters of 0.5MW, rising to 1MW PV plants up to 10MW common, with 60MW plants in operation Wind generator costs are below those of solar PV Wind generators average size is increasing from 2MW to 3MW, large units of 5MW are in use.

6 Profitable for the power semiconductor industry Power semiconductors needed for energy conversion Grid tied converters for Wind and Solar PV Active front end boost rectifiers for wind generators Power semiconductors are core element of variable speed drives Solar trackers for PV installations Blade pitch adjustment for wind generators Precise feed and mixing of Biomass material in biogas plants Variable speed drives save energy of mostly non-controlled motors consuming large part of electrical power generation Power semiconductors for renewables is the largest growth market Mere 7.5% share of the market in 2008 Growing at 25% per annum Expected to generate US$380 million in sales in 2012

7 Don t forget electric vehicles Forecast 20% of Global Automobile Market by 2030 Climate change grows as an issue Reduced emissions, noise, operating cost Obstacles: Li-Ion Battery cost & lifetime ~US$1000/kWh (16kWh in Volt, 24kWh in Leaf) Recharge stations/ smart grid

8 Challenges imposed by the market Our application expertise The challenging technological demands we face How far we ve come Enabling Technology

9 Application expertise 1 MW 100 kw 10 kw 1 kw 100 W 1 kw

10 Systems, Solutions, SKiiP in 3 growing markets 25% yearly growth Renewable energy Electric vehicles Industrial drives

11 Top 4 markets 86% of revenue SEMIKRON revenue in core applications Strongest market growth in solar and wind applications Drives 35% Wind, Solar 31% Power Supply 12% E-vehicles 8% Others 14%

12 Focus on power electronics - from chip to system Discrete Module Driver Solution/System IGBT SEMITRANS SEMITOP MiniSKiiP SEMiX SKiM SKiiP SEMI- STACK System MOSFET Thyristor SEMIPACK SEMIPONT SEMiSTART Diode Market leader with 30% market share in diode / thyristor modules Source: IMS Research The global power semiconductor market 2010

13 Innovative portfolio 42% Embedded Systems, Solutions, SKiiP 11% Rest 47% Modules In % of revenue

14 Challenges imposed by the market Our application expertise The challenging technological demands we face How far we ve come Enabling Technology

15 Challenging technological demands: In all sectors, reliability is top priority as this guarantees economic operation Compact size High efficiency These demands are conflicting As converter power increases, components are massively paralleled Size must shrink Power density increases, heat management becomes difficult For example: 3MW wind turbine 45kW power losses in power semiconductors Equivalent to heating system for 3 homes

16 Demands on design Windpower Demands: Very high intermittent operating lifetime Long term availability Very high reliability Environment: Very difficult to access Extreme cyclical nature of load Large temperature swings High vibration Solar is similar, with less short term cycling PV systems have largest potential for increasing efficiency of panels and overall system design Higher switching frequencies Higher DC link voltages Topologies: AFE booster, 3 level GTI

17 Electric Vehicle requirements are most severe High ratio output power / volume High ratio output power / weight Passive temperature ΔT 100K (two cold starts every day for 15 years) Active temperature ΔT 40K cycles cycles Non-operational life Operational life 20 years h h Ambient temperature Liquid cooling -40 C to +135 C -40 C to +105 C Vibration Shock Protection class 5g-12g random 50g-100g IP 54 IP69K

18 Automotive power market is a special challenge Only 4% share for power modules, but growing ~19% p.a. Special challenges are: High ambient temperature High number of cycles Compact size Shock and vibration Design challenges: Chip temperatures increase to 175 C Cooling density increases Temperature gradients much larger Solder joints fail Large module base plates deform Symmetrical operation of large numbers of parallel chips These challenges are not much tougher than high power renewables!

19 Challenges imposed by the market Our application expertise The challenging technological demands we face How far we ve come: 2011 Enabling Technology

20 SKiiP 4 13,8 16,5 19,0 Lowest thermal resistance 13,8 K/kW SKiiP4 Prime Pack Mega Dual Most powerful module on the market with 3600 A 33% more power than SKiiP3 100% solder-free, sintered chips Unique burn-in test, in real converter mode Approx. 2 hours under worst case conditions Junction temperature of the silicon reaches up to 140 C

21 In 2010: 3MVA converter >4MVA/m 3 3 MVA 3-phase inverter fits into standard 600mm x 600mm x 2000 mm cabinet

22 Solution Center platforms in 2011 Qualified and tested power semiconductor solutions, air- & water-cooled SKiiPRACK Synchronous wind generators Double-fed wind generators Solar inverters High power inverters SEMIKUBE Solar inverters Industrial inverters Pump & compressor drives 450 kw - 2,5 MW 75 kw - 1 MW SEMiXBOX 10 kw kw Elevators AC/DC drives Solar inverters Uninterruptible power supplies

23 Powered by SKiiP Technology Almost every 2 nd windmill is powered by SEMIKRON technology 57 Gigawatt wind capacity is powered by SEMIKRON 122 Gigawatt is the worldwide installed wind capacity since 1993 (Source: BTM Consult ApS, 03/2009) electric fork lifts are powered by SEMIKRON systems hybrid buses save 30% fuel with solder-free SKiM IGBT modules

24 Experience in electric/hybrid vehicles since 1992 SEMIKRON automotive projects Passenger cars Racing cars Hybrid busses Hybrid trucks Agricultural vehicles Construction vehicles

25 VePOINT - a SEMIKRON company 100% subsidiary of SEMIKRON Automotive Systems GmbH & Co. KG Specialising in the automotive market Developing and producing for electric and hybrid cars Inverters DC/DC converters Chargers Goal: smaller power electronic packages higher power density higher integration level

26 Platform technologies used for vehicle application I/O BOT Logic Level shifter Bootstrap TOP1 TOP2 TOP3 Electronics SOI Packaging 100% solder-free long lifetime Chips SiC CAL Sinter joint between chip and DCB No base plate Spring contacts Terminal: pressure contact

27 SKAI Systems in 2011 Fully integrated systems for vehicles

28 SKAI = SEMIKRON Advanced Integrated System Aux. power CAN comm., external I/O IP67 enclosure DSP controller Power supply Gate driver Protection DC+ current voltage DC link capacitor V T I I I temperature AC Φ1 Φ2 Φ3 DC- Heat sink Water inlet Water outlet

29 SKAI model range SKAI HV V battery : V 250kVA in 448x244x109mm Motor Ratings: 150kW (1200V IGBT) 100kW (600V IGBT) SKAI LV V battery : V Up to 55kVA

30 Case study: Pioneer in tractors with generator Objective Reduced fuel consumption Increased power 14V on-board power-supply with 50% more power More power in the main drive thanks to optimised cooling G 20KW 750V Solution Generator connected to the main drive powers Fan, air compressor, air conditioning, 14V onboard power-supply Customised multi-converter system in a watercooled IP67 case DC-bus pre-charge 10W/14V Battery M M Charge 1,2KW/14V Air con 5KW/480V Motor fan 10KW/480V

31 Challenges imposed by the market Our application expertise The challenging technological demands we face How far we ve come Enabling technology

32 7/29/ Technological evolution Solder technology Standard technology Pressure contact technology Spring contacts 100% solder-free Sintered SKiN flex layer Solder pins and screw terminals Reduced number of solder layers. No copper base plate needed Replaced solder pins Provides electrical connection to the controller Sinter layer between DCB and chip Replaces solder layers Replaces wire bonds and thermal paste Double-sided chip sintering

33 SKiM: no solder Pressure < 50 MPa Temperature < 200 C Chip Sinter layer (silver powder) Substrate with gold flash surface Silver powder before sintering Silver powder after sintering V. Demuth

34 SKiiP: Construction principle 3600A Module rating Gate driver Spring contacted Terminals Pressure contacted Additional fixation More robust against external forces No base plate DCB directly pressed to heat sink Chips: IGBT4/ CAL4 sintered Heat sink Liquid, air, customized

35 SKiM: the combination of the best Revolutionary stability of chip / DCB connection Sintering instead of soldering High performance Terminals Pressure contacts Low thermal resistance DCB directly on heat sink V. Demuth

36 Sinter + Spring + SKiiP Technology = 100% solder-free Technology Electronics SOI 100% solder-free = long lifetime = SKiM Packaging Chips SiC CAL + + Sinter joint between chip and DCB Spring contacts No base plate, pressure contact

37 Standard Technology Wire bond-free SKiN Technology New packaging technology No wire bonds, thermal paste or solder

38 7/29/ Wire bond-free Wire bonds replaced by sintered SKiN flex layer Double-sided chip sintering for excellent thermal and electrical chip characteristics Continuous sinter layer on top of chips 25% higher surge currents than with wire bonds Standard Technology SKiN Technology Wire bond-free Wire bonds Solder-free Soldered

39 7/29/ Thermal paste-free 30% lower thermal resistance at 0.65 K/W Increased thermal conductivity results in improved chip cooling and higher inverter current Thermal paste replaced by sinter layer between DCB and heat sink Standard Technology R th[j-a] [K/W] SKiN Technology Chip + DCB Thermal paste 0.25 Cooling Heat 81mm 2 chip size 95W 125W

40 7/29/ Current density doubled 3.0 A/cm2 3 MW inverter 2200 A rms per phase Compact integration of driver, protection, interfaces, snubbers and semiconductors in SKiN Technology 3.0 A/cm 2 SKiN based unit 1.5 A/cm 2 Module based unit

41 7/29/ x higher power cycling 10 x higher power cycling compared to standard modules Expected life time: 20 years High chip junction temperatures 200 C for SiC and GaN can be exploited thanks to sinter technology Power cycles to failure SKiN Technology 10x higher Standard Technology T j [K], T j,max = 150 C

42 7/29/ For 35% smaller inverters Wind power 3 MW 4-quadrant inverter, low-voltage Compact integration of driver, fiber optic interfaces, DC-link, capacitors, liquid cooling and power semiconductors in SKiN Technology Automotive 90 kw in 5.5 l, liquid-cooled 8.5 kg, IP6K9K protection Compact integration of 3-phase IGBT inverter, DC-DC converter, cooling, controller, DC-link and capacitors

43 7/29/ Packaging The SKiN flex layer replaces the bond wires Chips are sintered on chip upper and underside The thermal paste layer is replaced by a sinter layer Terminals are sintered to the DBC

44 7/29/ Flat integration Interface to driver / controller via the SKiN flex layer welded on the PCB side by side Example showing flat, sintered terminals

45 7/29/ Flexible integration The connections are flexible and can be bent upwards The driver / controller can be placed on the upper above the SKiN flex layer

46 7/29/ D integration Future integration of driver and protection functions on the upper of the SKiN flex layer possible Advantage: optimum switching control owing to close location of driver and IGBT

47 Thank you Wire bond-free