Electronic Costing & Technology Experts

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Britton Oliver
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France Phone : +33 (0) 240 180 916 email

which do not bind System Plus Consulting

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1 Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer Nantes France Phone : +33 (0) info@systemplus.fr August 2016 Version 1 Written by Sylvain HALLEREAU DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners by SYSTEM PLUS CONSULTING, all rights reserved. 1

2 Glossary 1. Overview / Introduction 4 Executive Summary Reverse Costing Methodology 2. Company Profile 10 I3system 3. Physical Analysis 14 Synthesis of the Physical Analysis Physical Analysis Methodology Thermal Expert IR Camera 16 Module Views, Dimensions & Pin Out Module Opening IR Sensor Assembly, Wire bonding Process Ceramic Package 20 Silicon Window IR Sensor 30 View, Dimensions & Marking Pixels Area Overview Contact Pixels Details (Active, Compensation Pixels) ROIC Die 49 ROIC Delayering & Process IR Sensor Cross-Section 57 Cross-Section : ROIC Cross-Section : Arm Cross-Section: Microbolometer 4. Manufacturing Process Flow 72 Global Overview ROIC, Microbolometer & Package Process Flows IR Sensor Wafer Fabrication Unit 5. Cost Analysis 85 Main steps of economic analysis Yields Hypotheses ROIC Front-End Cost Microbolometer Front-End Cost IR Sensor wafer & Die Cost I3BOL384_17A Cost 6. Estimated Price Analysis 103 Manufacturer Financial Ratios I3BOL384_17A Estimated Selling Price Contact by SYSTEM PLUS CONSULTING, all rights reserved. 2

3 1. Overview/Introduction 3 Introduction Company Profile : I3system Thermal expert Main Features Executive Summary Seek Thermal - Therm-App - FLIR ONE 2 nd Gen. - Thermal Expert Comparison Reverse Costing Methodology 2. Physical Analysis 12 Global view of the Packaging Packaging Opening Accessories Global Views of the Thermal Expert Views and Dimensions of the Housing Thermal Expert Disassembly Lens Module Analysis Electronic Board Electronic Board Top Side Global View Electronic Board Top Side High Definition Photo Electronic Board Top Side Components Markings Electronic Board Top Side Components Identification Electronic Board Bottom Side Global View Electronic Board Bottom Side High Definition Photo Electronic Board Bottom Side Components Markings Electronic Board Bottom Side Components Identification 3. Cost Analysis 34 Accessing the BOM Estimation of the cost of the PCB BOM Cost - Electronic Board BOM Cost - Housing BOM Cost - Packaging Material Cost Breakdown Accessing the Added Value (AV) cost Electronic Board Manufacturing Flow Details of the Electronic Board AV Cost Details of the Housing Assembly AV Cost Added Value Cost Breakdown Manufacturing Cost Breakdown 4. Estimated Price Analysis 54 Estimation of the Selling Price Contact by SYSTEM PLUS CONSULTING, all rights reserved. 3

4 This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the I3system I3BOL384_17A 17µm pixel microbolometer. The I3BOL384_17A has been found in the Thermal Expert infrared camera for mobile. The camera is screwed on the smartphone. The I3BOL384_17A is a new microbolometer from I3system for industrial and consumer applications. The I3BOL384_17A is featuring a 384x288 pixels resolution with a pixel size of 17µm. The sensor technology in the I3BOL384_17A core is an TiOx microbolometer. Based on complete physical analysis of the I3BOL384_17A microbolometer, this report provides the manufacturing cost of the infrared sensor by SYSTEM PLUS CONSULTING, all rights reserved. 4

6 16.2 mm 16.2mm The microbolometer is encapsulated in a ceramic LCC package. 44 pins per package. Dimensions : 16.2mm x 16.2mm x 3.1mm IR Window: 15.7x15.7x0.7mm Ceramic substrate Top view 3.1mm 0.84mm 2.23mm Back view 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 6 Lateral view

7 xxmm Return to TOC xxmm Die Area: xxmm² (XX x XXmm) Nb of PGDW per 8-inch wafer: XX Assuming scribe line of 100µm Pad number: 40 Connected: 19 Test only: 6 Microbolometer Die Overview 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 7 PGDW: Potential Good Dies per Wafer

Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

17 Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts. Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated). These results are open for discussion. We can reevaluate this circuit with your information. Please contact us: 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 17

Electronic Costing & Technology Experts

Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer 44200 Nantes France Phone : +33 (0) 240 180 916 email : info@systemplus.fr www.systemplus.fr January 2016 - Version 1 written by David