Samsung LM101A Chip Scale Package LED

Transcription

1 Samsung LM101A Chip Scale Package LED LED report by Sylvain Hallereau February rue la Noue Bras de Fer NANTES - FRANCE info@systemplus.fr by System Plus Consulting Samsung LM101A 1

2 SUMMARY 3 o Executive Summary o Reverse Costing Methodology Company Profile 10 o Samsung 15 o Synthesis of the o Package analysis Package Views & Dimensions Package Cross-Section o LED Die LED Die View & Dimensions LED Die Process LED Die Cross-Section LED Die Cross-Section Cathode LED Die Cross-Section Anode LED Die Process Characteristic 51 o Synthesis of the cost analysis o Yields Explanation & Hypotheses o LED die LED Front-End Cost LED Die Probe Test, Thinning & Dicing LED Wafer Cost LED Die Cost o LED Component Packaging Cost Packaging Step Cost Component Cost Component Cost Evolution Price Analysis 65 o Estimation of selling price Company services 68 LED Manufacturing Process 41 o LED Die Front-End Process Flow o LED Die Fabrication Unit o Package Process flow o Final Test & Packaging Fabrication unit 2017 by System Plus Consulting Samsung LM101A 2

3 Executive Summary o Executive Summary o Reverse Costing Methodology This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Samsung LM101A Chip ScalePackage LED. The SCP8TT78HPL1TLS06E is the first generation Chip Scale Package (CSP) LED device from Samsung. The LED presents a flip chip structure. The SCP8TT78HPL1TLS06E is a neutral white (4000 K) LED with a CRI of 80. The design allows low thermal resistance and a high degree of reliability with plastic free structure. The wafer level packaging makes a very competitive cost. The report goes into depth in its analysis of the packaging and the components, with images of the new Chip scale package structure. The LM101A LED family is adapted to Bulb, Candle, MR16, PAR, Spot light products. The SCP LED is a new market which represents 0.8% of the LED market today but will be 6 times larger in 2021, (yole develloppement). With this component, Samsung positions in on this new CSP LED market by System Plus Consulting Samsung LM101A 3

4 Package Views & Dimensions o Synthesis o Package o Die design o Die Cross-Section o o o o The package type is a chip scale package (CSP) Package size : 1.2mm x 1.2mm x 0.4mm Package area: 1.44mm² LED area: 0.67mm² (47% of the package) 0.2mm 1.2mm 0.82mm 0.2mm 0.82mm Package Front view Package Back view 0.36mm 0.4mm Package Side view 2017 by System Plus Consulting Samsung LM101A 4

5 XXmm LED die Dimensions XXmm o o Die area: XXmm² (XXmm x XXmm) There is no marking on the die. o Synthesis o Package o Die design o Die Cross-Section LED Die Optical view 2017 by System Plus Consulting Samsung LM101A 5

6 Die process o Synthesis o Package o Die design o Die Cross-Section Detail back side SEM View 2017 by System Plus Consulting Samsung LM101A 6

7 Die cross section Cathode Electrode EDX o Synthesis o Package o Die design o Die Cross-Section Epitaxy Cathode metal layers EDX 2017 by System Plus Consulting Samsung LM101A 7

8 LED Process Flow (1/2) o LED Front-End Fab Unit o LED Front-End Process o Packaging Process o Packaging Unit Epitaxy Epitaxy GaN GaN Epitaxy PSS (Patterned Sapphire Substrate) Anode Insulation Drawing not to Scale 2017 by System Plus Consulting Samsung LM101A 8

9 LED Front-End Cost o Synthesis o Die Cost o Packaging Cost o Component Cost o Cost Evolution 2017 by System Plus Consulting Samsung LM101A 9

10 LED Wafer Cost per process steps o Synthesis o Die Cost o Packaging Cost o Component Cost o Cost Evolution 2017 by System Plus Consulting Samsung LM101A 10

11 Component Cost o Synthesis o Die Cost o Packaging Cost o Component Cost o Cost Evolution 2017 by System Plus Consulting Samsung LM101A 11

12 COMPANY SERVICES 2017 by System Plus Consulting Samsung LM101A 12

13 Business Models Fields of Expertise o Company services o Related reports o Feedbacks o Contact o Legal Custom Analyses (>130 analyses per year) Reports (>40 reports per year) Costing Tools Trainings 2017 by System Plus Consulting Samsung LM101A 13

14 Related Reports o Company services o Related reports o Feedbacks o Contact o Legal REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING LED SP SETi 2 UVC 270 LED SP Toshiba TL1L4 GaN on Si LED SP SORAA GaN on GaN LED MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT LED CSP LED Lighting module 2017 MicroLED Displays 2017 LED Packaging 2017 Automotive Lighting 2016 Bulk GaN Substrate Market 2017 PATENT ANALYSIS - KNOWMADE 2017 by System Plus Consulting Samsung LM101A 14

15 Contact PHOENIX YOLE Inc. FRANKFURT/MAIN Europa Sales Office NANTES Headquarter LYON YOLE HQ TOKYO YOLE KK o Company services o Related reports o Feedbacks o Contact o Legal GREATER CHINA YOLE Headquarters 21 rue La Noue Bras de Fer Nantes FRANCE sales@systemplus.fr Europe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY llevenez@systemplus.fr America Sales Office Steve LAFERRIERE Phoenix USA laferriere@yole.fr Asia Sales Office Takashi ONOZAWA Tokyo JAPAN onozawa@yole.fr Mavis WANG GREATER CHINA wang@yole.fr 2017 by System Plus Consulting Samsung LM101A 15