SDS Solder Ball Hidden Champion! S-Pak Pb Free Solder Balls. Introduction. S-Pak Solder balls

Transcription

1 SDS Solder Ball Hidden Champion! S-Pak Pb Free Solder Balls Introduction S-Pak Solder balls Super daekil Semiconductor materials

2 Contents I. Company Overview - Introduction of SDS - History and Scope of business ii. Manufacturing Process

3 Introduction of SDS Company Name: SDS Co.,Ltd ( SDS ) Head office :#656 Tongsam-Ri, Namsa-Myun, Cheoin-Gu, Yongin-City, Gyounggi-Do, Korea Establishment: May 1th, 2009 (Start DK Metal from Feb. 1th, 1992.) President : Jeom Yup Choo Founding : USD 1.7 Million (Feb. 2013) Employee : 45 employees Sales Revenue : US $ 22 Million (2012) Web site: Contact : (head office and Plant) Yongin City SDS Co.,Ltd HQ Solder balls, Adhesive resin for NCP and thermal conductive Seoul Gumi Factory ; DK Metal Raw solder materials. Solder Anode, Bar solder Flux core solder, Tape solder Busan

4 History Launched DK Metal for Raw solder alloy (3th Raw Solder material maker in Korea) Launched SDS Co., Ltd for semiconductor and electronic materials SDS Merged Solder ball business from SK Chemicals (15 TH May) Vision for M/S 1 ST Solder ball manufacture Acquired ISO9001:2008/ISO14001:2004 Quality and Environment system Hynix s AVL acquired. ( got first approval) Amkor Korea, Amkor Philippine s AVL acquired. ( got first approval) Semiteq AVL acquired. ( got first approval) Licensed from Fuji Developed new plant.(6,972m 2 ) Adopted New gas type balling machine (MD) Developed Low-α Solder (LA Grade < 0.3 cph/cm2, 5N) Establishment Company research center Winpac AVL acquired Hitech semiconductor(china) AVL acquired ASE Korea AVL acquired Got No 1. evaluation result from Hynix Signetics AVL acquired Venture company qualified.

5 Scope of Business The Systematization from raw solder material to Solder ball. Ball Anode Advanced Solder Balls Solder Ball Anode Wire solder No1. Solder ball manufacture Solder related materials Cu core solder balls Low M.P Solder balls Low Alpha solder balls COF Underfill Entry into Electronic Materials Law Solder Materials Goal (2013) Advanced IT Materials (Adhesive for electronics) Solder Ball Anode Bar Solder Tape Solder Solder Wire Anode Bar solder Tape solder Electronic Components COF Underfill for LDI PKG Adhesive for Semiconductor NCP and Thermal epoxy Adhesive for Semiconductor 5

6 Sales status Sales 22 Million $ /year Domestic : M/S more than 30% Oversea : M/S more than 30% Sales 40 Million $ / year Target Sales 60 Million $ / year M/S 1 st Solder ball Manufacture 2012 (Present) ~ Investment $3,000,000 $1,000,000 $500,000 Capability (Kpcs/Month) 36,000,000 45,000,000 70,000, ,000,000

7 Market Share for solder ball only 2012 Sales of solder balls (3 Million $) Hynix: M/S 30% Hitech: M/S 40% AmKor K: M/S 10% Amkor P: M/S 30% Semiteq: M/S 80% Winpak: M/S 50% Signetics: M/S ~5% ASEK: ~ SCK: ~ Solder balls US$ 3 Mil. Hynix(Korea): BOC(DRAM), POP for Apple Hitech(China): BOC(DRAM) Amkor(ATK, ATP): Qualcomm, Infineon, Micron, Intel etc. nominated. Semiteq/Winpak/Signetics: MCP, POP, BOC Raw solder materials US$19 Mil. Ball Anode Flux core solder wire Tape and Bar solder

8 Domestic QML of Solder ball Location of Qualified Site No. Ball size Product Description Remark mm Sn/3.0Ag/0.5Cu For BOC Pkg mm Sn/1.0Ag/0.5Cu Mobile DRAM mm Sn/3.0Ag/0.5Cu MCP Hynix, Semiteq Signetics, Winpak mm Sn/1.0Ag/0.5Cu MCP mm Sn/1.0Ag/0.5Cu mm Sn/1.2Ag/0.5Cu/0.05Ni(LF35) mm Sn/1.0Ag/0.5Cu mm Sn/3.0Ag/0.2Cu Apple apply mm Sn/1.0Ag/0.5Cu POP

9 Amkor(ATK, ATP) QML of Solder ball Location of supply Site Amkor Technology Philippines No. SID# Ball size Product Description Remark mm SAC mm SAC mm SAC mm SAC mm SAC mm SAC mm SAC mm SAC mm SAC mm SAC mm SAC mm SAC mm SAC1205(LF35) mm SAC1205(LF35) Infineon nominated

10 Amkor Technology Korea mm SAC mm SAC mm SAC mm SAC mm SAC1205(LF35) mm SAC1205(LF35) mm SAC1205(LF35) mm SAC1205(LF35) mm SAC mm SAC mm SAC mm SAC mm SAC mm SAC mm SAC mm Sn/4.0Ag/0.5Cu mm Sn/4.0Ag/0.5Cu mm Sn/4.0Ag/0.5Cu Qualcomm, Infineon, Micron, Intel nominated. Qualified all ball composition and all ball SID# more than 7 0types. Certain representative SID# displayed as followed specif ied alloy composition SAC405 SAC305 SAC105 SAC1205(LF35)

11 SDS Solder ball Capacity Production Capa. (Right now) Monthly Capa. 36 billion balls Delivery : Within 2 Weeks (Depend on customers request) Division Note B,C,W Separated each operation room Selection line(7 Lines) Clean room condition (Class 100,000) Range of Temp.: 20~26 Packing and Stock line Range of Humi.: Less than 55% DBM(MD) room Adopt of new type of M/C (April. 2010) area 3,500m2 Stock room Separated room Clean room

12 Characteristics of S-Pak Pb Free Solder Balls Alloy Compositions of S-pak Solder ball S-Pak Pb free solder ball s alloy compositions are completely controlled in the Sn/Ag/Cu alloy system. Basic element: Sn as balance element, Ag and Cu control within +/- 0.1% range. Impurities: Low Pb impurities less than 0.04%, All of impurities has limit range and we are well controlling. Types Alloy composition Melting Point( ) Specific Gravity Remarks Sn/Pb Sn / 37Pb Sn / Ag / Pb 179 ~ Pb Free Sn / 3.5Ag 219 ~ Sn / 4.0Ag / 0.5Cu 217 ~ Sn / 3.0Ag / 0.5Cu 217 ~ Sn / 2.5Ag / 0.5Cu 217 ~ Sn / 1.0Ag / 0.5Cu 217 ~ Sn / 1.2Ag / 0.5Cu / 0.05Ni 217 ~ Low Pb Impurities : Max. 0.03% Free of surface damage * Alloy compositions various depend on custom s request.

13 Characteristics of S-Pak Pb Free Solder Balls Grade Size (Ø, mm) Tolerance Composition (Sn/Ag/0.5Cu) (Unit: %) Max. Impurities (Unit:%) Bake test Ball Shape Melting point (Unit:, by DSC) Below & equal to : / Below to 0.330: +/ Above & equal to : +/ Above & equal to : +/ Sn : balance Ag : 1, 1.2, 2.5, 3, 4 ± 0.1 Cu : 0.5 ± 0.05 Pb : 0.04 Zn : Al : Fe : 0.02 Sb : 0.12 As : 0.01 Bi : 0.1 Cd : Ni: 0.04 Ge: 0.09 P, S : ND (Using Not contain P & S) Heating 150 for 12hr, No discolor Minimized dendrite Clean surface Cpk >=1.67 Roundness < 1.5% 215 ~ 227

14 Characteristics of S-Pak Pb Free Solder Balls Quality control Method Analysis Equipments Reference Solder compositions Analysis of Compositions and impurities ICP- 화학분석기 Spark-EMS 분석기 Sn: Remain. Other: Spec. meet. Size distribution 3D Analysis scope Cpk > 1.67 Ball Roundness 3D Analysis scope Roundness < 1.5% Discolor Colorimeter B* Value < 5.5 Surface shape SEM, EDS Shape difference

15 Manufacturing process S-Pak Pb Free Solder Balls World No.1 Solder ball Hidden Champion S-Pak Pb Free Solder Balls

16 Gas Process Flow Gas process use inert gas instead of oil in balling process. Solder liquid fall into inert gas tank and Oxygen concentration of the product is low. Sn, Ag, Cu Furnace Raw solder making process Mother Ingot Inert gas Balling Ingot Alloy Mixing and Melting Make Ingot Inspection Surface cleanliness Surface appearance Ball Diameter Size Distribution Solder compositions NG OK NG Size screen Screening NG Shape screen Balling in Inert Gas

17 Manufacturing Process Alloy mixing Process Raw solder making Process INCOMING QC Raw materials Alloy Mixing and Melting Balling (DBM) Middle QC Alloy comp. check Ball Screen Final QC Furnace Out-going QC Ingot Incoming QC

18 Manufacturing Process [Incoming QC] Incoming (IQC) Test Machine Test Time Purpose Per Lot Special impurity check (When customer ask) ICP- Tester Yearly Outside RoHS analysis (SGS, TUV) Per Lot Composition Check (Sn/Ag/Cu/Pb/Ge/Ni.) Spark- EMS

19 Manufacturing Process [Balling Process] Balling (DBM) Inert Gas < Drop and Cooling Molten metal drop into Inert Gas(N2, He, Ar) atmosphere in Balling Tank and progress in solidification. Solder ball made into Inert Gas state, there is no oxide content and it make low surface oxide value. < Solidification Real time size check By CCD Camera. Ball size is well controlled by pressure and Automatically calibrate ball sizes.

20 Manufacturing Process [Middle QC] Middle (QC) Inspection Machine Test Time Purpose (Sample Size) First Ball Size Inspection Per Lot (10%) 3D Inspection Machine Surface condition Discolor Inspection Machine Per Lot Discolor Ball Screen After shaking (40g)

21 Manufacturing Process [Ball Screen] Ball Screen (Machine) Size Screen (Using precision electro forming Mesh < ± 1 μm ) Shape Screen (Ball rolling on the plate with special angle) NG NG OK Inspection Machine 진동판 각도조정 양품 불량

22 Manufacturing Process [Final QC] Final QC Inspection Machine Test Time Purpose (Sample Size) 3D Inspection Machine Per Lot Second Ball Size and Roundness Inspection (300ea) Surface damage check (all lot by visual) Shake Tester Per Lot Discolor Ball & Surface Oxidation Check (40g) Spark-EMS Per Lot Composition Check (80g)

23 Manufacturing Process [OG QC] Outing going QC Box & Bottle Check Test Time Purpose Box Label 1. Out box condition 2. Box Label Check Total Lot Bottle Label 1. Bottle Label Check (Lot No. / Barcode) 2. Cap Label & Color Check Keeping sample Per Lot Outing going product FA. (200g)