Fine-Pitch Capillary. capillaries. wedges. tab tools. die attach. other. Fine-Pitch Capillary Basic Design Dimensions.

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1 Fine-Pitch Capillary Basic Design Dimensions Fine-pitch capillaries have two basic sets of industry standard dimensional characteristics: large geometry and small geometry. Large geometry dimensions generally refer shank, back hole, and cone. Small geometry dimensions refer tip and angle bottleneck details. As with standard capillaries, fine-pitch capillaries share basic common dimensions such as shank diameter and overall ol length. The major dimensional differences exist at tip details of ol and in specialized angle bottleneck construction. Ø0.030 / 0.76mm ±0.003 / 0.08mm Ø / 1.58mm / 0.003mm / 0.005mm R BOTTLENECK HEIGHT CONE ABTNK T CONE BOTTLENECK HEIGHT MAIN TAPER (MTA) Figure 58 Angle bottleneck (ABTNK or AB) geometry dimensions T ABTNK capillaries wedges / 9.52mm / 11.1mm / 11.94mm / 15.88mm / 19.05mm ±0.005 / 0.13mm OR ABTNK H B FACE tab ols T Figure 59 Small (tip) geometry dimensions Industry standard fine-pitch small geometry dimensions: die attach Figure 57 Large geometry dimensions Industry standard large geometry dimensions: 1. Shank Diameter (SD) 2. Tool Length (L) 3. Cone Angle or Main Taper Angle 4. Back Hole Tip Diameter (T) Hole Diameter or Size (H) Chamfer Diameter (CD or B) Inside Chamfer () Inside Chamfer Angle ( Angle) Face Angle (Note: may be flat, 0 ) Outside Radius (OR) Angle Bottleneck Angle (AB or ABTNK Angle) Angle Bottleneck Height (AB or ABTNK Height) or Tel Fax 41

2 Fine-Pitch Process Requirements The following is a generic set of recommendations aid those looking implement finer-pitch bond processes: Although ball-bond process depends on interaction of multiple variables, a few generic recommendations can be made: Use Design of Experiments (DOE) whenever unknown variables could be present Process window as large as possible Be ready maximize reliability (i.e. highest shear and pull values possible) Select proper capillary material and geometric design fit your bonding requirements (i.e bonded ball size and thickness) Optimize bonded ball size fit bond pad opening (BPO) The bond pad opening (BPO) restricts size of bonded ball and bond pad pitch (BPP) controls optimum size of capillary tip diameter that can be used. It is essential that bonded ball be placed completely within BPO. The capillary tip diameter must be large enough provide a strong second bond but also clear any adjacent s during bonding process. 1. Select gold based on process application; (i.e. low loops, molding stresses) Select state-of--art bonder with high level of flexibility with special attention ultrasonic control capabilities (i.e. finer ultrasonic control resolution) Make sure substrate material and die are properly matched for fine-pitch process Select proper capillary material and geometric design fit your bonding requirements (i.e bonded ball size and thickness) Molding and mold compound suitability Fine-Pitch Process Capillary Design Considerations Hole Diameter (H): For fine-pitch applications, a hole clearance can be in./7.6µm for 70µm-90µm pitch, in./5µm for 60µm pitch, and in./3.5µm for 50µm pitch bonding. This is critical insure good movement with hole during looping without causing drag, resulting in sagging, wavy, or tight loops Chamfer Diameter (CD or B): The contribution of CD is control bonded ball size. With bond pad opening (BPO) as a limiting facr, selection of proper CD is very important. Typically, size for in./23µm in./25µm is in./5µm in./6µm. When using a in./30µm, typical size can range from in./6µm in./8µm. Inside Chamfer Angle ( Angle): The most common angle for fine-pitch bonding is 90. For some ultrafine-pitch applications, an angle of is selected reduce bonded ball size. Poor ball shear results may stem from se steeper angles. Angle Bottleneck Angle: This angle is critical for capillary avoid contact with adjoining loops during bonding. Generally, 10 is recommended but 5 may be required for some ultra-fine-pitch applications. Angle Bottleneck Height: The height required depends on critical loop heights immediately adjacent capillary or those s which capillary must pass between when bonding staggered bond pads. A standard height is in./254µm. Tip Diameter (T): Optimal tip diameter selection is determined by BPP and desired loop height be cleared. Loop configuration must also be considered when bonding in corners of some devices. Fine-Pitch Bond pad pitch spacing of 60µm is common in wafer processing. New technologies improve die performance and reduce cost of manufacturing are pushing implementation of even tighter pad spacing. It is common see now 55µm pitch and 50µm pitch as normal production processes. The introduction of smaller than 50µm pitch is slower than anticipated due numerous challenges facing assembly houses. Some of se challenges include looping strength capable of resisting mold flow stresses without damaging s or creating shorts between s, and finding optimum substrate and molding material minimize stress already finer gold diameters. The gold is challenged not only meet higher mechanical properties but dimensional and chemical as well. Any chemical changes improve mechanical properties can affect its reactivity bonding surface where it must be attached. These same changes can also affect free air ball formation sometimes ignored or blamed on capillary geometrical design. 42

3 Selection of ideal is a balancing act where process engineer must weigh all consequences and decide which ones will impact reliability and process performance. The finer-pitch capillary is a challenge by itself. Not only must it provide good mechanical lerances, it must also provide higher performance in terms of bond quality. Bond quality is measured based on Shear force, Pull strength, and Intermetallic reaction. The only way se properties can be enhanced is by clever geometrical design and optimized ceramic materials that can transfer ultrasonic energy with higher efficiency. Process 1800 As semiconducr industry moved finer and finer pitches, demand for smaller angle bottleneck tip diameters and tighter dimensional lerances grew. Gaiser recognized this need and developed Process 1800 manufacturing process. Process 1800 eliminated previously standard grinding operation now leaving angle bottleneck portion with a mirror smooth finish. The newest bottleneck manufacturing technology providing superior bottleneck strength Increased shear strength and rigidity of ABTNK Superior ultrasonic energy transmission and a wider tuning window Substantially tighter dimensional lerances Reduced standard deviations Sub-micron average grain size, near-zero porosity of ceramic, and zirconia ughened ceramic materials Ideal for high-frequency transducers Fully Aumatic Bonder / High Speed Bonder Fine Pitch Capillary Hole Diameter Guide Wire Diameter in. / µm Hole Diameter in. / µm / / / / / / / / / / / / / / / / / / / / / / / / 43 Capillary ABTNK Manufacturing Method Capillary Material Tip Diameter ABTNK Height Strength Test Data Standard Manufacturing of 99.9% Al O 2 3 Process 1800 Al 2 O 3 10 ABTNK 10 ABTNK Standard Grinding Process % Al O 99.9% Al O in. / 90µ m in. / 90µ m 0.010in. / 254µ m 0.010in. / 254µ m C ore Angle Lot No. L7A L7A No. of Tools Tested Mean ABTNK Break Strength Blending of and ol face Minimizes cut tail problems Reduces effects of flame-off error 142 gm 272 gm The Chamfer Diameter Radius (CDR) The Chamfer Diameter Radius (CDR) was developed eliminate cut tail problems on new fine-pitch devices. This design is a blending where meets face of capillary: die attach tab ols wedges capillaries CDR Figure 60 Process 1800 style angle bottleneck Figure 61 Example of chamfer diameter radius (CDR) or Tel Fax 43

4 CDR2B, Chamfer Diameter Radius Design The transition between Inside Chamfer () and Face Angle (FA) is surface area responsible for flattening and weakening bonding during bond termination process. At this time, diameter is reduced a few fractions of a micron in thickness allowing bonder s clamping mechanism break it free so that a straight piece of is left exiting capillary tip. The small amount of gold protruding from capillary tip is n melted in a ball by action of an electrical discharge produced by EFO system. It is se increased stresses that Gaiser Precision Bonding Tools addresses with new CDR2B feature which is now available on capillaries for 50µm pitch or less. The CDR2B provides significant stress relief at -FA transition reducing and/or eliminating premature termination of, also known as cut s or missing tails. The phographs below details surface features between a standard -FA capillary and a capillary with CDR2B finish. The melted ball is used start a new bond cycle where ball is welded die-pad openings. The is strung across forming a loop that connects carrier or substrate lead points and where will be connected and a new termination cycle will begin. The termination cycle is a process that depends on accurate control of geometrical capillary features as well as mechanical and software features embedded in bonding equipment. As bonder applies various control parameters (Force, Time, Contact Velocity, Ultrasonic Energy, etc.) over area be terminated, compressive and shear stresses experience an increase at -FA transition. The degree of stress varies depending on and FA configuration (see Figure 62). The relationship between stress and capillary tip dimensions is considered inversely proportional. As tip diameter gets smaller, fit finer pad spacing (Pitch), stress per area unit area increases FORCE FORCE Figure 62 Stress diagrams Standard Capillary CDR2B Capillary Figure 63 A standard -FA capillary vs. a capillary with CDR2B finish SB - Small Ball Inside Chamfer The proliferation of smaller geometries in semiconducr back-end assembly industry means smaller bond pads with tighter spacing among each or. These requirements have created a demand for smaller, more tightly controlled capillary geometries produce a bonded ball of uniform shape and form, and of similar quality found in those of larger and older semiconducr devices. However, function of capillary is no longer simply provide form and shape but assist in creation of a reliable bond. New capillary design rules must now include or processing facrs such as pad metallization and structure (low K, etc.), packaging design and materials, and processing facrs (temperature, ultrasonic frequency, etc.). Standard capillary designs can provide shape and form but fall short in providing higher reliability in terms of shear strength and/or intermetallic formation as well as pad reliability (cratering, pad peeling, etc.). Gaiser Precision Bonding Tools new SB design addresses form, shape, and reliability all at once by means of a unique design that controls and distributes stresses responsible for bond formation. Proper manipulation of such stresses helps control intermetallic formation, bond deformation, and minimizes bond pad sub-layer damage such as cratering and pad peeling. 44

5 Standard limited intermetallics SB more complete intermetallics Standard Ceramic CZ1 capillaries Figure 64 Intermetallic reactions of a Standard capillary and a SB capillary compared CZ3 CZ8 Figure 66 Common materials used and manufactured by Gaiser wedges Figure 65 Standard capillary vs. SB capillary Ceramic Material Choices Gaiser ceramic materials are blended achieve higher mechanical and ultrasonic performance qualities. Each of various blends is optimized give best performance for intended application. The multiplicity of package materials, die pad metallization, and ultrasonic frequencies used on day s processes necessitates that a capillary not only meets geometrical parameters but acoustical ones as well. The spread of fine-pitch products requires finer and tighter controls and resolution transfer bonding energy without detriment ball shape and quality. This is only possible by cusmizing ceramic powders produce a capillary that is acoustically efficient maximize bonding energy usage. The following are most common materials used and manufactured by Gaiser Precision Bonding Tools. For details on ir application, please contact your nearest sales representative or our sales department. Avg Grain Size Density Bending Strenth Ultrasonic Efficiency Vickers Hardness Color Technical Specifications Std. Ceramic CZ1 CZ3 CZ8 1.3µ m 0.5µ m 0.35µ m 0.4µ m g / cm 4.29g / cm 4.38g / cm 4.27g / cm 572MPa 1013MPa 1120MPa 1046MPa 81.2% 85.2% 88.8% 84.4% 2144HV 1716HV 2658HV 2000HV White Light Pink Dark Pink White Figure 67 Technical specifications of common materials New Package Development The semiconducr industry is a dynamic one, always changing and evolving fit needs of consumer. The drive meet and fill cusmer s needs is main reason a multiplicity of package configurations exist. Every package is designed maximize performance and product requirements. This effort meet design requirements is most challenging one as it pushes materials and processes limit. Use of Polyimide-based substrates has increased significantly. Fast and low temperature curing die attach material is more popular in order minimize die stresses. Multi-die structures where die are stacked vertically are common in order meet performance requirements. Multi-die modules within a single package are also becoming popular because of multi-tasking requirements from new consumer products. tab ols die attach or Tel Fax 45

6 Micro-Leadframe / QFN Packages Reasons for previous problems are as follows: Too much induced lateral movement and vibration of already bonded units within strip of devices during bonding process Resonance effect of units of strip under work stage during bonding High elasticity of laminated film absorbs o much of bonding energy resulting in significant second bond weakening and failure The following efforts are being pursued in order refine and optimize QFN package: Figure 68 Example of a QFN package The QFN (Quad Flat Non-leaded) is at p of list of rapidly growing popular devices in industry day. Comprised of a CSP plastic encapsulated package with a copper leadframe substrate, its small size and low profile make it ideal for high-density PCB s used in small scale electronic applications such as cellular phones, pagers, and PDA s. It is becoming part of lower cost, low pin count SO, TSSOP, Mini-BGA, DIP, and QUAD configurations. The two common types of leadframes are silver spot plated leads or nickel-palladium preplated. These leadframes are pre-taped with film at botm and ready use for production. Success for bonding this package requires following: Selection of polyimide film of pre-tape leadframe Selection of mold compound for lead-bleed prevention A suitable solution various CTE (coefficient of rmal expansion) effects overall package integrity Some package engineers have resorted ball bumping on lead side reduce vibration and create a more rigid base for second bond. For a 70µm pitch QFN package, Gaiser has developed a T= in./89µm with an 8 face angle capillary ( P-35(2-8D-8)20D-AB10x10-CZ1). This capillary has achieved a mid-span pull strength of 4.5 grams, maximum pull strength of 7.4 grams, and an average pull strength of 6.0 grams. Lead frame design Mold compound selection Polyimide film selection Window clamp design Choice of bonder Bonding parameter optimization Failure optimize above selections may result in following: Broken ball neck Weak and stressed ball neck line Poor stitch/crescent bond formation Weak pull strength Figure 69 Ball bond for a 70µm QFN package made with part number: P-35(2-8D-8)20D-AB10x10-CZ1 46

7 Chip Scale Packages (CSP) Fine-Pitch Capillary Figure 70 & 71 Stitch bonds for a 70µm QFN package [in X(above) and Y(below) directional scrubs] made with part number: P-35(2-8D-8)20D-AB10X10-CZ1 The two most popular types of CSP s use eir flex (polyimide base) or rigid laminate. Both require low temperature bonding. Most CSP s have very short loops so second bond is as close as possible die edge. This design requirement demands use of a bottleneck capillary that in many cases needs be taller than usual in order avoid contact with die edge. Because of lack of rigidity in se type of subtrates, ultrasonic energy is easily absorbed or attenuated. So special attention geometrical designs as well as material properties is of an utmost importance. A capillary with less attenuation properties such as a 30 as opposed a 20 cone angle and CZ8 or CZ3 material would be ideal for applications like those mentioned here. Higher frequencies are strongly recommended since y reduce exaggerated mechanical vibration amplitude and increase velocity of vibration, which increases energy applied at interface of bond. capillaries wedges Patterned Cu Interposer-Stiffener Overmold Compound Die Attach Adhesive Vias in Polyimide Dielectric Circuit Layer Die Adhesive tab ols Figure 73 Cavity-up enhanced ball grid array (CUEBGA) package that incorporates a stiffer laminated with adhesive polyimide flex circuit Stacked Die Packages The trend of semiconducr technology is achieve higher package performance (electrical, mechanical, rmal, etc.). One way get closer those goals is vertical stacking of dies. These dies share a common package giving m a performance advantage that a multi-chip package does not have. The performance advantage is in form of communication speed, a parameter that has become of greater importance as multi-task systems are becoming more and more popular. die attach Figure 72 Side view of stitch bond showing exhibiting good transition from bond or Tel Fax 47

8 The performance advantage is not without its sacrifices. These sacrifices are usually related assembly process. The main concern is lack of rigidity exhibited by this type of package. The use of multiple layers of die attach adhesive furr reduces its mechanical rigidity making entire package sensitive energy losses due absorption or attenuation. The mechanical rigidity is reduced even more when dies are offset from each or creating a mechanical cantilever effect that absorbs bonding energy. Copper Wire Ball Bonding Copper bonding has always had a special appeal because of comparative price against gold. The cost facr is mainly driving force behind preference implement copper as a substitute for most expensive material, gold, in most of semiconducr products. The solutions for such an unstable package are found in our 38 cone angle, specifically designed for this type of application. Complementing cone angle design is new ceramic material CZ3 which provides amongst highest ultrasonic transmissivity of any capillary material in industry day. Again high frequencies are a necessity when processing se types of packages. The higher energy better in order substitute predominant mechanical vibration for purer form of energy, Phonon generation. Wire bond cantilevered edge of thin die Figure 76 A consistently shaped free air copper ball The one aspect that is usually ignored is less publicized material differences that exist between well known gold and copper. These differences are Hardness, Cyclic Fatigue Resistance, Heat Affected Zone, and Oxidation. Figure 74 Example of a 3-die stack package Reverse bonds Figure 75 Example of a quad stack package Hardness This is one of main culprits for bondability issues. These issues range from poor welding of first bond and second bond sub-layer damage (cratering, chip-out) of bond pad structure. The limiting welding performance is associated with reduced intermetallic formation when copper ball bond gets in contact with aluminum bond pad. The effect of hardness on second bond impacts most ol life as need for higher bonding parameters increases in order maximize welding area. Cyclic Fatigue In order minimize impact of hardness, high-purity copper must be used. This means no dopants or impurities should be aloud. A high-purity copper material can also be highly susceptible work hardening due cyclic phenomena. The work hardening effect can be detrimental product life performance as brittle neck failure could appear during device temperature cycling. 48

9 Figure 77 Typical brittle neck failure that occurred during temperature cycling tests. The results of high expansion mold compound and work hardening phenomena at ball neck. Oxidation Copper is a highly reactive material in presence Oxygen forming CuO 2, a hard and difficult remove oxide that hinders welding process between Copper and Aluminum, Copper Silver, or Copper Copper surfaces. This is reason an inert atmosphere must be used protect Copper from reacting with Oxygen. Any amount of Oxygen, eir during process of ball formation or during actual bond process cycle, can create serious bonding issues that range from ball shape bond integrity. Presence of Oxygen during ball formation has been associated with mis-shapened ball bonds, blow holes, and voids on surface of copper balls as well. The Process Once proper inert gas, purity, package, and machine hardware are selected, next step is select proper capillary design that will provide a consistent and reliable bond process. Such a process will consist of minimum bonding parameter levels, with an extended ol life, and maximum bond quality and integrity. Gaiser s materials CZ3 and CZ8 can provide best alternative with a selected set of geometrical features maximize bondability. Wire Diameter in. / µm Coppper Part Numbers Currently Used Part Number / GM-38(2-F-10)20D-AB10x10-CZ / GM-65(4-8D-15)20D / GM-82(5-8D-15)20D-CDR GM-100(7.5-8D-20)20D-CZ GM-93(6.5-8D-20)20D-CZ / GM-120(7.5x120D-8D-25)20D / GM-165(10-8D-30)20D 50µm and Below Pad Pitch Bonding The constant trend of semiconducr industry increase die performance while maintaining cost of manufacturing has pushed front-end foundries shrink silicon dies even furr. The impact of this shrinkage is most obvious in spacing (Pitch) between bond pads and reduction in size. This, in turn, exerts higher demands on chip assembly bond processes and associated materials. The impact on bond process comes in many forms in order maintain current quality standards which are easily achieved with larger pad pitches. The bond process for interconnections under 50µm demands better and more repeatable shear and pull values, exceptional control of Free Air Ball (FAB), higher resolution hardware responsible for Bond Forces, Bond Head Velocities, and Ultrasonic Power. The FAB requires a state of art Electronic Flame Off (EFO) system capable of controlling Current and Breakdown Voltage with a higher resolution than older systems in order produce consistent and repeatable ball sizes. The Bond Force applied during bonding cycle must be equally important and with even higher resolution (grams/ bit) in order maximize bond information with higher shear values but without excessive deformation. At same time, one must not forget equally important Contact Velocity and Search Height parameters which can also affect overall bonded shape. The Ultrasonic Power parameter is one of most significant but least undersod. It must be controlled in such a way that higher resolution, capable of allowing minute adjustments, is possible so bonds are consistent and repeatable. Variations in power delivered eir because of hardware variations (capillary clamping method impedance, frequency) or because of poorly designed control systems (phase angle control, frequency range, etc.) can cause significant process variations. Eventually it can affect short and long term product quality and reliability such as lifted bonds, low shear values, missing tails, opens (no ball), intermetallic formation, and many more. The Ultrasonic Frequency is also important, since higher frequencies provide less mechanical excursion but higher acoustical energy. They are ideal provide minimum bond deformation but with higher bond strength. The suggested frequencies for pad pitches of 50µm or less is one greater than 100kHz. Lower frequencies are not recommended because of its mechanical aggressiveness. or die attach tab ols wedges capillaries Tel Fax 49

10 For materials, capillary and gold s play an important role in allowing trouble free and repeatable bond process. Capillary Tip Geometry is key in achieving consistent ball centering and shape and, most important, robustness of second bond or stitch bond. The biggest issue in finepitch bonding is second bond consistency. Gaiser has developed ideal combination between geometric features and ceramic material. This combination helps control and manipulate various stresses (compressive, radial, and tangential) occurring during bonding cycle so that a trouble free and repeatable termination process is possible. It is also important not ignore effect of gold. As pitch becomes smaller, diameter becomes smaller and more sensitive stresses during loop formation and or bending stresses that might take place during bond cycle. The gold alloy must be tailored minimize ball neck cracking, maintain loop shape, provide a strong welded area on stitch, and a repeatable, straight-tail length for consistent free air ball (FAB) size. Figure 79 50µm pitch ball bonds Figure 80 50µm pitch stitch bond Figure 78 50µm pitch capillary Figure 81 50µm pitch package using in./23µm gold 50

11 capillaries Figure 82 Ball bonds in a 50µm pitch package using in./23µm gold Figure 85 Ball bonds made with in./30µm gold for 80µm pitch package wedges tab ols Figure 83 Package with complex looping profile incorporating a two-tier lead design Figure 86 Stitch bond width is equal twice diameter die attach Figure 84 Ball bond made with in./30µm gold for 100µm pitch package Smashed ball = in./68µm or Figure 87 Stich bonds made with in./30µm gold Tel Fax 51

12 Future Fine-Pitch Packages Fine-Pitch Capillary Current users are beginning make internal studies of 50µm pitch capablities in efforts stabilize and optimize processes for mass production. As challenge reach finer pitches of 45µm and 40µm begins, bonder manufacturers are looking ahead and developing equipment for 35µm pitch using in./15µm, and 30µm pitch with in./13µm. The Gaiser Products group of CoorsTek is working in partnership with several bonder and manufacturers by providing necessary capillary designs meet se new challenges. Figure 88 A 45µm pitch ball bond made with in./18µm. Squashed ball = in./32µm Figure 89 A 45µm pitch stitch bond made with in./18µm. Figure 91 Ball bonds made at 35µm pitch with ultra-fine-pitch capillary Figure 90 Ball bonds in a 45µm pitch package using in./18µm. Figure 92 Stitch bonds made with a 35µm ultra-fine-pitch capillary 52

13 wedges capillaries Figure 93 & 94 Ultra-fine-pitch (35µm) capillary vs. standard pitch (175µm-225µm) capillary. The tip diameter (0.0018in./46µm) of ultra fine pitch ol (left) will fit in same hole diameter as that of standard capillary (right). die attach tab ols Figure 95 Gaiser 30µm ultra-fine-pitch capillary T = in./42µm H = in./19µm or Tel Fax 53

14 Fine-Pitch Capillaries Important Elements for Fine-Pitch Applications CRITAL CLEARANCE TYPAL MAXIMUM LOOP HEIGHT EFFECTIVE CRITAL LOOP HEIGHT ADJACENT TO CAPILLARY PAD PITCH PAD SIZE FRONT VIEW SIDE VIEW Important Elements for Determining Proper Tools in Fine-Pitch Applications Bond Pad Pitch: The distance between centers of bond pads. Bond Pad Size: May be square, rectangular, or round. The most important dimension is size along pad pitch, as shown above. Loop Height: The most important aspect of loop height is effective critical loop height directly adjacent capillary. If capillary is designed clear only maximum loop height, which occurs away from capillary, n T dimension will be less than required, resulting in a less than ideal second bond. Critical Clearance: The design clearance between capillary angle bottleneck, capillary manufacturing lerances, loop control, and desired quality standards all influence designed clearance. 54

15 Fine-Pitch Capillaries 1851, 1820, 1853, & 1854 Series The 1851 angle bottleneck capillary represents Gaiser s answer fine-pitch and ultra -fine-pitch bonding ol design. Our proprietary Process 1800 imparts a mirror smooth finish angle bottleneck portion of capillary. This increases shear strength and rigidity which results in superior ultrasonic energy transmission and a wider tuning window ideal for high frequency transducers. Process 1800 also provides substantially improved dimensional lerances and improved CPKs. capillaries CONE (STANDARD) wedges R 10 BOTTLENECK HEIGHT OR 10 ABTNK H FACE tab ols Specify: Series - H - Length+Finish - T( - Face Angle - OR)Options Example: GM-40(3-8D-10)20D-AB10x GM-50(4x120D-8D-12)AB10x GM-36(4-11D-8)AB10x P-32(2-8D-5)20D-AB5x8-CZ1 B 90 T For 120 angle, specify x120d in part number. Or angles may be specified. For single angle, specify as 1853 series. Standard angle is 90 unless orwise specified. See page 56 for more about 1853 and 1854 series. die attach Note: For T dimensions less than or equal /89µm, must specify CZ series material. For T dimensions less than or equal /74µm, contact Gaiser or your representative for part number. For dimensions equal /3.8µm, do not specify with radiused inside chamfer. For dimensions equal /2.5µm, do not specify with radiused inside chamfer and must have polished tip finish. If a radiused inside chamfer is desired in a 120, use 1820 series. For 1853 series, a radiused inside chamfer is not available, see page 56. or Tel Fax 55

16 56 ERIES S E ARCHITECTUR 0 9 E ARCHITECTUR 20 1 S DEFINITION 1851 Double Architecture Standard 0 /50 9 d an 120 /80 optional angles or Gaiser utilizes Series 1851 The architecture. Double standard is Double 90 /50 The specified. orwise unless 1851 BL With Inside (Blended Chamfer) BL with 1851 specified orwise unless 90 N/A 1820) (see Radiused/Blended a adds BL The Double 90 Chamfer Inside capillaries or and Series use BL, 120 For 1820 Radius Full Series Blended (120 Chamfer) Inside N/A BL) with 1851 (see Double 120 BL with architecture 120 utilizes Series 1820 The with architecture Double Gaiser Chamfer. Inside Radiused/Blended use 120, than or angle For BL Single Architecture basic utilizes Series 1853 The design. angle Single is size when specifying Consider Double for small oo t Single Architecture Edge Blend with as same is Series 1854 The a that except Series Single 1853 applied is break edge tiny very angle from transition Hole RADIUSED INSIDE CHAMFER 120 RADIUSED INSIDE CHAMFER BLEND EDGE 120 BLEND EDGE Cusm User-Specified Dimensions Series 1851, 1820, 1853, & 1854 Series

17 capillaries 57 Tel Fax wedges tab ols die attach or Guide Troubleshooting Bonding Wire Capillary Related Problems Bonding and Applications Fine-Pitch for ympm S e Caus ossible P y Remed Possible ball above Broken height loop for Insufficient increase order in parameters loop Increase length loop low o height security Ball or height, kink height, security ball Increase motion reverse Loops Sagging sag loops causing loops in much Too downward facr loop Decrease length reverse Increase tensioner Check/clean close o placement bond Wedge lead of tip increase position wedge "Re-teach" bond wedge of level surface set incorrectly height ond B t heigh bond "Re-teach" ball Non-sticking have may materials pad contaminated or Poor detecr non-stick after fail bond caused sampling timing detecr non-stick if Check correct are signals current and low o force ond B e forc bond Increase low o power ltrasonic U r powe ultrasonic Increase small o size ball air ree F t curren or EFO time Increase size ball No malfunction FO solenoid E d EFO solenoi Replace small o size ball air ree F t curren or EFO time Increase wedge Non-sticking clamped not inger F p set-u improve and clamp holder work Adjust or contaminated Leadframe leadframe on plating poor parameters bond Change quality check and material Inspect leadframe incoming of open Wire problem feed ire W r senso feed Adjust clamp irty D s jaw clamp Clean wedge on force xcessive E e wedg on force Reduce wedge on power xcessive E e wedg on power ultrasonic Reduce short Wire long o Tail check force clamp out Carry adjustment and small o is distance lectrode E t adjustmen and check EFO height out Carry ball Malformed power ultrasonic xcessive E r powe ultrasonic Reduce FAB nconsistent I d lea floating Check set-up poor with power/force xcessive E d lea bond Reduce bond club Golf electrode rch contacts old G h lengt tail or level rch Reduce dirty is electrode orch T l alchoho with electrode Clean broken is wiring electrode orch T e electrod new rch with replace or Repair Fine-Pitch Capillary Troubleshooting Guide

18 Ultra-Fine-Pitch Angle Bottleneck UFAB Series Capillaries Gaiser s UFAB (Ultra-Fine-Pitch Angle Bottleneck) series is designed for ultra-fine-pitch ball bonding. The UFAB series utilizes our exclusive Process 1800 method of manufacturing combined with high-strength CZ-series materials. Process 1800 produces a maximum strength angle bottleneck geometry that is neir ground nor injection molded. The UFAB-series is equipped with inside chamfer geometries that provide consistent small squashed ball formation size with high shear strengths and excellent looping characteristics. Tip sizes are available for 55µm, 50µm, 45µm, and 35µm pitch as indicated in tables. Part numbers proven in Gaiser Applications Technology Lab are indicated on adjacent page. Key Elements of Ultra-Fine-Pitch Ball Bonding Basic Application Requirements: 1. Wire diameter 2. Bond pad pitch (BPP) 3. Pad size or pad opening 4. Desired squashed ball diameter 5. Desired ball height* Resultant Dimensions: 6. Capillary T dimension 7. Clearance Series Face Angle Table Face Angle 180FX 0, Flat Face 1804X X X 11 Type Table Series Type 5. Desired Ball Height* 6. Capillary "T" Dimension 7. Clearance 2. Bond Pad Pitch (BPP) 3. Pad Size (or Pad Opening) 1. Wire Diameter 4. Desired Squashed Ball Diameter 18XXB 70 18XXH 90 18XXL XXS XXC 70, w/ Blend Edge 18XXJ 90, w/ Blend Edge 18XXM 100, w/ Blend Edge 18XXT 120, w/ Blend Edge 18XXY SB 18XXZ SPECIAL *Ball Height Typically = 1/3 Wire Diameter 58

19 Ultra-Fine-Pitch Angle Bottleneck UFAB Series Capillaries Pitch (BPP) Wire Dia. (mils) * Serie s * Dash Number H in. / µm B in. / µm in. / µm T in. / µm OR in. / µm AB 30 Cone AB 20 Cone 50µ FH - 10WRE / / / / / 7. 6 AB10x8 AB10x8 50µ FH - 9.5XRE / / / / / 7. 6 AB10x8 AB10x8 45µ FH - 8.5WME / / / / / 7. 6 AB10x8 AB10x8 40µ FH - 8.5SIE / / / / / 7. 6 AB5x8 AB5x8 35µ FH - 7.5LDD / / / / / 5. 1 AB5x6 AB5x6 *The above series and dash numbers were validated in Gaiser Applications Technology Lab and employ flat face, 90 single design. Or configurations are available using UFAB series part number system. capillaries Example Part Number: 1808H-10PSE-437P-20D-AB5x8-CZ3 Part Number Format Explained: Gaiser Process 1800 Face Angle (see Face Angle Table) Type (see Type Table) Hole Size & Size (see Hole & Size Tables) T Size & OR Size (see T Size & OR Size Tables) Length & Finish Options (20 cone, angle bottleneck configuration, material, etc) 18 XX X - XXX XX - XXXX - XXX... wedges Hole Size Table T Size Table OR Size Table Dash No. Hole Size in. / µ m / / / 22 Designation T Size in. / µ m D / 47 E / 48 F / 50 Designation OR Size in. / µ m D / 5 E / 8 F / 10 tab ols / 23 G / 51 G / / 24 H / 52 H / / 25 I / 53 Z SPECIAL / 27 J / / / / 30 Designation Size Table Size in. / µ m F / 1. 9 L / 2. 5 P / 3. 2 S / 3. 8 V / 4. 4 W / 5. 1 X / 5. 7 Y / 6. 4 Z SPECIAL K / 56 L / 57 M / 58 N / 60 P / 61 Q / 62 R / 64 S / 65 T / 66 U / 67 V / 69 W / 70 X / 71 Y / 74 Z SPECIAL Available Angle Bottlenecks 30 Cone 20 Cone AB5x6 AB5x6 AB5x8 AB5x8 AB5x10 AB5x10 AB10x6 AB10x6 AB10x8 AB10x8 AB10x10 AB10x10 die attach or Tel Fax 59