Supply and Demand Chain Executive Trend 2010 ACER CSR FORUM

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1 Supply and Demand Chain Executive Trend Copper Clad Laminates Dept Electronic Materials Division Nan Ya Plastics Corporation December 010 Page 1

2 The Driving Force for Greener Electronics Page

3 Computer Product Advancements to HFR-Free To Date Key System Elements Notebook Status H 010 New Products CPU heat sink HFR-free HFR-free CPU socket HFR-free HFR-free Desktop Status H 010 New Products CPU fan HFR-free not available HFR-free not available CPU HFR-free HFR-free Memory modules HFR-free HFR-free Power Supply HFR-free & PVC-free not available Hard drive & DVD burner HFR-free HFR-free Video/graphics card or module Motherboard (excluding highend circuits required for workstations & servers) HFR-free Low volume, specific models only HFR-free & PVC-free not available HFR-free Not HFR-free System enclosure PVC-free PVC-free Page 3

4 Targeted Timeline for Transition of Notebook and Desktop Products to HFR-free Components by inemi Members* Focus Evaluate and qualify HFR-free alternatives for high-performance PCBs Transition to PVC-free alternatives for notebook/desktop power cords Transition to HFR-free sockets/connectors for notebook/desktop systems (for at least 95% of the part numbers on new products shipping in 1Q 011) Complete by Q4 011 Q4 011 Q1 011 *inemi members include major PC OEMs and ODMs like Dell, HP, Lenovo, Foxconn, Flextronics, and Quanta, etc. Page 4

5 Halogen Contribution by Assembly Hard Drive 4% Touch Pad 3% CPU % Sockets % Battery % Cable % Keyboard 1% PCB laminates account for large share of total halogen contribution. Fan 6% Cards 7% Motherboard 56% Display 7% DVD Drive 8% Source: inemi Page 5

6 CH 3 Br CH 3 Br H C CH CH O C O H C HC CH O C O O CH 3 OH Br CH 3 Br CH 3 H C CH CH O C O H C HC CH OH CH 3 O Br O Br HO Br CH 3 C Br OH Br O Br Dioxin Br CH 3 TBBPA Br Br Br Br O Br Furan Brominated Flame Retardents can form Dioxins and Furans if burned under sub-optimal conditions Page 6

7 Halogen Free Means Low Halogen Content Common Industry Accepted Definition JPCA-ES IPC-4101C maximum Br: 900 ppm maximum Cl: 900 ppm max. Br + Cl: 1500 ppm IEC inemi members Page 7

8 Example of Flame Retardancy Mechanism Page 8

9 610.3/334kk Nanya Copper Clad Laminates MARKET AND GROWTH OF RIGID LAMINATE (DEMAND) (Area) (M m ) (F) Area CAAGR ( ) Paper Laminate % CEM Laminate % FR-4 Laminate % High T g Laminate % Halogen-free FR-4 Laminate % Specialty Laminate % BT/BT-Equivalent Laminate % Total % (Value) ($M) (F) Value CAAGR ( ) Paper Laminate $950 $903 $696 $ % CEM Laminate $477 $447 $384 $ % FR-4 Laminate $3,45 $3,153 $,697 $3,11.9% High T g Laminate $890 $944 $686 $1,066 9.% Halogen-free FR-4 Laminate $44 $504 $561 $1, % Specialty Laminate $430 $44 $384 $59 9.1% BT/BT-Equivalent Laminate $384 $37 $34 $ % Total $6,980 $6,764 $5,731 $8,08 7.4% Page 9

10 710.7/334Ckk FR-4 HALOGEN-FREE LAMINATE DEMAND BY APPLICATION (AREA) Area (M m ) CAAGR Cellular phone % NB PC % DT PC % MP % DSC % Camcorder % Game console % LCD Displays % Others (Portable game, etc) % Total % Page 10

11 PCB RIGID LAMINATE SUPPLIER BY AREA (No Mass Laminate/No Paper) 009 Sumitomo Bakelite 6.0M m 1.9% Park Electrochemical 4.8M m 1.5% Other 5.3M m 16.4% Nan Ya Plastics 56.9 M m 17.9% Mitsubishi Gas Chemical 6.M m 1.9% Grace 8.3M m.6% Hitachi Chemical 9.5M m 3.0% TUC 10.1M m 3.% Kc kk_pcbnomassarea Kingboard 45.6 M m 14.3% April 010 Doosan 14.7M m 4.6% ITEQ 15.1M m 4.7% Isola 16.3M m 5.1% Panasonic Electric 17.5M m 5.5% Shengyi Sci. Tech 36.0 M m 11.3% Elite Materials 19.4M m 6.1% Total: 318.6M m 11 Page 11

12 HALOGEN-FREE LAMINATE SUPPLIERS Area Other.4M m 6.9% ITEQ.1M m 6.% Hitachi Chemical.6M m 7.5% Shengyi Sci. Tech.7M m 8.1% Doosan 3.3M m 9.7% Panasonic Electric 5.9M m 17.3% Elite Materials (EMC) 8.1M m 3.7% Nan Ya Plastics 7.0M m 0.6% Shengyi Sci. Tech $46M 6.% Doosan $67M 9.1% Hitachi Chemical $79M 10.7% Value Other $55M 7.4% ITEQ $60M 8.1% N Ckk_halofree Nan Ya Plastics $118M 15.9% Panasonic Electric $19M 6.0% Elite Materials (EMC) $1M 16.6% TOTAL LAMINATE: 34M m TOTAL LAMINATE: $739M Note: Includes Prepreg Source: Prismark Page 1

13 1,00 1, YY/MM Cyclical but Steady Growth for HF Laminates: An Irreversible Trend? (1,000 SHEETS) /01 07/03 07/05 Halogen Free /07 07/09 07/11 008/01 08/03 08/ /07 08/09 08/11 009/01 09/03 09/ ,053 1, /07 09/09 09/11 010/01 10/03 10/05 10/07 Page 13

14 Materials For Lead Free Assembly Halogen Free Laminates Must Be Compatible with Pb-free Assembly Process Critical Laminate Properties to be Considered: Decomposition Temperature (Td) Z axis Coefficient of Thermal Expansion (CTE) Glass Transition Temperature (Tg) T60 & T88 Time to de-lamination at elevated temperatures Modulus of elasticity of the composite laminate materials Page 14

15 Slash Sheet # Tg min Tg max IPC 4101-C C Halogen Free Specification Sheets Td min Fillers No Yes No Yes Yes No Flame retardant 1 Phosphorous, Nitrogen and/or Inorganic Compound Flammability V-0 V-0 V-0 V-0 V-0 V-0 Z-Axis alpha 1 max Z-Axis alpha max % max Moisture Absorption % max T T T-300 AABUS AABUS AABUS AABUS Halogen Threshold Limits 900ppm max. Br or Cl and 1500ppm max. Br + Cl. Page 15

16 Supply Chain Readiness for Green Solutions TG NP-00 BT Laminate IC Substrates 00 BT Laminate (H.F) IC Substrate NPG-00 NP-180 FR-5 Grade high layer count MLB IC Substrate 180 High Tg(H.F) high layer count MLB IC Substrate NPG-180 O NP-175/F NP-170 FR-4 Grade high layer Count MLB 175 High Tg (H.F) high layer count MLB NPG-170 NPGN-170 O NP-155/F NP-150 High performance FR-4 Special application 150 Halogen Free FR-4 NPG NPGN-150 O NP-140M NP-140 FR-4 Tetra-functional for MLB 140 Halogen Free Laser drillable prepreg for HDI Laser PP O FR-4 D/S FR-4-86 UV FR-4-98 CTI Halogen Free Resin coated copper for HDI NPG-RCC O O CEM-3 CEM-1 CEM-3-86/ CEM-3-01 Halogen free CEM-1-87/ CEM-1-97 CTI Low Dk/Df High frequency & low loss NP-LDII Tg by DSC Suitable for Lead Free OSelective Pb-free Process NPG(Halogen Free) Page 16

17 Performance Properties of Halogen Free Laminates Item FR4 NP-155F NPG NPGN-150 NPG-170 NPGN-170 NPG-180 NPG-00 Resin system Br. Epoxy Br. Epoxy Halogen Free Halogen Free Halogen Free Halogen Free Halogen Free Halogen Free Curing agent Dicy Non Dicy Dicy Non Dicy Dicy Non Dicy Non Dicy Non Dicy Tg (,DSC) (TMA) (DMA) 05(DMA) CTE (%, 50~50 ) T-60 (min) 5 >60 >60 >60 >60 >60 >60 >60 T-88 (min) >40 >5 >40 >5 >40 >40 >40 Td (,TGA) Dk (@1GHz) Df (@1GHz) Rigid construction: 4 ply 768 NPG: G for Green (HF) Materials Page 17

18 Cost Effect for Halogen Free PCB Standard FR-4 Halogen Free Factors Laminate ~1.30 HF Resin (cost varies depending on core thickness) Drilling Reduced drill hits Desmear Index for 4~6-layer PCB Increased cycle time Total PCB Cost Adder Page 18

19 CLEAN LAMINATION PRODUTION PROCESS 配料 (VARNISH MIXING) Accelerator Br-epoxy hardner Solvent 成品 Inspection/Package 裁邊 Trimming 促進劑 溴化樹脂 硬化劑 溶劑 熱壓 Lamination Optical Inspection 玻纖布 Glass Fabric 烘箱 oven 裁片 Prepreg Cutting 含浸 Impregnation 原料混合 mixing 疊片 Core Up A B C 基材 銅箔 鋼板 組合 Lay-up C B A B C B A B C B A B C Page 19

20 Epoxy Varnish Recycle and Reuse Page 0

21 Reuse of Thermal Lagging Materials Page 1

22 Reusable Plastic Pallets Page

23 Facility Reduce and Recycle Efforts Water Recycle: Reverse Osmosis Ionic Exchange Vaporization Tank Copper Foil LAMINATES Epoxy Resin Steam Reduction;Saving: 1.55 ton/hour Rain Water Recycle;Saving: 4 ton/day Glass Fabric Carbon Emission Reduction Gas Fuel Reduction: Low Temp Desizing Page 3

24 Nanya Copper Clad Laminates Page 4