Halogen-Free Dielectric Substrates
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1 Halogen-Free Dielectric Substrates
2 Halogen-Free Dielectric Substrates WEEE (Waste Electrical and Electronic Equipment (Draft proposal May 10, 2000) January 1, 2008 Halogen Elimination Deadline
3 Halogen-Free Dielectric Substrates O () x () x Polybrominated Biphenyl Oxide (PBBO or PBDE) () x () x Polybrominated Biphenyl (PBB)
4 Halogen-Free Dielectric Substrates Difunctional epoxy resin O CH 3 CH 2 CH CH 2 O C O CH 2 CH CH 2 CH 3 O + Tetrabromobisphenol A (TBBPA) HO CH 3 C OH CH 3 ominate epoxy resin O CH 2 CH CH 2 O CH 3 C CH 3 O CH 2 CHOH CH 2 - O n CH 3 C CH 3 O O CH 2 CH CH 2
5 Halogen-Free Dielectric Substrates omine Flame Retardant Alternatives Inorganic fillers Examples: Alumina Trihydrate (ATH) Magnesium Hydroxide Mg (OH 2 ) Zinc Borate Mechanism: Release of water ( and may promote char) Advantages: Relatively inexpensive Useful as synergist Disadvantages: High loading required Frequently narrow in temperature range performance Sometimes Hydrophylic Tg reduction Typically inadequate without synergist Moisture sensitivity Low peel strength at high loading
6 Halogen-Free Dielectric Substrates omine Flame Retardant Alternatives Organic (Phosphorus) Materials - Additive Examples: Red Phosphorus Organophosphorus compounds Mechanism: Char formation Advantages: Relatively low loading of phosphorus required Wide temperature range performance Disadvantages: Cost Tg reduction Frequently toxic before encapsulation in epoxy resin matrix Alteration of prepreg performance Low solubility Phosphate restrictions in USA Moisture sensitivity Low peel strength
7 Halogen-Free Dielectric Substrates omine Flame Retardant Alternatives Organic Materials - Reactive Examples: Epoxy reactive phosphorus compounds Mechanism: Char formation Advantages: Relatively low loading of phosphorus required Wide temperature range performance No dispersion issues Less toxic Good thermal performance Good peel strength Disadvantages: Cost Some Tg reduction Moisture sensitivity
8 Halogen-Free Dielectric Substrates omine Flame Retardant Alternatives Intumescent Combinations - Additive Examples: Organophosporus compounds Mechanism: Foaming char formation acts as insulator Advantages: Relatively low loading required Very effective No toxic by products Disadvantages: Cost Difficult to work with Alteration of prepreg performance Tg reduction Phosphate restrictions in USA Moisture sensitivity
9 Halogen-Free Dielectric Substrates Polyclad Criteria 94-V0 Effectivity Performance Cost Thermal Electrical Processability Quality Peel strength Moisture absorption
10 PCL-HF-541 Halogen-Free Laminates & Prepregs 140 C Tg Reactive organic phosphorus flame retardant Samples available for evaluation
11 PCL-HF-541 Halogen-Free Laminates & Prepregs POLYCLAD LAMINATE/PREPREG GRADE - PCL-HF-541/PCL-HFP-541 (Provisional Data Sheet) IPC-4101 SPECIFICATION SHEET DESIGNATION(S) /21USED FOR PROVISIONAL SPEC REQUIREMENTS LAMINATE Typical Values/IPC-4101/21 Specification <.031 in (thickness <.78mm).031 in (thickness >.78mm) Units Test Method Property Typical Value IPC-4101 /21 Spec Typical Value IPC-4101 /21 Spec English (metric) IPC-TM-650 (or as noted) Tg by DSC min min ( o C) Decomposition Temperature ( o C) ASTMD3850 Z CTE A. Pre-Tg 50 B. Post-Tg 250 (PPM/ o C) X, Y, CTE A. Pre-Tg 15 B. Post-Tg 17 (PPM/ o C) Thermal Conductivity 0.36 W/MK ASTMD5930 Thermal Stress 20 C, spec minimum A. Unetched B. Etched Permittivity, spec maximum 1MHz Loss Tangent, spec maximum Volume Resistivity, spec minimum Surface Resistivity, spec minimum 1MHz A. C-96/35/90 B. After moisture resistance C. At elevated temperature A. C-96/35/90 B. After moisture resistance C. At elevated temperature Pass Pass x x x x10 6 Pass Visual Pass Visual Pass Pass x x x x10 6 Pass Visual Pass Visual Pass/Fail (MEGOHM) (MEGOHM- CM)
12 PCL-HF-541 Halogen-Free Laminates & Prepregs POLYCLAD LAMINATE/PREPREG GRADE - PCL-HF-541/PCL-HFP-541 (Provisional Data Sheet) IPC-4101 SPECIFICATION SHEET DESIGNATION(S) /21USED FOR PROVISIONAL SPEC REQUIREMENTS LAMINATE Typical Values/IPC-4101/21 Specification <.031 in.031 in (thickness <.78mm) (thickness >.78mm) Units Test Method Property Typical IPC-4101 Typical IPC-4101 English IPC-TM-650 Value /21 Spec Value /21 Spec (metric) (or as noted) Dielectric eakdown, spec minimum (KV) Arc Resistance, spec minimum Sec Electric Strength, spec minimum (Laminate or prepreg as laminated) VOLT/MIL (3.5x10 4 ) (3.0x10 4 ) (VOLT/MM) CTI UL-746A VOLTS ASTMD3638 Peel Strength, spec minimum 5.0(90) 4.0(70) 5.0(90) 4.0(70) Lbs/inch (Kg/M) Flexural Strength, spec minimum A. Low profile copper foil and very low profile all copper weights >17 microns B. Standard profile copper foil 1. After thermal stress 2. At 125 C 3. After process solutions A. Length direction B. Cross direction 7.5(145) 4.5(80) 4.0(70) 3.0(55) 7.5(135) 6.0(105) 4.0(70) 4.5(80) 6.0X10 4 (4.2X10 7 ) 5.0X10 4 (3.5X10 7 ) PSI (Kg/M 2 ) 2.4.4
13 PCL-HF-541 Halogen-Free Laminates & Prepregs POLYCLAD LAMINATE/PREPREG GRADE - PCL-HF-541/PCL-HFP-541 (Provisional Data Sheet) IPC-4101 SPECIFICATION SHEET DESIGNATION(S) /21USED FOR PROVISIONAL SPEC REQUIREMENTS LAMINATE Typical Values/IPC-4101/21 Specification <.031 in (thickness <.78mm).031 in (thickness >.78mm) Units Test Method Property Typical Value IPC-4101 /21 Spec Typical Value IPC-4101 /21 Spec English (metric) IPC-TM-650 (or as noted) Young s Modulus by DMA (GPA) Poisons Ratio (X,Y) 0.18/0.20 ASTM Moisture Absorption, spec maximum % Flammability V0 V0 V0 V0 UL-94 PREPREG Property Typical Value IPC-4101 Specification Unit Test Method Volatile Content Spec maximum % Shelf life at 50% RH Maximum, 70 F (20 C) Maximum Meets requirement 90 days (from date of delivery) Days
14 PCL-HF-571 Halogen-Free Laminates & Prepregs 160 C Tg Reactive organic phosphorus/inorganic filler flame retardant Limited samples available
15 PCL-HF-571 Halogen-Free Laminates & Prepregs POLYCLAD LAMINATE/PREPREG GRADE - PCL-HF-571/PCL-HFP-571 (Provisional Data Sheet) IPC-4101 SPECIFICATION SHEET DESIGNATION(S) /24USED FOR PROVISIONAL SPEC REQUIREMENTS LAMINATE Typical Values/IPC-4101/21 Specification <.031 in (thickness <.78mm).031 in (thickness >.78mm) Units Test Method Property Typical Value IPC-4101 /24 Spec Typical Value IPC-4101 /24 Spec English (metric) IPC-TM-650 (or as noted) Tg by DSC ( o C) Decomposition Temperature ( o C) ASTMD3850 Z CTE A. Pre-Tg 40 B. Post-Tg 200 (PPM/ o C) X, Y, CTE A. Pre-Tg 15 B. Post-Tg 17 (PPM/ o C) Thermal Conductivity 0.36 W/MK ASTMD5930 Thermal Stress 20 C, spec minimum A. Unetched B. Etched Permittivity, spec maximum 1MHz Loss Tangent, spec maximum Volume Resistivity, spec minimum Surface Resistivity, spec minimum 1MHz A. C-96/35/90 B. After moisture resistance C. At elevated temperature A. C-96/35/90 B. After moisture resistance C. At elevated temperature Pass Pass Pass Visual Pass Visual Pass Pass Pass Visual Pass Visual Pass/Fail (MEGOHM) (MEGOHM- CM)
16 PCL-HF-571 Halogen-Free Laminates & Prepregs POLYCLAD LAMINATE/PREPREG GRADE - PCL-HF-571/PCL-HFP-571 (Provisional Data Sheet) IPC-4101 SPECIFICATION SHEET DESIGNATION(S) /24USED FOR PROVISIONAL SPEC REQUIREMENTS LAMINATE Typical Values/IPC-4101/21 Specification <.031 in.031 in (thickness <.78mm) (thickness >.78mm) Units Test Method Property Typical IPC-4101 Typical IPC-4101 English IPC-TM-650 Value /24 Spec Value /24 Spec (metric) (or as noted) Dielectric eakdown, spec minimum (KV) Arc Resistance, spec minimum Sec Electric Strength, spec minimum (Laminate or prepreg as laminated) VOLT/MIL (3.5x10 4 ) (3.0x10 4 ) (VOLT/MM) CTI UL-746A VOLTS ASTMD3638 Peel Strength, spec minimum 5.0(90) 4.0(70) 5.0(90) 4.0(70) Lbs/inch (Kg/M) Flexural Strength, spec minimum A. Low profile copper foil and very low profile all copper weights >17 microns B. Standard profile copper foil 1. After thermal stress 2. At 125 C 3. After process solutions A. Length direction B. Cross direction 7.5(145) 4.5(80) 4.0(70) 3.0(55) 7.5(135) 6.0(105) 4.0(70) 4.5(80) 6.0X10 4 (4.2X10 7 ) 5.0X10 4 (3.5X10 7 ) PSI (Kg/M 2 ) 2.4.4
17 PCL-HF-571 Halogen-Free Laminates & Prepregs POLYCLAD LAMINATE/PREPREG GRADE - PCL-HF-571/PCL-HFP-571 (Provisional Data Sheet) IPC-4101 SPECIFICATION SHEET DESIGNATION(S) /24USED FOR PROVISIONAL SPEC REQUIREMENTS LAMINATE Typical Values/IPC-4101/21 Specification <.031 in.031 in (thickness <.78mm) (thickness >.78mm) Units Test Method Property Typical IPC-4101 Typical IPC-4101 English IPC-TM-650 Value /24 Spec Value /24 Spec (metric) (or as noted) Young s Modulus by DMA (GPA) Poisons Ratio (X,Y) ASTM Moisture Absorption, spec maximum % Flammability V0 V0 V0 V0 UL-94 PREPREG Property Typical Value IPC-4101 Specification Unit Test Method Volatile Content Spec maximum % Shelf life at 50% RH Maximum, 70 F (20 C) Maximum Meets requirement 90 days (from date of delivery) Days
18 Halogen-Free Dielectric Substrates Polyclad Status Evaluating licensing options Working with resin suppliers Internal development Synergistic combinations (over 50 evaluated to date) Laminate/prepreg availability PCL-HF-541 (140 C Tg) - Samples available UL listed PCL-HF-571 (160 C Tg) Limited samples available UL Pending/in process Planned resin coated foil availability Sample availability Q4 2000/Q1 2001
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