ThunderClad 2. TU-883 HF Very Low Loss Material. Laminates & Prepregs Mass Lamination Service Insulated Metal Substrate Materials

Transcription

1 ThunderClad 2 TU-883 HF Very Low Loss Material Laminates & Prepregs Mass Lamination Service Insulated Metal Substrate Materials

2 TUC Product Roadmap 2 ULVP VLP HCF Ultra Low Void Prepreg Very Low Profile Copper Foil Heavy Cu foil (max. 12 oz) LDP Laser Drillable Prepreg UTC Ultra-Thin Core (1mil) ZBC Buried Capacitance D+9 DS within +/-100 ppm Super Low Loss CCL / ThunderClad 3 HF Low Loss CCL / ThunderClad Df 1GHz / Low Signal Loss Board HF Mid-Tg Low Dk / TU-787 LK --- Dk 3.4, Df @10GHz / High Speed / RF HF Very Low Loss / ThunderClad Df 10GHz / Excellent Signal Integrity --- Dk 3.2 ; Df < / Anylayer HF High Reliability CCL / TU Hi-Tg Low CTE / Harsh Environment High Thermal Reliability Green Materials Low Loss Lead Free Process Compatibility 10 cycles 6 cycles TU-768/768 F (Tg180) TU-662/668 (Tg150) --- high Layer Count/ High density Multi-layer Board TU-722 (Tg180) ---High Layer Count/ High Density Multi-layer Board TU-862 HF (Tg180) TU-84P NF --- Rigid-Flex TU-747 LK (Tg150) TU-747 HF (Tg150) --- Mid-Loss --- Low Dk / Any-layer ---Consumer / HP / NB High Speed / Low Dk/Df TU-872 SLK / SLK Sp Low Dk/Df Laminate TU-872 LK IMS ---High Speed /Low Signal Loss Board Insulated Metal Substrate TU-322 / TU-362 / TU W/mK / 1 W/mK

3 ThunderClad 2 3 TU-883 / HF Very Low Loss Material Design for high speed digital / RF application Lead-free process compatible Build-up with either E-glass or NE-glass Build-up with RTF or VLP foil Flat Dk / Df varied with frequency Dk=3.6@10GHz ; Df=0.0049@10GHz (1080 GF ) Tg = 210 o C (DMA) Status : Sample stage / ready for PCB/OEM evaluation.

4 ThunderClad 2 4 Type Performance Tg, (DSC), C Tg, (DMA), C Tg, (TMA), C Td, (TGA, 5%wt loss) C ThunderClad 2 TU TU-872 SLK Z-axis Expansion, ( C), % GHz ( SPC method ) / (1080 GF) 1GHz ( SPC method ) / (1080 GF) Flammability, UL94 94V-0 94-V0 Peel strength (1oz), lb/in 4~6 5~7 T-260, min T-288, min >60 > PCT/1hr/Dip (288 C), sec >180 >120

5 Viscosity ( Pa.s ) Rheology 5 1.E+06 TU-883 Heat Rise Rate : 2.0 deg C/min 1.E+05 1.E+04 1.E+03 1.E Temperature ( degc )

6 Dk Propagation Cu H oz 2116 x 1 Cu H oz 2116x1 Cu H oz TU-872 SLK MLS TU-883 VSP TU-883 MLS Competitor-M GHz

7 Insertion Loss Construction & Foil 7

8 Dk Phase Constant - Temperature Cu H oz 2116 x 1 Cu H oz 2116x1 Cu H oz GHz GHz degc Two-line method

9 Loss db/in Loss [db/in] Insertion Loss - Temperature GHz 8 GHz -1.0 TU GHz 15 GHz Cu H oz 2116 x 1 Cu H oz 2116x1 Cu H oz degc Two-line method Freq. [GHz]

10 Thermal Reliability (case 1) 26L 10 Material : ThunderClad 2 (TU-883) Layer count : 26 layer Board Thickness : 3.2 mm 2 oz copper foil : x 4 layers Pitch design : 0.65, 0.8 & 1.0 mm Drilling hole size : 0.3 mm Pattern design : x 4 types ( D1 ~ D4 ) Test criteria : 260 o C, reflow 10X & 288 o C solder float x6

11 Thermal Reliability (case 1) 26L 11 L1 H oz PP 2116HRC 1 L2/3 3mil 1/1 PP 2116HRC 1 L4/5 3mil 1/1 PP 2116HRC 1 L6/7 3mil 1/1 PP 2116HRC 1 L8/9 3mil 1/1 PP 2116HRC 1 L10/11 3mil 1/1 PP 106HRC 2 L12/13 6mil 2/2 (2ply) PP 106HRC 3 L14/15 6mil 2/2 (2ply) PP 106HRC 2 L16/17 3mil 1/1 PP 2116HRC 1 L18/19 3mil 1/1 PP 2116HRC 1 L20/21 3mil 1/1 PP 2116HRC 1 L22/23 3mil 1/1 PP 2116HRC 1 L24/25 3mil 1/1 PP 2116HRC 1 L26 H oz

12 Thermal Reliability 0.8 mm / Solder 6x 12 Solder 6x D2 design D3 design

13 Thermal Reliability 0.65 mm / Solder 6x 13

14 Thermal Reliability 1.0 mm / reflow 10x 14 Reflow 10x Pitch 1.0 mm D2 design Reflow 10x D3 design Pitch 1.0 mm

15 Thermal Reliability 0.8 mm / reflow 10x 15 Reflow 10x Reflow 10x D3 design Pitch 0.8 mm D2 design Pitch 0.8 mm

16 Thermal Reliability 0.65 mm / reflow 10x 16 Reflow 10x Reflow 10x D3 design Pitch 0.65 mm D2 design Pitch 0.65 mm

17 Thermal Reliability (case 1) : 26L 17 Design / stress Solder 6x Pitch 1.0 mm Pitch 0.8 mm Pitch 0.65 mm D1 D2 D3 D4 D1 D2 D3 D4 D1 D2 D3 D4 Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass reflow 10X Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass No delamination No crack No ICD No Pad Lifting

18 Thermal Reliability (case 2) 24L 18 Material : ThunderClad2 (TU-883) Layer count : 24 layer Board Thickness : 3.3 mm 2 oz copper foil : x 4 layers Pitch design : 0.5, 0.65, 0.8 & 1.0 mm Drilling hole size : 0.3 mm Pattern design : enclosed design Test criteria : 260 o C, reflow 8x, 288 o C solder float x10

19 Thermal Reliability (case 2) 24L 1 Stack-up Org. P/P Thick Cu Remaining % Thickness Predicted Thickness L1 H Prepreg 3313 RC L2 H Core 3313X L3 H Prepreg 2116 RC L4 H Core 3313X L5 H Prepreg 1067 RC Prepreg 1067 RC L6 H Core 3313X L7 H Prepreg 106 RC Prepreg 106 RC L Core 3313X L Prepreg 1078 RC Prepreg 106 RC RC L Core 3313X L Prepreg 1080 RC Prepreg 106 RC RC L Core 3313X L Prepreg 1078 RC Prepreg 106 RC RC L Core 3313X L Prepreg 1080 RC Prepreg 106 RC RC L Core 3313X L Prepreg 106 RC Prepreg 106 RC L18 H Core 3313X L19 H Prepreg 1067 RC Prepreg 1067 RC L20 H Core 3313X L21 H Prepreg 2116 RC L22 H Core 3313X L23 H Prepreg 3313 RC L24 H Thickness

20 Reliability : Solder float / x-section 20 Pitch: 0.8mm Hole : 0.3mm Solder Float@288C x10 : Pass 50x 100x

21 Reliability : Solder float / x-section 21 Pitch: 0.65mm Hole : 0.3mm Solder Float@288C x10 : Pass 50x 100x

22 Reliability : reflow / x-section 22 Pitch: 0.80mm Hole : 0.3mm IR x 8 (> 255C, 20-30sec) : Pass 50x 100x

23 Reliability : reflow / x-section 23 Pitch: 0.65mm Hole : 0.3mm IR x 8 (> 255C, 20-30sec) : Pass 50x 100x

24 Thermal Reliability (case 2) : 24L 24 Design / stress Pitch 1.0 mm Pitch 0.8 mm Pitch 0.65 mm Pitch 0.50mm Solder 10x Pass Pass Pass Pass reflow 8X Pass Pass Pass Pass No De-lamination No crack No ICD No Pad Lifting

25 Thermal Reliability (case 3) 30L 25 Material : ThunderClad2 (TU-883) Layer count : 30 layer Board Thickness : 3.6 mm 2 oz copper foil : x 4 layers Pitch design : 1.0 mm Drilling hole size : 0.3 mm Test criteria :288 o C solder float x8 L1 1 oz 106RC75x2 L2/L3 2mil 1/1 1067x1 RTF L4/L5 3mil H/H 1078x1 RTF L6/L7 3mil H/H 1078x1 RTF L8/L9 3mil H/H 1078x1 RTF L10/L11 3mil H/H 1078x1 RTF L12/L13 4mil 1/2 1067x2 RTF 1080RC63x2 L14/L15 4mil 2/2 1067x2 RTF x2 L16/L17 4mil 2/2 1067x2 RTF 1078RC67x2 L18/L19 4mil 2/1 1067x2 RTF L20/L21 3mil H/H 1078x1 RTF L22/L23 3mil H/H 1078x1 RTF L24/L25 3mil H/H 1078x1 RTF L26/L27 3mil H/H 1078x1 RTF L28/L29 2mil 1/1 1067x1 RTF 106RC75x2 L30 1 oz

26 Thermal Reliability (case 4) 30L 26 After 8x 10sec 288C Solder Float 1.0mm pitch

27 Thermal Reliability (case 3) : 30L 27 Design / stress Solder 8x Pitch 1.0 mm Pass No De-lamination No crack No ICD No Pad Lifting

28 Thermal Reliability (case 4) 30L 28 Material : ThunderClad2 (TU-883) Layer count : 30 layer Board Thickness : 3.6 mm 2 oz copper foil : x 4 layers Pitch design : 0.8, 0.7 mm Drilling hole size : 0.3 mm Test criteria :288 o C solder float x8 L1 1 oz 106RC75x2 L2/L3 2mil 1/1 1067x1 RTF L4/L5 3mil H/H 1078x1 RTF L6/L7 3mil H/H 1078x1 RTF L8/L9 3mil H/H 1078x1 RTF L10/L11 3mil H/H 1078x1 RTF L12/L13 4mil 1/2 1067x2 RTF 1080RC63x2 L14/L15 4mil 2/2 1067x2 RTF x2 L16/L17 4mil 2/2 1067x2 RTF 1078RC67x2 L18/L19 4mil 2/1 1067x2 RTF L20/L21 3mil H/H 1078x1 RTF L22/L23 3mil H/H 1078x1 RTF L24/L25 3mil H/H 1078x1 RTF L26/L27 3mil H/H 1078x1 RTF L28/L29 2mil 1/1 1067x1 RTF 106RC75x2 L30 1 oz

29 Thermal Reliability (case 4) 30L A B A B 0.8 matrix hole 20x20 20x20 30x30 30x30 pitch 0.7mm 0.7mm 0.8mm 0.8mm drilling bit size 0.25 mm

30 Thermal Reliability (case 4) 30L 30 After 8x 10sec 288C Solder Float 0.7mm pitch design A 0.7mm pitch design B

31 Thermal Reliability (case 4) 30L 31 After 8x 10sec 288C Solder Float 0.8mm pitch design A 0.8mm pitch design B

32 Thermal Reliability (case 5) : 24L 32 Design / stress Pitch 0.8 mm design A Pitch 0.8 mm design B Pitch 0.7 mm design A Pitch 0.7 mm design A Solder 8x Pass Pass Pass Pass No De-lamination No crack No ICD No Pad Lifting

33 33