Sputtering Targets. for Semiconductor Manufacturing Applications TECHCET s Market & Supply Chain Critical Materials Report By Terry A.

Transcription

1 Sputtering Targets for Semiconductor Manufacturing Applications TECHCET s Market & Supply Chain Critical Materials Report By Terry A. Francis Edited by L. Shon Roy TECHCET Group a TECHCET CA LLC Company August info@techcet.com

2 Table of Contents 1: Executive Summary : Scope & Methodology : Semiconductor Market Overview Forecast Trends Wafer StartForecast : Raw Material Economic Overview Copper Tantalum Aluminum Titanium Sponge Tungsten : Supply Chain Update Copper Supply Tightens Titanium Tungsten China Update : Supply Chain Analysis & Pricing Copper Tantalum Aluminum Titanium Tungsten Other Total Cumulative Target Price Forecast : Technology Trends Technology Updates Cobalt Integration Material Challenges Beyond Copper Approaches to Solve Barrier Problems TSV : Regulatory Updates Conflict Minerals: Dodd Frank European Union (EU) Commission, Council and Parliament...77

3 Table of Contents, continued 9: Business Trends and Analysis Supplier Market Share Target Production Competitive Environment Cu & Al Tungsten Cobalt Sn Update Conflict Minerals Precious Metals Rare Earths Summary : Supplier News and Profiles Honeywell JX Nippon Praxair Tosoh SMD KFMI Grikin Appendix B: Raw Materials Process Overview B.1 Copper: Process Overview B.2 Tantalum: Process Overview B.3 Aluminum: Process Overview 143 B.4 Titanium: Process Overview A.5 Tungsten: Overview Appendix C: China Perspective C.1 China Perspective Appendix D: Approaches to Solve Barrier Problems D.1 Approaches to Solve Barrier Problems Appendix E: Technology Trends E.1 200mm devices mm devices Limits of Barrier Thickness Appendix A: Key Manufacturing Cost Drivers..114 A.1 Cost Components A.2 Key Cost Drivers of Copper Targets A.3 Key Cost Drivers of Tantalum Targets A.4 Key Cost Drivers of Aluminum Targets A.5 Key Cost Drivers of Titanium Targets A.6 Key Cost Drivers of Tungsten Targets...135

4 List of Figures Figure 1.1: Sputtering Target Total Revenue...12 Figure 3.1: Wafer Starts by Device Type...19 Figure 3.2: Wafer Start Forecast...21 Figure 4.1: 2016 Global Cu Mine Production Figure 4.2: 2015 Global Cu Consumption...24 Figure 4.3: 2015 Ta Mine Production Figure 4.4: 2015 Global Ta Metal Demand Figure 4.5: 2015 WW Al Production Figure 4.6: 2015 US Domestic Al Demand...28 Figure 4.7: 2016 Ti Sponge Production Figure 4.8: 2016 Global Ti Sponge Demand Figure 4.9: 2015 W Mine Production Figure 4.10: 2015 Global W Metal Demand Figure 4.15: W Process Summary...38 Figure 6.3 : Cu Sputtering Target Revenue Forecast Figure 6.4: Ta Target Price Forecast...46 Figure 6.5 : Ta Sputtering Target Revenue Forecast.47 Figure 6.6: Al Target Price Forecast...50 Figure 6.7 : Al Sputtering Target Revenue Forecast. 51 Figure 6.8: Ti Target Price Forecast...54 Figure 6.9 : Ti Sputtering Target Revenue Forecast 55 Figure 6.11 W Target Price Forecast...58 Figure 6.10: W Sputtering Target Revenue Forecast...59 Figure 6.12: Other Sputtering Target Revenue Forecast.60 Figure 6.13: Sputtering Target Market Share by Application 61 Figure 6.14: Sputtering Target Cumulative Price Forecast..62 Figure 6.15: Sputtering Target Cumulative Revenue Forecast..63 Figure 6.1 Global growth in Cu: Changes and Surprise 40 Figure 6.2: Cu Target Price Forecast...42

5 List of Figures (Continued) Figure 7.1 Interconnect metallization Roadmap..66 Figure 7.2: Contact Resistance Comparison with Cobalt..67 Figure 7.3: TSV Middle Process v. Standard TSV Last Process...71 Figure 9.1: 2015Target Supplier Market Share...79 Figure 9.2a: 2014 Target Unit Production Figure 9.2b: 2019 Target Unit Production...80 Figure A.1: Copper Raw Material Cost Driver Figure A.2: Copper Purification/Consolidation Cost Driver Figure A.3: Copper Forming Cost Driver Figure A.4: Copper Machining and Bonding Cost Figure A.5: Ta Raw Material Cost Driver Figure A.6: Ta Purification Cost Driver Figure A.7: Ta Consolidation Cost Driver Figure A.8: Ta Forming Cost Driver Figure A.9: Ta Machining and Bonding Cost Driver 126 Figure A.10: Al Raw Material Cost Driver Figure A.11: Al Purification/Consolidation Cost Driver 128 Figure A.12: Al Forming Cost Driver Figure A.13: Al Machining and Bonding Cost Driver 130 Figure A.14: Ti Raw Material Cost Driver Figure A.15: Ti Purification/Consolidation Cost Driver 132 Figure A.16: Ti Forming Cost Driver Figure A.17: Ti Machining and Bonding Cost Driver Figure A.18: W Raw Material Cost Driver Figure A.19: W Purification Cost Driver..., Figure A.20: W Consolidation Cost Driver Figure A.21: W Forming Cost Driver Figure A.22: W Machining and Bonding Cost Driver Figure B.1: Cu Process Summary..141 Figure B.2: Ta Process Summary..142 Figure B.3: Al Process Summary..143 Figure B.4: Ti Process Summary..144 Figure B.5: W Process Summary..145

6 List of Figures and Tables Figures (Continued) Figure C.1 China Target Market Share% Figure E.1 5nm BEOL Approaches..153 Figure E.2 Barrier Limits. 154 Tables Table 6.1: CU Target Supplier Supply Chain Integration. 38 Table 6.2: Ta Target Supplier Supply Chain Integration Table 6.3: Al Target Supplier Supply Chain Integration...48 Table 6.4: Ti Target Supplier Supply Chain Integration Table 6.5: W Target Supplier Supply Chain Integration Table 7.1: Alternatives to Cu, Resistivity Comparison. 68 Table 10.1: KFMI Target Specifications Table 10.2 Grikin Target Specifications Table A.1: Process to Manufacture High Purity Grade Sputtering Targets