Cypress Semiconductor Package Qualification Report
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1 Cypress Semiconductor ackage Qualification Report QT# VERSION 2.0 January lead Thin Quad Flat ack 10 x 10 x 1.0mm, MSL1, 235C Reflow Amkor Bupyeong Korea Assembly CYRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Sabbas Daniel Mira Ben-Tzur V Quality Engineering rincipal Reliability Engineer (408) (408)
2 ackage: 52-lead TQF ackage (10 x 10 x 1.0mm), MSL1, 235C Reflow age 2 of 6 ACKAGE QUALIFICATION HISTORY QUAL REORT DESCRITION OF QUALIFICATION UROSE Qualify Amkor Bupyeong-Korea for TQF 52-lead, 10 x 10 x 1.0mm, MSL1, 235C Reflow, using G700L Mold Compound and 3230 Epoxy DATE COM. Mar 04
3 ackage: 52-lead TQF ackage (10 x 10 x 1.0mm), MSL1, 235C Reflow age 3 of 6 MAJOR ACKAGE INFORMATION USED IN THIS QUALIFICATION ackage Designation: A52 ackage Outline, Type, or Name: 52-lead Thin Quad Flat ack (TQF) Mold Compound Name/Manufacturer: G700L Mold Compound Flammability Rating: V-O per UL 94 Oxygen Rating Index: N/A Lead Frame Material: Copper Lead Finish, Composition / Thickness: 85% Sn 15% b Die Backside reparation Method/Metallization: Grinding Die Separation Method: Sawing Die Attach Supplier: BT Die Attach Material: 3230 Bond Diagram Designation Wire Bond Method: Thermosonic Wire Material/Size: Au 1.2 mil Thermal Resistance Theta JA C/W: 55 C/W ackage Cross Section Yes/No: N/A Assembly rocess Flow: Name/Location of Assembly (prime) facility: Korea-Q (Amkor Bupyeong-Korea) ELECTRICAL TEST / FINISH DESCRITION Test Location: Cypress hilippines (CML-R) Fault Coverage: 100% Note: lease contact a Cypress Representative for other packages availability.
4 ackage: 52-lead TQF ackage (10 x 10 x 1.0mm), MSL1, 235C Reflow age 4 of 6 RELIABILITY TESTS ERFORMED ER SECIFICATION REQUIREMENTS Stress/Test High Temperature Operating Life Early Failure Rate High Temperature Operating Life Latent Failure Rate Test Condition (Temp/Bias) Dynamic Operating Condition, Vcc Max = 3.8V, 150C Dynamic Operating Condition, Vcc Max = 7.0V, 150C Dynamic Operating Condition, Vcc Max = 3.8V, 150C Dynamic Operating Condition, Vcc Max = 7.0V, 150C Temperature Cycle MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C recondition: JESD22 Moisture Sensitivity MSL Hrs., 85 C/85%RH+3IR-Reflow, 235 C+0, -5 C ressure Cooker 121 C, 100%RH recondition: JESD22 Moisture Sensitivity MSL 1 Result /F High Accelerated Saturation Test (HAST) 168 Hrs., 85 C/85%RH+3IR-Reflow, 235 C+0, -5 C 130 C, 3.63V, 85%RH recondition: JESD22 Moisture Sensitivity MSL Hrs., 85 C/85%RH+3IR-Reflow, 235 C+0, -5 C Acoustic Microscopy Cypress Spec Die Shear Cypress Spec Internal Visual Cypress Spec X-Ray MIL-STD-883, Method 32012, Cypress Spec
5 ackage: 52-lead TQF ackage (10 x 10 x 1.0mm), MSL1, 235C Reflow age 5 of 6 Reliability Test Data QT #: Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL1 IMIZ9974CA (7C8Z9974C) KOREA-Q COM 15 0 IMIZ9974CA (7C8Z9974C) M KOREA-Q COM 15 0 IMIZ9974CA (7C8Z9974C) M1 KOREA-Q COM 15 0 STRESS: DIE SHEAR IMIZ9974CA (7C8Z9974C) KOREA-Q COM 5 0 IMIZ9974CA (7C8Z9974C) M KOREA-Q COM 5 0 STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 3.63V), RE COND 168 HR 85C/85%RH, MSL1 IMIZ9974CA (7C8Z9974C) KOREA-Q IMIZ9974CA (7C8Z9974C) M KOREA-Q STRESS: HIGH TEM DYNAMIC OERATING LIFE-EARLY FAILURE RATE, 150C, 3.8V, Vcc Max CYWUSB6934 (7B6934A) /9/20 KOREA-L STRESS: HIGH TEM DYNAMIC OERATING LIFE-EARLY FAILURE RATE, 150C, 7V, Vcc Max CY7C136 (7C136G) TAIWN-G STRESS: HIGH TEM DYNAMIC OERATING LIFE-LATENT FAILURE RATE, 150C, 3.8V, Vcc Max CYWUSB6934 (7B6934A) /9/20 KOREA-L CYWUSB6934 (7B6934A) /9/20 KOREA-L STRESS: HIGH TEM DYNAMIC OERATING LIFE-LATENT FAILURE RATE, 150C, 7V, Vcc Max CY7C136 (7C136G) TAIWN-G CY7C136 (7C136G) TAIWN-G STRESS: INTERNAL VISUAL IMIZ9974CA (7C8Z9974C) KOREA-Q COM 5 0 IMIZ9974CA (7C8Z9974C) M KOREA-Q COM 5 0 STRESS: RESSURE COOKER TEST (121C, 100%RH), RE COND 168 HR 85C/85%RH, MSL1 IMIZ9974CA (7C8Z9974C) KOREA-Q IMIZ9974CA (7C8Z9974C) M KOREA-Q STRESS: X-RAY IMIZ9974CA (7C8Z9974C) KOREA-Q COM 15 0 IMIZ9974CA (7C8Z9974C) M KOREA-Q COM 15 0
6 ackage: 52-lead TQF ackage (10 x 10 x 1.0mm), MSL1, 235C Reflow age 6 of 6 Reliability Test Data QT #: Device Fab Lot # Assy Lot # AssyLoc Duration Samp Rej Failure Mechanism STRESS: TC COND. C -65C TO 150C, RE COND 168 HR 85C/85%RH, MSL1 IMIZ9974CA (7C8Z9974C) KOREA-Q IMIZ9974CA (7C8Z9974C) KOREA-Q IMIZ9974CA (7C8Z9974C) KOREA-Q IMIZ9974CA (7C8Z9974C) M KOREA-Q IMIZ9974CA (7C8Z9974C) M KOREA-Q IMIZ9974CA (7C8Z9974C) M KOREA-Q IMIZ9974CA (7C8Z9974C) M1 KOREA-Q IMIZ9974CA (7C8Z9974C) M1 KOREA-Q IMIZ9974CA (7C8Z9974C) M1 KOREA-Q
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