Assembly Site: JCET, China Package Types: SOT-23 3L, SOD-323, SC-79 Report No: QUAL08-WB

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Byron Palmer
5 years ago
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Mike Gillis Requester: Barry McClusky Product/Package Reliability: Ken Symonds / Steven Campbell

1 e Package / Assembly Site Qualification Interim Report 9/25/08 Assembly Site: JCET, China Package Types: SOT-23 3L, SOD-323, SC-79 Report No: QUAL08-WB Qualification Team Package Engineer: Mike Gillis Requester: Barry McClusky Product/Package Reliability: Ken Symonds / Steven Campbell Prepared by: Ken Symonds Skyworks Solutions, Inc. Product & Package Reliability 20 Sylvan Road, Woburn, MA

2 JCET, China Package / Assembly Qualification Report REVISION HISTORY Rev Description of Change Author Submit Date A Initial Release Ken Symonds Table of Contents 1 Summary Reference Documents Skyworks Documents Other Supporting Documents Product Description and Information Reliability File Number: Product Information Assembly Package and Material Information Package and Assembly Reliability Testing Package Level Reliability Results Assembly Manufacturability Requirements JCET Reliability Testing...10 Page 2 of 10 SQ Skyworks Solutions, Inc.

3 Product & Package Reliability 1 Summary This document presents the interim results for verifying JCET, China as a qualified manufacturing and assembly site for Skyworks. Standard package-level qualification testing is being performed by Skyworks, including preconditioned HAST, temperature cycle, autoclave and high temperature storage. This testing has been successfully completed for the SOD323. The SC79 has successfully completed post preconditioning electrical test and autoclave. The SOT23 has successfully completed post preconditioning electrical test. ECDs for the remaining tests are provided. Standard assembly-level testing including solderability, physical dimensions, wire bond pull, wire bond shear and die shear is to be performed at JCET. Assembly data submitted to date includes acceptable bond pull and die shear data, however, it does not include solderability, wire bond shear or physical dimensioning data. This information is needed. JCET has also performed some level of package level Reliability testing which has passed; however, it should be noted that the sample sizes are much smaller than our JEDEC requirements. Overall ECD for the work outlined in this plan is 11/25/08. 2 Reference Documents 2.1 Skyworks Documents SQ Qualification Standard SQ Wafer Process Qualification Requirements SQ Package and Assembly Qualification Requirements SQ Product Qualification Requirements 2.2 Other Supporting Documents JESD22 JEDEC Standard Test Methods JESD47 Stress-Test-Driven Qualification of Integrated Circuits MIL-STD-883F Department of Defense Test Method Standard, Microcircuits Skyworks Solutions, Inc. Proprietary and Confidential Page 3 of 10

4 JCET, China Package / Assembly Qualification Report 3 Product Description and Information 3.1 Reliability File Number: Product Information Test Vehicle: SMV LF / SOD-323 Product Function/Frequency: Varactor Diode Mask Info Size in mm Fabrication Information Die Mask Size X Size Y Foundry Fab Process VSHPH0032R2U Woburn AD Planar Test Vehicle: SMS LF / SOT-23 Product Function/Frequency: Schottky Diode Mask Info Size in mm Fabrication Information Die Mask Size X Size Y Foundry Fab Process SNTIJK001U Woburn AD Planar Test Vehicle: SMP LF / SC-79 Product Function/Frequency: PIN Diode Mask Info Size in mm Fabrication Information Die Mask Size X Size Y Foundry Fab Process PDM A Woburn AD Planar Page 4 of 10 SQ Skyworks Solutions, Inc.

5 Product & Package Reliability 3.3 Assembly Package and Material Information Package Type SOT-23 3L SOD-323 SC-79 Package Dimensions 2.9x1.3x x1.25x x.8x.6 Package Details JCET Carsem Test Vehicle SMS7621- SMV1233- SMP LF 011LF 079LF Configuration Series Pair Single Single Die Dimensions (mils) 10.5x x x10.5 Die Area (mils^2) # Terminals Mold Compound KL-G800H KL-G800H KL-G800H MC Mfg'r Hysol-Huawei Hysol-Huawei Hysol-Huawei (Epoxy/Eutectic) Epoxy Epoxy Eutectic Die Attach 84-1LMISR4 84-1LMISR4 Ablestick Ablestick Au-Ge Wirebond 1 mil Au 1 mil Au 1 mil Au Lead Frame Material Alloy 42 Alloy 42 Alloy 42 Lead Frame Plating matte Sn matte Sn matte Sn Paddle Size (mils) 32x36 27x26 27x26 31x32 21x21 Paddle area (mils^2) 1152 / 702 / DPA Mold Compound MP8000C MP8000C MP8000C MC Mfg'r Nitto Denko Nitto Denko Nitto Denko (Epoxy/Eutectic) Epoxy Epoxy Eutectic Die Attach 84-1LMISR4 84-1LMISR4 Ablestick Ablestick Au-Ge Wirebond 1 mil Au 1 mil Au 1 mil Au Lead Frame Material Alloy 42 Alloy 42 Alloy 42 Lead Frame Plating matte Sn matte Sn matte Sn Paddle Size (mils) 35x37 32x24 32x24 32x32 19x19 Paddle area (mils^2) 1295 / 768 / DPA Package Type SOT-23 3L SOD-323 SC-79 Skyworks Solutions, Inc. Proprietary and Confidential Page 5 of 10

6 JCET, China Package / Assembly Qualification Report 4 Package and Assembly Reliability Testing 4.1 Package Level Reliability Results SMV LF / SOD-323 Test 1 Qty Endpoints Results Preconditioning 2 MSL 1/260 (JESD22-A113) 240 x 1 lot 185 x 2 lots ATE CSAM 24 Hr Moisture Soak 3x Reflow ATE - CSAM QL1 : 0 Fail / 265 QL2 : 0 Fail / 185 QL3 : 0 Fail / 185 Temperature Cycling -65 o C to +150 o C (JESD22-A104) 500 cycles (condition C) QL1: 0 Fail / 77 QL2 : 0 Fail / 77 QL3 : 0 Fail / 77 Autoclave 121ºC, 100% RH, 30 PSIA, unbiased (JESD22-A102) 96 hours QL1: 0 Fail / 77 QL2 : 0 Fail / 77 QL3 : 0 Fail / 77 HAST 130ºC, 85% RH, 33 PSIA, Unbiased (JESD22-A110) 77 x 1 lot 96 hours QL1 : 0 Fail / 77 High Temp Storage 150 o C (JESD22-A103) 25 x 3 lots 1008 hours QL1 : 0 Fail / 25 QL2 : 0 Fail / 25 QL3 : 0 Fail / 25 1 All stress tests are performed by the procedures referenced in SQ Preconditioning is required before TC, and HAST Page 6 of 10 SQ Skyworks Solutions, Inc.

7 Product & Package Reliability SMS LF / SOT-23 Test 1 Qty Endpoints Results Preconditioning 2 MSL 1/260 (JESD22-A113) 240 x 1 lot 185 x 2 lots ATE CSAM 24 Hr Moisture Soak 3x Reflow ATE - CSAM QL1 : 0 Fail / 265 QL2 : 0 Fail / 185 QL3 : 0 Fail / 185 Temperature Cycling -65 o C to +150 o C (JESD22-A104) 500 cycles (condition C) ECD: 10/24 Autoclave 121ºC, 100% RH, 30 PSIA, unbiased (JESD22-A102) 96 hours ECD: 10/17 HAST 130ºC, 85% RH, 33 PSIA, Unbiased (JESD22-A110) 77 x 1 lot 96 hours ECD: 10/17 High Temp Storage 150 o C (JESD22-A103) 25 x 3 lots 1008 hours ECD: 11/15 1 All stress tests are performed by the procedures referenced in SQ Preconditioning is required before TC, and HAST Skyworks Solutions, Inc. Proprietary and Confidential Page 7 of 10

8 JCET, China Package / Assembly Qualification Report SMP LF / SC-79 Test 1 Qty Endpoints Results Preconditioning 2 MSL 1/260 (JESD22-A113) 240 x 1 lot 185 x 2 lots ATE CSAM 24 Hr Moisture Soak 3x Reflow ATE - CSAM QL1 : 0 Fail / 265 QL2 : 0 Fail / 185 QL3 : 0 Fail / 185 Temperature Cycling -65 o C to +150 o C (JESD22-A104) 500 cycles (condition C) ECD: 10/20 Autoclave 121ºC, 100% RH, 30 PSIA, unbiased (JESD22-A102) 96 hours QL1: 0 Fail / 77 QL2 : 0 Fail / 77 QL3 : 0 Fail / 77 HAST 130ºC, 85% RH, 33 PSIA, Unbiased (JESD22-A110) 77 x 1 lot 96 hours ECD: 10/6 High Temp Storage 150 o C (JESD22-A103) 25 x 3 lots 1008 hours ECD: 11/6 1 All stress tests are performed by the procedures referenced in SQ Preconditioning is required before TC, and HAST Page 8 of 10 SQ Skyworks Solutions, Inc.

9 Product & Package Reliability 5 Assembly Manufacturability Requirements (Performed at JCET) Test 1 Qty Specification Results Solderability 30 packages from a minimum of 3 lots per package type JESD22-B102 Not provided n Assembly Data Wire Bond Pull All bonds on 3 die per lot per package type Mil-Std-883E, Method 2011, Conditions C & D (>8gms) Wire Bond Shear All bonds on 3 die per lot per package type JESD22-B116 Not provided n Assembly Data Die Shear 5 die x 3 lots per package type Mil-Std-883E, Method 2019 Pass Physical Dimensions 30 packages from minimum of 3 lots JESD22-B100 Not provided n Assembly Data 1 All stress tests are performed by the procedures referenced in SQ Skyworks Solutions, Inc. Proprietary and Confidential Page 9 of 10

10 JCET, China Package / Assembly Qualification Report 6 JCET Reliability Testing Reliability testing was performed by JCET using these packages with their own test vehicles. Sample sizes are less than JEDEC; however, the results are passing. Test 1 Qty Endpoints Results Preconditioning 2 MSL 1/260 (JESD22-A113-D) 45 x 1 lot Per Package Type 24 Hr Moisture Soak 3x Reflow SOD-323: SOT-23: SC79: Temperature Cycling -65 o C to +150 o C (JESD22-A104-B) 15 x 1 lot Per Package Type 1000 cycles (condition C) SOD-323: SOT-23: SC79: Pressure Cooker 121ºC, 100% RH, 2 atm, unbiased (JESD22-A102-C) 15 x 1 lot Per Package Type 168 hours SOD-323: SOT-23: SC79: High Temp Storage 150 o C (JESD22-A103-B) 15 x 1 lot Per Package Type 1008 hours SOD-323: SOT-23: SC79: 1 All stress tests are performed by the procedures referenced in SQ Preconditioning is required before TC, and HAST Page 10 of 10 SQ Skyworks Solutions, Inc.

Product Qualification Report

e Product Qualification Report Part Number: SKY65111-348LF Package Type: 16L MLQP (3.0 X 3.0 mm) Report No: 301028 Qualification Team Product Engineer: Peter J. DiCarlo Requester: Peter J. DiCarlo Product/Package