Cypress Semiconductor Package Qualification Report
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1 Cypress Semiconductor Package Qualification Report QTP# VERSION 1.0 September Ld SNC, 32Ld SOIC, 28/32/36/44Ld SOJ Packages 11 mils Wafer Thickness and Saw Step Cut MSL 3, 220C Reflow Cypress Philippines (CML-R) CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Rene Rodgers Principal Reliability Engineer (408)
2 Package: SOIC,SNC,SOJ Packages,, MSL3, 220C Reflow Page 2 of 7 Package Qualification History Qual Report Description of Qualification Purpose Qualify 11 mils Wafer Thickness and Saw Step Cut of ALL 28L SOIC, 32L SNC, 28/32/36/44L SOJ packages, MSL3, 220C Reflow Temperature assembled at Cypress, Phil. (CML-R) Date Comp. Apr 04
3 Package: SOIC,SNC,SOJ Packages,, MSL3, 220C Reflow Page 3 of 7 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: S Package Outline, Type, or Name: 32-Lead Plastic Small Outline Ic s (SOIC) Mold Compound Name/Manufacturer: Sumitomo EME6600HR Mold Compound Flammability Rating: V-O per UL94 Oxygen Rating Index: 28% Lead Frame Material: Copper Lead Finish, Composition / Thickness: 85% Sn, 15% Pb Die Backside Preparation Method/Metallization: Grinding Die Separation Method: Wafer Saw Step Cut Die Attach Method: Epoxy Die Attach Supplier: Dexter Die Attach Material: QMI 509 Bond Diagram Designation Wire Bond Method: Thermosonic Wire Material/Size: 0.80 mil Thermal Resistance Theta JA C/W: C/W Package Cross Section Yes/No: N/A Assembly Process Flow: Name/Location of Assembly (prime) facility: Cypress Philippines (CML-R) (Conventional Line) ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Cypress Philipines (CML-R) Fault Coverage: 100% Note: Please contact a Cypress Representative for other packages availability.
4 Package: SOIC,SNC,SOJ Packages,, MSL3, 220C Reflow Page 4 of 7 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: V3233 Package Outline, Type, or Name: 32-Lead Plastic Small Outline J-Bend (SOJ) Mold Compound Name/Manufacturer: Sumitomo EME6600HR Mold Compound Flammability Rating: V-O per UL94 Oxygen Rating Index: 28% Lead Frame Material: Copper Lead Finish, Composition / Thickness: 85% Sn, 15% Pb Die Backside Preparation Method/Metallization: Grinding Die Separation Method: Wafer Saw Die Attach Method: Epoxy Die Attach Supplier: Dexter Die Attach Material: QMI 509 Bond Diagram Designation Wire Bond Method: Thermosonic Wire Material/Size: 1.0 mil Thermal Resistance Theta JA C/W: C/W Package Cross Section Yes/No: N/A Assembly Process Flow: Name/Location of Assembly (prime) facility: Cypress Philippines (CML-R) (Conventional Line) ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Cypress Philipines (CML-R) Fault Coverage: 100% Note: Please contact a Cypress Representative for other packages availability.
5 Package: SOIC,SNC,SOJ Packages,, MSL3, 220C Reflow Page 5 of 7 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: V3644 Package Outline, Type, or Name: 32-Lead Plastic Small Outline Ic s (SOJ) Mold Compound Name/Manufacturer: Sumitomo EME6600HR Mold Compound Flammability Rating: V-O per UL94 Oxygen Rating Index: 28% Lead Frame Material: Copper Lead Finish, Composition / Thickness: 85% Sn, 15% Pb Die Backside Preparation Method/Metallization: Grinding Die Separation Method: Wafer Saw Die Attach Method: Epoxy Die Attach Supplier: Dexter Die Attach Material: QMI 509 Bond Diagram Designation Wire Bond Method: Thermosonic Wire Material/Size: 0.80 mil Thermal Resistance Theta JA C/W: C/W Package Cross Section Yes/No: N/A Assembly Process Flow: Name/Location of Assembly (prime) facility: Cypress Philippines (CML-R) (Conventional Line) ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Cypress Philipines (CML-R) Fault Coverage: 100% Note: Please contact a Cypress Representative for other packages availability.
6 Package: SOIC,SNC,SOJ Packages,, MSL3, 220C Reflow Page 6 of 7 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test Test Condition (Temp/Bias) Result P/F Temperature Cycle MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity MSL Hrs., 30 C/60%RH+3IR-Reflow, 220 C+5, -0 C Pressure Cooker Test No bias, 121 C, 100%, Precondition: JESD22 Moisture Sensitivity MSL Hrs., 30 C/60%RH+3IR-Reflow, 220 C+5, -0 C High Accelerated Saturation Test 130 C, 85%RH, 5.5V MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C P P P Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs., 30 C/60%RH+3IR-Reflow, 220 C+5, -0 C Acoustic Microscopy Test Cypress Spec P Die Shear Cypress Spec P
7 Package: SOIC,SNC,SOJ Packages,, MSL3, 220C Reflow Page 7 of 7 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY7C188 (7C188B) CML-R COMP 15 0 CY62128BLL (7C621268H) CML-R COMP 15 0 CY7C1049DV33 (7C1049C) CML-R COMP 15 0 STRESS: DIE SHEAR CY7C188 (7C188B) CML-R COMP 3 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 5.5V, PRE COND 192 HR 30C/60%RH, MSL3 CY7C188 (7C188B) CML-R CY62128BLL (7C621268H) CML-R STRESS: PRESSURE COOKER TEST, 121C, 100%RH, PRE COND 192 HR 30C/30%RH, MSL3 CY7C188 (7C188B) CML-R CY62128BLL (7C621268H) CML-R STRESS: TC CONDITION C, -65C TO 150C, PRE COND 192 HR 30C/30%RH, MSL3 CY7C188 (7C188B) CML-R CY62128BLL (7C621268H) CML-R CY62128BLL (7C621268H) CML-R CY7C1049DV33 (7C1049C) CML-R CY7C1049DV33 (7C1049C) CML-R
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