Cypress Semiconductor Package Qualification Report. 60 FBGA (8 x 20 x 1.2mm) SnPb, MSL3, 220 C Reflow Unisem-Indonesia
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1 ackage Qualification Report QT# VERSION 1.0 July FBGA (8 x 20 x 1.2mm) Snb, MSL3, 220 C Reflow Unisem-Indonesia CYRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Rene Rodgers Reliability Engineer, MTS (408) Mira Ben-Tzur Quality Engineering Director (408)
2 60 FBGA (8 x 20 x 1.2mm) MSL3, 220C Reflow age 2 of 7 ACKAGE QUALIFICATION HISTORY QUAL REORT DESCRITION OF QUALIFICATION UROSE Qualify 60 FBGA (8 x 20 x 1.2mm) b-free, MSL3, 260C Reflow, using CRM 1577A Epoxy and Nitto GE100LFCSV Mold Compound with SAC Solder Balls assembled at AIT, Indonesia Qualify 60 FBGA (8 x 20 x 1.2mm) Snb, MSL3, 220C Reflow, using CRM 1577A Epoxy and Nitto GE100LFCSV Mold Compound assembled at Unisem, Indonesia DATE COM. Nov 07 Apr 08
3 60 FBGA (8 x 20 x 1.2mm) MSL3, 220C Reflow age 3 of 7 MAJOR ACKAGE INFORMATION USED IN THIS QUALIFICATION ackage Designation: BA60 ackage Outline, Type, or Name: 60- Fine Ball Grid Array (FBGA) Mold Compound Name/Manufacturer: Nitto GE100LFCSV Mold Compound Flammability Rating: V-0 UL-94 Mold Compound Alpha Emission Rate : cm 2 /h Oxygen Rating Index: NA Substrate Material: Green Substrate Lead Finish, Composition / Thickness: Snb Die Backside reparation Method/Metallization: Backgrind Die Separation Method: Saw Die Attach Supplier: Sumitomo Die Attach Material: CRM 1577A Die Attach Method: Epoxy Bond Diagram Designation: Wire Bond Method: Thermosonic Wire Material/Size: Au/ 0.8mil Thermal Resistance Theta JA C/W : C/W ackage Cross Section Yes/No: Yes Assembly rocess Flow: Name/Location of Assembly (prime) facility: Unisem-Indonesia (AT) MSL Level: 3 Reflow rofile: 220C ELECTRICAL TEST / FINISH DESCRITION Test Location: CML-R
4 60 FBGA (8 x 20 x 1.2mm) MSL3, 220C Reflow age 4 of 7 RELIABILITY TESTS ERFORMED ER SECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result /F Electrostatic Discharge Charge Device Model (ESD-CDM) 500V Cypress Spec Electrostatic Discharge Human Body Model (ESD-HBM) High Accelerated Saturation Test (HAST) 2,200V JESD22, Method A114-E 130 C, 3.65V, 85%RH recondition: JESD22 Moisture Sensitivity MSL Hrs, 30 C/60%RH + 3IR-Reflow, 260 C+0, -5 C High Temp Storage 150C, no bias ressure Cooker Temperature Cycle 121 C, 100%RH, 15 SIG recondition: JESD22 Moisture Sensitivity MSL Hrs, 30 C /60%RH + 3IR-Reflow, 260 C+0, -5 C MIL-STD-883C, Method 1010, Condition C, -65 C to C recondition: JESD22 Moisture Sensitivity MSL3 192 Hrs 30 C/60%RH + 3IR-Reflow, 260 C+0, -5 C Acoustic Microscopy Cypress Spec Ball Shear Cypress Spec Solder Ball Shear JESD-B117 Bond ull Cypress Spec Constructional Analysis Cypress Spec Cross Section Cypress Spec Die Shear Cypress Spec Dye enetrant Test Cypress Spec Final Visual Inspection Cypress Spec Internal Visual Cypress Spec hysical Dimension Cypress Spec Solderability Cypress Spec Thermal Shock Cypress Spec X-Ray MIL-STD
5 60 FBGA (8 x 20 x 1.2mm) MSL3, 220C Reflow age 5 of 7 Reliability Test Data QT #: Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC CY7C1069A (7C1069A) AIT-INDONESIA COM 15 0 CY7C1069A (7C1069A) AIT-INDONESIA COM 15 0 CY7C1069A (7C1069A) AIT-INDONESIA COM 15 0 STRESS: BALL SHEAR CY7C1069A (7C1069A) AIT-INDONESIA COM 10 0 STRESS: BOND ULL CY7C1069A (7C1069A) AIT-INDONESIA COM 15 0 STRESS: CONSTRUCTIONAL ANALYSIS CY7C1069A (7C1069A) AIT-INDONESIA COM 5 0 STRESS: DIE SHEAR CY7C1069A (7C1069A) AIT-INDONESIA COM 15 0 STRESS: DYE ENETRANT TEST CY7C1069A (7C1069A) AIT-INDONESIA 500V 9 0 CY7C1069A (7C1069A) AIT-INDONESIA COM 15 0 CY7C1069A (7C1069A) AIT-INDONESIA COM 15 0 STRESS: ESD-CHARGE DEVICE MODEL, 500V CY7C1069A (7C1069A) AIT-INDONESIA COM 9 0 STRESS: ESD-HUMAN BODY CIRCUIT ER JESD22, METHOD A114-E, 2,200V CY7C1061A (7C1069A) AIT-INDONESIA COM 9 0 STRESS: FINAL VISUAL INSECTION CY7C1069A (7C1069A) AIT-INDONESIA COM CY7C1069A (7C1069A) AIT-INDONESIA COM CY7C1069A (7C1069A) AIT-INDONESIA COM STRESS: HIGH TEM STORAGE CY7C62167D (7C62162D) AIT-INDONESIA CY7C62167D (7C62162D) AIT-INDONESIA STRESS: HI-ACCEL SATURATION TEST, (130C, 3.6V), 85%RH, RE COND 192 HR 30C/60%RH, MSL3 CY7C1069A (7C1069A) AIT-INDONESIA STRESS: INTERNAL VISUAL CY7C1069A (7C1069A) AIT-INDONESIA COM 5 0
6 60 FBGA (8 x 20 x 1.2mm) MSL3, 220C Reflow age 6 of 7 Reliability Test Data QT #: Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HYSICAL DIMENSIONS CY7C1069A (7C1069A) AIT-INDONESIA COM 10 0 CY7C1069A (7C1069A) AIT-INDONESIA COM 10 0 CY7C1069A (7C1069A) AIT-INDONESIA COM 10 0 STRESS: RESSURE COOKER TEST (121C, 100%RH), RE COND 192HRS 30C/60%RH, MSL3 CY7C1069A (7C1069A) AIT-INDONESIA STRESS: SOLDERABILITY CY7C1069A (7C1069A) AIT-INDONESIA COM 3 0 CY7C1069A (7C1069A) AIT-INDONESIA COM 3 0 CY7C1069A (7C1069A) AIT-INDONESIA COM 3 0 STRESS: SOLDER BALL SHEAR CY7C1069A (7C1069A) AIT-INDONESIA COM 2 0 CY7C1069A (7C1069A) AIT-INDONESIA COM 2 0 CY7C1069A (7C1069A) AIT-INDONESIA COM 2 0 STRESS: TC COND. -65C TO 150 C, RECONDITION 192 HRS 30C/60%RH, MSL3 CY7C1069A (7C1069A) AIT-INDONESIA CY7C1069A (7C1069A) AIT-INDONESIA CY7C1069A (7C1069A) AIT-INDONESIA STRESS: THERMAL SHOCK CY7C1069A (7C1069A) AIT-INDONESIA CY7C1069A (7C1069A) AIT-INDONESIA STRESS: X-RAY CY7C1069A (7C1069A) AIT-INDONESIA COM 15 0
7 60 FBGA (8 x 20 x 1.2mm) MSL3, 220C Reflow age 7 of 7 Reliability Test Data QT #: Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: CROSS SECTION CY7C1069A (7C1069A) AIT-INDONESIA COM 5 0 CY7C1069A (7C1069A) AIT-INDONESIA COM 5 0 STRESS: FINAL VISUAL INSECTION CY7C1069A (7C1069A) AIT-INDONESIA COM CY7C1069A (7C1069A) AIT-INDONESIA COM STRESS: SOLDERABILITY CY7C1069A (7C1069A) AIT-INDONESIA COM 3 0 CY7C1069A (7C1069A) AIT-INDONESIA COM 3 0 STRESS: SOLDER BALL SHEAR CY7C1069A (7C1069A) AIT-INDONESIA COM 5 0 CY7C1069A (7C1069A) AIT-INDONESIA COM 5 0 STRESS: X-RAY CY7C1069A (7C1069A) AIT-INDONESIA COM 5 0 CY7C1069A (7C1069A) AIT-INDONESIA COM 5 0
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