Supplier Response (CHD Cu wire) FSL-TJN-FM S9S08SG32E1xTG/ SG16E1xTG - MC9S08SG32. Item Name. 2. Supplier s Part Number/Data Sheet:
|
|
|
- Amberlynn Quinn
- 6 years ago
- Views:
Transcription
1 2. Supplier s Part Number/Data Sheet: Supplier Response (CHD Cu wire) S9S08SG32E1xTG/ SG16E1xTG - Supplier Response (CHD/ Au wire) S9S08SG32E1xTG/ SG16E1xTG - a. Facility name/plant #: No.15, Xing Hua Avenue; XiQing Tianjin China (TJN) c. Country: China China 17. Die Attach: a. Die attach material ID: SUMITOMO CRM-1064MBL ablestick 8290 b. Die attach method: Epoxy Epoxy c. Die placement diagram: Available upon request Available upon request a. Plastic mold compound supplier & ID: Sumitomo G630AY Sumitomo G700K c. Flammability rating: UL94 V0 UL94 V0 e. Tg (glass transition temperature) ( C): f. CTE (above & below Tg) (ppm/ C): 12 & & 49 a. Wire bond material: Cu Au c. Type of wire bond at die: Ball bond Ball bond No.15, Xing Hua Avenue; XiQing Tianjin China (TJN)
2 -010revA, -011revB, - 012Rev-. 2. Supplier s Part Number/Data Sheet: Supplier Response (CHD/ Cu wire) ATP1 S9S08SG32E1xTG/ SG16E1xTG / a. Facility name/plant #: ATP1 ATP1 Supplier Response (CHD/ Au wire) ATP1 S9S08SG32E1xTG/ SG16E1xTG / c. Country: Philippines Philippines a. Plastic mold compound supplier & ID: Sumitomo G700LS Sumitomo G700K b. Mold compound type: Epoxy Resin EMC Halide free c. Flammability rating: UL94 V0 UL94 V0 e. Tg (glass transition temperature) ( C): f. CTE (above & below Tg) (ppm/ C): 9 & & 49 a. Wire bond material: Pd coated Cu Au c. Type of wire bond at die: Ball bond ball d. Type of wire bond at leadframe: Stitch bond stitch
3 Supplier Response (CHD/ Cu wire) Supplier Response (CHD/ Au wire) 2. Supplier s Part Number/Data Sheet: S9S08SG8E2xTG/ S9S08SG4E2xTG S9S08SG8E2xTG/ S9S08SG4E2xTG a. Facility name/plant #: No.15, Xing Hua Avenue; XiQing Tianjin China (TJN) c. Country: China China 17. Die Attach: a. Die attach material ID: SUMITOMO CRM-1064MBL ablestick 8290 b. Die attach method: Epoxy Epoxy c. Die placement diagram: Available upon request Available upon request a. Plastic mold compound supplier & ID: Sumitomo G630AY Sumitomo G700K c. Flammability rating: UL 94 V0 UL 94 V0 e. Tg (glass transition temperature) ( C): f. CTE (above & below Tg) (ppm/ C): 12 & & 49 a. Wire bond material: Cu Au c. Type of wire bond at die: Ball Bond Ball Bond No.15, Xing Hua Avenue; XiQing Tianjin China (TJN)
4 Supplier Response (CHD/ Cu wire) ATP1 Supplier Response (CHD/ Au wire) ATP1 2. Supplier s Part Number/Data Sheet: S9S08SG8E2xTG/ S9S08SG4E2xTG S9S08SG8E2xTG/ S9S08SG4E2xTG a. Facility name/plant #: ATP1 ATP1 c. Country: Philippines Philippines a. Plastic mold compound supplier & ID: Sumitomo G700LS Sumitomo G700K c. Flammability rating: UL94 V0 UL 94 V0 e. Tg (glass transition temperature) ( C): f. CTE (above & below Tg) (ppm/ C): 9 & & 49 a. Wire bond material: Pd coated Cu Au c. Type of wire bond at die: Ball bond Ball Bond
5 Supplier Response ( CHD/ Cu wire) Supplier Response (CHD/Au wire) 2. Supplier s Part Number/Data Sheet: S9S08SC4E0xTG/ MC9S08SC4RM S9S08SC4E0xTG/ MC9S08SC4RM a. Facility name/plant #: No.15, Xing Hua Avenue; XiQing Tianjin China (TJN) c. Country: China China 17. Die Attach: a. Die attach material ID: SUMITOMO CRM-1064MBL ablestick 8290 b. Die attach method: Epoxy Epoxy c. Die placement diagram: Available upon request Available upon request a. Plastic mold compound supplier & ID: Sumitomo G630AY Sumitomo G700K c. Flammability rating: UL 94 V0 UL 94 V0 e. Tg (glass transition temperature) ( C): f. CTE (above & below Tg) (ppm/ C): 12 & & 49 a. Wire bond material: Cu Au c. Type of wire bond at die: Ball Bond Ball Bond No.15, Xing Hua Avenue; XiQing Tianjin China (TJN)
6 Supplier Response (CHD/ Cu wire) ATP1 Supplier Response (CHD/Au wire) ATP1 2. Supplier s Part Number/Data Sheet: S9S08SC4E0xTG/ MC9S08SC4RM S9S08SC4E0xTG/ MC9S08SC4RM a. Facility name/plant #: ATP1 ATP1 c. Country: Philippines Philippines a. Plastic mold compound supplier & ID: Sumitomo G700LS Sumitomo G700K c. Flammability rating: UL94 V0 UL 94 V0 e. Tg (glass transition temperature) ( C): f. CTE (above & below Tg) (ppm/ C): 9 & & 49 a. Wire bond material: Pd coated Cu Au c. Type of wire bond at die: Ball bond Ball Bond
Assembly Site Expansion for 1.2um IDR PLCC 52/68 from NXP-ATKL to ATP1
5/7/2018 epcn Print: Final Product Change Notification 201803025F01 Final Product Change Notification 201803025F01 Issue Date: Effective Date: Dear Product Data, 09-May-2018 07-Aug-2018 Here's your personalized
Cypress Semiconductor Mold Compound Qualification Report
Cypress Semiconductor Mold Compound Qualification Report QTP# 010601 VERSION 2.0 (G3) October 2004 28-44 Lead SOJ/20-32 Lead SOIC/28 Lead SNC s Sumitomo EME 6600HR Mold Compound, MSL3 Assembly CYPRESS
Project Proposal. Cu Wire Bonding Reliability Phase 3 Planning Webinar. Peng Su June 6, 2014
Project Proposal Cu Wire Bonding Reliability Phase 3 Planning Webinar Peng Su June 6, 2014 Problem Statement Background Work of the inemi Cu wire reliability project identified that bonding quality and
If you have any questions concerning this change, please contact:
February 17, 2014 PPCN #130027 PROCESS/ PRODUCT CHANGE NOTIFICATION This is to inform you that Micrel Inc has qualified Exposed Pad (E-Pad) SOIC packages at STARS Microelectronics, Thailand as an alternative
Materials Declaration Form
Materials Declaration Form IPC 1752 Version 2 Form Type * Distribute Sectionals * Material Info Subsectionals * A-D Distribute * : Required Field Supplier Information Company Name * STMicroelectronics
Product Change Notifications
Product Change Notifications Preparing for PCNs in Harsh Environment Applications Steven O. Dunford PWA Center of Excellence Schlumberger IPC/ECIA/JEDEC J-STD-046 Customer Notification Standard for Product/Process
Analog, MEMS and Sensor Group (AMS)
05-13-2015 Report ID 2015-W20AMKOR-TRANSFER PRODUCT/PROCESS CHANGE NOTIFICATION PCN AMS/15/9324 Analog, MEMS and Sensor Group (AMS) Production transfer from Amkor Korea to Amkor Philippines for component
If you have any questions concerning this change, please contact: NAME: Hank Chou PHONE:
January 20, 2014 Preliminary December 8, 2014 Final PPCN #140001 PROCESS/ PRODUCT CHANGE NOTIFICATION This is to inform you that Amkor, a Micrel assembly subcontractor, is transferring TQFP/LQFP production
Environmental Management and Materials Information
Environmental Management and Materials Information Product Content Information for: MAX44285FAWA+ Links Qualifications Package Description Chemical Composition Detailed Package Component Data Other Component
Environmental Management and Materials Information
Environmental Management and Materials Information Product Content Information for: MAX3622CUE+ Links Qualifications Package Description Chemical Composition Detailed Package Component Data Qualifications
Materials Declaration Form
Materials Declaration Form IPC 1752 Version 2 Form Type * Distribute Sectionals * Material Info Subsectionals * A-D Manufacturing Info * : Required Field Supplier Information Company Name * STMicroelectronics
Environmental Management and Materials Information
Environmental Management and Materials Information Product Content Information for: MAX3674ECM+T Links Qualifications Package Description Chemical Composition Detailed Package Component Data Qualifications
Cypress Semiconductor Package Qualification Report
Cypress Semiconductor Package Qualification Report QTP# 041007 VERSION 1.0 September 2004 28Ld SNC, 32Ld SOIC, 28/32/36/44Ld SOJ Packages 11 mils Wafer Thickness and Saw Step Cut MSL 3, 220C Reflow Cypress
Certificate of non-use of The Controlled Substances
Certificate of non-use of The Controlled Substances Company name Product Covered Thyristor SOT-89 Package Issue Date It is hereby certified by, that there is neither RoHS (EU Directive 2011/65/EU)-restricted
Cypress Semiconductor Package Qualification Report. 60 FBGA (8 x 20 x 1.2mm) SnPb, MSL3, 220 C Reflow Unisem-Indonesia
ackage Qualification Report QT# 080805 VERSION 1.0 July 2008 60 FBGA (8 x 20 x 1.2mm) Snb, MSL3, 220 C Reflow Unisem-Indonesia CYRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Rene Rodgers Reliability
Materials Declaration Form
Materials Declaration Form IPC 1752 Version 2 Form Type * Distribute Sectionals * Material Info Subsectionals * A-D Manufacturing Info * : Required Field Supplier Information Company Name * STMicroelectronics
Final Product/Process Change Notification Document # : FPCN22191X Issue Date: 16 March 2018
Title of Change: SOIC-8 Insourcing to ON Semiconductor Philippines (OSPI) Factory from HANA (Thailand) - Phase 1 Proposed first ship date: 23 June 2018 Contact information: Samples: Additional Reliability
Final Product/Process Change Notification Document # : FPCN22191XF Issue Date: 23 April 2018
Title of Change: SOIC-8 Insourcing to ON Semiconductor Carmona, Philippines (OSPI) Factory from GEM (China). Proposed first ship date: 30 July 2018 Contact information: Contact your local ON Semiconductor
Final Product/Process Change Notification Document # : FPCN22191XC Issue Date: 21 March 2018
Title of Change: SOIC-8 Insourcing to ON Semiconductor Philippines (OSPI) Factory from GEM (China) Proposed first ship date: 28 June 2018 Contact information: Samples: Additional Reliability Data: Type
Materials Declaration Form
Materials Declaration Form IPC 1752 Version 2 Form Type * Distribute Sectionals * Material Info Subsectionals * A-D Manufacturing Info * : Required Field Supplier Information Company Name * STMicroelectronics
Final Product/Process Change Notification Document # : FPCN22191XC Issue Date: 21 March 2018
Title of Change: SOIC-8 Insourcing to ON Semiconductor Philippines (OSPI) Factory from GEM (China) Proposed first ship date: 28 June 2018 Contact information: Samples: Additional Reliability Data: Type
Environmental Management and Materials Information
Environmental Management and Materials Information Product Content Information for: MAX3637ETM+ Links Qualifications Package Description Chemical Composition Detailed Package Component Data Qualifications
CYPRESS SEMICONDUCTOR ADVANCED PRODUCT CHANGE NOTIFICATION
CYPRESS SEMICONDUCTOR ADVANCED PRODUCT CHANGE NOTIFICATION PCN: 020040 DATE: December 16, 2002 Subject: 32 SOJ Mold Compound Changed to EME6600HR & EME9600HR at OMEDATA To: Description of change: The mold
Body. Please reference the attached Product Change Notification (PCN# ) which addresses the following:
October 18, 2010 Subject: QFP Base Device Package Type Body Size PCI9080-3/G QFP 28X28 208L PCI9052/G QFP 28X28 160L PCI6152-xx33PC/G QFP 28X28 160L PCI6150-xx66PC/G QFP 28X28 208L Body BGA Base Device
Innovative MID Plating Solutions
Innovative MID Plating Solutions High Reliability Wire Bond Technique for MIDs Jordan Kologe MacDermid Electronics Solutions jkologe@macdermid.com 1 MacDermid: Specialty Chemical Solutions Over 2000 Worldwide
Process Change Notice #
User Registration Register today to create your account on Silabs.com. Your personalized profile allows you to receive technical document updates, new product announcements, how-to and design documents,
Mold Compound and Copper Wire Selection for Quad-Flat Packages with High Density Leadframe in Automotive Applications
Mold Compound and Copper Wire Selection for Quad-Flat Packages with High Density Leadframe in Automotive Applications Vanessa Wyn Jean Tan vanessa.wyn.jean.tan@nxp.com Poh Leng Eu poh-leng.eu@nxp.com Yin
PCN Title: Addition of New Fab/Assembly Site and Design Change
DATE: 6 December 2016 PCN #: 2254 PCN Title: Addition of New Fab/Assembly Site and Design Change Dear Customer: This is an announcement of change(s) to products that are currently being offered by Diodes
Materials Declaration Form
Materials Declaration Form IPC 1752 Form Type * Distribute Version Sectionals * Material Info Subsectionals * Manufacturing Info * : Required Field 2 A-D Supplier Information Company Name * STMicroelectronics
ENCAPSULANT MATERIAL CHANGE FOR BGA Pb-FREE PACKAGES
Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0708 UPDATE ENCAPSULANT MATERIAL CHANGE FOR BGA Pb-FREE PACKAGES Change Description This is an update to PCN0708, published July 2007. Altera is implementing
Reliability Qualification Report ACP R Package
Reliability Qualification Report ACP2-1230-4R Package January 31, 2013 ACP2-1230-4R Reliability Qualification Plan Table of Contents Purpose.3 Background Information..3 Qualification Tests 5 Explanation
Allegro MicroSystems, Inc.
Allegro MicroSystems, Inc. Materials Declaration Report 4/30/2008 11:08:31AM Report ID: MDR4118LW1672JFTR Allegro Part #: A6841SLWTR-T B.O.M. ID: 106 Package Code: LW / LW Lead Count: 18 Assy Location:
Copper Wire Packaging Reliability for Automotive and High Voltage
Copper Wire Packaging Reliability for Automotive and High Voltage Tu Anh Tran AMPG Package Technology Manager Aug.11.2015 TM External Use Agenda New Automotive Environments Wire Bond Interconnect Selection
PRODUCT CHANGE NOTIFICATION
Cypress Semiconductor Corporation, 198 Champion Court, San Jose, CA 95134. Tel: (408) 943-2600 PRODUCT CHANGE NOTIFICATION PCN: PCN162502 Date: June 24, 2016 Subject: Qualification of Cypress Bangkok as
Die Attach Materials. Die Attach G, TECH. 2U. TECHNICAL R&D DIV.
Die Attach Materials Die Attach G, TECH. 2U. TECHNICAL R&D DIV. 2 Topics 3 What it is X 5,000 X 10,000 X 50,000 Si Chip Au Plating Substrate Ag Resin 4 Current Products Characteristics H9890-6A H9890-6S
Qualification Report. June, 1994, QTP# Version 1.1 CY7C46X/47X, MINNESOTA FAB MARKETING PART NUMBER DEVICE DESCRIPTION. Cascadable 32K x 9 FIFO
Qualification Report June, 1994, QTP# 92361 Version 1.1 CY7C46X/47X, MINNESOTA FAB MARKETING PART NUMBER CY7C460 CY7C462 CY7C464 CY7C470 CY7C472 CY7C474 DEVICE DESCRIPTION Cascadable 8K x 9 FIFO Cascadable
Final Product/Process Change Notification Document # : FPCN22191XH Issue Date: 18 June 2018
Title of Change: SOIC-8 Insourcing to ON Semiconductor Philippines (OSPI) Factory from GEM (China) Proposed first ship date: 25 September 2018 Contact information: Samples: Additional Reliability Data:
Materials Declaration Form
Materials Declaration Form IPC 1752 Version 2 Form Type * Distribute Sectionals * Material Info Subsectionals * A-D Manufacturing Info * : Required Field Supplier Information Company Name * STMicroelectronics
Basic Project Information. Background. Version: 2.0 Date: June 29, Project Leader: Bart Vandevelde (imec) inemi Staff: Grace O Malley
inemi Statement of Work (SOW) Packaging TIG Impact of Low CTE Mold Compound on 2nd Level Solder Joint Reliability Project, Phase 2 (Experimental build and testing) Version: 2.0 Date: June 29, 2015 Project
Materials Declaration Form
Materials Declaration Form IPC 1752 Form Type * Distribute Version Sectionals * Material Info Subsectionals * Manufacturing Info * : Required Field 2 A-D Supplier Information Company Name * STMicroelectronics
PCN Title: Additional FAB Source (TPSCo), Additional Assembly/Test Site (SAT) and BOM (Bill of Materials) on select devices
DATE: 18 th July, 2016 PCN #: 2239 PCN Title: Additional FAB Source (TPSCo), Additional Assembly/Test Site (SAT) and BOM (Bill of Materials) on select devices Dear Customer: This is an announcement of
SE2618F with Cu wire at Carsem Package Qualification Plan
SE2618F with Cu wire at Carsem Package Qualification Plan Part Number: SE2618F with Cu wire Product Type: 2.4GHz 802.11b/g/n WLAN FEM Package Type: QFN 2.5 x 2.5 x 0.45mm 16L Report No: Qual-QP-12-01106
Product / Process Change Notification
Dear Customer, Please find attached our INFINEON Technologies PCN: Implementation of halogen-free mold compound and copper wire bonding for products assembled in lead-free package PG-SC59 Important information
Next Gen Packaging & Integration Panel
Next Gen Packaging & Integration Panel ECTC 2012 Daniel Tracy, Sr. Director Industry Research & Statistics SEMI May 29, 2012 Packaging Supply Chain Market Trends Material Needs and Opportunities Market
PRODUCT / PROCESS CHANGE NOTIFICATION. 1. PCN basic data
PRODUCT / PROCESS CHANGE NOTIFICATION 1. PCN basic data 1.1 Company STMicroelectronics International N.V 1.2 PCN No. AMG/17/10447 1.3 Title of PCN Material set change on TSSOP14 and TSSOP16 packages for
The Shift to Copper Wire Bonding
The Shift to Copper Wire Bonding E. Jan Vardaman President TechSearch International, Inc. www.techsearchinc.com 1/3/06 3/4/06 5/3/06 7/2/06 8/31/06 10/30/06 12/29/06 2/27/07 4/28/07 6/27/07 8/26/07 10/25/07
Trends and Developments
Trends and Developments Monique Mayr Monique.Mayr@eu.panasonic.com European R&M Group Panasonic Corporation Electronic Material Business Division Weitere Informationen finden Sie auch auf: http://www3.panasonic.biz/em/pcbm/en/index.html
VT-45PP VT-47PP VT-447PP
& Prepreg General Information Ventec provides a series of and Prepregs with different glass style and resin content. These products have good bonding and thermal performance in applications of heat sink
800 W. 6 th Street, Austin, TX 78701
800 W. 6 th Street, Austin, TX 78701 Assembly Site Transfer from StatsChipPac Kuala Lumpur, Malaysia (SCM) to ANST Wuxi CHINA for the CS8421-CNZ(R) component Process/Product Change Notification (Reference
Materials Declaration Form
Materials Declaration Form IPC 1752 Version 2 Form Type * Distribute Sectionals * Material Info Subsectionals * A-D Manufacturing Info * : Required Field Supplier Information Company Name * STMicroelectronics
Materials Declaration Form
Materials Declaration Form IPC 1752 Version 2 Form Type * Distribute Sectionals * Material Info Subsectionals * A-D Manufacturing Info * : Required Field Supplier Information Company Name * STMicroelectronics
Materials Declaration Form
Materials Declaration Form IPC 1752 Version 2 Form Type * Distribute Sectionals * Material Info Subsectionals * A-D Manufacturing Info * : Required Field Supplier Information Company Name * STMicroelectronics
Qualification Report CASCADEABLE FIFOS. November 1995, QTP# Version 1.2 DEVICE DESCRIPTION MARKETING PART NUMBER. 1K x 9 Cascadeable FIFO
Qualification Report November 1995, QTP# 94468 Version 1.2 CASCADEABLE FIFOS MARKETING PART NUMBER CY7C419 CY7C420/CY7C421 CY7C424/CY7C425 DEVICE DESCRIPTION 256 x 9 Cascadeable FIFO 512 x 9 Cascadeable
Cypress Semiconductor 2-Die Stacked & Molding Compound Package Qualification Report
Cypress Semiconductor 2-Die Stacked & Molding Compound ackage Qualification Report QT# 023607 VERSION 1.0 March, 2003 CYM52KQT36AV25 18Mb ipelined MCM with QDR Architecture in 165-ball FBGA package (2-die)
23 rd ASEMEP National Technical Symposium
THE EFFECT OF GLUE BOND LINE THICKNESS (BLT) AND FILLET HEIGHT ON INTERFACE DELAMINATION Raymund Y. Agustin Janet M. Jucar Jefferson S. Talledo Corporate Packaging & Automation/ Q&R STMicroelectronics,
Low Dielectric Constant 3.9. RoHS/WEEE compliant. SMT Board Designs using LCCC s or other low expansion chip carriers (See Figure 1)
WOVEN KEVLAR REINFORCED LAMINATE AND PREPREG is a woven Kevlar aramid fiber reinforced multifunctional epoxy laminate and prepreg system engineered to provide in-plane CTE values as low as 6 ppm/ C for
Materials Declaration Form
Materials Declaration Form IPC 1752 Version 2 Form Type * Distribute Sectionals * Material Info Subsectionals * A-D Manufacturing Info * : Required Field Supplier Information Company Name * STMicroelectronics
Cu Wire Bonding Survey Results. inemi Cu Wire Bonding Reliability Project Team Jan 30, 2011
Cu Wire Bonding Survey Results inemi Cu Wire Bonding Reliability Project Team Jan 30, 2011 Outline About inemi Project Overview Survey Mechanism Survey Respondents Survey Results Technology Adoption Status
Power Electronics Packaging Solutions for Device Junction Temperature over 220 o C
EPRC 12 Project Proposal Power Electronics Packaging Solutions for Device Junction Temperature over 220 o C 15 th August 2012 Page 1 Motivation Increased requirements of high power semiconductor device
HOW THE MOLD COMPOUND THERMAL EXPANSION OVERRULES THE SOLDER COMPOSITION CHOICE IN BOARD LEVEL RELIABILITY PERFORMANCE
HOW THE MOLD COMPOUND THERMAL EXPANSION OVERRULES THE SOLDER COMPOSITION CHOICE IN BOARD LEVEL RELIABILITY PERFORMANCE AUTHORS: B. VANDEVELDE, L. DEGRENDELE, M. CAUWE, B. ALLAERT, R. LAUWAERT, G. WILLEMS
Package Qualification Report Reliability By Design
Package Qualification Report Reliability By Design Qualification Description: The information contained herein represents proof of Reliability and Performance of the Package Series listed below in accordance
Maximum MAX662 12V DC-DC Converter
Construction Analysis Maximum MAX662 12V DC-DC Converter Report Number: SCA 9512-445 Global Semiconductor Industry the Serving Since 1964 17350 N. Hartford Drive Scottsdale, AZ 85255 Phone: 602-515-9780
MATERIAL NEEDS AND RELIABILITY CHALLENGES IN AUTOMOTIVE PACKAGING UNDER HARSH CONDITIONS
MATERIAL NEEDS AND RELIABILITY CHALLENGES IN AUTOMOTIVE PACKAGING UNDER HARSH CONDITIONS Varughese Mathew NXP Semiconductors 6501 William Cannon Drive, Austin TX, USA Automotive Innovation Driven by Electronics
800 W. 6 th Street, Austin, TX 78701
800 W. 6 th Street, Austin, TX 78701 Assembly Site Transfer from StatsChipPac Kuala Lumpur, Malaysia (SCM) to ANST Wuxi CHINA for the CS8422-CNZ(R) component Process/Product Change Notification (Reference
Product Change Notification - JAON-07LFEV539 (Printer Friendly)
Product Change Notification - JAON-07LFEV539-28 Nov 2016 - CCB 2695 and 2695.0... http://www.microchip.com/mymicrochip/notificationdetails.aspx?pcn=jaon-07lfev539 Page 1 of 3 11/29/2016 English Search...
inemi Statement of Work (SOW) inemi Packaging TIG Impact of Low CTE Mold Compound on 2nd Level Solder Joint Reliability Phase 1 & Phase 2
inemi Statement of Work (SOW) inemi Packaging TIG Impact of Low CTE Mold Compound on 2nd Level Solder Joint Reliability Phase 1 & Phase 2 Version: 4.1 Date: March 26, 2014 Project Leader: Bart Vandevelde
Guideline Regarding Non-Containment Management on Fujitsu Group Specified Chemical Substances
Guideline Regarding Non-Containment Management on Fujitsu Group Specified Chemical Substances June 20, 2009 (Edition 3.0) Fujitsu Limited 1. Objectives of This Guideline It is expected that regulations
12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 PCN# 20140505002 Qualify New Assembly Material set for Selected Device(s) Change Notification / Sample Request Date: 5/7/2014 To: Newark/Farnell PCN Dear
TRANSFER MOULDING & EPOXY MOULD COMPOUND TECHNOLOGY WORKSHOP
TRANSFER MOULDING & EPOXY MOULD COMPOUND TECHNOLOGY WORKSHOP TRANSFER MOULDING & EPOXY MOULD COMPOUND TECHNOLOGY WORKSHOP INTRODUCTION This workshop will provide participants with knowledge and understanding
Chips Face-up Panelization Approach For Fan-out Packaging
Chips Face-up Panelization Approach For Fan-out Packaging Oct. 15, 2015 B. Rogers, D. Sanchez, C. Bishop, C. Sandstrom, C. Scanlan, TOlson T. REV A Background on FOWLP Fan-Out Wafer Level Packaging o Chips
Cypress Semiconductor Qualification Report QTP# 97092VERSION 1.0 June, 1997
Cypress Semiconductor Qualification Report QTP# 97092VERSION 1.0 June, 1997 SST SONET/SDH Serial Transceiver CY7B952 SST is a trademark of Cypress Semiconductor Corporation SST SONET/SDH Serial Transceiver
Assembly Site: JCET, China Package Types: SOT-23 3L, SOD-323, SC-79 Report No: QUAL08-WB
e Package / Assembly Site Qualification Interim Report 9/25/08 Assembly Site: JCET, China Package Types: SOT-23 3L, SOD-323, SC-79 Report No: 302747-QUAL08-WB Qualification Team Package Engineer: Mike
Cypress Semiconductor Package Qualification Report
Cypress Semiconductor ackage Qualification Report QT# 034003 VERSION 2.0 January 2006 52-lead Thin Quad Flat ack 10 x 10 x 1.0mm, MSL1, 235C Reflow Amkor Bupyeong Korea Assembly CYRESS TECHNICAL CONTACT
PARALOID EXL-2655 Impact Modifier For Thermoset Applications
Technical Data Sheet PARALOID EXL-2655 Impact Modifier For Thermoset Applications Regional Product Availability Description Benefits Typical Properties Packaging Asia-Pacific PARALOID EXL-2655 Impact Modifier
800 W. 6 th Street, Austin, TX 78701
800 W. 6 th Street, Austin, TX 78701 Assembly and Test Site Transfer from StatsChipPac Kuala Lumpur, Malaysia (SCM) to ANST Wuxi CHINA for the CS42L52-CNZ(R) and CS43L22-CNZ(R) components Process/Product
Microelectronic Materials CATALOG
Microelectronic Materials CATALOG LORD partners with customers to leverage expertise in multiple chemistries and diverse applications to develop customized solutions. Design Without Compromise At LORD,
EMI Shielding Thermal Management
www.emi-tec.de EMI Shielding Thermal Management The EMI-tec The owner-run, traditional company was founded in 1969 as the Engineering Office Helmut Kahl. In 1986 the EMI-tec Elektronische Materialien GmbH
Motorola MC68360EM25VC Communication Controller
Construction Analysis EM25VC Communication Controller Report Number: SCA 9711-562 Global Semiconductor Industry the Serving Since 1964 17350 N. Hartford Drive Scottsdale, AZ 85255 Phone: 602-515-9780 Fax:
MATERIAL DECLARATION SHEET
MATERIAL DECLARATION SHEET Product Part Number Product Line 1530-1X-W PoE Ethernet Surge Protector MSL 1 RoHS Compliant No Compliance Date N/A No. 1 Construction Element (subpart) Acrylic Conformal Coating
800 W. 6 th Street, Austin, TX 78701
800 W. 6 th Street, Austin, TX 78701 Assembly and Test Site Transfer from StatsChipPac Kuala Lumpur, Malaysia (SCM) to ANST Wuxi CHINA for the CS42L52-CNZ(R) and CS43L22-CNZ(R) components Process/Product
Advanced Materials. Raising performance with benzoxazine resins
Raising performance with benzoxazine resins Quarter 1, 2015 Table of contents Features and benefits Features and benefits Reaction mechanism Product selection Araldite benzoxazine resins structure Product
Analog & MEMS Group (AMS)
16-March-2017 Report ID 2018-W11 SO16-SHZ PRODUCT/PROCESS CHANGE NOTIFICATION PCN AMS/18/10777 Analog & MEMS Group (AMS) Qualification of ST Shenzhen as Assembly and Test & Finishing site for selected
12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Additional Pb Free Lead Finish and expansion of capacity (ASE-Shanghai) for Selected SOIC (D) products. Change Notification / Sample Request Date: 3/28/2013
POTENTIAL FAILURE MODE AND EFFECT ANALYSIS (PROCESS FMEA) Process : MOLD Process Responsibility : Product : Key Date : Core Team :
SEC. # 4..1-1-DCS FORM # DC -0 3 A 10 OF 26 A rocess : MOLD rocess Responsibility : roduct : Key Date : Core Team : rocess otential otential S C otential Cause(s O Current Current D R Recommended Responsibility
The 3D Silicon Leader. Company Presentation. SMTA Houston, 14th March 2013
The 3D Silicon Leader Company Presentation SMTA Houston, 14th March 2013 Who are we? Independent Company located in Caen, Normandy, France Dedicated to manufacturing of leading edge Integrated Passive
Cree EZ-p LED Chips Handling and Packaging Recommendations
Cree EZ-p LED Chips Handling and Packaging Recommendations INTRODUCTION This application note provides the user with an understanding of Cree s EZ-p p-pad up (anode up) LED devices, as well as recommendations
PRODUCT / PROCESS CHANGE NOTIFICATION. 1. PCN basic data
PRODUCT / PROCESS CHANGE NOTIFICATION 1. PCN basic data 1.1 Company STMicroelectronics International N.V 1.2 PCN No. MDG/18/10548 1.3 Title of PCN ASE Kaohsiung (Taiwan) additional source for LQFP 7x7
12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 PCN# 20100929002 Additional Pb Free Lead Finish and expansion of capacity (ASE-Shanghai) for Selected SOIC (D) products. Final Change Notification / Sample
Freescale Semiconductor Inc
Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MPC8270CZUUPEA FTBGA 480 37*37*1.7P1.27 SUPPLIER Company Name Freescale Semiconductor Inc Company Unique ID 14-141-7928 Response
Quality Starts With Me
1 DAEWON COMPANY INTRODUCE DAEWON COMPANY INTRODUCE 2 Quality Starts With Me ABOUT DAEWON Daewon has founded in 1975 and has grown into a leading supplier of plastic Extrusion and injection molded products
Materials Declaration Form
Materials Declaration Form IPC 1752 Form Type * Distribute Version Sectionals * Material Info Subsectionals * Manufacturing Info * : Required Field 2 A-D Supplier Information Company Name * STMicroelectronics
Microelectronic Materials. Catalog
Microelectronic Materials Catalog LORD partners with customers to leverage expertise in multiple chemistries and diverse applications to develop customized solutions. Design Without Compromise At LORD,
Technical Note. Micron Wire-Bonding Techniques. Overview. Wire Bonding Basics. TN-29-24: Micron Wire-Bonding Techniques Overview
Overview Technical Note Micron Wire-Bonding Techniques Overview For more than 30 years, the semiconductor industry has used aluminum (Al) bond pads with gold (Au) wire to connect internal die to external
Package Qualification Report
Package Qualification Report Reliability By Design Qualification Description: The information contained herein represents proof of Reliability and Performance of the Package Series listed below in accordance
Freescale Semiconductor Inc
Freescale Semiconductor Inc PART INFORMATION Mfg Item Number PCIMX6L8DVN10AA Mfg Item Name MAPBGA 432 13*13 P0.5 SUPPLIER Company Name Freescale Semiconductor Inc Company Unique ID 14-141-7928 Response
12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Qualification of TIPI as Additional Assembly and Test Site for Select SOT-23 Package Devices Change Notification / Sample Request Date: 8/25/2016 To: PREMIER
12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Qualification of AMKOR P1 as Additional Assembly and Test Site for Select SOIC Package Devices Change Notification / Sample Request Date: 8/2/2016 To: Newark/Farnell
Material based challenge and study of 2.1, 2.5 and 3D integration
1 Material based challenge and study of 2.1, 2.5 and 3D integration Toshihisa Nonaka Packaging Solution Center R&D Headquarters Hitachi Chemical Co., Ltd., Sep. 8, 2016 Hitachi Chemical Co., Ltd. 2010.
Novel Materials and Activities for Next Generation Package. Hitachi Chemical., Co.Ltd. Packaging Solution Center Hiroaki Miyajima
Novel Materials and Activities for Next Generation Package Hitachi Chemical., Co.Ltd. Packaging Solution Center Hiroaki Miyajima 1. Activities of Packaging Solution Center 2. Novel Materials for Next Gen.
REDUCTION OF WARPAGE OCCURRENCE STACK-DIE QFN THROUGH FEA AND STATISTICAL METHOD
REDUCTION OF WARPAGE OCCURRENCE STACK-DIE QFN THROUGH FEA AND STATISTICAL METHOD I. Abdullah, M. Z. M. Talib, I. Ahmad, M. N. B. C. Kamarudin and N. N. Bachok Faculty of Engineering,Universiti Kebangsaan