Wafer/Panel Level Package Flowability and Warpage Project. Call for Sign-up Webinar

Transcription

1 Wafer/Panel Level Package Flowability and Warpage Project Call for Sign-up Webinar Project Chair: Renn Chan Ooi, Intel Corporation Tanja Braun, Fraunhofer IZM inemi Staff: Haley Fu Session 2: Thursday, March 15, 2018 China Time: 9:00-10:00 pm US EDT: 9:00-10:00 pm Recording (available for up to 6 months after webinar):

2 Agenda Introduction of Project Chairs inemi Project Development Process Project Briefing Companies Involved in Planning Background & Objectives Project Scope Project IS/IS Not Work Plan Schedule How to Join Q&A Note: All phones will be on mute until the end of the presentation

3 Introduction of Project Chairs Renn Chan Ooi, Intel Corporation Renn Chan joined Intel Corp since 2005 and is Senior Assembly & Packaging Analyst focusing on encapsulation and assembly technology challenges. Received doctorate degree in Mechanical Engineering from University of Sheffield, UK in Field of interest includes thermo-fluids analysis for assembly processes, imaging processing and assembly flow visualization. Tanja Braun, Fraunhofer IZM Tanja joined Fraunhofer IZM in Recent research is focused on wafer and panel level packaging technologies. She is head of the group Assembly & Encapsulation Technologies since Lead the Fan-out Panel Level Packaging Consortium at Fraunhofer IZM Berlin. Received Dr. degree from Technical University of Berlin in Holds several patents in the field of advanced packaging. 3

4 Successful inemi Projects Address knowledge gap(s) of industry: Common problem Best solved by working together Timed success that aligns to business needs Best manifested on complex far reaching issues Often includes reliability testing & verification Requires teamwork across multiple levels of the supply chain: Ensures efficient alignment of goals and investments of the varied team players; Supports the company s commercial interests. Delivers a coordinated industry wide response and capability set. OEM/ODM/EMS/OSATs/Suppliers at multiple levels.

5 inemi Project Development Process - 5 Steps 0 1 INPUT SELECTION We are here DEFINITION PLANNING EXECUTION / REVIEW CLOSURE Initiative Open for Industry input inemi Technical Committee (TC) Approval Required for Execution Project Limited to committed Members

6 inemi Project Management Policy Two governing documents for projects Statement of work (SOW): sets out project scope, background, purpose, benefits, and outlines required resources, materials, processes, project schedule, etc. Project Statement (PS): signed by participating companies to secure commitment on resource and time contributions. inemi Project requires inemi membership Signed membership agreement Commitment to follow inemi By-laws and IP policy 6

7 Project Briefing

8 Companies Contributed to Project Formation

9 Background & Objectives Industry adaptation of wafer size > Φ300mm or panel > 300x300mm 2. Flowability of mold impacts the quality and potentially warpage of the wafer/panel for subsequent processes: Need to identify key processing factors that impacts followability. Establish factors from flowability that impacts warpage. Establish other material factors that impact post mold warpage.

10 Scope 1 - Flowability: Focus and Strategy Granular powder: Low flowability risk from initial members discussion, considered for warpage study. Challenges of the keep out zone (KOZ) at wafer/panel peripherals and the impact to flow and warpage. Liquid dispense: Dispense pattern dictates knit lines/weld lines. Identify risk of flying dies from molding pressure. Understand material behavior of selected candidates. Identify working window and the cliff of failure. Explore opportunities from process parameters to mitigate flow issues. Challenges of the KOZ at wafer/panel peripherals and the impact to flow and warpage. Sheet lamination: Challenges of the KOZ at wafer/panel peripherals and the impact to flow and warpage. Issue of die displacement. Understand material behavior of selected candidates, identify working window and the cliff of failure. Explore opportunities from process parameters to mitigate flow issues. KOZ

11 Scope 2 - Warpage: Focus and Strategy Simulation & Experimental Approach: Understand warpage related material property from material candidates. Prelim warpage simulation to identify feasible range of sample dimensions. Conduct actual molding for model validation and process understanding. Failure analysis (cross section) of mold material behavior. Final simulation DOEs for warpage optimization from process and material aspect. Chemical Shrinkage: Methodology in measuring mold material chemical shrinkage. Capability of incorporating it in warpage modeling explore readiness of simulation software. The need for benchmark material with minimum or almost zero chemical shrinkage.

12 Project Scope: Is/Is Not Analysis This Project IS: This Project IS NOT: To conduct mold material property measurements. To conduct solder joint reliability. To conduct mold flow and warpage simulation to understand key modulating factors. To evaluate RDL processes before/after mold. To conduct molding experiments on test vehicles based on simulation results. To develop specific standard(s). To evaluate flowability of mold process through inspection of void, flow marks, etc. Biased towards specific suppliers, geographies or market segment. To evaluate warpage of mold process through measurement tools.

13 Work Plan Step 1 Step 1 Material characterization and preliminary simulation Task 1: Process & TV finalize and source dummy die, panel, and other collaterals for project Mold first up until de-bonding on metal carrier. Wafer size >300mm and panel size of 400x400~600x600mm2. Dummy die size of 10x10mm with um silicon thickness. Mold thickness range from 00 to 500um. Die to die spacing 1/4 ~1x die size. Silicon die selection: pure silicon, dummy die with bump, etc. Task 2: Mold compound selection Up to 3 or more mold materials to be studied. Task 3: Molding material characterization for flowability and warpage simulation Curing kinetics (Kamal s model). Rheokinetics (Macosko model). TMA, DMA, modulus, Poisson s ratio measurements, etc., for warpage. Task 4: Chemical shrinkage measurement Comparison of chemical shrinkage measurements methodology. Application into curing and warpage simulation (e.g., PVTc models, etc.). Task 5: Conduct preliminary flow simulation to gain further insight Preliminary flow simulation to call out potential flow related risks and aide decision in finalizing/update test vehicle attributes. Task 6: Conduct preliminary warpage simulation with additional focus on chemical shrinkage Preliminary warpage simulation to call out potential CTE mismatch and chemical shrinkage related risks and aide decision in finalizing/update test vehicle attributes. Ack: Moldex3D

14 Work Plan Step 2 Step 2 Molding experiments Task 7: Conduct molding of selected test vehicles Assemble finalized test vehicle and conduct selected molding process. Task 8: Conduct flowability inspection of test vehicles Potential short-shot, visual inspections, post assembly failure analyses, silica particle distributions, etc., for flowability assessment. Flow simulation model fine tuning for flowability prediction. Task 9: Conduct warpage measurements of test vehicles Conduct warpage measurement and post assembly failure analyses. Thermo-mechanical simulation model fine tuning for warpage prediction.

15 Work Plan Step 3 Step 3 Final simulation DOEs Task 10: Finalize flow and warpage simulation DOEs to identify key modulating factors and process optimizations Finalize second round of simulation DOEs based on preliminary simulation and actual unit assembly learnings. Task 11: Conduct final simulation DOEs Conduct second round of simulation DOEs to cover working range and limits of flowability and warpage behavior of test vehicle and technology. Task 12: Data analysis and review for final reporting

16 Schedule Q1 Q2 Q3 Q4 Q5 Task 0: Literature research X X X X X X X X X X X X X Step 1: Material characterization and preliminary simulation Checkpoint 1 Task 1: Finalize process and TV, and source X X dummy die, panel, and other collaterals Task 2: Mold compound selection X Task 3: Mold characterization X X X Task 4: Chemical shrinkage measurement X X X Task 5: Preliminary flow simulation X X Task 6: Preliminary warpage simulation X X Step 2: Molding experiment Checkpoint 2 Task 7: Molding of test vehicles X X Task 8: Flowability inspection of test vehicles X Task 9: Warpage measurements of test vehicles X Step 3: Final simulation Task 10: Finalize the 2nd round simulation DOE X Task 11: Conduct simulation X X Task 12: Data analysis and final reporting X X

17 Expected Project Participants This project looks forward to the participation of epoxy mold compound manufacturers, component suppliers, molding tool manufacturers, mold flow simulation software companies, thermos-mechanical warpage simulation software companies, PCB fabricators, OSATS, foundries, and manufacturing research institutes. 17

18 How to Join

19 Sign-Up Due on April 14, 2018 inemi membership is required to join the project Download SOW and PS from inemi web: Sign the PS Signature of representative of participants Signature of manager approval Send scanned PS to inemi VP of Operations will sign and approve your participation and send you back the completed PS with acceptance Join inemi membership, or questions, contact Haley Fu 19

20 Resource In-kind Contribution Please input "Yes" for those items that your firm plans to provide in-kind support to this project. Specify in detail if need in the bottom cell. The final experimental design and test vehicle design will be decided and agreed by the project team. Area Resource Needed In-kind Contribution Mold compound Dummy silicon die Materials Carrier Substrates Shield fence area and components for assembly Other area of interest/components to be included in the study Simulation Test vehicle assembly Measurement/Test Failure analysis Others Detail description of your in-kind contribution Flow and warpage simulation Assembly facilities or services to build test vehicles Mold material properties Curing kinetics (Kamal s model) Rheokinetics (Macosko model) TMA DMA Modulus Poisson s ratio measurements Chemical shrinkage measurements Flowability inspection Warpage measurement Failure analysis of final assembled test vehicles Other suggested task with associated resource contribution 20

21 Questions?

22 Haley Fu