COPPER CLAD LAMINATES HITACHI COPPER CLAD LAMINATES

Transcription

1 217 COPPER CLD LMINTES HITCHI COPPER CLD LMINTES

2 In the world of electronics, especially information systems and equipment, advancements are occurring on a daily basis and many new technologies are rebuting one after the other. The solution you need is here Hitachi Chemical Co., Ltd. is engaged in producing materials from printed wiring boards to substrates and in processing materials using "combined technology," a combination of our existing reliable technologies developed over years and of leadingedge technologies. The balanced, reliable, advanced solutions of Hitachi Chemical and related peripheral technologies are designed to support the electronics of the future.

3 CONTENTS Recommended Base Materials by pplication Characteristics P4 P6 Glass Epoxy Multilayer Materials P 9 MCLHS1 MCLE77G MCLE75G MCLE7G MCLE679FG MCLE679F Type(R) MCLE78G TD2 MCLE75G MCLE67 P1 P12 P14 P16 P18 P2 P22 P24 P26 P28 Materials for ICT Infrastructure P31 MCLE679 Type(W) MCLLW9G/91G MCLHE679G Type(S) Polyimide Multilayer Material MCLI671 P32 P34 P36 P39 P4 Glass Epoxy Double Sided Materials P43 MCLE67 CEM3 E668T Type(K)(Tracking resistance) Materials for Fine Patterning P44 P47 P48 P51 PFEL P52 Epoxy dhesive Film S26 P55 P56 KOBELITE LMINTE P57 KELGEF Type(R) KEL571(Only nonwoven aramid structure) P6 P62 KEL973(Composite structure of nonwoven aramid and polyester) P62 Precautionary Statement Precautions for Use Precautions in Process Precautions in Designing Precautions for Use of Completed PWB P65 P66 P67 P68 P69 Recommendation Press Condition for Multilayer Board Lamination Standards P7 P83 UL Standard P84 BS Standard CS Standard P85

4 Recommended Base Materials by pplication Product MultiLayer Materials MCL HS1 MCL E77G MCL E75G MCL E7G MCL E679FG MCL E679F Type(R) MCL E78G TD2 MCL E75G MCL E67 Feature High Tg, Low Dielectric Constant, Low Dissipation Factor, Low Thermal Expansion High Tg, High Elasticity, Low Thermal Expansion High Tg, High Elasticity, Low Thermal Expansion High Tg, High Elasticity, Low Thermal Expansion High Tg, High Elasticity, Low Thermal Expansion High Tg, High Elasticity, Low Thermal Expansion Low Dielectric Constant, High Elasticity Low Elastic Modulus High Tg, High Heat Resistance Good Dimensional Reliability, and Dielectric Property Environmentally Friendly Halogen Free Lead Free pplication (288 ) Digital Consumer Products Consumer products Game Instrument Personal Computer Mobile Phone Router Server Infrastructure Products Base Station ntenna Electronics Devices Products Package For Semiconductor (BG CSP MCM) Memory Modules Semiconductor Testing Devices Highfrequency Parts utomotive Products Electronic Control Unit utomotive Electronics ITS UL NSI ー ー ー ー FR4.1 FR4. FR4.1 ー FR4.1 FR4. Page

5 Product MCL E679 Type(W) Materials For ICT Infrastructure MCL MCLLW9G HE679G MCLLW91G Type (S) Polyimide Multilayer Materials MCL I671 Glass Epoxy Double Side Materials MCL E67 CEM3 E668T Type(K) Materials for Fine Patterning PFEL Feature High Tg, High insulating Reliability High Tg High Heat Resistance, Low Dielectric Constant, Low Dissipation Factor High Heat Resistance, Low Dielectric Constant High Tg, High Heat Resistance Dimensional Stability, Low Warpage High CTI CEM3 Semiadditive Process Compatible Environmentally Friendly Halogen Free Lead Free pplication (288 ) Digital Consumer Products Consumer products Game Instrument Personal Computer Mobile Phone Router Server Infrastructure Products Base Station ntenna Electronics Devices Products Package For Semiconductor (BG CSP MCM) Memory Modules Semiconductor Testing Devices Highfrequency Parts utomotive Products Electronic Control Unit utomotive Electronics ITS UL NSI FR4. ー FR4.1 GPY FR4. CEM3 ー Page

6 General Characteristics Multilayer Materials Item Condition Unit MCLHS1 Halogen Free MCLE77G Halogen Free MCLE75G Halogen Free MCLE7G Halogen Free MCLE679FG Halogen Free MCLE679F Type(R) MCLE78G Halogen Free TD2 MCLE75G Halogen Free MCLE67 UL NSI FR4.1 FR4. FR4.1 FR4.1 FR4. Tg TM DM 21~23 24~26 26~28 32~34 25~27 295~35 25~27 295~35 165~175 2~22 16~17 19~2 16~17 2~22 155~17 155~17 195~215 12~13 15~16 X Y (3~12 ) 6~8 6~8 4~6 4~6 5~7 5~7 7~9 7~9 13~15 13~15 12~14 12~14 13~15 15~17 6~9 6~9 12~15 14~17 13~16 14~17 CTE *1 (<Tg) ppm/ 2~3 8~13 1~15 15~25 23~33 2~3 35~45 8~13 3~4 5~7 Z (>Tg) 13~18 7~9 7~9 9~12 14~17 13~16 18~23 2~3 18~24 2~3 Solder Heat Resistance(26 ) sec. >3 >3 >3 >3 >3 >3 >3 >3 >3 >12 Copper Peel Strength 18μm 35μm kn/m.8~1..6~.8.8~1..9~1.1 1.~1.2.9~ ~ ~ ~1.3 1.~ ~1.3.8~.9.9~ ~ ~ ~ ~2.1 Surface Roughness μm 2~3 2~3 2~3 2~3 2~3 2~3 5~13 5~13 Flexural Modulus (Lengthwise) GPa 23~28 3~32 32~34 32~34 23~28 27~33 25~29 5~8 25~29 23~25 Dielectric Constant 1MHz 1GHz *2 C96/2/65 3.9~ ~ ~ ~ ~ ~5. 4.6~ ~ ~ ~5. 4.5~ ~ ~ ~3.8 5.~ ~ ~ ~4.2 Dissipation Factor 1MHz 1GHz *2 C96/2/65.3~.4.3~.5.4~.6.6~.8.7~.9.8~.1.9~.11.8~.1.16~.18.8~.1.13~.15.7~.9.9~.11.11~.13.9~.11.14~.16.13~.17.18~.2 Volume Resistivity Ω c m ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ Surface Resistance C96/2/65 Ω ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ Insulation Resistance C96/2/65 C96/2/65 +D2/1 Ω ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ Water bsorption E24/5 +D24/23 %.2~.4 *4.2~.4 *4.4~.6 *3.4~.6 *3.4~.6 *3.3~.5 *3.1~.3.1~.3.8~.12.12~.14 Flammability (UL94) V V V V V V V V Thermal Conductivity Xeflash W / m K.4~.5.6~.7.6~.7.75~.85.75~.85.4~.5.4~.5.3~.4.6~.7.3~.4 *1) Heating Rate: 1 /min. *2) Measured by Triplateline Resonator *3).1mm *4).2mm 6

7 Materials For ICT Infrastructure Polyimide Multilayer Materials Glass Epoxy Double Sided Materials Item Condition Unit MCLE679 Type(W) MCLLW 9G/91G Halogen Free MCLHE679G Type(S) Halogen Free MCLI671 MCLE67 UL NSI FR4. FR4.1 GPY FR4. Tg TM DM 173~183 25~215 19~21 24~28 18~19 26~28 2~213 23~245 12~13 X Y (3~12 ) 12~15 14~17 12~15 12~15 12~15 14~17 12~15 12~16 13~16 14~17 CTE *1 (<Tg) ppm/ 5~6 35~45 3~4 5~8 5~7 Z (>Tg) 2~3 24~29 19~23 2~3 2~3 Solder Heat sec. >3 >3 >3 >3 >12 Copper Peel Strength 18μm 35μm kn/m 1.2~ ~1.7.5~.7 (HVLP).5~.8.5~.7 (RT).6~.8 1.3~ ~ ~ ~2.1 (HVLP) (RT) Surface Roughness μm 5~13 5~13 5~13 Flexural Modulus (Lengthwise) GPa 24~26 16~21 23~26 24~26 Dielectric Constant 1MHz 1GHz *2 C96/2/65 4.7~ ~ ~ ~ ~ ~ ~ ~ ~4.8 1MHz.13~.15.5~.1.4~.6.11~.13.13~.17 Dissipation Factor C96/2/65 1GHz *2.21~.22.2~.35.6~.8.13~.15 Volume Resistivity Ω c m ~ ~ ~ ~ ~ C96/2/65 Surface Resistance Ω ~ ~ ~ ~ ~ Insulation Resistance C96/2/65 C96/2/65 +D2/1 Ω ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ Water bsorption E24/5 +D24/23 %.15~.2.2~.4.1~.3.1~.2.6~.8 Flammability (UL94) V V V V V Thermal Conductivity Xeflash W / m K.3~.4.4~.5.4~.5.25~.35.3~.4 bove properties are typical figures as a laminate. The figures as PCB may change depending on its material construction. bove values are Hitachi experimental data and not guaranteed. 7

8 General Characteristics CEM3 Tg Item Condition Unit TM DM JIS UL NSI E668T Type(K) CGE3F CEM3 13~14 X Y (3~8 ) 18~22 19~23 CTE (<Tg) ppm/ *1 4~5 Z (>Tg) 28~3 Solder Heat Resistance(26 ) sec. >12 Copper Peel Strength 18μm 35μm kn/m 1.2~ ~2.2 Surface Roughness μm Flexural Modulus (Lengthwise) GPa Dielectric Constant 1MHz 1GHz C96/2/65 4.4~4.8 *4 Dissipation Factor 1MHz 1GHz C96/2/65.24~.3 *4 Volume Resistivity C96/2/65 Ω c m ~ Surface Resistance C96/2/65 Ω ~ Insulation Resistance C96/2/65 C96/2/65 +D2/1 Ω ~ ~ Water bsorption E24/5 +D24/23 %.4~.8 (1.6mm) Thermal Conductivity Xeflash W / m K.6~.8 Flammability (UL94) V *1)3~8. *2)2~25. 8

9 Glass Epoxy Multilayer Materials Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material MCLHS1 P1 Halogen Free, High Tg, High Elastic Modulus, Ultra Low CTE Multilayer Material MCLE77G P12 Halogen Free, High Tg, High Elastic Modulus and Low CTE Multilayer Material MCLE75G P14 Halogen Free, High Tg, High Elastic Modulus and Low CTE Multilayer Material MCLE7G P16 Halogen Free, High Elastic Modulus and Low CTE Multilayer Material MCLE679FG P18 High Elastic Modulus and Low CTE Multilayer Material MCLE679F Type(R) P2 Halogen Free, Low Dielectric Constant, High Tg and High Heat Resistance Multilayer Material MCLE78G P22 Reduction of Solder Crack/ Low Elastic Modulus Material TD2 P24 Halogen Free, High Tg and High Heat Resistance Multilayer Material MCLE75G P26 FR4 Multilayer Material MCLE67 P28 9

10 Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material MCLHS1 GH1 Prepreg Low Dielectric Constant Glass Thermosetting Resin Multilayer Material Features MCLHS1(E) with Low Dk glass has low Dk/Df values. Suitable for package and high frequency application. MCLHS1 has low CTE values and reduces warpage. Wellsuited for buildup construction. pplications Semiconductor packages. (FCCSP,PoP,SiP) Core material for HDI. Core material for Thinner Module. Standard Specifications Part Number Type Copper Foil Thickness Code Name M.6 ctual Thickness and Tolerance.6±.2mm ー 3μm 5μm 12μm 18μm 35μm (STD,LP,RT,HVLP).1 M.11 M.15 M ±.2mm.1±.2mm.15±.2mm.21±.3mm.2±.2mm.4±.4mm MCLHS1.81 M.6.8±.8mm.6±.2mm (E) 3μm 5μm 12μm 18μm 35μm (LP,RT,HVLP).1 M.11 M.15 M ±.2mm.1±.2mm.15±.2mm.21±.3mm.2±.2mm.4±.4mm.81.8±.8mm Note1) STD:12μm, 18μm, 35μm; LP:3μm, 5μm, 12μm; RT:18μm, 35μm; HVLP:12μm, 18μm, 35μm. Please contact us for details. Note2) In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker one. Characteristics Thin Laminate Item Condition Unit (t.2mm) ctual Value Test Method MCLHS1 MCLHS1 Type(E) (IPCTM65) Tg TM DM 21~23 24~ CTE *1 X Y Z (3~12 ) (<Tg) (>Tg) ppm/ 6~8 6~8 2~3 13~ Solder Heat Resistance(26 ) sec. >3 T26(Without copper) T288(Without copper) TM min. >6 > Decomposition Temperature(5% weight loss) TG 43~ Copper Peel Strength 12μm 18μm kn/m.7~.9.8~ Surface Roughness(Ra) μm 2~ Flexural Modulus(Lengthwise) GPa 23~ Dielectric Constant Dissipation Factor 1GHz *2 1GHz *2 1GHz *2 1GHz *2 C96/2/65 C96/2/65 3.9~ ~4.1.3~.4.5~.6 3.4~ ~3.6.2~.3.3~ Volume Resistivity Surface Resistance C96/2/65+C96/4/9 C96/2/65+C96/4/9 Ω cm Ω 1 114~ ~ Insulation Resistance C96/2/65 C96/2/65+D2/1 Ω 1 114~ ~1 115 Water bsorption E24/5+D24/23 %.2~ *1)Heating Rate:1 /min. *2)Measured by TriplateLine Resonator..4mm thickness core is used depending on test item.

11 Prepreg Glass Cloth Properties Part Number Type Style Yarn Count (warp fill) Resin Content (%) Volatile Content (%) Dielectric Thickness after Lamination *1 (mm) GH1 ー (E) (117N75) (127N71) (137N71) (178N61) (2116N55) (E127N73) (E137N73) (E178N63) (E213N6) (E2116N57) ±2 71±2 71±2 61±2 46±2 73±2 73±2 63±2 6±2 57± Test Method(IPCTM65) )The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is %. This value changes depending on the press condition or inner layer pattern. Warpage of coreless5layer 2 15 Room Temp(Start) TEG Chip *Package size : 14mm 14mm *Chip size : 7.3mm 7.3mm *Chip thickness : 15μm *Underfill thickness : 6μm(CELC3734) <Sample> *L1,5:12μm Cu1%,L2,3,4:No copper,sr: *Prepreg construction GH1 Type(E):(178,R.C.:63%) 4ply GE7G Type(R):(178,R.C.:66%) 4ply GE75G:(178,R.C.:65%) 4ply Convex Room Temp (after reflow) Transmission Loss(dB/cm) Transmission Loss MCLLW91G.4 MCLHS1 Type(E) MCLLW9G MCLE77G Type(LH).9 MCLE7G Type(R) Frequency (GHz) 1 Warpage(μm) Reflow Temp <Measurement conditions> Evaluation PWB:Stripline Temperature & Humidity:25 /6%RH Characteristic impedance:pprox.5ω Proofreading method:trl(thrureflectline) P/P Core w t b Trace width(w):.12~.14mm Dielectric thickness(b):.25mm Trace thickness(t):18μm 2 GH1 Type(E) 5LPWB Concave GE7G Type(R) 5LPWB GE75G 5LPWB 11

12 Halogen Free, High Tg, High Elastic Modulus, Ultra Low CTE Multilayer Material MCLE77G GE77G Prepreg High Tg Glass Epoxy Multilayer Materials Features MCLE77G has ultra low CTE values in x,y directions and reduces warpage of package substrate significantly. MCLE77G Type(LH) has ultra low CTE value(less than 2.ppm/ ). GE77G is suited for EPS(Embedded Passive Substrate) construction package. pplications Semiconductor packages. (FCCSP,PoP,SiP) Core material for Thinner Module. Standard Specifications Part Number Type MCLE77G ー (LH) Copper Foil Thickness 2μm 3μm 5μm 12μm (STD,LP) 2μm 3μm 5μm 12μm 18μm (STD,LP) Code Name M.6.1 HD.15 M.22.2 LHM.6 LH.1 LHD.15 LH.2 LHY.25 ctual Thickness and Tolerance.6±.2mm.15±.2mm.155±.2mm.25±.3mm.21±.4mm.6±.2mm.15±.2mm.155±.2mm.21±.3mm.255±.3mm Note1)STD:Standard copper foil, LP:Low profile copper foil. Note2) STD:12μm,18μm; LP:2μm, 3μm, 5μm, 12μm, 18μm. Please contact us for details. Note3) In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker one. Characteristics Thin Laminate Item Condition TM Tg DM X (3~12 ) Y CTE *1 (<Tg) Z (>Tg) Solder Heat Resistance(26 ) T26(Without copper) TM T288(Without copper) Decomposition Temperature(5% Weight Loss) TG Heat Resistance for HDI Process(Semidditive) 26 Reflow 12μm Copper Peel Strength 18μm Surface Roughness(Ra) Flexural Modulus(Lengthwise) 1MHz Dielectric Constant C96/2/65 1GHz *2 1MHz Dissipation Factor C96/2/65 1GHz *2 Volume Resistivity C96/2/65+C96/4/9 Surface Resistance C96/2/65+C96/4/9 C96/2/65 Insulation Resistance C96/2/65+D2/1 Water bsorption E24/5+D24/23 *1)Heating Rate:1 /min. *2)Measured by TriplateLine Resonator. t.4mm thickness core is used depending on test item. Unit ppm/ sec. min. cycles kn/m μm GPa Ω cm Ω Ω % (t.2mm) ctual Value Test Method MCLE77G MCLE77G Type(LH) (IPCTM65) 26~28 3~ ~6. 4.~6. 1.5~2. 1.5~ ~13 7~9 >3 > >6 43~45 > ~ ~.8 2~ ~32 4.4~ ~4.3.3~.5.4~.6 34~36 4.2~ ~4.1.3~.5.4~ ~ ~ ~ ~ ~

13 Prepreg Glass Cloth Properties Part Number Type Style Yarn Count (warp fill) Resin Content (%) Volatile Content (%) Gelation Time (sec.) Dielectric Thickness after Lamination *1 (mm) GE77G ー (L).25 (117N72).25 (117N76).3 (127N72).3 (127N76).4 (137N72).25 (L117N72).25 (L117N76).3 (L127N72).3 (L127N76).35 (L124N68).35 (L124N73).4 (L137N72).45 (L13N71) ±2 76±2 72±2 76±2 72±2 72±2 76±2 72±2 76±2 68±2 73±2 72±2 71± ±3 27± Test Method(IPCTM65) )The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is %. This value changes depending on the press condition or inner layer pattern. Warpage of FCCSP Underfill Chip substrate TEG Chip *Package size : 14mm 14mm *Chip size : 7.3mm 7.3mm *Chip thickness : 15μm *Underfill thickness : 6μm(CELC3734) *Solder Resist : 2μm (FZ27G) <Sample> Core Thickness 2μm+124(SHD)PPG MCLE75G Type(LH)+GE75G Type(L) MCLE77G Type(LH)+GE75G Type(L) MCLE77G Type(LH)+GE77G Type(L) 15 1 Room Temp(Start) Convex RoomTemp (after reflow) Warpage(μm) Reflow Temp MCLE75G Type(LH) +GE75G Type(L) Concave MCLE77G Type(LH) +GE75G Type(L) MCLE77G Type(LH) +GE77G Type(L)

14 14 Halogen Free, High Tg, High Elastic Modulus and Low CTE Multilayer Material MCLE75G GE75G Prepreg High Tg Glass Epoxy Multilayer Materials Features MCLE75G has low CTE values in x,y directions and reduces warpage of package substrate significantly. MCLE75G Type(L) has ultra low CTE value( 5ppm/ ). MCLE75G Type(LH) has ultra low CTE value(3ppm/ ). Wellsuited for buildup construction. Standard Specifications Part Number Type Characteristics Thin Laminate Tg CTE *1 Item X Y Solder Heat Resistance(26 ) T26(Without copper) T288(Without copper) Decomposition Temperature(5% Weight Loss) Heat Resistance for HDI Process(Semidditive) 12μm Copper Peel Strength 18μm Surface Roughness(Ra) Flexural Modulus(Lengthwise) Dielectric Constant Dissipation Factor Z 1MHz 1GHz *2 1MHz 1GHz *2 TM DM Condition (3~12 ) (<Tg) (>Tg) TM TG 26 Reflow Volume Resistivity C96/2/65+C96/4/9 Surface Resistance C96/2/65+C96/4/9 C96/2/65 Insulation Resistance C96/2/65+D2/1 Water bsorption E24/5+D24/23 *1)Heating Rate:1 /min. *2)Measured by TriplateLine Resonator. Thickness core is used depending on test item. C96/2/65 C96/2/65 Unit ppm/ sec. min. cycles kn/m μm GPa Ω cm Ω Ω % pplications Semiconductor packages. (FCBG,FCCSP,PoP,SiP) Core material for HDI. Core material for Thinner Module. Copper Foil Thickness Code Name ctual Thickness and Tolerance 2μm U.3.3±.13mm 3μm 5μm U.4.4±.13mm 12μm (LP,PF) T.6.6±.13mm 2μm M.6.6±.2mm 3μm.1.11±.2mm 5μm 12μm M.11.1±.2mm 18μm M.15.15±.2mm () (STD,LP,PF) M.22.21±.3mm (L) 2μm.2.21±.3mm MCLE75G 3μm.31.31±.3mm 5μm.41.41±.4mm 12μm.51.52±.5mm 18μm 35μm.61.62±.6mm 7μm.71.72±.7mm (STD,LP,PF).81.82±.8mm 2μm M.6.6±.2mm (LH) 3μm.1.11±.2mm 5μm D.15.15±.2mm 12μm.2.21±.3mm (STD,LP,PF).26.26±.3mm Note1)STD:Standard copper foil, LP:Low profile copper foil, PF:Hitachi profilefree copper foil. Note2) STD:12μm,18μm, 35μm, 7μm; LP:2μm, 3μm, 5μm, 12μm, 18μm; PF:2μm, 3μm, 5μm, 12μm. Please contact us for details. Note3) U for 1ply; T for 2ply. Note4) In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker one. Note5) The thickness means that of dielectric layer. (t.1mm) ctual Value Test Method MCLE75G MCLE75G Type(L)MCLE75G Type(LH) (IPCTM65) 25~27 295~ ~7 5~7 3~4 3~4 1~15 7~9 >3 >6 2.5~ ~ >6 43~45 >2.8~ ~1.1 2~ ~34 4.5~ ~4.4.6~.8.7~.9 34~36 4.3~4.5 4.~4.2.6~.8.7~.9 37~39 4.3~4.5 4.~4.2.6~.8.7~ ~ ~ ~ ~ ~

15 Prepreg Glass Cloth Properties Part Number GE75G ー (L) Type (117N73) (127N73) (137N73) (178N65) (2116N58) (L117N73) (L127N73) (L124N7) (L124N75) (L137N73) (L13N69) (L13N73) (L178N65) (L2116N58) Style Yarn Count (warp fill) Resin Content (%) 73±2 73±2 73±2 65±2 58±2 73±2 73±2 7±2 75±2 73±2 69±2 73±2 65±2 58±2 Volatile Content (%) 2. Gelation Time (sec.) 16±3 18±3 2±3 16±3 18±3 2±3 Dielectric Thickness after Lamination *1 (mm) Test Method(IPCTM65) *1)The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is %. This value changes depending on the press condition or inner layer pattern. Warpage of FCBG 2 TEG Chip *Chip size:2mm 2mm *Chip thickness:.725mm *Bump diameter:8μm *Bump pitch:2μm TEG Substrate *Sub size:35mm 35mm *Core thickness:.4mm *Build up thickness:3μm 2stack *SR thickness:2μm Warpage Evaluation Results 2 TEG Substrate spec *Size:14mm 14mm *Total thickness:25μm *SR thickness:2μm (SR72G:Hitachi Chemical) *Prepreg thickness:4μm *Core thickness:11μm 15 Convex 15 Convex Warpage(μm) 1 5 Warpage(μm) High Tg Halogen Free FR4 MCLE7G Type(R) Concave MCLE75G 15 MCLE7G Type(R) MCLE75G Concave MCLE75G Type(L)

16 Halogen Free, High Tg, High Elastic Modulus and Low CTE Multilayer Material MCLE7G High Tg Glass Epoxy Multilayer Materials Features Has low CTE values in x,y directions and reduces warpage of package substrate significantly. Wellsuited for buildup construction. Good drill processability : lower process cost. Standard Specifications Part Number Type (R) MCLE7G (R) (RL) Copper Foil Thickness 2μm 3μm 5μm 12μm (LP,PF) 2μm 3μm 5μm 12μm 18μm (STD,LP,PF) 2μm 3μm 5μm 12μm 18μm 35μm 7μm (STD,LP,PF) GE7G Prepreg Code Name U.3 U.4 T.4 U.5 T.6 M.6.1 M.11 M.15 M pplications Semiconductor packages. (FCBG,FCCSP,PoP,SiP) Core material for HDI. Core material for Thinner Module. ctual Thickness and Tolerance.3±.13mm.4±.13mm.4±.13mm.5±.13mm.6±.13mm.6±.2mm.11±.2mm.1±.2mm.15±.2mm.2±.3mm.2±.3mm.3±.3mm.4±.4mm.5±.5mm.6±.6mm.7±.7mm.8±.8mm Note1)STD:Standard copper foil, LP:Low profile copper foil, PF:Hitachi profilefree copper foil. Note2) STD:12μm,18μm, 35μm, 7μm; LP:2μm, 3μm, 5μm, 12μm, 18μm; PF:2μm, 3μm, 5μm, 12μm. Please contact us for details. Note3) U for 1ply; T for 2ply. Note4) In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker one. Note5) The thickness means that of dielectric layer. Characteristics Thin Laminate Item Condition Unit (t.1mm) ctual Value Test Method MCLE7G Type(R)MCLE7G Type(RL) (IPCTM65) Tg TM DM X (3~12 ) CTE *1 Y (<Tg) Z (>Tg) Solder Heat Resistance(26 ) T26(Without Copper) TM T288(Without Copper) Decomposition Temperature(5% Weight Loss) TG Heat Resistance for HDI Process(Semidditive) 26 reflow 12μm Copper Peel Strength 18μm Surface Roughness(Ra) Flexural Modulus(Lengthwise) Dielectric Constant Dissipation Factor Volume Resistivity Surface Resistance Insulation Resistance Water bsorption Flammability(UL94) 1MHz 1GHz *2 1MHz 1GHz *2 C96/2/65 C96/2/65 C96/35/9+C96/4/9 C96/2/65 C96/2/65+D2/1 E24/5+D24/23 ppm/ sec. min. cycle kn/m μm GPa Ω cm Ω Ω % 25~27 295~35 7~9 5~7 7~9 5~7 15~25 9~12 >3 >6 >6 43~45 >2.9~1.1 1.~1.2 2~3 32~34 34~36 4.8~5. 4.6~ ~ ~4.4.8~.1.8~.1.9~.11.1~ ~ ~ ~ ~ ~.6 V *1)Heating Rate:1 /min. *2)Measured by TriplateLine Resonator..4mm thickness core is used depending on test item.

17 Prepreg Part Number GE7G ( ー ) (L) Type (117N74) (127N74) (137N74) (178N66) (2116N59) (L127N74) (L137N74) (L178N66) Style Glass Cloth Yarn Count (warp fill) Resin Content (%) 74±2 74±2 74±2 66±2 59±2 74±2 74±2 66±2 Volatile Content (%) 2. Properties Gelation Time (sec.) 16±3 13±3 125±3 16±3 13±3 Dielectric Thickness after Lamination *1 (mm) Test Method(IPCTM65) *1)The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is %. This value changes depending on the press condition or inner layer pattern. Elastic Modulus 1.4 mount of deflection by hole area ctual package aperture ratio 16 Elastic Modulus (GPa) 1 1 High Tg Halogen Free FR4 MCLE7G Type(R) tan δ Flexure (mm) High Tg Halogen Free FR4 MCLE7G Type(R) Temperature( ) FCBG Warpage Hole area ratio(%) TEG Chip *Chip size : 2mm 2mm *Chip thickness :.725mm *Bump diameter : 8μm *Bump pitch : 2μm *TEG Substrate *Sub size : 35mm 35mm *Core thikness :.7mm *Build up thickness : 3μm 2 stack *SR thickness : 2μm 15 1 Convex Warpage(μm) High Tg Halogen Free FR MCLE7G Type(R) Concave MCLE7G Type(RL) 17

18 Halogen Free, High Elastic Modulus and Low CTE Multilayer Material MCLE679FG MCLE679FGB Black Type GE679FG Prepreg High Tg Glass Epoxy Multilayer Material(FR4) Features Halogen free material for environmental concerns. CTE (Zdirection) is 5% lower than that of our standard FR4. Elastic modulus is 2% higher than that of our standard FR4. Even thin laminate has less warpage and deflection. Superior heat resistance for soldering(suitable for the lead free process). Surface roughness is 1/4 of our standard FR4, and making fine pattern possible. pplications Semiconductor packages. (FCBG, BG, CSP) Core material for HDI. Standard Specifications Part Number MCLE679FG MCLE679FGB Type (S) (R) (S) Copperfoil Thickness 2μm 3μm 5μm 12μm (LP,PF) 2,3,5,12,18μm (STD,LP,PF) 2μm 3μm 5μm 12μm 18μm 35μm 7μm (STD,LP,PF) Code Name U.3 U.4 U.5 T.4 T.5 T.6 T.7 M ctual Thickness and Tolerance.3±.13mm.4±.13mm.5±.13mm.4±.13mm.5±.13mm.6±.13mm.7±.13mm.7±.2mm.11±.2mm.16±.3mm.21±.4mm.32±.5mm.4±.5mm.6±.6mm.8±.8mm Note1)STD:Standard copper foil, LP:Low profile copper foil, PF:Hitachi profilefree copper foil. Note2) STD:12μm,18μm, 35μm, 7μm; LP:2μm, 3μm, 5μm, 12μm, 18μm; PF:2μm, 3μm, 5μm, 12μm. Please contact us for details. Note3) U for 1ply; T for 2ply. Note4) In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker one. Note5) The thickness means that of dielectric layer. Characteristics Thin Laminate Tg CTE *1 Item X Y Solder Heat Resistance(26 ) T26(Without Copper) T288(Without Copper) Decomposition Temperature(5% Weight Loss) Heat Resistance for HDI Process(Semidditive) Copper Peel Strength 18μm 35μm Surface Roughness(Ra) Flexural Modulus(Lengthwise) Dielectric Constant Dissipation Factor Volume Resistivity Surface Resistance Z 1MHz 1GHz *2 1MHz 1GHz *2 Condition TM DM (3~12 ) (<Tg) (>Tg) TM TG 26 Reflow C96/2/65 C96/2/65 C96/35/9 Insulation Resistance C96/2/65 C96/2/65+D2/1 Water bsorption E24/5+D24/23 Flammability(UL94) *1)Heating Rate:1 /min. *2)Measured by TriplateLine Resonator..8mm thickness core is used depending on test item. Unit ppm/ sec. min. cycles kn/m μm GPa Ω cm Ω Ω % ctual Value MCLE679FG Type(R) 165~175 2~22 13~15 13~15 23~33 14~17.9~ ~1.2 23~28 5.2~5.4.4~.6 >3 >6 >6 34~36 >1 2~3 4.6~4.8.8~.1.16~ ~ ~ ~ ~ V MCLE679FG Type(S) 175~185 21~23 12~14 12~14 2~3 13~16 1.1~ ~1.3 24~29 5.~5.2.3~.5 (t.4mm) Test Method (IPCTM65) ー ー ー ーー

19 Prepreg Glass Cloth Properties Part Number Type Style Yarn Content (warp fill) Resin Content (%) Volation Content Gelation Time Dielectric Thickness(mm) (%) (sec.) *1 ()fter pattern filling GE679FG (R) (S) (GBPE) (GRZPE) (GRROE) (GRSKE) (GSPE) (GSBPE) (GSBSE) (GSZPE) (GSROE) (GSSKE) ±2 73±2 68±2 58±2 78±2 73±2 78±2 73±2 68±2 58± ±3 165±3 155±3 175±3 165± Test Method(IPCTM65) *1)The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is %. This value changes depending on the press condition or inner layer pattern. Throughhole reliability Test condition:55, 3min. 15, 3min. Pattern:Wall to wall distance.3mm, Laminate thickness:t.8mm Precondition:26 reflow 2times Solder dipping(26 1sec.) change ratio of conductive resistance(%) Prepreg thickness after pattern filling (Inner layer copper 15μm) 6 Number of cycles :MCLE679FG Type(S) :MCLE679FG Type(R) Flexure(mm) Stiffness Properties 12 1 Weigh t( 1 g) 8 Span U.4 T.4 U.5 T.6 Thickness Flexure T.7 Span : 1mm Span : 15mm Span : 2mm Span : 25mm Span : 3mm Span : 35mm Span : 4mm prepreg thickness(μm) GSBSE GSBPE GSPE 1 Prepreg Thickness Copper remain ratio(%) 19

20 2 High Elastic Modulus and Low CTE Multilayer Material MCLE679F Type(R) High Tg Glass Epoxy Multilayer Material(FR4) Features Coefficient of thermal expansion is 2% (in the X and Ydirections) and 5% (in the Zdirection) lower than that of our standard FR4. Elastic modulus is 3% higher than that of our standard FR4. Even thin laminate has less warpage and deflection. Superior heat resistance at PCT. Surface roughness is 1/4 that of our standard FR4, making fine pattern possible. Standard Specifications Part Number Type MCLE679F Characteristics Thin Laminate Item (R) Copper Foil Thickness 2,3,5,12,18,35μm(STD,LP,PF) 2μm 5μm 12μm 18μm 35μm 7μm (STD,LP,PF) Condition TM Tg DM CTE *1 X (3~12 ) Y (<Tg) Z (>Tg) Solder Heat Resistance(26 ) T26(Without Copper) TM T288(Without Copper) Decomposition Temperature(5% Weight Loss) TG Heat Resistance for HDI Process(Semidditive) 26 Reflow Copper Peel Strength 18μm 35μm Surface Roughness(Ra) Flexural Modulus(Lengthwise) Dielectric Constant 1MHz C96/2/65 1GHz *2 1MHz Dissipation Factor C96/2/65 1GHz *2 Volume Resistivity Surface Resistance C96/35/9 C96/2/65 Insulation Resistance C96/2/65+D2/1 Water bsorption E24/5+D24/23 Flammability(UL94) *1)Heating Rate:1 /min. *2)Measured by TriplateLine Resonator..8mm thickness core is used depending on test item. Unit ppm/ sec. min. cycles kn/m μm GPa Ω cm Ω Ω % GE679F Type(R) Prepreg pplications Semiconductor packages. (FCBG, BG, CSP) Core material for HDI. (MCLE679F Type (R) is recommended for FCBG with insulation film.) Code Name M ctual Value MCLE679F Type(R) 16~17 19~2 12~14 12~14 2~3 13~16 >3 >6 >3 34~36 >1 1.1~ ~1.3 2~3 27~33 4.8~5. 4.5~4.7.8~.1.13~ ~ ~ ~ ~ ~.5 V ctual Thickness and Tolerance.7±.2mm.11±.2mm.16±.3mm.21±.4mm.32±.4mm.42±.5mm.63±.6mm.84±.9mm Note1)STD:Standard copper foil, LP:Low profile copper foil, PF:Hitachi profilefree copper foil. Note2) STD:12μm,18μm, 35μm, 7μm; LP:2μm, 3μm, 5μm, 12μm, 18μm; PF:2μm, 3μm, 5μm, 12μm. Please contact us for details. Note3) In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker one. Note4) The thickness means that of dielectric layer. (t.4mm) Test Method (IPCTM65) ー ー ー ーー

21 Prepreg Part Number GE679F (R) Type.4 (FRZPE) (FRUOE).6 (FRROE).1 (FRSKE).15 (FREGE) Style Glass Cloth Yarn Count (warp fill) Resin Content (%) 73±2 68±2 68±2 58±2 51±2 Volatile Content (%) Properties Gelation Time (sec.) 115±25 11±25 Dielectric Thickness after Lamination *1 (mm) Test Method(IPCTM65) *1)The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is %. This value changes depending on the press condition or inner layer pattern. Flexural Modulus Barcol Hardness MCLE679F Type(R) Standard FR4 MCLE679 Type(W) Flexural Modulus (GPa )Temperature( ) Barcol Hardness Standard FR4 MCLE679 Type(W) MCLE679F Type(R) Temperature( ) MCLE679F Type(R) 4 Flexure (mm ) Stiffness Properties MCLE679 Type(W) Standard FR4 Water bsorption under 85 85%RH (t.4mm) 1..8 MCLE679 Type(W).6.4 MCLE679F Type(R) Laminate Thickness(mm) Test Method Substrate Weight(2g) Flexure Water bsorption (% )Processing Time(hrs.) Span (1mm) Substrate Size 22mm(Length) 1mm(Width) 21

22 Halogen Free, Low Dielectric Constant, High Tg and High Heat Resistance Multilayer Material MCLE78G GE78G <Prepreg> Low Dielectric Constant Epoxy Multilayer Material (FR4) Features Halogenfree with low dielectric property. (Dk 3.5 Resin cont. = 7%)) High Tg and elastic modulus is higher than standard FR4 at high temperature. Superior heat resistance. (Suitable for the lead free process) pplications Smartphone. Tablet PC. Standard Specifications Part Number Type Copper Foil Thickness Code Name ctual Thickness and Tolerance 12, 18, 35μm ±.2mm.5±.2mm.6±.2mm 12μm.7.7±.2mm MCLE78G 18μm.8.8±.2mm.9.9±.2mm 35μm.1.1±.2mm 7μm.15.15±.3mm Note 1)In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker one. Characteristics Thin Laminate (t.8mm) Item Condition Unit ctual Value MCLE78G Test Method (IPCTM65) Tg TM DM 16~17 2~ ー CTE *1 X Y Z (3~12 ) (<Tg) (>Tg) ppm/ 13~15 15~17 35~45 18~ Solder Heat Resistance(26 ) sec. >3 ー T26(Without Copper) T288(Without Copper) TM min. > Decomposition Temperature (5% Weight Loss) TG 38~ Copper Peel Strength 18μm 35μm kn/m 1.~ ~ Flexural Modulus(Lengthwise) GPa 25~ Dielectric Constant (R.C.:7%) 1GHz 1GHz *2 C96/2/65 3.4~ ~ Dissipation Factor (R.C.:7%) Volume Resistivity Surface Resistance Insulation Resistance Water bsorption Flammability(UL94) 1GHz 1GHz *2 C96/2/65 C96/2/65+C96/4/9 C96/2/65+C96/4/9 C96/2/65 C96/2/65+D2/1 E24/5+D24/23 Ω cm Ω Ω %.9~.11.12~ ~ ~ ~ ~ ~.3 V ーー *1)Heating Rate:1 /min. *2)Measured by TriplateLine Resonator. 22

23 Prepreg Part Number GE78G Type (127N72) (16N7) (16N72) (137N7) (137N74) (167N69) (167N72) (18N62) (178N62) Style Glass Cloth Yarn Count (warp fill) Resin Content (%) 72±2 7±2 72±2 7±2 74±2 69±2 72±2 62±2 62±2 Volatile Content (%) Properties Gelation Time (sec.) 3. 28±4 Dielectric Thickness after Lamination *1 (mm) Test Method(IPCTM65) *1)The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is %. This value changes depending on the press condition or inner layer pattern. Correlation between Dielectric Constant and Frequency 4.5 Correlation between Dissipation Factor and Frequency.3 4. MCLE75G.25.2 MCLE75G Dk 3.5 MCLE78G Df.15.1 MCLE78G Frequency(GHz) Frequency(GHz) Elastic Modulus MCLE78G 1. Elastic Modulus (GPa )tan δ 1. MCLE75G Temperature( ) Note) Measured by Triplateline Resonator. 23

24 Reduction of Solder Crack/Low Elastic Modulus Material TD2 Prepreg [ ] Low Elastic Modulus Thermosetting Resin Multilayer Material Features pplied to PWBs surface of standard material, absorb soldering stress and inhibit solder crack. Elastic modulus is 1/4 of that of standard FR4. Enables to reduce solder crack without using high functional material, by combining TD2 with standard material. pplications Electronic equipment for automobiles. Engine room set board. PCB on component packagings. Standard Specifications [Prepreg] Part Number TD2 Prepreg Type (137N77) (178N66) (3313N58) (151N54) Style Glass Cloth Yarn Count (warp fill) Resin Content (%) 77±2 66±2 58±2 54±2 *1) The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is %. This value changes depending on the press condition or inner layer pattern. Properties Volatile Content (%) 2. Dielectric Thickness after Lamination *1 (mm) Characteristics Thin Laminate (3313N58, t.4mm) Tg CTE *1 Item X Y Solder Heat Resistance(26 ) Z TM Condition (3~12 ) (<Tg) (>Tg) Unit ppm/ sec. ctual Value TD ~9 6~9 8~13 2~3 >3 Test Method (IPC TM65) ー T26(Without Copper) T288(Without Copper) Decomposition Temperature(5% Weight Loss) 18μm Copper Peel Strength 35μm Flexural Modulus(Lengthwise) Elastic Modulus(Lengthwise)Tensile Dielectric Constant *2 1GHz Dissipation Factor *2 1GHz Volume Resistivity Surface Resistance Insulation Resistance Water bsorption Flammability(UL94) TM TG C96/2/65 C96/2/65 C96/2/65+C96/4/9 C96/2/65+C96/4/9 C96/2/65+D2/1 E24/5+D24/23 min. kn/m GPa GPa ーー Ω c m Ω Ω % ー >5 >5 345~36.8~.9.9~1.1 5~8 7~1 3.6~3.8.11~ ~ ~ ~ ~.3 V ー ー ー *1)Heating Rate : 1 /min. *2)Measured by cavity resonator..1mm thickness core is used depending on test item. 24

25 Connection reliability of Pbfree solder Thermal condition:4 (3min.) 125 (3min.) 1 8 1Cycles 2Cycles 3Cycles Thickness :t1.6mm(4layer) Specimen structure :Core t1.4mm,b/u t.1mm Solder :Pbfree solder Solder crack of TD2+FR4(Cross section, after 3cycles.) 6 Crack ratio 6% 2125R 3226R Crack ratio 1% Crack ratio (% ) R 3226R 6332R 2125R 3226R 6332R TD2+FR4 FR4 Elastic modulus Elastic Modulus(MPa) TD2 Resin only Conventional FR Temperature( ) Mechanical drilling processing fter 3hits Specimen structure :Core t1.2mm,b/u t.2mm μm )Thickness :t1.6mm(4layer) ve. Max. Roughness (2 1 TD2+MCLE75G TD2+CEL323 MCLE75G TD2+ MCLE75G CEL323 TD2+ CEL323 Condition of mechanical drilling Stackup :3 panels E/B :l t.15mm Revolution :12krpm Feeding Speed :2.4m/min. Drill bit :φ.3mm 25

26 Halogen Free, High Tg and High Heat Resistance Multilayer Material MCLE75G GE75G <Prepreg> High Tg Glass Epoxy Multilayer Material(FR4) Features Environmentally friendly material. It has achieved the UL 94V level of flammability without using any compound which includes halogen, antimony or red phosphorus. Superior heat resistance to that of our standard FR4, and suitable for the lead free process. The coefficient of thermal expansion in Zdirection is 4% lower than that of our standard FR4.Excellent throughhole reliability. pplications Electronics for automobiles. Personal computer, high density electronic equipment. Electronic branch exchanges, mobile phones, etc. Main frame computers. Standard Specifications Part Number Type MCLE75G Copper Foil Thickness 12μm 18μm 35μm 7μm Code Name V.2.3 V.4.5 V ctual Thickness and Tolerance.6±.3mm.1±.3mm.15±.4mm.2±.4mm.3±.5mm.4±.6mm.5±.7mm.6±.8mm.8(.7)±.9mm 1.(.9)±.1mm 1.2(1.1)±.11mm 1.6(1.5)±.19mm Note 1)In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker one. Note 2)The thickness is means that of dielectric layer.figure in bracket ( )means thickness of dieletric layer of MCL using 7μm copper foil. Characteristics Thin Laminate (t.8mm) Item Condition Unit ctual Value MCLE75G Test Method (IPCTM65) Tg TM DM 155~17 195~ ー X (3~12 ) 12~15 CTE *1 Y Z (3~12 ) (<Tg) (>Tg) ppm/ 14~17 3~4 18~ Solder Heat Resistance(26 ) sec. >3 ー T26 T288 TM TM min. >6 > Decomposition Temperature(5% Weight Loss) TG 38~ Copper Peel Strength 18μm 35μm kn/m 1.2~ ~ Flexural Modulus(Lengthwise) GPa 25~ Dielectric Constant 1MHz 1GHz *2 C96/2/65 5.~ ~ Dissipation Factor Volume Resistivity Surface Resistance 1MHz 1GHz *2 C96/2/65 C96/2/65+C96/4/9 C96/2/65+C96/4/9 Ω cm Ω.9~.11.14~ ~ ~ Insulation Resistance C96/2/65 C96/2/65+D2/1 Ω ~ ~ ーー Water bsorption E24/5+D24/23 %.8~ Flammability(UL94) V *1)Heating Rate:1 /min. *2)Measured by TriplateLine Resonator. 26

27 Prepreg Part Number GE75G Type (18N65) (178N65) (2116N56) (151N52) (7628N51) Style Glass Cloth Yarn Count (Warp Fill) Resin Content (%) 65±2 65±2 56±2 52±2 51±2 Volatile Content (%) 1. Properties Gelation Time (sec.) 145±3 145±3 145±3 135±3 135±3 Dielectric Thickness after Lamination *1 (mm) Test Method(IPCTM65) *1)The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is %. This value changes depending on the press condition or innerlayer pattern. Change ratio of conductive resistance(%) Throughhole reliability ー 55 3min. 15 3min. (t1.6mm) 2 Standard FR4 15 High Tg FR4 1 5 MCLE75G ー Number of cycles Correlation between Dielectric Constant and Resin Content 5. Correlation between Dissipation Factor and Resin Content.22 Dk GHz 3.8 2GHz 5GHz Note)IPC TM Resin Content(%) Df GHz.16 2GHz 5GHz Resin Content(%) 27

28 FR4 Multilayer Material MCLE67 GE67N Prepreg Glass Epoxy Multilayer Material(FR4) UV Block Type [ MCLE67 Type(W) ] Features Superior electrical and mechanical characteristics. Laminating time can be reduced depending on prepreg types and conditions. pplications Personal computers and highdensity electronic equipment. Small and midsize computers and their peripheral devices. Electronic branch exchanges, portable terminal devices, etc. Standard Specifications Part Number Type MCLE67 (W) Copper Foil Thickness 12μm 18μm 35μm 7μm Code Name V.2.3 V.4.5 V ctual Thickness and Tolerance.6±.3mm.1±.3mm.15±.4mm.2±.5mm.3±.5mm.4±.8mm.5±.8mm.6±.9mm.8(.7)±.1mm 1.(.9)±.12mm 1.2(1.1)±.12mm Note 1)In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker one. Note 2)The thickness means that of dielectric layer. Figure in bracket ( )means thickness of dielectric layer of MCL using 7μm copper foil. Characteristics Thin Laminate (t.8mm) Item Condition Unit ctual Value MCLE67 Test Method(IPCTM65) Tg CTE *1 X Y Solder Heat Resistance(26 ) T26(Without Copper) T288(Without Copper) Decomposition Temperature(5% Weight Loss) 18μm Copper Peel Strength 35μm Flexural Modulus(Lengthwise) 1MHz Dielectric Constant 1GHz *2 Dissipation Factor Volume Resistivity Surface Resistance Insulation Resistance Water bsorption Flammability(UL94) Z 1MHz 1GHz *2 TM DM (3~12 ) (<Tg) (>Tg) TM TG C96/2/65 C96/2/65 C96/35/9 C96/2/65 C96/2/65+D2/1 E24/5+D24/23 ppm/ sec. min. kn/m GPa Ω cm Ω Ω % 12~13 15~16 13~16 14~17 5~7 2~3 >12 >1 ー 3~32 1.4~ ~2.1 23~25 4.7~ ~4.2.13~.17.18~ ~ ~ ~ ~ ~.14 V ー ー ー ーー *1)Heating Rate:1 /min. *2)Measured by TriplateLine Resonator. 28

29 Prepreg Glass Cloth Properties Part Number Type Natural UV Yarn Count Resin Content Volatile Gelation Time Style Color Block (warp fill) (%) content (%) (sec.) (KLN)(WKLN) 62± (LPN) 68±2 125±25 (VGN)(WGN) 52± (VJN) 55±2 GE67N.5 (VEFP) 48±2 15± (VEGJ)(WEGJ) 51±2 12±25 (VHDN)(WHDN) 45± (VHGQ) 52±2 15±25 *1)The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is %. This value changes depending on the press condition or inner layer pattern. Resin Flow (%) 42±5 48±5 31±5 37±5 27±5 32±5 27±5 35±8 Dielectric Thickness after Lamination *1 (mm) Test Method (IPCTM65) bout 4kV ( ) ( Short in Time Circuits of With Cu( ) Without Cu( ) φ5mm (Cu on both Sides) Etched on both sides 1 1 Laminate Thickness Cu Foil φ5mm Electrode Time to Short Circuits Obtained the value of destruction voltage by increasing the voltage ( constantly per 5V /sec. ) Laminate Estimation Thickness Step by Step Starting from 5% of destruction voltage, obtained the maximum voltage that withstood for 1 min. Voltage was increased by 1kV. ) Withstand Voltage(kV ) Result of Withstand Voltage Test Laminate Thickness(mm) Dk Dk Dielectric Constant vs Resin Content of Laminate(1MHz) Resin Content (%) Correlation between Dielectric Constant and Frequency Frequency (GHz) Df Correlation between Dissipation Factor and Frequency Frequency (GHz) Note)Measured by Triplateline Resonator. 29

30 3 MEMO

31 Materials For ICT Infrastructure High Tg Multilayer Material MCLE679 Type(W) P32 Halogen Free, High Tg, Low Transmission Loss Multilayer Material MCLLW9G/91G P34 Halogen Free, Low Dielectric Constant and High Heat Resistance Multilayer Material MCLHE679G Type(S) P36 31

32 High Tg Multilayer Material MCLE679 Type(W)GE679N Prepreg High Tg Glass Epoxy Multilayer Material(FR4) Features High Tg (>25 : DM) and excellent throughhole reliability. The thermal decomposition temperature is high and reliability at high temperature is superior. (Thermal decomposition temperature: >34 ) Water absorption is low and insulation degradation is small. pplications Semiconductor packages.(bg, CSP and MCM) Main frame computers. Telephone switchboards. Mobile phones. Semiconductor testing devices and burnin boards. Electronics for automobiles. Standard Specifications Part Number Type MCLE679 (W) Copper Foil Thickness 12,18,35μm 12μm 18μm 35μm 7μm (STD,LP) Code Name ctual Thickness and Tolerance.7±.2mm.1±.3mm.15±.3mm.2±.4mm.3±.5mm.4±.7mm.6±.7mm.8(.7)±.9mm 1.(.9)±.1mm 1.2(1.1)±.12mm Note1)STD:12μm,18μm, 35μm, 7μm; LP:2μm, 3μm, 5μm, 12μm, 18μm. Please contact us for details. Note2) In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker one. Note3) The thickness means that of dielectric layer. Characteristics Thin Laminate (t.8mm) Item Condition Unit ctual Value MCLE679 Type(W) Test Method(IPCTM65) Tg TM DM 173~183 25~ CTE *1 X Y Z (3~12 ) (<Tg) (>Tg) ppm/ 12~15 14~17 5~6 2~ Solder Heat Resistance(26 ) sec. >3 T26(Without Copper) T288(Without Copper) TM min. >6 > Decomposition Temperature(5% Weight Loss) TG 34~ Copper Peel Strength 18μm 35μm kn/m 1.2~ ~ Surface Roughness(Ra) μm 5~ Flexural Modulus(Lengthwise) GPa 24~ Dielectric Constant 1MHz 1GHz *2 C96/2/65 4.7~ ~ Dissipation Factor 1MHz 1GHz *2 C96/2/65.13~.15.21~ Volume Resistivity Surface Resistance C96/35/9 Ω cm Ω ~ ~ Insulation Resistance C96/2/65 C96/2/65+D2/1 Ω ~ ~ Water bsorption E24/5+D24/23 %.15~ Flammability(UL94) V *1)Heating Rate:1 /min. *2)Measured by TriplateLine Resonator.

33 Part Number GE679N Defect Rate (% )Number of cycles 2 MCLE679 Type(W) GPY Water bsorption (% ) Prepreg Type (WOPE) (WULE) (WUME) (WSGE) (WCJE) (WQEE) Glass Cloth Yarn Count (warp fill) Thermal Shock Test(MILSTD22 Method17E) Water bsorption PCT Condition: MPa 2. GPY Style Standard FR4 (t.8mm) Standard FR4 MCLE679 Type(W) Resin Content (%) 68±2 62±2 65±2 52±2 56±2 48±2 Volatile Content (%) 1. Barcol Hardness Properties Gelation Time (sec.) 12±25 Barcol Hardness Standard FR4 Resin Flow (%) ±5 33±5 MCLE679 Type(W) GPY Temperature( ) Dielectric Thickness after Lamination *1 (mm) Test Method(IPCTM65) *1)The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is %. This value changes depending on the press condition or inner layer pattern Processing time(hrs.) 33

34 Halogen Free, High Tg, Low Transmission Loss Multilayer Material MCLLW9G/91G GW9G/91G<Prepreg> Low Dielectric constant Glass Thermosetting Resin Multilayer Material Features MCLLW91G achieved low dielectric constant (3.3 at 1GHz) and low dissipation factor (.28 at 1GHz) using low Dk glass and HVLP copper. MCLLW91G enables the highspeed transmission/communication of 25Gbps by the low transmission loss. MCLLW91G has excellent heat resistance, connection reliability. pplications Highspeed computer, server Highspeed Router High Frequency Devices, ntenna Standard Specifications Part Number MCLLW9G (E glass cloth) MCLLW91G (Low Dk glass cloth) Type Copper Foil Thickness 18μm 35μm 7μm (RT) 12μm 18μm 35μm (HVLP) Code Name M.5 M.6 M.8.1 M M ctual Thickness and Tolerance.5±.2mm.6±.2mm.8±.2mm.1±.2mm.1±.2mm.13±.3mm.15±.3mm.2±.3mm.25±.4mm Note 1)In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker one. Note 2)Please inquire about the lineup except the above. Characteristics Thin Laminate Tg CTE *1 Item Solder Heat Resistance(26 ) T26(Without Copper) T288(Without Copper) Decomposition Temperature(5% Weight Loss) 18μm RT Copper Peel Strength 18μm HVLP Flexural Modulus(Lengthwise) 1GHz *2 Dielectric Constant 1GHz *2 Dissipation Factor Volume Resistivity Surface Resistance Insulation Resistance Water bsorption Flammability(UL94) * 1)Heating Rate: 1 /min. X Y Z 1GHz *2 1GHz *2 TM DM (3~12 ) (<Tg) (>Tg) TM TG C96/2/65 C96/2/65 Condition C96/2/65+C96/4/9 C96/2/65+C96/4/9 C96/2/65 C96/2/65+D2/1 E24/5+D24/23 * 2)Measured by Triplateline Resonator. Unit ppm/ sec. min. kn/m GPa Ω cm Ω Ω % ctual Value MCLLW9G MCLLW91G 19~21 24~28 12~15 12~15 35~45 24~29 >3 >6 >6 37~39.6~.8.5~.7 16~21 3.5~ ~ ~ ~3.4.25~.35.2~.3.4~.5.25~ ~ ~ ~ ~ ~.4 V (t.8mm) Test Method (IPCTM65) ー ーー

35 Prepreg Part Number GW9G GW91G Type (137N72) (178N65) (3313N57) (2116N55) (137N74) (178N67) (213N59) (2116N57) Style Glass Cloth Yarn Count (warp fill) Resin Content (%) 72±2 65±2 57±2 55±2 74±2 67±2 59±2 57±2 Properties Volatile Content (%) 2. Dielectric Thickness after Lamination *1 (mm) Test Method(IPCTM65) *1)The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is %. This value changes depending on the press condition or inner layer pattern. Note)Please inquire about the lineup other than the above. Dielectric characterization results MCLLW9G(RT).8.7 MCLFX2 3.4 MCLFX2.6 MCLLW9G(RT) Dk 3.2 MCLLW91G(HVLP) Df PTFE CCL PTFE CCL.3.2 MCLLW91G(HVLP) Frequency(GHz) Frequency(GHz) Measurement Conditions Method :TriplateLine Resonator(JPCTM1) Temperature & Humidity :25 /6%RH Laminate Thickness(b):1.6mm(SignalGround : 8μm), Copper foil (t):18μm(rt,hvlp) Signal Conductor Line Width(w):1mm(Zo:ca.5Ω) Copper Foil(t):18mm(RT,HVLP) w t b Transmission Loss(dB/m) Transmission Loss ー 5 ー 1 ー 15 ー 2 ー 25 ー 3 ー 35 ー 4 ー 45 ー 5 ー 55 Frequency(GHz) MCLLW91G(HVLP) MCLLW9G(HVLP) MCLLW91G(RT) MCLLW9G(RT) MCLFX2(VLP) Measurement conditions Evaluation PWB :Stripline Temperature & Humidity :25 /6%RH Characteristic impedance :pprox. 5Ω Inner layer surface treatment :Blackreduction Proofreading method : TRL(ThruReflectLine) P/P Core w t b Trace width(w):.12mm Dielectric thickness(b):.25mm Trace thickness(t):18μm 35

36 Halogen Free, Low Dielectric Constant and High Heat Resistance Multilayer Material MCLHE679G Type(S)GH679G Type(S) Prepreg Low Dielectric Constant Thermosetting Resin Multilayer Material(FR4) Features Enables lower transmission loss than MCLHE679G with lower dissipation factor. High Tg and superior heat resistance for soldering. (Suitable for the lead free process) The coefficient of thermal expansion in Zdirection is 3% lower than that of our standard FR4. Environmentally friendly material. It achieved the UL 94VO level of flammability without using any compound which includes halogen, antimony or red phosphorous. pplications Network applications. Highfrequency parts. (filters,vcos,etc.) Standard Specifications Part Number Type MCLHE679G (S) Copper Foil Thickness 12μm 18μm 35μm 7μm Code Name ctual Thickness and Tolerance.6±.2mm.8±.2mm.1±.2mm.15±.3mm.2±.3mm.4±.4mm.6±.6mm.8±.8mm 1.±.8mm 1.2±.1mm Note 1)In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker one. Note 2)The thickness means that of dielectric layer. Characteristics Thin Laminate (t.8mm) Item Condition Unit ctual Value Test Method(IPCTM65) MCLHE679G Type(S) Tg TM 18~ DM 26~28 ー CTE *1 X 12~15 (3~12 ) Y 14~17 ppm/ (<Tg) 3~4 Z (>Tg) 19~ Solder Heat Resistance(26 ) sec. >3 ー T26(Without Copper) >6 TM min. T288(Without Copper) > Decomposition Temperature(5% Weight Loss) TG 37~ Copper Peel Strength(RT) 18μm.5~.7 kn/m 35μm.6~ Flexural Modulus(Lengthwise) GPa 23~ MHz 4.1~ Dielectric Constant 1GHz *2 C96/2/65 3.7~ GHz *3 3.9~ MHz.4~ Dissipation Factor 1GHz *2 C96/2/65.6~ GHz *3.5~ Volume Resistivity Ω cm ~ C96/35/9 Surface Resistance Ω ~ Insulation Resistance C96/2/ ~ ー Ω C96/2/65+D2/ ~ ー Water bsorption E24/5+D24/23 %.1~ Flammability(UL94) V * 1)Heating Rate: 1 /min. * 2)Measured by Triplateline Resonator. * 3)Measured by Material nalyzer. 36

37 Prepreg Glass Cloth Properties Part Number Type Style Yarn Count (Warp Fill) Resin Content (%) Volatile Content (%) Gelation Time (sec.) Dielectric Thickness after Lamination *1 (mm) GH679G (S137N72) (S18N64) (S18N69) (S178N64) (S3313N56) (S3313N62) (S2116N54) (S2116N6) (S151N49) ±2 64±2 69±2 64±2 56±2 62±2 54±2 6±2 49± ± Test Method(IPCTM65) *1)The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is %. This value changes depending on the press condition or inner layer pattern. Correlation between Dielectric Constant and Frequency 5. Correlation between Dissipation Factor and Frequency Standard FR4.2 Standard FR4 Dk 4. MCLHE679G Df.15 MCLHE679G Type(S).1 MCLHE679G MCLHE679G Type(S) Frequency(GHz) Frequency(GHz) 2 MCLHE679G Type(S) 4 MCLHE679G 6 8 Transmission Loss (db/m ) Transmission Loss Frequency(GHz) 37

38 38 MEMO

39 Polyimide Multilayer Material Polyimide Multilayer Material MCLI671 P4 39

40 Polyimide Multilayer Material MCLI671 GI671N Prepreg Glass Modified Polyimide Multilayer Material(GPY) Features High Tg (>23 : DM) material for high throughhole reliability. Same lamination condition as FR4 is applicable. (175, 9 min.) MD, a general polyimide resin curing agent, is not used. (NonMD Resin System) Resin flow control technology enables from high to low flow. pplications Main frame computers and super computers. Semiconductor testing equipment, and burnin boards. Flexrigid PWBs. (noflow prepreg) Standard Specifications Part Number MCLI671 Type Copper Foil Thickness 12μm 18μm 35μm 7μm Code Name ctual Thickness and Tolerance.6±.2mm.1±.2mm.2±.4mm.3±.4mm.41±.5mm.79±.1mm Note 1)In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker one. Note 2)The thickness means that of dielectric layer. Characteristics (t.8mm) Item Condition Unit ctual Value MCLI671 Test Method (IPCTM65) Tg TM DM 2~213 23~ ー CTE *1 X Y Z (3~12 ) (<Tg) (>Tg) ppm/ 12~15 12~16 5~8 2~ Solder Heat Resistance(26 ) sec. >3 ー T26(Without Copper) T288(Without Copper) TM min. >6 > Decomposition Temperature(5% Weight Loss) TG 33~ Copper Peel Strength (18μm) 2 18 kn/m 1.3~1.5 1.~ Flexural Modulus (Lengthwise) GPa 24~ Dielectric Constant 1MHz 1GHz *2 C96/2/65 4.2~ ~ Dissipation Factor 1MHz 1GHz *2 C96/2/65.11~.13.13~ Volume Resistivity Surface Resistance Insulation Resistance Water bsorption C96/35/9 C96/2/65 C96/2/65+D2/1 E24/5+D24/23 Ω cm Ω Ω % ~ ~ ~ ~ ~ ーー Flammability(UL94) V ー * 1)Heating Rate: 1 /min. * 2)Measured by Triplateline Resonator. 4

41 Prepreg Part Number GI671N (T) (N) (F) Type Glass Cloth Yarn Count Style Resin Content (Warp Fill) (%) ±3 65±3 54±3 68±3 59±3 74±3 Volatile Content (%) 2. Properties Resin Flow (%) 5±5 43±5 29±5 4±3 54±5 Dielectric Thickness pplication after Lamination *1 (mm) MLB Flexrigid PWBs Metal core PWBs Test Method(IPCTM65) *1)The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is %. This value changes depending on the press condition or inner layer pattern. Correlation between Dielectric Constant and Frequency (t.8mm) 5. Correlation between Dissipation Factor and Frequency (t.8mm) Standard FR4.2 Standard FR4 Dk 4. MCLI671 Df.15 MCLI Frequency (GHz) Note)Measured by Triplateline Resonator. Barcol Hardness Frequency (GHz) Water bsorption PCT Condition: MPa (t.8mm) 1. Barcol Hardness Standard FR4 MCLI671 Water bsorption (%).5 MCLI671 Standard FR Temperature ( ) Treating Time (hrs.) Thermal Shock Test MILSTD22 Method 17E 1 Flexural Strength 7 Defect Rate (%) 8 Standard FR MCLI No. of Cycles Flexural Strength (MPa) Treating Time (hrs.) 41

42 42 MEMO

43 Glass Epoxy Double Sided Materials Copper Clad Laminate for Double Sided PWBs(FR4) MCLE67 P44 43

44 Copper Clad Laminate for Double Sided PWBs MCLE67 UV Block Type [ MCLE67 Type(WK) ] Glass Epoxy Copper Clad Laminate(FR4) Features Superior electrical characteristics, surface smoothness and dimensional stability. Superior drilling ability. Superior heat resistance, moisture resistance and throughhole reliability. pplications Office automation equipment, communication tools and measuring instruments. Game machines. Electronics for automobiles. Standard Specifications Part Number MCLE67 Type (WK) Copper Foil Thickness 18μm 35μm 7μm (15μm) Code Name.3 ctual Thickness and Tolerance.3±.8mm.4±.13mm.5±.13mm.6±.15mm.8(.7)±.17mm 1.(.9)±.18mm 1.2(1.1)±.19mm 1.6(1.5)±.19mm Note 1) In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker one. Note 2) The thickness means that of dielectric layer. Figure in bracket ( ) means thickness of dielectric layer of MCL using 7μm copper foil. Note 3) Prior confirmation is recommended for 15μm copper foil availability Characteristics (t1.6mm) Item Condition Unit ctual Value MCLE67 Test Method (IPCTM65) Tg TM 12~ CTE *1 X Y Z (3~12 ) (<Tg) (>Tg) ppm/ 13~16 14~17 5~7 2~ Solder Heat Resistance(26 ) sec. >12 ー Heat Resistance E1/2 No Problem ー Copper Peel Strength 18μm kn/m 1.4~ Flexural Strength Length Width N/mm 2 5~6 4~ Dielectric Constant(1MHz) Dissipation Factor(1MHz) C96/2/65 C96/2/65 4.7~4.8.13~ Volume Resistivity Surface Resistance C96/35/9 Ω cm Ω ~ ~ Insulation Resistance C96/2/65 C96/2/65+D2/1 Ω ~ ~ ー Water bsorption E24/5+D24/23 %.6~ Flammability (UL94) V * 1)Heating Rate: 1 /min. 44

45 Dimensional Change(% ) Dimensional Stability Length Width (t1.6mm) Heat Resistance Property [Unit: sec.] NSI Solder Heat Resistance (Float) Reflow Heat Thickness Copper Resistance Grade /3sec. 35μm 1.6mm Double Sided FR4 18 OK 18 OK 18 OK OK.3 s Received Etch Out Dried at (ll Laminate) 14 2min. (Vertical) (Laminate Surface Temperature) 3 Max.257~ Temperature(Processing Time (sec.) Length )25 Process Dried at 17 3min. (Horizontal) Sample Size :33mm(Length) 25mm(Width) Tooling Hole :1.φ31 23mm % IR Reflow Temperature Profile ) UV Blocking Property (Type(WK)) %UV Transmission() UV Blocking Property (Type(WK)) 2.5 Wavelength: 35nm UV Transmission( Thickness (mm) Wavelength: 42nm Thickness (mm) Elastic Modulus (Tensile) Poisson's Ratio Elastic GPa Modulus()Poisson's Ratio Width (t1.6mm) Length Width (t1.6mm) Laminate Surface Temperature ( ) Laminate Surface Temperature ( ) 45

46 46 MEMO

47 46 MEMO

48 CEM3 Copper clad laminate for TrackingResistant composites E668T Type(K) P48 47

49 CEM3 E668T Type(K) Copper Clad laminate for trackingresistant composites Features Good tracking resistance(cti6) pplications Power supply units. Displays. ir conditioners. Washing machines Standard Specifications Part Number E668T (Doubleside) E568T (Oneside) Type (K) (K) Please consult in advance for production support. Master Size(Length Width)(mm) Copper Foil Thickness 18μm 35μm 7μm 35μm 7μm ctual Thickness(mm) Characteristics Item Condition Unit ctual Value Test Method E668T/E568T (IPCTM65) Tg TM 13~ X 18~22 (3~12 ) CTE Y ppm/ 19~ Z Solder Heat Resistance(26 ) (<Tg) sec. 4~5 >12 Copper Peel Strength 18μm kn/m 1.2~1.6 35μm 1.8~ Surface Roughness(Ra) Flexural Modulus(Lengthwise) μm GPa Dielectric Constant Dissipation Factor 1MHz 4.4~ C96/2/65 1GHz 1MHz.24~ C96/2/65 1GHz Volume Resistivity C96/2/65 Ω cm ~ Surface Resistance C96/2/65 Ω ~ Insulation Resistance C96/2/ ~ Ω C96/2/65+D2/ ~ Water bsorption Flammability(UL94) E24/5+D24/23 %.4~.8(1.6mm) V The contents of this report are based on the results of experiments conducted by HITCHI CHEMICL and do not represent a guarantee of the values for each property. Before using this product, please study its properties, methods for using it, etc., using this data as a reference. 48

50 Tracking resistance 1 Method IEC6112 Number of droplets E668T Type(K) E668(General CEM3) Voltage(V) Electrolyte Voltage Detection Platinum Electrode Sample 6 Base Glass plate NH4Cl(.1%) 1~6V.5/2sec. Nozzle 4±.1mm 35±5mm 49

51 5 MEMO

52 Fine Patterning Material Copper Foil for Fine Patterning PFEL P52 5/5 1/1 15/15 2/2 25/25 3/3 35/35 4/4 PFEL 51

53 Copper Foil for Fine Patterning PFEL ProfileFree Copper Foil is Suitable for Fine line Patterning with the Surface Roughness 1.~2.μm(adhesive side). Features PFEL is a copper foil that is appropriate for fine line patterning with semiadditive process(sp)using rough shapes of primer made with the copper profile. PFEL has high peel strength for plating copper. High flexural modulus substrates with using prepregs. pplications Semiconductor package substrates High density multilayer PWB Part Number Copper Foil Thickness(μm)Special Surface Treatment(μm)Roughness(μm) Composition Process PFEL Ra :.3~.4 Rz : 1.5~2.5 SP *1 PFEL3 3 2,4 Ra :.3~.5 Rz : 1.5~2.5 Ultra low profile copper foil PFEL2 2 2,4 Ra :.3~.5 Rz : 1.5~2.5 SP *1 PFEL Ra :.3~.5 Rz : 1.5~2.5 Special surface treatment MSP *2 PFEL1.5SP Ra :.2~.3 Rz : 1.5~2.5 1:fter lamination of the material to the prepreg,the copper foil is etched out,and the special surface treatment with appropriate roughness made by a replica of the copper profile etched out remains on prepreg surface.this process is SP using this replica. 2:Semi additive process using thin copper foil as seed layer for having E, less copper +copper on both patterming and via plating purpose. Surface Ra:.3~.5 Ra:.2~.3 PFEL PFEL SP Fine patterning with SP 2μm 2μm Design L/S=1/1μm with PFEL (Exposure LDⅠ) Design L/S=7/7μm with PFEL SP (Exposure LDⅠ) Design L/S=5/5μm with PFEL SP (Exposure Stepper) 52

54 Copper peel strength Plating copper peel strength Copper peel strength(kn/m) Ra:1.~3.μm Ra:.3~.5μm Ra:.3~.5μm Ra:.2~.3μm Plating copper peel strength(kn/m) Ra:.3~.5μm Ra:.3~.5μm Ra:.2~.3μm. Standard Ultra Low profile copper foil copper foil PFEL PFEL SP. Ultra Low profile copper foil PFEL PFEL SP MCLE77G Type(R) Copper foil 1.5μm with plating copper 2μm MCLE77G Type(R) plating copper thickness 2μm Fine patterning process Buildup materials Laminate Buildup material Core Press PFEL PFEL Prepreg Core Viahole formation Viahole formation & Desmear Desmear Copper foil Etching SP The roughness was formed by desmear SP The roughness was formed by a replica of the copper profile. Stable surface shape 53

55 54 MEMO

56 Epoxy dhesive Film LowElastic dhesive Film S26 P56 55

57 LowElastic dhesive Film S26 Epoxy dhesive Film Features Good adhesivity. Low elasticity. Standard Specifications Part Number S26 Type pplications Electric and electronic equipment. Ceramic oscillation device. Electric highprecision position device. ctual Thickness 25μm, 5μm, 75μm Carrier Film Thickness 75μm(PET) Characteristics(CStage) Item Storage Modulus Tg CTE Peel Strength *1 Breakdown Voltage *1 Volume Resistivity *1 (<Tg) (>Tg) Condition DVE(25 ) DVE TM Unit MPa ppm/ kn/m kv Ω c m ctual Value S26 1~12 5~7, 19~21 11~13 14~16 1.8~2. 7.~ ~ Test Method (IPCTM65) *1)Board characteristics(copper foil 35μm/S26/L2mm). Characteristics(BStage) Item Condition Unit ctual Value Test Method (IPCTM65) Volatile Content 17 15min. weight method wt% 3 56

58 KOBELITE LMINTE KELGEF KEL571 (Only nonwoven aramid structure) KEL973 (Composite structure of nonwoven aramid and polyester) P58 57

59 KOBELITE LMINTES Table of article numbers Part Number Division Resin Base material KELGEF (R) Glass fabric KEL9383NT KEL571 KEL973 Epoxy Glass fabric, Nonwoven glass fabric Nonwoven aramid fabric Nonwoven aramid fabric, Polyester fabric Color Natural color Grades JIS NSI ELGEF FR4. CEM3 Equivalent Item UL Features 94V Good insulation resistance Good strength High precision thickness 94V Good insulation resistance Good punching performance Reduction scratch High precision thickness pplications Insulation spacer, FPC brace board, Retaining board for polishing Insulation spacer, FPC brace board Retaining board for polishing Thickness(mm) Size(mm).1~2..2~2.5 1.~1.6.2~2..6~2. 1,2 1,2 ctual thickness and tolerance ctual thickness JIS KOBELITE tolerance tolerance KELGEF KELGEF(R) KEL9383NT KEL571 KEL973 ±.2 ±.2 ±.2 ±.3 ±.1 ±.3 ±.3 ±.1 ±.3 ±.3 ±.12 ±.1 ±.3 ±.3 ±.13 ±.12 ±.3 ±.3 ±.3 ±.15 ±.15 ±.4 ±.4 ±.15 ±.15 ±.4 ±.4 ±.4 ±.15 ±.15 ±.5 ±.15 ±.5 ±.5 ±.2 ±.2 ±.2 ±.2 ±.6 ±.6 ±.2 ±.2 ±.2 ±.8 ±.8 ±.23 ±.23 ±.2 ±.22 ±.8 ±.8 ±.25 ±.25 ±.2 ±.14 ±.1 ±.3 ±.3 ±.2 ctual thickness JIS tolerance ±.35 ±.4 ±.55 ±.6 ±.7 ±.8 ±.9 ±1.1 ±1.1 ±1.3 KELGEF ±.35 ±.4 ±.55 ±.6 ±.7 ±.8 ±.9 ±1.1 ±1.1 ±1.3 1.In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker one. 2.Thickness guarantee area is 92 92mm, center of 12 12mm (Only KELGEF(R),KEL571,KEL973) Water absorption(jis K 6912) Condition:E24/5+D24/23 Unit (%) Part Number KELGEF Thickness(mm) JIS ELGEF Warp &Twist Standard Thickness(mm) < 3. 3.< 5. 5.< 7. 7.< 1. 1.< < 2. Unit (%) The ratio of the warp & twist ageinst 1mm KOBELITE JIS

60 Characteristics(t1.mm) Item Condition Unit KELGEF/KELGEF(R) ctual Value KEL9383NT KEL571 KEL973 Withstand Voltage Vertical To Layer C9/2/65 kv/mm 18~3 18~3 Insulation Resistance C9/2/65 C9/2/65 +D2/1 Ω ~ ~ ~ ~ ~ ~ Dielectric Constant (1MHz) C9/2/65 C9/2/65 +D24/23 4.5~5. 4.6~ ~ ~4.8 4.~ ~4.3 Dissipation Factor (1MHz) C9/2/65 C9/2/65 +D24/23.16~.25.2~.26.15~.22.18~.23.2~.22.21~.23 Flexural Strength Length Width N/mm 2 6~65 45~5 35~41 29~35 33~4 3~38 2~22 17~19 Flexural Modulus Length Width kn/mm 2 22~24 19~22 8.4~ ~8. 7.4~ ~6.8 Compressive Strength vertical parallel N/mm 2 4~55 25~3 Izod Impact Strength J/cm 5.~6.5 Cleavage Strength kn 7.84~9.81 ir Flammability E2/18 No abnormality No abnormality No abnormality No abnormality Specific Gravity 1.7~ ~ ~ ~1.6 Chemical Resistance HCI NaOH ( * 1) No abnormality No abnormality No abnormality No abnormality No abnormality No abnormality No abnormality No abnormality Flammability (UL94) V V ptitude Punching Temperature 15~16 X 12~14 2~22 6~8 27~3 CTE *2 Y (3~8 ) ppm/ 14~16 22~25 8~1 38~4 Z 5~7 4~5 15~12 The contents of this report are based on the results of experiments conducted by HITCHI CHEMICL and do not represent a guarantee of the values for each property. Before use, please study its properties, methods for using it, etc., using this data as a reference. * 1)Concentration:3±.2%, 2±2. ppearance checked with naked eyes after soaking for 24hrs. * 2)Heating Rate:1 /min. 59

61 KOBELITE LMINTE KELGEF Glass epoxy laminates Features Precise thickness and low warpage compared to the standard epoxy glass laminates. pplications Retaining board for polishing DM substrate Polishing products Hard disk Standard Specifications Part Number Type KELGEF (R) Please consult in advance for production support. Master Size(Length Width)(mm) ctual Thickness(mm)