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1 Incorporating:

2 Contents Section Page The Company 3 Contacts 4 Quality Approvals 5 Capability and Design Guidelines 6 Current Technology / Future Technology 6 Maximum PCB dimensions 7 PCB types 7 Popular Interconnection Methods / Design Guidelines 8 Annular Ring and Feature Clearances 12 Solder resist and legend 13 Profiling 14 Maximum panel sizes 15 Controlled Impedance 16 Electrical test 17 Materials 18 Rigid 18 Flexible 19 Copper weight conversion 20 Finishes 21 Turnaround time 22 Equipment list 23 Key Plant, Proposed New Plant 23 Stevenage Circuits March 2011 Page 2 of 30

3 The Company The Stevenage Circuits Group manufactures prototype and medium volume bare Printed Circuit Boards (PCBs). We specialise in S/S, D/S, Multilayer, Flexible, Flexi-rigid, HDI and Buried Passive requirements. Utilising our U.K. based facilities and offshore approved partners we offer a dynamic process for supplying you: Time-critical Prototypes and Cost-Sensitive Volume Premium Fast Track Service We can supply product to mainland Europe within 48 hours. We consider ourselves a key strategic partner to our customers. Our sister company Tru-Lon also offers PTFE and metal-backed solutions to the microwave industry. Stevenage Circuits (incorporating Tru-Lon): Established: 1971 Turnover: 11 million (potential for 15 million) Number of employees: 150 Factory Size: 70,000 sq ft Location: Stevenage, Herts. UK. (55km N of London) Status: Privately owned CEO Stuart Spink Stevenage Circuits March 2011 Page 3 of 30

4 Contacts (Stevenage Site) HR Director: Sales and Marketing Director Special Projects Director: Engineering Director: Sales Manager: Operations Manager Process Engineering Manager: QMS Manager: QC Manager: Engineering Manager: Mark Brown Rob Brown David Brown Jeremy Rygate David Wyllie Tim Gee Jonathan Calver Beverley Cording Paul Estwick Phil Firth Tel: +44 (0) Fax: +44 (0) Steve Stokes-Geddes Stevenage Circuits March 2011 Page 4 of 30

5 Quality Approvals Underwriters Laboratories (File: E107779) V0 rating for FR4 V0 rating for High Tg FR4 V0 rating for FR4 suitable for lead free assembly V0 rating for Flex V0 rating for Flex-rigid using FR4 V0 approval for reinforced polyimide BS EN ISO 9001:2008 (Certificate number: FM 53484) IECQ to BS (CECC) (Certificate number: 022/QCA) Rigid S/S, D/S, M/L Flex Flexi-rigid All above with through, blind and buried holes (mechanically and laser drilled) Future Quality Approvals Underwriters Laboratories Additional FR4, Flex and Polyimide Stevenage Circuits March 2011 Page 5 of 30

6 Capability and Design Guidelines Current Technology Maximum number of layers (BS approved): 36 Minimum track: 75µm (3 mil) Minimum gap: 75µm (3 mil) Smallest mechanically drilled holes: 150µm (6 mil) Smallest mechanically drilled blind holes: 150µm (6 mil) Smallest laser drilled holes: 25µm (1 mil) Smallest laser drilled blind holes: 50µm (2 mil) Smallest buried holes: 25µm (1 mil) Aspect ratio max - through holes: 16 : 1 (FHS) Aspect ratio max - blind holes: 1 : 1 (FHS) Drilled hole edge to copper (M/L rigids): 175µm (7 mil) Drilled hole edge to copper (F/Rs): 225µm (9 mil) Controlled Impedance +/- 10% Vias in S/M pads Planar transformers Chip on-board and component in-board Edge plating Edge plated half holes Edge plated fingers Buried resistors +/- 15% Solder resist laser ablation Laser structuring (copper pattern) Resin filled vias Copper filled blind vias Buried Capacitance (no licence required) Future Technology (within 1 year) Minimum track: 50µm (2 mil) Minimum gap: 50µm (2 mil) Drilled hole edge to copper: 150µm (6 mil) Stevenage Circuits March 2011 Page 6 of 30

7 Maximum PCB Dimensions Size: >4 layers 26.2 x 19.2 < or = 4 layers 27.2 x 19.2 Thickness: 25µm - 4.8mm (6.0mm if sub-contracted processes used) PCB Types Single Sided Double Sided Multilayer (including sequential build) Stepped multilayer High Density Interconnect (HDI) Flexible Flex-rigid Controlled Impedance Surface mounted and buried heatsinks Blind and buried vias Buried resistors Fibre Optics in board Stevenage Circuits March 2011 Page 7 of 30

8 Popular interconnection methods and design guidelines (8 layer circuit) 1) Standard Plated Through Hole: C o p p e r fe a t u r e to b e a t le a s t L a y e r m m a w a y fr o m d r ille d h o le ( m m if F /R ) T r a c k (7 5 m ic r o n ) D r ille d h o le d ia m e t e r is m m m in im u m ( F in is h e d H o le S iz e ( F H S ) is 0.1 m m le s s th a n d r ille d s iz e ) A s p e c t r a t io (th ic k n e s s : F H S ) is 1 6 : 1 m a x im u m F o r 1.6 m m th ic k P C B, m in im u m d r ill s iz e is 0.2 m m P a d s iz e a t le a s t m m b ig g e r th a n d r ille d h o le ( m m if F /R ) Stevenage Circuits March 2011 Page 8 of 30

9 2) Laser drilled blind vias: PTH Laser drilled blind microvia 1-2, 7-8 Layer Capture pad to be at least 0.2mm larger in diameter than drilled hole Target pads can be 0.2mm diameter 1 for 0.1mm hole Target pad to be at least 0.1mm larger in diameter than drilled hole Laser vias can exit to surface mount pads on outer layers, with very little solder loss on assembly Drill diameter 0.025mm - 0.2mm (FHS 0.050mm less) Aspect ratio 1:1 max after plating Recommendation between layers 1 and 2: a) 1 x 106 pre-preg (0.050mm) and blind drill at 0.1mm or b) 2 x 106 pre-preg (0.100mm) and blind drill at 0.15mm 3) Buried vias: PTH Buried vias 2-3, 6-7 Layer 1 Pad size to be at least 0.20mm bigger than drilled hole Drilled hole diameter 0.025mm - 0.2mm Can be laser drilled Aspect ratio 16:1 maximum Stevenage Circuits March 2011 Page 9 of 30

10 4) Laser blind sequential bond: L a y e r B u rie d P T H L a s e r d rille d b lin d h o le 1-2, 7-8 (re s in fille d ) a s d e s c rib e d e a rlie r P T H s fro m 1-8 a re o p tio n a l. If n o t re q u ire d, o u te r la y e rs c a n c o n ta in o n ly s u rfa c e m o u n t p a d s A ll v ia s m u s t e x it to p a d s, s o 2-7 h o le s m u s t h a v e p a d s o n 2 a n d 7 5) Blind sequential bond: Layer "Double multilayer" with blind holes filling and plating over All vias must exit to pads, so 1-4 and 5-8 holes must have pads on 4 and 5 Stevenage Circuits March 2011 Page 10 of 30

11 6) Double laser blind sequential (2 bonds): Buried PTH Laser drilled blind holes 1-2, 2-3, 6-7, 7-8 Layer ) Double laser blind sequential (3 bonds): Buried PTH Laser drilled blind holes 1-2, 2-3, 6-7, 7-8 Layer Etc Stevenage Circuits March 2011 Page 11 of 30

12 Annular Ring and Feature Clearances Cross-section after plating. 1 Clearance 2 Annular Ring Layer 1 Core 1 2 Layer 2 Layer 3 Core Layer 4 Layer 5 Layer mm (7 mil) clearance over drilled hole 0.10mm (4 mil) annular ring over drilled hole size. Track to Feature Clearances Minimum of mm (3 mil) clearance between pad and track Minimum of mm (7 mil) clearance between hole and track Stevenage Circuits March 2011 Page 12 of 30

13 Solder Resist and Legend Solder Resist Rigid circuits Sun Chemicals Imagecure XV501T4 (Argus air spray system) Colour matt green, red, black and blue. Flexible circuits Nippon Polytech NPR-80/ID100T (screen printed) Colour brown Nominal Thickness 25µm (min 12.5µm) We can plug through via holes using solder resist with a drill size of 0.3mm Legend Peel Mask Photoimageable or silkscreen Minimum line width of 150µm (6 mil) Standard colour White or Yellow Nominal Thickness 250µm (10 mil), min 200µm (8 mil) Solder resist features: (A) Minimum resist dam: (B) Minimum resist clearance (to ensure no encroachment): Solder resist registration: 75µm (3 mil) 50µm (2 mil) +/- 50µm (2 mil) A B Stevenage Circuits March 2011 Page 13 of 30

14 Profiling Copper to Edge: Rout Diameters: Rout Tolerance: Chamfer Angles: Scoring: Scoring Tolerance: 0.25mm (10 mil) 0.6, 0.8, 1.6, 2.4 mm standard Others: please enquire +/-0.1 mm 20º, 45º standard Dimension A (copper to edge of PCB) 0.4mm (16 mil) minimum Dimension B (residue) 0.2mm weak, 0.3mm medium, 0.4mm strong Scoring cut angle 30º +/-0.1 mm (4 mil) Scoring Dimensions Knife Edge Tooling for Flexible Circuit Technology (+/- 0.2mm edge to pattern) Laser profiling with 20µm cut (+/- 25µm edge to pattern) Stevenage Circuits March 2011 Page 14 of 30

15 Maximum Panel Sizes (Usable circuit area is 2" less in each axis) Process Maximum (") Additional Exposure 21 x 24 Outer Layer 21 x 26 Inner Layer Plating 24 wide Machining 21 x 30 Drilling 18 x 24 Routing Bonding 21 x 28 Surface Finish 18 x 24 Nickel/Gold 24 x 24 HASL 24 wide Immersion tin 24 wide Silver Plasma desmear 18 x 24 Test 25.6 x 26.4 Flying Probe and Bed of Nails tester Silkscreen 21 x 26 Conveyorised 24 wide Desmear, Resist, Etch, Bond Treat Direct Metalisation Our preferred panel sizes are: 18 x 12, 18 x 16 (consult for flex), 21 x 18 (consult for flex) Consult for: 21 x 12, 21 x 16, 24 x 18, 26 x 21* and 28 x 21* * Limited processes Stevenage Circuits March 2011 Page 15 of 30

16 Controlled Impedance Test Equipment: Polar CITS500 Differential Impedance Tester Dielectric Constant: Tolerance: 3.85 or 4.3 after bonding standard 10% standard 5% special Some examples: Surface microstrip Embedded microstrip Coated microstrip Symmetrical stripline Offset stripline Edge-coupled surface microstrip Edge-coupled embedded microstrip Edge-coupled coated microstrip Edge-coupled symmetrical stripline Edge-coupled offset stripline Broadside-coupled stripline For further enquiries, please contact engineering on Stevenage Circuits March 2011 Page 16 of 30

17 Electrical Test Machine Types: Test type: Pitch: Pad size: Active test area: Panel size: Flying Probe test Double sided, simultaneous test to supplied data 100µm (4 mil) minimum 80µm (3 mil) minimum 23.6 x 24.4 maximum 25.6 x 26.4 maximum Board thickness: 0.025mm - 10mm ( ) Insulation test: Continuity test: > 10 Mohm standard (can test > 0.5Mohm to 150Mohm) < 10 ohm standard (can test < 0.05ohm to 8Kohm) Test Voltage: 40 V (can test up to 250 V) Stevenage Circuits March 2011 Page 17 of 30

18 Materials A) Rigid materials Material Multifunctional FR4 (Lead free assembly) Tg ( C) Dk Df TCE (z) (%) (50-260ºC) Application / Comments Popular PCB material used in computer and telecommunication applications etc. Can also have specific CTI. Higher Tg than Difunctional Laser drillable Easier to laser drill giving smoother hole walls pre-preg Getek Improved thermal and electrical properties High Tg FR Withstands higher temperatures BT / Epoxy Withstands higher temperatures. Better electrical properties lower Dk and Df Cyanate Ester Withstands extremely high temperatures and has excellent electrical properties Polyimide Withstands extremely high temperatures due to high Tg and low TCE (z). Low Df PTFE Alternatives Properties approaching PTFE but can be processed like FR4. Optimum frequency range 100MHz 15GHz PTFE Optimum frequency range 1 90GHz Metal backed PTFE SI glass Resin Coated Copper (RCC) Halogen free Thermount 280 Can be thick Aluminium, Brass or Copper backed Better signal integrity Ideal for outer layers with laser micro-drilling down to penultimate layers, bonded to rigid core. No re-inforcement Environmentally friendly Aramid fibre reinforcement. Epoxy or Polyimide. Easily laser ablatable. Improved / repeatable dimensional stability. Ideal for sequential bond Higher Glass Transition Temperature (Tg) gives lower Z axis TCE, giving better reliability at extreme temperatures, better in-service repair capability and the ability to produce thicker boards with higher aspect ratio holes enduring higher temperatures Lower Dielectric Constant (Dk) gives increased signal speeds Lower Dissipation Factor (Df) minimises signal attenuation Copper from 5µm to 140µm Stevenage Circuits March 2011 Page 18 of 30

19 B) Flexible materials Material Manufacturer Adhesive type Copper clad extruded polyimide Coverlay Bond ply (ad. / base / ad.) Bond ply (pure adhesive) Flex photoimageable solder resist Thickness Tg ( C) Dk Df Flam. Base (mil) Ad. (mil ) Cu. (µm) rating Espanex SB-.. Adhesiveless 1, 2-12, 18, V0 series 35, 70 Du Pont AP-.. Adhesiveless 1, 2, 3-12, 18, V0 series 35, 70 Toray Adhesiveless 2-2, 4 V0 Du Pont LF-.. Acryllic 1, 2, 3, 1 18, 35, 40 Adh None series 4, 5* Base Du Pont FNC-.. series Epoxy 1, 2* , 35, V0 Espanex SPC-... Modified V0 series polyimide Du Pont LF0-.. Acryllic 1, 2, 3, 1, 2, - 40 Adh. 3.7 None series Base Du Pont FNCC- Epoxy V0...series Du Pont LF0-.. Acryllic 1, 2, 3 1, 2, - None series 3 Espanex SPB-.. series Du Pont FNCA-...series Nippon Polytech NPR-80/ID100T Modified - 1.4, V0 polyimide Epoxy V0-1 approx. * Thicknesses exclude adhesive on both sides - - V0 Our preferred flex material is the Espanex range, which is manufactured by the Nippon Steel Chemical company (NSC). See for further details We can also use and hold reasonable stocks of DuPont and Toray adhesiveless materials and DuPont LF- series We hold UL rating (V0) for flex and flex-rigids that use Espanex flex and FR4 rigid materials Other materials available on request Polyester based materials can also be obtained for low temperature applications Stevenage Circuits March 2011 Page 19 of 30

20 Copper Weight Conversions Oz / sq ft µm mil (0.001 ) Mixed copper weights available Stevenage Circuits March 2011 Page 20 of 30

21 Finishes Finish Thickness Typical uses Electroless Nickel / Immersion Gold (ENIG) Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG or Super or Universal finish) 3 5µm Ni 0.1µm max Au 3 5µm Ni µm Pd µm Au Soldering Aluminium wire bond Touch pads Soldering Aluminium wire bond Gold wire bond Touch pads Electroplated Hard Gold 2.5µm pore free Au Edge friction contacts Pogo pin contacts All over friction contacts Electroplated Soft Gold 2.5µm pore free Au Soldering Aluminium wire bond Gold wire bond Touch pads Pogo pin contacts Electroplated Ni / Electroplated Hard Gold 3-5µm Ni 1.5µm Au HASL (63:37) Variable, solderable Soldering Electroplated Tin/Lead + Immersion Tin Soldering Organic Solderability Preservative Soldering Electroless Nickel / Electroplated Hard Gold 3 5µm Ni 1.3µm min Hard Au Electroless Nickel / Electroplated Soft Gold 3 5µm Ni 1µm min Soft Au Edge friction contacts Pogo pin contacts All over friction contacts Edge friction contacts All over friction contacts Soldering Aluminium wire bond Touch pads Gold wire bond Pogo pin contacts Immersion Sterling Silver (Macdermid) µm Ag Soldering Aluminium wire bond Touch pads Immersion Tin (Atotech Stannatech) >1µm Soldering Carbon Key Pads Mixed and other finishes please enquire N.B. Nickel finish is not suitable for circuits that are flexed or require press fit connectors, due to its brittle nature. Stevenage Circuits March 2011 Page 21 of 30

22 Turnaround time (working days) Standard Fast D/S 10 2 Multilayer 15 3 (depending on layer count and number of bonds) Flexible 15 5 Flexi rigid Faster turnaround times are available dependent on the product type Stevenage Circuits March 2011 Page 22 of 30

23 Key Plant EQUIPMENT LIST Laser Direct Imaging (LDI) (2 off) Laser drills (4 off) Auto-registration exposure units for outer layers and solder resist Direct and Electroless metalisation Pulse and DC plating Copper Via Fill Plating line Ink Jet legend printer Resin Fill via equipment Thin core handling Air-spray Solder Resist High temperature, vacuum assist presses (3 off) X-ray tooling up to 36 Layers (post etch and post bond) Immersion tin line (Atotech) Frontline Genesis and InCam for CAM Electroless Nickel / Immersion Gold line (PAL) Controlled depth routers Automatic Final Inspection machine Stevenage Circuits March 2011 Page 23 of 30

24 CAM (Graphics handling and panelisation) Work Station Genesis (6 off) Orbotech Work station Genesis X terminal (3 off) Laser photoplotter 7008 EF Data link to drilling Data link to routing Data link to laser Data link to AOI Data link to BBT Orbotech Orbotech Excellon Technic Electric Orbotech Orbotech Raid System with DAT backup Fire wall FTP site Linux operating system Linux MULTILAYER PRODUCTION Inner layer chemical cleaning line Holmuller 2003 Cut sheet laminator Hakuto 2008 Laser direct imaging system DP100SL Orbotech 2003 Hot roll laminator Dupont 1994 Perkin Elmer Exposure Frame with L-Config Frames Perkin Elmer 2000 Develop, acid etch and strip line Holmuller 2005 Inner layer adhesion promoting line Holmuller 2009 Laminar flow lay up station (for flexis) Slee 2008 Bonding press - automatic system Burkle 1995 Bonding presses - high temperature (2 off) Burkle 1998 / 2003 Optiline post etch punch Multiline 1995 Stevenage Circuits March 2011 Page 24 of 30

25 AUTOMATIC OPTICAL INSPECTION V309 with Blaser Upgrade Orbotech 1996 Discovery AOI Orbotech 2008 Verismart A verification station (x2) Orbotech 2008 DRILLING Post bond X-ray Tooling up to 36 Layers (with SPC for material movement) Multiline 2000 Real time X-ray verification system Glenbrook 1996 Multihead auto load small hole drilling machine with Z axis control, auto drill gauging and management Hitachi 1996 Single spindle auto load small hole drilling machine with Z-axis control, auto drill gauging and management (x4) Schmoll 2003 Two spindle auto load small hole drilling machine with Z-axis control, auto drill gauging and management (x2) Schmoll 2003 Posalux Ultraspeed Head auto load drill with laser measuring, Quick Drill and adaptive drill functions Posalux 2000 Laser drill (UV YAG) (x3) ESI 2000, 2005, 2007 Laser drill (UV YAG) LPKF 2003 Stevenage Circuits March 2011 Page 25 of 30

26 DRILLED HOLE PRE-TREAT Plasma desmear system for high Tg and flexirigid production Plasonic 1998 Conveyorised desmear line with ultrasonics for small hole and blind via technology FSL 1998 DIRECT METALLISATION Brushing machine with copper recovery unit Pola Masa 1993 Shadow Line Hollmuller 2008 PHOTOMECH Paragon 8800i Laser Direct Imaging Orbotech 2009 Conveyorised developer Cemco FSL 2004 Shipley 1600SPC automatic Cut-Sheet Laminator Shipley 2000 Vacuum Laminator Rohm Haas 2007 Automatic exposure system Bacher 2002 Laminator Morton Int BASE METAL PLATING Pulse Plating Upgrade on Copper and Tin Electro-plating Line F.T.L Side to side pulse rectification system Chemring 1995 Copper via fill Veratronic 2008 OUTER LAYER CHEMICAL PROCESSING Outer layer etch and Tin / Lead strip Holmuller 2001 Stevenage Circuits March 2011 Page 26 of 30

27 PHOTOIMAGEABLE SOLDER RESIST MecEtch surface preparation Cemco 2008 Air-spray Solder Resist Applicator Argus 2000 Automatic Exposure System (x2) Bacher 2001 Ink Jet legend printer Microcraft 2007 Solder resist developer Cemco FSL 2004 Automatic brushing machine with copper recovery system Pola and Masa 1997 HMW 680GW water-cooled exposure frame Orc 1990 SCREEN PRINTING Resin Fill THP30 ITC 2006 Printing frame (3 off) Kippax * Automatic printing frame Argon 1997 Exposure frame Kippax 1994 Conveyorised UV curing oven Hedinair 1990 SOLDERABLE FINISHES Electroless Nickel / Immersion Gold PAL 2004 Immersion Tin (Atotech Stannatech) FTL 2008 Sub-Contracted : Hot Air Solder Levelling (leaded and lead free) Electrolytic Nickel and hard Gold Electroless Nickel / Palladium Electroless Nickel / Palladium / Gold Palladium Sterling Silver Stevenage Circuits March 2011 Page 27 of 30

28 ELECTRICAL TEST Emma Vertical Test Machine 2 off Microcraft probe roving probe bare board tester ATG probe roving probe bare board tester (x 2) ATG 1999 PROFILING Two spindle, depth control Drill/Routers (x2) Lenz CNC MLB2 Drill/Router Wessel 1997 Vero Router 1500 Tecnic 1992 Jump scoring machine SL 13.9 Telmec SPA 1994 CNC drill router Wessel 1996 Post Rout Cleaner IS 2001 Rule die punch for thin substrates Samstrong 1998 Laser drill (UV YAG)(x3) ESI 2000, 2005, 2007 Laser drill (UV YAG) LPKF 2003 MISCELLANEOUS MACHINING EQUIMENT Edge bevel machine Astro Tech * PROGRAMMING / MEASURING MahrVision MS660 3 axis co-ordinate measurement machine Mahr 2007 Stevenage Circuits March 2011 Page 28 of 30

29 QUALITY CONTROL Full range of BS9000 CECC test equipment Cemco * Temp and Humidity Cycling oven Sharetree 2009 Microscope Trinocular AX10 Zeiss 2009 Microscope Trinocular BX51 Olympus 2004 Micro sectioning equipment Struers 2008 ph meters Pye 1995 Chemical Analysis Equipment Gallenkamp MZ6 stereo Microscope (40x magnification ) Leica 2007 SMZ-168 Stereo microscope (40x magnification) + camera Motic 2008 Controlled impedance measurement system (T.D.R.) Polar 2006 Eddy current through hole tester (2 off) CMI 1995 X-ray Fluorescence coating thickness measure Fischer 1999 Scientific Automatic Final Inspection machine Visper 2010 PRODUCTION CONTROL Quotation, job tracking, data collection system Softwires 2000 ENVIRONMENTAL Rinse water copper removal system BEWT 1994 Spent etch copper plate out system BEWT 1992 Local rinse water copper recovery system (3 off) Retec 2008 Local rinse water recovery system Adept 2008 De-ionised water purifiers Elga 1992 Soft water system Adept 2005 Reverse osmosis system Elga 1997 Stevenage Circuits March 2011 Page 29 of 30

30 Caxton Way Stevenage Herts SG1 2DF England Tel: +44 (0) Fax: +44 (0) Why not visit our web site: Stevenage Circuits March 2011 Page 30 of 30