Highly Reliable Flip-Chip-on-Flex Package Using Multilayered Anisotropic Conductive Film
|
|
- Jacob Arnold
- 6 years ago
- Views:
Transcription
1 Journal of ELECTRONIC MATERIALS, Vol. 33, No. 1, 2004 Regular Issue Paper Highly Reliable Flip-Chip-on-Flex Package Using Multilayered Anisotropic Conductive Film MYUNG JIN YIM, 1,3 JIN-SANG HWANG, 1 JIN GU KIM, 1 JIN YONG AHN, 1 HYUNG JOON KIM, 2 WOONSEONG KWON, 2 and KYUNG-WOOK PAIK 2 1. Department of ACF Development, Telephus Inc., Taejon, Korea. 2. KAIST, Department of Materials Science and Engineering mjyim@ telephus.com Anisotropic conductive lm (ACF) has been used as interconnect material for at-panel display module packages, such as liquid crystal displays (LCDs) in the technologies of tape automated bonding (TAB), chip-on-glass (COG), chipon- lm (COF), and chip-on-board (COB). Among them, COF is a relatively new technology after TAB and COG bonding, and its requirement for ACF becomes more stringent because of the need of high adhesion and ne-pitch interconnection. To meet these demands, strong interfacial adhesion between the ACF, substrate, and chip is a major issue. We have developed a multilayered ACF that has functional layers on both sides of a conventional ACF layer to improve the wetting properties of the resin on two-layer ex for better interface adhesion and to control the ow of conductive particles during thermocompression bonding and the resulting reliability of the interconnection using ACF. To investigate the enhancement of electrical properties and reliability of multilayered ACF in COF assemblies, we evaluated the performance in contact resistance and adhesion strength of a multilayered ACF and single-layered ACF under various environmental tests, such as a thermal cycling test (255 C/1160 C, 1,000 cycles), a high-temperature humidity test (85 C/85% RH, 1,000 h), and a high-temperature storage test (150 C, 1,000 h). The contact resistance of the multilayered ACF joint was in an acceptable range of around a 10% increase of the initial value during the 85 C/85% RH test compared with the single-layered ACF because of the stronger moisture resistance of the multilayered ACF and ex substrate. The multilayered ACF has better adhesion properties compared with the conventional single-layered ACF during the 85 C/85% RH test because of the enhancement of the wetting to the surface of the polymide (PI) ex substrate with an adhesion-promoting nonconductive lm (NCF) layer of multilayered ACF. The new ACF of the multilayered structure was successfully demonstrated in a ne-pitch COF module with a two-layer ex substrate. Key words: Flip chip, chip-on- lm (COF), anisotropic conductive lm, adhesion, reliability INTRODUCTION Anisotropic conductive lm (ACF) has been widely used as an interconnect material in at-panel display module packages, such as liquid crystal displays (LCDs), plasma display panel, and organic electroluminescence display, and ip-chip module packages, such as chip-on-glass (COG), chip-on- lm (COF), and (Received March 7, 2003; accepted July 21, 2003) chip-on-board (COB) because of its advantages of low-temperature processing to cure the lm below 150 C, a ne-pitch interconnect possible below 50- m pitch, an environmental friendly interconnect without lead, and ux-free or solvent-free material and processing. The COF is a new technology compared with COG and COB in the production of at-panel modules. For example, LCD module production using COF technology is in a growth stage because of its advantages 76
2 Highly Reliable Flip-Chip-on-Flex Package Using Multilayered Anisotropic Conductive Film 77 of ne-pitch interconnection, low contact resistance, and pretest capability compared with COG in the high-density, multifunctional LCD module, such as in mobile phones and personal digital assistants. 1 Furthermore, this technology has great potential in many other product applications that demand a nepitch interconnect and thin packages with a high level of reliability on various types of substrates, such as chip-scale packages, multichip modules, and radio-frequency integrated circuit (IC) packages. 2,3 In at-panel module fabrication, the geometry of the COF is very similar to that of tape automated bonding (TAB), and the bonding process is similar to that of COG. The difference is in the substrate, COF has a two-layer structure, normally Cu, and polyimide (PI), which is thinner, has a higher density and better exibility and is more durable in high temperature than TAB with a three-layer structure (Cu, adhesive, and PI), as depicted in Fig. 1. In COF technologies, there are several alternatives for interconnect materials and processes, such as Au-to-Sn joining, solder joining, ACF joining, and nonconductive paste. Among them, ACF joining technology has been applied as the main bonding method in LCD application. 4,5 The ACFs, which are composite materials composed of an adhesive polymer resin and conductive particles of metal-coated polymer particles, have been developed to form ne-pitch and reliable interconnects of IC bumps on ex substrates. The COF s substrate is a two-layer structure without an adhesive layer and, therefore, has a weak adhesion property for ACF materials. It is necessary to improve the adhesion property between the IC chip, ACF, and two-layer ex substrate for the reliability requirements of the COF module. In addition, nepitch interconnection is the basic requirement using the ACF method for IC packaging and other potential high-end applications. In this paper, we present a multilayer ACF that has functional layers on both sides of a conventional ACF layer to improve interface adhesion and control the bonding property during thermocompression bonding and the resulting reliability of the interconnection using the developed ACF for COF module assembly. Material Preparation EXPERIMENT The multilayered ACF was prepared by multiple coating of the release lm and slitting processes that cut the ACF to the speci c width. Figure 2a and b shows that the multilayered ACF has functional layers on both sides of the ACF layer that has conductive llers and nonconductive llers (NCFs). a Fig. 1. Schematic drawings of (a) TAB (3 layer structure) and COF (2 layer structure) lm and their applications in LCD module assembly using ACFs. b a b Fig. 2. Schematic drawings of (a) multiple-layered ACF, (b) cross-section view of ACF by SEM and (c) COF bonding process using developed ACFs. c
3 78 Yim, Hwang, Kim, Ahn, Kim, Kwon, and Paik Table I. Speci cation of Test Samples Test Driver IC Chip size X 5 14 mm, Y mm Bump material Au (electroplated) Bump height 18 m Bump size 50 m 3 50 m Bump pitch 70 m Test Substrate Base lm PI, 22 m thick Conductor Cu, 12 m thick ACF Conductive Filler 4 m diameter Thickness 40 m Width 3 mm Functional layers have no particles inside the layer and good ow properties during thermocompression bonding. The functional layers have a low modulus of less than 100,000 dyn/cm 2 around 100 C before cure to be owed easily on the ne-pitched surface of the COF substrate. The ACF layer with conductive metal-coated polymer balls of 4- m diameter has silica llers of 0.8 m to reduce the mobility of conductive llers during bonding to have more conductive particles between the ne-pitch bumps and electrodes of the ex substrate. Figure 2c shows the COF bonding process using the multilayered (triple-layered structure) ACF in this study. The speci cation of the test samples used in this COF experiment using multilayered ACFs is summarized in Table I. ACF Characterization To characterize the material properties of multilayered ACF, we measured the curing properties and the Tg value by differential scanning calorimetry (DSC). The cured ACF samples were prepared by placing the adhesive mixture in a convection oven at 150 C for 30 min then thinning to a 0.6-mm-thick dimension for thermomechanical characterization, such as thermomechanical analysis (TMA) for the coef cient of thermal expansion (CTE) measurement, thermogravimetric analysis (TGA) for decomposition temperature, and dynamic mechanical analysis (DMA) for modulus measurement, and the moisture absorption rate test. COF Bonding Test There are three process steps for the COF bonding. First, the gold bumps on the chip and the input/output pads on the ex substrates were aligned. The multilayered ACF was then laminated on the substrate (prebonding). Finally, bonding pressure of MPa and temperature of 210 C for 5 15 sec were applied to bond the chip on the ex substrate ( nal bonding). The chip is electrically connected to the substrate via entrapped conductive llers of the ACF. In ne-pitch interconnection, the number of conductive particles on the bump is very important to achieve low contact resistance. As the effective number of conductive particles trapped between the small area of bumps and substrate electrodes is higher, the contact resistance is lower because of the many conductive paths. Therefore, the effect of bonding parameters, such as bonding pressure, on the number of conductive particles on the bump and contact resistance were evaluated. The initial contact resistance was measured using a four-point probe, and adhesion properties of the IC chip on the ex substrate were measured using the 90 peel-strength test. Reliability Test To investigate the reliability of the COF module using multilayered ACF, the stability of the contact resistance of a single interconnect and adhesion strength of the driver IC on the ex substrate under environmental stress were evaluated. Contact resistance and adhesion strength were measured at each time interval until completion of the reliability tests. For the reliability test conditions, 85 C/85% RH high humidity and 150 C temperature condition for 1,000 h, C thermal cycling for 1,000 cycles condition with a precondition test of 30 C/70% RH for 192 h and two times of re ow at 275 C peak temperature were used. RESULTS AND DISCUSSION Material Characterization DSC Results The DSC curves in Fig. 3a show that the curing reaction was started when the temperature reached 118 C, the typical temperature of conventional ACF. The general bonding temperature of ACF for COF is in the range of C for 5 20 sec. Figure 3b shows the isothermal curing curves and time for full cure of the multilayered ACF at 180 C, 200 C, and 220 C. From those curves, the developed multilayered ACF can be cured 20 sec at 180 C, 15 sec at 200 C, and 10 sec at 220 C. The time for full cure of the ACF can be measured by this method. Thermomechanical Analysis Results The CTEs of multilayered ACF cured at 180 C for 20 sec were measured using TMA. The in ection point of the thermal expansion curve is de ned as TMA Tg (Tg TMA ). The Tg TMA was 121 C. The CTE of the multilayered ACF below the Tg TMA, de ned as 1, and the CTE above the Tg TMA, de ned as 2, are important parameters in determining the reliability of the COF assembly using ACF. A low CTE of adhesive can reduce the thermal strain induced by thermomechanical stress caused by thermal mismatch between chip and organic substrate, resulting in the high electrical stability during reliability test. 6 Figure 4 shows that the 1 is 100 ppm/ C higher than normal ACF for a COF of ppm/ C for its multilayered ACF structure with NCF layers on both sides of ACF layer. DMA Results Dynamic mechanical analysis was performed to evaluate the elasticity behavior of the multilayered
4 Highly Reliable Flip-Chip-on-Flex Package Using Multilayered Anisotropic Conductive Film 79 a Fig. 3. DSC curves of multi-layerd ACF samples. (a) Dynamic scan at 10 C/min ramp rate and (b) Isothermal scan at different temperatures. b Fig. 4. TMA analysis of the multi-layered ACF cured. Fig. 5. DMA analysis of the multi-layered ACF cured. ACF cured as a function of temperature. The DMA test specimens were prepared by placing a multilayered ACF to be cured in the oven at 150 C for 5 min. After that, the sample was removed from the oven, cooled to room temperature, and cut into a square with dimensions of about mm. The measurement was performed in single cantilever mode under 1-Hz sinusoidal strain loading. The elasticity of the multilayered ACF at 25 C was 1.45 GPa and 0.02 GPa at 150 C. The elastic modulus has an effect on adhesion strength, 7 and a modulus above 1 GPa at 25 C is preferred for high adhesion and low contact resistance. Therefore, the relatively low modulus of the multilayered ACF for ne-pitch COF application is better than the conventional ACF, which is single layered with a high density of conductive llers and a high modulus of 3 GPa based on the literature. Moisture Absorption Moisture absorption has a large in uence on the re ow stability and reliability of ip-chip-on- ex using ACF. When water is absorbed in the ACF and the ex, interfacial adhesion between chip-adhesive- ex becomes weak, and delamination occurs because of the moisture accumulation and moisture release from the adhesive in the center of the bonded area. Therefore, the amount of absorbed water and the diffusion rate along the interface are important material characteristics. 8 The amount of moisture absorption was measured by weighing the multilayered ACF cured before and after 85 C/85% RH for 500 h. An average 2.1 wt.% of moisture absorption rate was found, and this value is typical for epoxy-based ACF. Degree of Cure Measurement of Multilayered ACF Each specimen of multilayered ACF was cured in a hot plate for a speci ed time at different temperatures, the amount of heat generated was measured with a DSC unit, and the reaction rate was determined with the following formula: Reaction rate 5 (Q o 2 Q T )/Q o where Q o is the initial amount of heat generated, and Q T is the amount of heat generated after hardening. The degree of cure of ACF is one of the critical parameters in uencing assembly reliability because
5 80 Yim, Hwang, Kim, Ahn, Kim, Kwon, and Paik Fig. 6. Reaction rates (Degree of cure) of multi-layered ACFs for COF package at different temperature and time. as the degree of cure of the resin in ACF increased, the peel strength of the ACF interconnect increased. Figure 6 shows that curing at 230 C for 5 sec is necessary to have 90% cure of the multilayered ACF during the COF bonding process. Over 90% cure is essential for reliable adhesion of the ACF joint during nal bonding. COF Bonding Characteristics Figures 7 and 8 show the bonding pressure effect on the contact resistance and deformation of the conductive ball of the COF module using a multilayered ACF bonded at 210 C for 5 sec, 10 sec, and 15 sec. The results indicate that the contact resistance decreases with high bonding pressure and increasing bonding time. The effect of bonding pressure on contact resistance can be explained by the conductive ball deformation, as shown in Fig. 8, scanning electron microscopy pictures of the conductive ball trapped between the Au bump of the IC and the pad of the ex in the COF module with different bonding pressures at 210 C for 10 sec. As the gap between the Au bump and pad decrease with increasing bonding pressure, the conductive ball deforms more, and the contact area between conductive ball, bump, and pad surface also becomes larger. This is the Fig. 7. Effect of bonding pressure on the contact resistance of the COF assembly using multi-layered ACF at different bonding time at 210 C. relationship between bonding pressure and contact resistance. The contact resistance is dependent on the number of conductive particles on the bump. The number of conductive particles was measured as a function of bonding pressure and is shown in Fig. 9. The number of conductive particles was not in uenced by bonding time and pressure. The contact resistance is mainly dependent on the particle deformation and reaction rate of the epoxy in the COF bonding process. As characterized in Fig. 6, it is necessary to have the ACF over 90% reacted during the bonding process for high adhesion and low contact resistance of the ACF interconnect. The adhesion properties were evaluated by a 90 peel test, as shown in Fig. 10. The multilayered ACF has better adhesion properties under a high humidity and temperature environment compared with a conventional single-layered ACF. This is due to the enhancement of the wetting to the surface of the PI ex substrate with the adhesion-promoting NCF layer of the multilayered ACF. The moisture absorption was also prevented at the interface between the multilayered ACF, IC, and ex substrate because of the better wetting property. Adhesion strength of the COF assembly using the multilayered ACF was a b c Fig. 8. SEM pictures of deformed conductive particles in the COF assemblies using multi-layered ACF bonded at 210 C for 10 seconds with (a) 20, (b) 50, and (c) 80 g/bumps.
6 Highly Reliable Flip-Chip-on-Flex Package Using Multilayered Anisotropic Conductive Film 81 Fig. 9. Number of conductive particles on the bump for different bonding at 210 C for 10 seconds. Fig. 11. Reliability of COF assemblies using multi-layered ACFs in thermal cycle test. Fig. 10. Adhesion properties of multi-layered ACF in the COF assembly before and during high-temperature humidity test (85 C/85%RH, 500 hrs). maintained above 600 gf/cm during the 85 C/85% RH test, compared with the COF assembly using single-layered ACFs, which was lowered below 600 gf/cm. Reliability Test Results The COF assembly using the multilayered ACF was subjected to three major environmental stresses to characterize the reliability of the assembly by monitoring of the contact resistance. Before performing the reliability test, a preconditioning test of 30 C/70% RH for 192 h and two times re ow at 275 C peak temperature was performed. Figure 11 shows the reliability result from a temperature cycle test of C for 1,000 cycles to determine assembly integrity, such as electrical connection and adhesion between the ACF and ex when exposed to thermal stress from repeated expansion and shrinkage. The COF assemblies using the multilayered ACF and conventional ACF with a Fig. 12. Reliability of COF module using multi-layered ACFs in 85 C/ 85%RH test. single-layer structure showed stable contact resistance behavior that indicate suf cient durability under a thermal cycle environment. The contact resistance variations of COF assemblies using the multilayered ACF during the 85 C/85% RH condition and 150 C aging condition for 1,000 h are shown in the Figs. 12 and 13. The contact resistance increases of the multilayered ACF joint were in an acceptable range of around 10% during the 85 C/85% RH test compared with the single-layered ACF because of the stronger moisture resistance of the multilayered ACF and ex substrate. The contact resistances of both ACFs in the 150 C aging test were stable, con rming durability of COF assemblies. CONCLUSIONS In this paper, we presented a highly reliable COF technology using multilayered ACF with functional layers for the improvement of adhesion and reliabil-
7 82 Yim, Hwang, Kim, Ahn, Kim, Kwon, and Paik the single-layered ACF because of improved adhesion characteristics on the two-layer ex substrates. However, improvement of adhesion for reliability in severe environmental condition is needed. ACKNOWLEDGEMENTS Financial support from the Innovative Business Development Program under Small and Medium Business Administration and the Ministry of Commerce, Industry and Energy of Korea is gratefully acknowledged. Fig. 13. Reliability of COF assembly using multi-layered ACF in 150 C temperature storage test. ity. We manufactured a triple-layered ACF using multiple coating technology and measured its thermomechanical properties of curing property, CTE, modulus, etc. We also investigated the effect of bonding pressure, time, and temperature on contact resistance of the multilayered ACF and correlated its behavior with the number of conductive particles on the bump and reaction rate of the resin. The reliability tests of the COF assemblies of the multilayered ACF compared with the single-layered ACF showed that adhesion and electrical properties of multilayered ACF joints were superior to those of REFERENCES 1. P. Clot, J.F. Zeberli, J.M. Chenuz, F. Ferrando, and D. Styblo, Proc. of IEEE, US 24th Intl. Electronics Manufacturing Technology Symp. 1999, pp C. Kallymayer, H. Oppermann, S. Anhock, R. Azadech, R. Aschenbrenner, and H. Reichl, Proc. Electronic Packaging and Technology Conf. (EPTC) 1998, pp R. Fillion, B. Burdick, P. Piacente, L. Douglas, and D. Shaddock, Proc. Int. Conf. on Multichip Modules & High Density Packaging (New York: IEEE, 1998), pp S.M. Chang, J.H. Jou, A. Hsieh, T.H. Chen, C.Y. Chang, Y.H. Wang, and C.M. Huang, Microelectron. Reliab. 41, 2001 (2001). 5. Y.C. Chan, K.C. Hung, C.W. Tang, and C.M.L. Wu, Proc. Adhesive Joining Coating Technology in Electronics Manufacturing (Piscataway, NJ: IEEE, 2000), pp M.J. Yim and K.W. Paik, IEEE Trans. Comp. Packag. Technol. 24, 24 (2001). 7. T. Fujinawa, K. Kobayashi, M. Arifuku, and N. Fukushima, Hitachi Chem. Rep. 7, 21 (2002). 8. C.V. Veen, E. Janssen, B. Pahl, and J. Guenther, Proc. Eur. Microelectronics Packaging & Interconnection Symp. (Cracow, Poland: 2002), pp
Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity for Flip Chip Applications
Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity for Flip Chip Applications Myung-Jin Yim, Jin-Sang Hwang and Jin-Gu Kim ACA/F Dept., Telephus, Inc. 25-11, Jang-dong, Yusong-gu, Taejon
More informationHigh Reliable Non-Conductive Adhesives for Flip Chip CSP Applications
High Reliable Non-Conductive Adhesives for Flip Chip CSP Applications Myung-Jin Yim, Jin-Sang Hwang ACA/F Div., Telephus Co. 25-11, Jang-dong, Yusong-gu,, Taejon 35-71, Korea Tel.: +82-42-866-1461, Fax:
More informationAnisotropic Conductive Adhesives with Enhanced Thermal Conductivity for Flip Chip Applications
Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity for Flip Chip Applications Myung-Jin Yim, Jin-Sang Hwang and Jin-Gu Kim ACA/F Dept., Telephus, Inc. 25-1 1, Jang-dong, Yusong-gu, Taejon
More informationMicroelectronics Reliability
Microelectronics Reliability 52 (2012) 217 224 Contents lists available at SciVerse ScienceDirect Microelectronics Reliability journal homepage: www.elsevier.com/locate/microrel Enhancement of electrical
More informationThe Effect of Fillers in Nonconductive Adhesive on the Reliability of Chip-on-Glass Bonding with Sn/Cu Bumps
Materials Transactions, Vol. 52, No. 11 (2011) pp. 2106 to 2110 #2011 The Japan Institute of Metals The Effect of Fillers in Nonconductive Adhesive on the Reliability of Chip-on-Glass Bonding with Sn/Cu
More informationBonding Parameters of Anisotropic Conductive Adhesive Film and Peeling Strength
Key Engineering Materials Online: 5-11-15 ISSN: 1-9795, Vols. 97-3, pp 91-9 doi:1./www.scientific.net/kem.97-3.91 5 Trans Tech Publications, Switzerland Bonding Parameters of Anisotropic Conductive Adhesive
More informationHitachi Anisotropic Conductive Film ANISOLM AC-8955YW. Issued 2007/03/30
Hitachi Chemical Data Sheet Hitachi Anisotropic Conductive Film ANISOLM AC-8955YW Issued 27/3/3 1. Standard specification, bonding condition, storage condition and characteristic...1 2. Precautions in
More informationNon-Conductive Adhesive (NCA) Trapping Study in Chip on Glass Joints Fabricated Using Sn Bumps and NCA
Materials Transactions, Vol. 49, No. 9 (2008) pp. 2100 to 2106 #2008 The Japan Institute of Metals Non-Conductive Adhesive (NCA) Trapping Study in Chip on Glass Joints Fabricated Using Sn Bumps and NCA
More informationDefense Technical Information Center Compilation Part Notice
UNCLASSIFIED Defense Technical Information Center Compilation Part Notice ADPO11324 TITLE: Characteristic Study of Chip-on-Film Interconnection DISTRIBUTION: Approved for public release, distribution unlimited
More informationANISOTROPIC conductive film (ACF) is a film-type
1350 IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 5, NO. 9, SEPTEMBER 2015 Effects of Bonding Pressures and Bonding Temperatures on Solder Joint Morphology and Reliability
More informationAnisotropic Conductive Films (ACFs)
Anisotropic Conductive Films (ACFs) ACF = Thermosetting epoxy resin film + Conductive particles Chip or substrate 1 Heat Pressure ACF Substrate 2 Chip or substrate 1 ACF Substrate 2 Applications Chip-on-Board
More informationIEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 32, NO. 2, JUNE /$ IEEE
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 32, NO. 2, JUNE 2009 339 Effects of Heating Rate on Material Properties of Anisotropic Conductive Film (ACF) and Thermal Cycling Reliability
More informationMicroelectronics Reliability
Microelectronics Reliability 52 (2012) 1182 1188 Contents lists available at SciVerse ScienceDirect Microelectronics Reliability journal homepage: www.elsevier.com/locate/microrel Studies on various chip-on-film
More informationY.C. Chan *, D.Y. Luk
Microelectronics Reliability 42 (2002) 1195 1204 www.elsevier.com/locate/microrel Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex
More informationEffects of Solder Reflow on the Reliability of Flip-Chip on Flex Interconnections Using Anisotropic Conductive Adhesives
254 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, VOL. 27, NO. 4, OCTOBER 2004 Effects of Solder Reflow on the Reliability of Flip-Chip on Flex Interconnections Using Anisotropic Conductive
More informationOVER the last several decades, the size of electronic
2108 IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 2, NO. 12, DECEMBER 2012 Study on Fine Pitch Flex-on-Flex Assembly Using Nanofiber/Solder Anisotropic Conductive Film
More informationReliability Evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages
Reliability Evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages Jae-Won Jang* a, Kyoung-Lim Suk b, Kyung-Wook Paik b, and Soon-Bok Lee a a Dept. of Mechanical Engineering, KAIST, 335 Gwahangno
More informationChip Warpage Damage Model for ACA Film Type Electronic Packages
Key Engineering Materials Vols. 297-3 (25) pp. 887-892 online at http://www.scientific.net 25 Trans Tech Publications, Switzerland Chip Warpage Damage Model for ACA Film Type Electronic Packages Se Young
More informationStudy of anisotropic conductive adhesive joint behavior under 3-point bending
Microelectronics Reliability 45 (2005) 589 596 www.elsevier.com/locate/microrel Study of anisotropic conductive adhesive joint behavior under 3-point bending M.J. Rizvi a,b, Y.C. Chan a, *, C. Bailey b,h.lu
More informationStudy on Effect of Coupling Agents on Underfill Material in Flip Chip Packaging
38 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 24, NO. 1, MARCH 2001 Study on Effect of Coupling Agents on Underfill Material in Flip Chip Packaging Shijian Luo, Member, IEEE, and
More informationIEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 7, NO. 3, MARCH
IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 7, NO. 3, MARCH 2017 371 Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn
More informationFlip Chip Joining on FR-4 Substrate Using ACFs
Flip Chip Joining on FR-4 Substrate Using ACFs Anne Seppälä, Seppo Pienimaa*, Eero Ristolainen Tampere University of Technology Electronics Laboratory P.O. Box 692 FIN-33101 Tampere Fax: +358 3 365 2620
More informationY.C. Chan *, D.Y. Luk
Microelectronics Reliability 42 (2002) 1185 1194 www.elsevier.com/locate/microrel Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex
More informationONE of the aspects of the continuous miniaturization in
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 28, NO. 3, SEPTEMBER 2005 499 SMT-Compatibility of Adhesive Flip Chip on Foil Interconnections With 40-m Pitch Hans de Vries, Jan van Delft,
More informationThermomechanical Response of Anisotropically Conductive Film
Thermomechanical Response of Anisotropically Conductive Film Yung Neng Cheng, Shyong Lee and Fuang Yuan Huang Department of Mechanical Engineering National Central University, Chung-li, Taiwan shyong@cc.ncu.edu.tw
More informationThe multilayer-modified Stoney s formula for laminated polymer composites on a silicon substrate
JOURNAL OF APPLIED PHYSICS VOLUME 86, NUMBER 10 15 NOVEMBER 1999 The multilayer-modified Stoney s formula for laminated polymer composites on a silicon substrate Jin S. Kim a) and Kyung W. Paik Department
More informationElectrical and reliability properties of isotropic conductive adhesives on immersion silver printed-circuit boards
DOI 10.1007/s00542-008-0678-0 TECHNICAL PAPER Electrical and reliability properties of isotropic conductive adhesives on immersion silver printed-circuit boards J. Lee Æ C. S. Cho Æ J. E. Morris Received:
More informationInterconnection Technology Based on InSn Solder for Flexible Display Applications
Interconnection Technology Based on InSn Solder for Flexible Display Applications Kwang-Seong Choi, Haksun Lee, Hyun-Cheol Bae, Yong-Sung Eom, and Jin Ho Lee A novel interconnection technology based on
More informationResearch Article A Study on the Conductivity Variation of Au Coated Conductive Particles in ACF Packaging Process
Nanomaterials Volume 2015, Article ID 485276, 8 pages http://dx.doi.org/10.1155/2015/485276 Research Article A Study on the Conductivity Variation of Au Coated Conductive Particles in ACF Packaging Process
More informationALTERNATIVES TO SOLDER IN INTERCONNECT, PACKAGING, AND ASSEMBLY
ALTERNATIVES TO SOLDER IN INTERCONNECT, PACKAGING, AND ASSEMBLY Herbert J. Neuhaus, Ph.D., and Charles E. Bauer, Ph.D. TechLead Corporation Portland, OR, USA herb.neuhaus@techleadcorp.com ABSTRACT Solder
More informationDynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages
Microelectronics Reliability 44 (2004) 295 302 www.elsevier.com/locate/microrel Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages Y.P. Wu a,b, M.O.
More informationII. A. Basic Concept of Package.
Wafer Level Package for Image Sensor Module Won Kyu Jeung, Chang Hyun Lim, Jingli Yuan, Seung Wook Park Samsung Electro-Mechanics Co., LTD 314, Maetan3-Dong, Yeongtong-Gu, Suwon, Gyunggi-Do, Korea 440-743
More informationEffect of Underfill Entrapment on the Reliability of Flip-Chip Solder Joint
Y. C. Chan e-mail: eeycchan@cityu.edu.hk M. O. Alam K. C. Hung H. Lu C. Bailey EPA Centre, Department of Electronic Engineering, City University of Hong Kong, Hong Kong, China; School of Computing and
More informationHitachi Anisotropic Conductive Film ANISOLM AC-7106U
HITACHI CHEMICAL DATA SHEET Hitachi Anisotropic Conductive Film ANISOLM AC-7106U 1. Standard Specification, Bonding and Storage Conditions, Reparability, and Characteristics... 1 Page 2. Precautions in
More informationA study of the assembly process and reliability performance of contactless smart cards fabricated using a non-conductive adhesive film
J. Adhesion Sci. Technol., Vol. 20, No. 2-3, pp. 245 259 (2006) VSP 2006. Also available online - www.vsppub.com A study of the assembly process and reliability performance of contactless smart cards fabricated
More informationFundamentals of Sealing and Encapsulation
Fundamentals of Sealing and Encapsulation Sealing and Encapsulation Encapsulation and sealing are two of the major protecting functions of IC packaging. They are used to protect IC devices from adverse
More information3M Anisotropic Conductive Film 5363
Technical Data November 2013 Product Description 3M Anisotropic Conductive Film (ACF) 5363 is a heat-bondable, electrically conductive adhesive film. The unbonded film is non-tacky at room temperature
More informationEditorial Manager(tm) for Microsystem Technologies Manuscript Draft
Editorial Manager(tm) for Microsystem Technologies Manuscript Draft Manuscript Number: Title: Electrical and Reliability Properties of Isotropic Conductive Adhesives on Immersion Silver Printed-Circuit
More informationVia Formation Process for Smooth Copper Wiring on Insulation Layer with Adhesion Layer
Sasaki and Tani: Via Formation Process for Smooth Copper Wiring (1/6) [Technical Paper] Via Formation Process for Smooth Copper Wiring on Insulation Layer with Adhesion Layer Shinya Sasaki and Motoaki
More informationGold to gold thermosonic bonding Characterization of bonding parameters
Gold to gold thermosonic bonding Characterization of bonding parameters Thi Thuy Luu *1, Hoang-Vu Nguyen 1, Andreas Larsson 2, Nils Hoivik 1 and Knut E.Aasmundtveit 1 1: Institute of Micro and Nanosystems
More informationRecent Advances in Die Attach Film
Recent Advances in Die Attach Film Frederick Lo, Maurice Leblon, Richard Amigh, and Kevin Chung. AI Technology, Inc. 70 Washington Road, Princeton Junction, NJ 08550 www.aitechnology.com Abstract: The
More informationIEEE TRANSACTIONS ON ADVANCED PACKAGING, VOL. 32, NO. 1, FEBRUARY /$ IEEE
IEEE TRANSACTIONS ON ADVANCED PACKAGING, VOL. 32, NO. 1, FEBRUARY 2009 123 Novel Nano-Scale Conductive Films With Enhanced Electrical Performance and Reliability for High Performance Fine Pitch Interconnect
More informationA study aimed at characterizing the interfacial structure in a tin silver solder on nickel-coated copper plate during aging
Sādhanā Vol. 33, Part 3, June 2008, pp. 251 259. Printed in India A study aimed at characterizing the interfacial structure in a tin silver solder on nickel-coated copper plate during aging D C LIN 1,
More information' Department of Electronic Engineering
Degradation Mechanisms of Anisotropic Conductive Adhesive Joints for Flip Chip on Flex Applications Y.C. Chad, K.C. Hung', C.W. Tang', and C.M.L. Wu* ' Department of Electronic Engineering * Department
More informationDevelopment of Anisotropic Conductive Film for Narrow Pitch Circuits
ELECTRONICS Development of Anisotropic Conductive Film for Narrow Pitch Circuits Hideaki TOSHIOKA*, Kyoichiro NAKATSUGI, Masamichi YAMAMOTO, Katsuhiro SATO, Naoki SHIMBARA and Yasuhiro OKUDA Anisotropic
More informationBonding Technology of FPD(Flat Panel Display)
Bonding Technology of FPD(Flat Panel Display) OSAKI ENGINEERING CO., LTD.(OEC) has been playing the pioneering role in bonding technology development of FPD, and obtained reliance as a leading maker. This
More informationFabrication of Smart Card using UV Curable Anisotropic Conductive Adhesive (ACA) Part II: Reliability Performance of the ACA Joints
Fabrication of Smart Card using UV Curable Anisotropic Conductive Adhesive (ACA) Part II: Reliability Performance of the ACA Joints C. W. Tan, Y M Siu, K. K. Lee, *Y. C. Chan & L. M. Cheng Department of
More informationElectrical and Thermal Properties of Electrically Conductive Adhesives Using A Heat-resistant Epoxy Binder
Electrical and Thermal Properties of Electrically Conductive Adhesives Using A Heat-resistant Epoxy Binder Masahiro Inoue 1),3) and Johan Liu 1),2) (1) Department of Microtechnology and Nanoscience, Chalmers
More informationSelection and Application of Board Level Underfill Materials
Selection and Application of Board Level Underfill Materials Developed by the Underfill Materials Design, Selection and Process Task Group (5-24f) of the Assembly and Joining Committee (5-20) of IPC Supersedes:
More informationBASE MATERIALS Through Assembly
Thermal Analysis of BASE MATERIALS Through Assembly Can current analytical techniques predict and characterize differences in laminate performance prior to exposure to thermal excursions during assembly?
More informationDevelopment of New No-Flow Underfill Materials for Both Eutectic Sn-Pb Solder and a High Temperature Melting Lead-Free Solder
466 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 26, NO. 2, JUNE 2003 Development of New No-Flow Underfill Materials for Both Eutectic Sn-Pb Solder and a High Temperature Melting Lead-Free
More informationMaterial based challenge and study of 2.1, 2.5 and 3D integration
1 Material based challenge and study of 2.1, 2.5 and 3D integration Toshihisa Nonaka Packaging Solution Center R&D Headquarters Hitachi Chemical Co., Ltd., Sep. 8, 2016 Hitachi Chemical Co., Ltd. 2010.
More information3M Anisotropic Conductive Film (for Touch Screen Panel)
Technical Data November 2013 3M Anisotropic Conductive Film 7371-20 (for Touch Screen Panel) Product Description 3M Anisotropic Conductive Film (ACF) 7371-20 is a heat-bondable, electrically conductive
More informationJournal of Science and Technology The Investigation of Die Back Edge Cracking in Flip Chip Ceramic Ball Grid Array Package (FC-CBGA)
The Investigation of Die Back Edge Cracking in Flip Chip Ceramic Ball Grid Array Package (FC-CBGA) Zainudin Kornain a, Azman Jalar a, Rozaidi Rasid b, a Institute of Microengineering and Nanoelectronics
More informationOxidation Prevention and Electrical Property Enhancement of Copper-Filled Isotropically Conductive Adhesives
Journal of ELECTRONIC MATERIALS, Vol. 36, No. 1, 27 DOI: 1.17/s11664-7-24-7 Ó 27 TMS Regular Issue Paper Oxidation Prevention and Electrical Property Enhancement of Copper-Filled Isotropically Conductive
More informationCharacterization of Coined Solder Bumps on PCB Pads
Characterization of Coined Solder Bumps on PCB Pads Jae-Woong Nah, Kyung W. Paik, Won-Hoe Kim*, and Ki-Rok Hur** Department of Materials Sci. & Eng., Korea Advanced Institute of Science and Technology
More informationSIDE WALL WETTING INDUCED VOID FORMATION DUE TO SMALL SOLDER VOLUME IN MICROBUMPS OF Ni/SnAg/Ni UPON REFLOW
SIDE WALL WETTING INDUCED VOID FORMATION DUE TO SMALL SOLDER VOLUME IN MICROBUMPS OF Ni/SnAg/Ni UPON REFLOW Y. C. Liang 1, C. Chen 1, *, and K. N. Tu 2 1 Department of Materials Science and Engineering,
More informationENHANCING MECHANICAL SHOCK PERFORMANCE USING EDGEBOND TECHNOLOGY
ENHANCING MECHANICAL SHOCK PERFORMANCE USING EDGEBOND TECHNOLOGY Steven Perng, Tae-Kyu Lee, and Cherif Guirguis Cisco Systems, Inc. San Jose, CA, USA sperng@cisco.com Edward S. Ibe Zymet, Inc. East Hanover,
More information(12) Patent Application Publication (10) Pub. No.: US 2009/ A1
(19) United States US 20090167735A1 (12) Patent Application Publication (10) Pub. No.: US 2009/0167735A1 Lee et al. (43) Pub. Date: Jul. 2, 2009 (54) FLEXIBLE FILMAND DISPLAY DEVICE COMPRISING THE SAME
More informationIN THE last decade, personal electronic devices have proliferated
834 IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 2, NO. 5, MAY 212 Measurement and Analysis for Residual Warpage of Chip-on-Flex (COF) and Chip-in-Flex (CIF) Packages Jae-Won
More informationEffects of Cu and Pd Addition on Au Bonding Wire/Al Pad Interfacial Reactions and Bond Reliability
Journal of ELECTRONIC MATERIALS, Vol. 35, No. 11, 2006 Regular Issue Paper Effects of Cu and Pd Addition on Au Bonding Wire/Al Pad Interfacial Reactions and Bond Reliability SANG-AH GAM, 1,3 HYOUNG-JOON
More informationIEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 6, NO. 9, SEPTEMBER
IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 6, NO. 9, SEPTEMBER 2016 1317 Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties
More informationEmbedded Passives..con0nued
Embedded Passives..con0nued Why Embedded Passives? Improves the packaging efficiency System-on-Package (SOP); SLIM integration Reducing size Eliminating substrate assembly Minimizing solder joint failure
More information2. Experimental Procedure Figure 1:
Influence Of Carbon, Metal-Coated Polymer, and Nano Powders On Sintering, and Electrical Performance of Nano-Micro-Filled Conducting dhesives For Z-xis Interconnections Rabindra N. Das, Frank D. Egitto,
More informationAn Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability
An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability Edward Kelley Isola Abstract Environmental regulations are forcing the elimination of lead (Pb) from electronic
More informationVariable Frequency Microwave For Chip-On-Board Glob Top Curing
Variable Frequency Microwave For Chip-On-Board Glob Top Curing Binghua Pan (Phone: 65-458629 Fax: 65-4565422 e-mail: binghua.pan@delphiauto.com) Chih Kai Nah (Phone: 65-458629 Fax: 65-4565422 e-mail: chih.kai.nah@delphiauto.com)
More informationFabrication of Smart Card using UV Curable Anisotropic Conductive Adhesive (ACA) Part I: Optimization of the curing conditions
Fabrication of Smart Card using UV Curable Anisotropic Conductive Adhesive (ACA) Part I: Optimization of the curing conditions K. K. Lee, K T Ng, C. W. Tan, *Y. C. Chan & L. M. Cheng Department of Electronic
More informationGold Passivated Mechanically Flexible Interconnects (MFIs) with High Elastic Deformation
Gold Passivated Mechanically Flexible Interconnects (MFIs) with High Elastic Deformation Chaoqi Zhang, Hyung Suk Yang, and Muhannad S. Bakir School of Electrical and Computer Engineering Georgia Institute
More informationOptimization of Material and Process for Fine Pitch LVSoP Technology
Optimization of Material and Process for Fine Pitch LVSoP Technology Yong-Sung Eom, Ji-Hye Son, Hyun-Cheol Bae, Kwang-Seong Choi, and Heung-Soap Choi For the formation of solder bumps with a fine pitch
More informationWeight (%) Temperature ( C)
Weight (%) 100 80 60 40 20 0 0 100 200 300 400 500 600 Temperature ( C) Supplementary Figure 1. Thermal analysis of (UPyU) 3 TMP. Thermogravimetric analysis (TGA) curve of (UPyU) 3 TMP from 25 to 600 C.
More informationQualification and Application of Pressure-less Sinter Silver Epoxy
Qualification and Application of Pressure-less Sinter Silver Epoxy Loh Kian Hwa, Nadzirah Yahya, Chin Siew Kheong, Lee Ken Hok Carsem Technology Centre Carsem (M) Sdn. Bhd S-site. Lot 52986 Taman Meru
More informationSelf-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
Materials Transactions, Vol. 50, No. 7 (2009) pp. 1684 to 1689 Special Issue on New Functions and Properties of Engineering Materials Created by Designing and Processing #2009 The Japan Institute of Metals
More informationElectrical and Fluidic Microbumps and Interconnects for 3D-IC and Silicon Interposer
Electrical and Fluidic Microbumps and Interconnects for 3D-IC and Silicon Interposer Li Zheng, Student Member, IEEE, and Muhannad S. Bakir, Senior Member, IEEE Georgia Institute of Technology Atlanta,
More informationWF6317. A superactive low-volatile/high heat-resistant water-soluble flux for ball soldering
WF637 A superactive low-volatile/high heat-resistant water-soluble flux for ball soldering Low viscosity and high tacking power stabilize ball holding force and ensures excellent solder wettability Easy
More informationFLIP CHIP is a packaging approach in which the integrated
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 27, NO. 2, JUNE 2004 345 Moisture Absorption in Uncured Underfill Materials Shijian Luo, Member, IEEE, and C. P. Wong, Fellow, IEEE Abstract
More informationDie Attach Materials. Die Attach G, TECH. 2U. TECHNICAL R&D DIV.
Die Attach Materials Die Attach G, TECH. 2U. TECHNICAL R&D DIV. 2 Topics 3 What it is X 5,000 X 10,000 X 50,000 Si Chip Au Plating Substrate Ag Resin 4 Current Products Characteristics H9890-6A H9890-6S
More informationQuestion: Are RO4000 materials compatible with lead-free processes? Answer:
Question: Are RO4 materials compatible with lead-free processes? Answer: RO4 cores and prepregs are among the most temperature stable products available. They easily meet or exceed all expectations for
More informationTrends and Developments
Trends and Developments Monique Mayr Monique.Mayr@eu.panasonic.com European R&M Group Panasonic Corporation Electronic Material Business Division Weitere Informationen finden Sie auch auf: http://www3.panasonic.biz/em/pcbm/en/index.html
More informationLow CTE / High Tg FR-4 with High Heat Resistance
Low CTE / High Tg FR-4 with High Heat Resistance Laminate: EM-827 Prepreg: EM-827B 1 Features Tg(DSC) > 170 Z direction CTE < 3.0% (50~260 ) High thermal degradation temperature: Td > 340 Excellent thermal
More informationHitachi Anisotropic Conductive Film ANISOLM AC-7206U-18
HITACHI CHEMICAL DATA SHEET Hitachi Anisotropic Conductive Film ANISOLM AC-7206U-18 Page 1. Standard Specification, Bonding and Storage Conditions, Reparability, and Characteristics... 1 2. Precautions
More informationTRADITIONALLY, epoxy based encapsulants are filled
54 IEEE TRANSACTIONS ON ADVANCED PACKAGING, VOL. 22, NO. 1, FEBRUARY 1999 Comparative Study of Thermally Conductive Fillers for Use in Liquid Encapsulants for Electronic Packaging C. P. Wong, Fellow, IEEE,
More informationResearch Paper. Isothermal solidification bonding of Bi2Te2.55Se0.45 thermoelectric material with Cu electrodes
Engineering & Technology Research 3(3): 000-000, February 2019 DOI: 10.15413/etr.2019.0001 2019 Academia Publishing Research Paper Isothermal solidification bonding of Bi2Te2.55Se0.45 thermoelectric material
More informationCopyright 2009 Year IEEE. Reprinted from 2009 Electronic Components and Technology Conference. Such permission of the IEEE does not in any way imply
Copyright 2009 Year IEEE. Reprinted from 2009 Electronic Components and Technology Conference. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Institute of Microelectronics
More informationSimulations and Characterizations for Stress Reduction Designs in Wafer Level Chip Scale Packages
Simulations and Characterizations for Stress Reduction Designs in Wafer Level Chip Scale Packages by Ming-Che Hsieh STATS ChipPAC Taiwan Co. Ltd. Copyright 2013. Reprinted from 2013 International Microsystems,
More informationEnhanced Thermal Conductivity of Polyimide Films via a Hybrid of Micro- and Nano-Sized Boron Nitride
The 2012 World Congress on Advances in Civil, Environmental, and Materials Research (ACEM 12) Seoul, Korea, August 26-30, 2012 Enhanced Thermal Conductivity of Polyimide Films via a Hybrid of Micro- and
More informationPressure-Assisted Low-Temperature Sintering of Silver Paste as an Alternative Die-Attach Solution to Solder Reflow
Pressure-Assisted Low-Temperature Sintering of Silver Paste as an Alternative Die-Attach Solution to Solder Reflow Zhiye (Zach) Zhang and Guo-Quan Lu Center for Power Electronics Systems The Bradley Department
More informationNew Technology for High-Density LSI Mounting in Consumer Products
New Technology for High-Density Mounting in Consumer Products V Hidehiko Kira V Akira Takashima V Yukio Ozaki (Manuscript received May 29, 2006) The ongoing trend toward downsizing and the growing sophistication
More informationAvatrel Stress Buffer Coatings: Low Stress Passivation and Redistribution Applications
Avatrel Stress Buffer Coatings: Low Stress Passivation and Redistribution Applications Ed Elce, Chris Apanius, Jeff Krotine, Jim Sperk, Andrew Bell, Rob Shick* Sue Bidstrup-Allen, Paul Kohl Takashi Hirano,
More informationHitachi Anisotropic Conductive Film ANISOLM AC-2056R
Flextronics HITACHI CHEMICAL DATA SHEET Hitachi Anisotropic Conductive Film ANISOLM AC-256R 215/12/4 Revised Page 1. Standard Specification, Bonding and Storage Conditions, Reparability, and Characteristics...
More information1.3.2 Nanotechnology Nanoporosity Deposition Methods Dissolution Methods
Table of Contents 1. Metal Finishing 1 1.1 Introduction 1 1.1.1 Description of Industrial Activity Covered 1 1.1.2 Environmental and Legislative Background 3 1.1.3 Emerging Technology or Research? 4 1.2
More informationEffects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives
Materials Transactions, Vol. 51, No. 1 (21) pp. 1785 to 1789 Special Issue on Lead-Free and Advanced Interconnection Materials for Electronics #21 The Japan Institute of Metals Effects of Silver oating
More informationCopyright 2009 Year IEEE. Reprinted from 2009 Electronic Components and Technology Conference. Such permission of the IEEE does not in any way imply
Copyright 2009 Year IEEE. Reprinted from 2009 Electronic Components and Technology Conference. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Institute of Microelectronics
More informationVT-45PP VT-47PP VT-447PP
& Prepreg General Information Ventec provides a series of and Prepregs with different glass style and resin content. These products have good bonding and thermal performance in applications of heat sink
More informationGeneral Introduction to Microstructure Technology p. 1 What is Microstructure Technology? p. 1 From Microstructure Technology to Microsystems
General Introduction to Microstructure Technology p. 1 What is Microstructure Technology? p. 1 From Microstructure Technology to Microsystems Technology p. 9 The Parallels to Microelectronics p. 15 The
More informationSuper Thin Flip Chip Assemblies on Flex Substrates - Adhesive Bonding and Soldering Technology Reliability Investigations and Applications
Super Thin Flip Chip Assemblies on Flex Substrates - Adhesive Bonding and Soldering Technology Reliability Investigations and Applications Julian Haberland, Barbara Pahl, Christine Kallmayer*, Rolf Aschenbrenner*,
More information23 rd ASEMEP National Technical Symposium
THE EFFECT OF GLUE BOND LINE THICKNESS (BLT) AND FILLET HEIGHT ON INTERFACE DELAMINATION Raymund Y. Agustin Janet M. Jucar Jefferson S. Talledo Corporate Packaging & Automation/ Q&R STMicroelectronics,
More informationDevelopment of gold to gold interconnection flip chip bonding for chip on suspension assemblies
Microelectronics Reliability 42 (2002) 381 389 www.elsevier.com/locate/microrel Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies C.F. Luk a,1, Y.C. Chan b,
More informationEffects of Pd Addition on Au Stud Bumps/Al Pads Interfacial Reactions and Bond Reliability
Journal of ELECTRONIC MATERIALS, Vol. 33, No. 10, 2004 Special Issue Paper Effects of Pd Addition on Au Stud Bumps/Al Pads Interfacial Reactions and Bond Reliability HYOUNG-JOON KIM, 1,3 JONG-SOO CHO,
More informationNovel Bumping and Underfill Technologies for 3D IC Integration
Novel Bumping and Underfill Technologies for 3D IC Integration Ki-Jun Sung, Kwang-Seong Choi, Hyun-Cheol Bae, Yong-Hwan Kwon, and Yong-Sung Eom In previous work, novel maskless bumping and no-flow underfill
More information