Photovoltaics & Solar Thermals. Thin-film equipment. Customized. FHR Anlagenbau GmbH I

Transcription

1 Photovoltaics & Solar Thermals Thin-film equipment. Customized. FHR Anlagenbau GmbH I

2 FHR Anlagenbau GmbH is an innovative enterprise in the branch of vacuum processing and thin-film technologies. The company was founded in 1991 in Dresden, Germany with the aim of developing and selling new concepts and solutions for multiple applications of thin films in the industry and R&D. Today, FHR Anlagenbau GmbH has formed part of the centrotherm photovoltaics AG, the world s leading technology and equipment provider for the photovoltaics sector. The FHR product portfolio comprises vacuum process systems for R&D applications, and technology and equipment for the production of CIGS solar cells and solar thermal power plants. The product range focuses strategically on foil coating systems for the production of flexible solar cells, organic solar cells, and energy-efficient OLED displays. Together with well-known industrial partners and research institutions, FHR has attained a globally leading technology and market position with these roll-to-roll systems. The FHR technology portfolio includes: Advanced deposition technologies by sputtering, evaporation, CVD and PECVD Reactive sputtering technologies for deposition of oxides and nitrides Advanced etching technologies by support of high density plasma sources Atomic Layer Deposition (ALD) for precisely controlled growth of monolayer stacks joined with excellent uniformity of thickness on complex 3D shapes Target manufacturing and target bonding FHR Anlagenbau GmbH Am Hügel 2, Ottendorf-Okrilla (Germany) phone , fax mail: postbox@fhr.de, web: Assembling of a glass coating system FHR.Line.2500-PVD for the production of thin-film solar cells.

3 Cermet type Thin films in solar cell making High efficiency meets low material consumption Example for a solar thermal power plant. absorber layer Cermet DC-Sputtering Mo, Ni Reactive-Sputtering Al₂O₃, ZrO₂ Supported sputtering technologies by FHR Reactive and non-reactive magnetron sputtering with DC, pulsed DC and RF Periodic Table of the Elements Nearly free choice of sputtering materials Metals (Cu, In, Ga, Mo, Ag), Alloys (CuIn, CuGa), Oxides (ZnO, InSnO, Al₂O₃, TiO₂), Nitrides (TiN, Si₃N₄) Additional thin-film technologies by FHR complete your coating solution Thermal Evaporation, Chemical Vapor Deposition, Atomic Layer Deposition, Plasma Etching, Reactive Ion Etching, Flash Lamp Annealing Example for a photovoltaic system. front glass encapsulate transparent front contact buffer layer absorber layer CuGaSe₂ contact layer Multi-junction type DC-Sputtering Cu, Ga front glass encapsulate transparent front contact buffer layer absorber layer CuInGaSe₂ metal contact substrate glass substrate glass transparent front contact absorber layer a-si:h or µ-si:h contact layer metal contact back glass CIGS type DC-Sputtering Cu:Ga, In DC-Sputtering Mo a-si & µ-si type Reactive Sputtering Si₃N₄ PECVD a-si:h PECVD µ-si:h DC-Sputtering Mo picture front cover and picture left: fotolia.de; picture right: MaxFX, 2010, shutterstock.de Concentrated solar power (CSP) Tube receivers with ultimate absorption selective reflector substrate absorber layer Ni, NiO selective reflector substrate absorber layer TiN x O y diffusion barrier selective reflector substrate DC-Sputtering Mo NiO type DC-Sputtering Ni Reactive Sputtering NiO DC-Sputtering Al TiN x O y type Reactive Sputtering TiN Reactive Sputtering TiO, TiO₂ DC-Sputtering Cu, Mo buffer layer absorber layer CuInSe₂ DC-Sputtering Cu, In CdTe type Supported sputtering technologies by FHR Reactive and non-reactive magnetron sputtering with DC, pulsed DC and RF metal contact substrate glass DC-Sputtering Ag substrate glass transparent front contact buffer layer DC-Sputtering InSnO Periodic Table of the Elements Nearly free choice of sputtering materials Metals (Cu, In, Ga, Mo, Ag), Alloys (CuIn, CuGa), Oxides (ZnO, InSnO, Al₂O₃, TiO₂), Nitrides (TiN, Si₃N₄) CrO type absorber layer CdTe metal contact back glass RF-Sputtering CdTe DC-Sputtering Mo Additional thin-film technologies by FHR complete your coating solution Thermal Evaporation, Chemical Vapor Deposition, Atomic Layer Deposition, Plasma Etching, Reactive Ion Etching, Flash Lamp Annealing absorber layer CrO selective reflector substrate Reactive Sputtering CrO DC-Sputtering Cu

4 Glass coating for the PV industry Deposition of metal and TCO layers Platform Target Material: Mo, Cr, Al / CuGa, In / ZnO:Al, ITO, i-zno Geometry: planar 2,500 mm 200 mm, rotatable 2,500 mm Ø 125 mm Utilization: planar > 30%, rotatable > 70% Substrate Material: glass Dimensions (length width height): Utilities & power supply e.g. 1,600 2,030 3 mm³ Utilities: 3 Ph, V, 60 Hz Max.power: 340 / 650 / 780 kw Deposition system Average power consumption: Number of process chambers: 4 / 6 / / 500 / 600 kw Deposition type: DC, MF and RF Magnetron type: planar or rotatable System dimensions Distance from target to substrate: mm Total system size (length width height): Substrate temperature range: RT - max. 200 C 18,720 / 21,490 / 24,260 9,000 2,200 mm³ Substrate potential: floating Total system weight: Independent process gases: 2 / 2 / 3 80,000 / 90,000 / 100,000 kg Base pressure (min. pressure before deposition): Transport, speed < ⁶ mbar Type of transport: inline System control & software Time to base pressure (min. time to reach base Orientation of substrate during deposition: Cleaning principle: Computer hardware: pressure): 12 h horizontal mech., exchange of shields Simatec S7 PLC, WinCC Dynamic deposition rate: Max. conveyor speed: 12 m/min Time needed for cleaning: 8 h Acquired data compatible with Access, Excel: Mo, Cr, Al: 100 nm x m/min Max. conveyor frequency: > 0.67 subst./minute Cleaning cycle: 7 days yes CuGa, In: nm x m/min Max. throughput: > 100 m²/h ZnO:Al: nm x m/min Nominal throughput: 82.3 m²/h Cooling system Warranty, time of delivery, distribution area Max. no. of cooling circuits: 2 Warranty: months, negotiable Layer quality Cleaning of chamber, gas disposal Max. water inlet pressure: 5-7 bar Time of delivery: < 40 weeks Thickness uniformity: < ± % Average uptime: 85% Average water consumption: ,000 l/min Distribution area: worldwide

5 Made for PV manufacturing Customer-specific with smallest footprints Platform Target Time to base pressure (min. time to Material: reach base pressure): 12 h Mo, Cr, Al / CuGa, In / ZnO:Al, ITO, i-zno Dynamic deposition rate: and others Mo (planar): 100 nm x m/min, Geometry: CuGa (planar): 80 nm x m/min, planar 1,700 mm 160 mm, In (planar): 40 nm x m/min, rotatable 1,700 mm Ø 5 inch ZnO:Al (planar): 40 nm x m/min, Utilization: ZnO:Al (rotatable): 100 nm x m/min planar > 30%, rotatable > 70% Transport, speed Utilities & power supply Layer quality Type of transport: inline Utilities: 3/N/PE AC 220V/380 V, 60 Hz Substrate Thickness uniformity: Max. number of substrates per carrier: Max.power: 340 / 740 / 890 kw Material: glass < ± 5 / < ± 2 / < ± 5% 2, depending on substrate size Average power consumption: Dimensions (length width height): Max. conveyor speed: 200 mm/s 250 / 600 / 750 kw e.g. 1,400 2,230 3 mm³ Max. conveyor frequency: > 0,67 substrates per minute System dimensions Deposition system Max. throughput: > 125 m²/h Total system size (length width height): Number of process chambers: Nominal throughput: 92,4 m²/h 19,660 / 31,560 / 33,330 3,200 2,200 mm³ avg. 4 / 10 / 12 Total system weight: Deposition type: Cleaning of chamber, gas disposal 80,000 / 120,000 / 130,000 kg avg. DC, MF and RF Average uptime: 93 / 85 / 93% Magnetron type: Cleaning principle: System control & software planar or rotatable mechanical, exchange of shields Computer hardware: Distance from target to substrate: Time needed for cleaning: 8 h Simatec S7 PLC, WinCC for HMI mm Cleaning cycle: 14 / 7 / 14 days Acquired data compatible with Access, Excel: Substrate temperature range: yes RT - max. 200 C Cooling system Substrate potential: floating Max. no. of cooling circuits: 2 Warranty, time of delivery, distribution area Independent process gases: Max. water inlet pressure: 5-7 bar Warranty: months, negotiable Ar, O₂ / Ar / Ar, O₂ Average water consumption: Time of delivery: < 40 weeks Base pressure (min. pressure before 320 / 800 / 1000 l/min Distribution area: worldwide deposition): < mbar

6 FHR equips customers around the world with tailor-made PV manufacturing equipment. Flexible solar cells Out of roll-to-roll machinery FHR offers custom-made web coating solutions Heated deposition drums for thermal treatment R&D tools Small scale production tools Reaching temperatures from 20 C up to 500 C Pilot line equipment Industrial solutions Improving formation of crystalline structures for photosensitive layers FHR provides standard and advanced thin-film processing Etching Sputtering Evaporation Annealing Achieving a low resistivity for TCO layers Implemented in-situ process monitoring Ellipsometry FHR manufactures tailor-made R2R equipment Raman-spectroscopy Substrate widths from 200 mm to 1,600 mm up X-ray fluorescence analysis Substrate materials: metal webs, polymer foils Implemented PLC technology Additional process technologies available Plasma-enhanced CVD Integrated high-precision band drives Dry etching Guarantee of high stability of belt tension and winding speed Flash Lamp Annealing Guarantee of optimal spool quality under different conditions, e.g. substrate material, substrate thickness or process temperature Applications Platform FHR.Roll.200 Versatile function layers Platform FHR.Roll.800 Conductive layers Insulating layers Barrier layers Adhesion layers Optical layers Versatile applications Flexible solar cells (CIGS, a-si, CdTe...) Flexible OLED displays Flexible electronics Flexible packaging FHR.Roll.300-OLED

7 FHR equips customers around the world with tailor-made PV manufacturing equipment. Increasing the solar yield R&D tools for advanced PV research Etching Evaporation Cluster type tools are the standard for wafer-based microelectronics or sub- Applications strates similar to wafers. However, their special fexibility regarding different processes and substrate handling make our cluster type equipment well Versatile function layers suited for advanced R&D in scientific and industrial environments. Conductive layers Insulating layers Barrier layers Numerous thin-film processing modules available Adhesion layers Etching Sputtering Evaporation Plasma-enhanced CVD Load Lock Flash Lamp Annealing Optical layers Versatile applications Semiconductors Atomic Layer Deposition MEMS & Sensors Flash Lamp Annealing Microelectronics Rapid Thermal Processing Optoelectronics Optics Customized R&D equipment based on a modular concept Solar cells Substrate sizes from 2 inch up to 300 mm diameter Substrate materials: metals, synthetics, glass Integrated PLC technology Handling of extreme heavy substrates Single Sputtering Multiple Sputtering Load lock module Etching module FHR.Star.150-RIE Etching module FHR.Star.100-PVD FHR.Star.150-PVD

8 Tailor-made sputtering targets Customized materials in individual shapes FHR is offering upon request all kinds of target materials, optionally bonded to specially designed backing plates. We deliver materials, matched in their quality parameters in an optimal way to the requirements of the purposed thin-film application. We provide sputtering targets with individual dimensions up to 4,000 mm. FHR boasts many years of experience in making bonded sputtering targets. A metallic bonding method which was developed in-house is widely used for this. This method ensures an electrically and thermally conductive, reliable and firm connection of sputtering target and cooling plate while minimising air or gas voids. Depending on the material combination and sputtering process actually used, FHR also employs other bonding techniques which allow the bonds to be optimised as regards their mechanical and electric properties and thermal conductivity. FHR is offering the bonding of planar-shaped targets as well as rotary cylindrical targets. Designed and proved for customers individual needs The company s comprehensive services also include development of customized designs for sputtering targets and backing plates as well as testing of sputtering targets in a performance test station. You benefit from our long-standing experience in engineering of professional sputtering systems. The optimum joining method for any application Free selection of thin-film materials Metallic bonding Depending on the demands made on the thermal and mechanical stability of the target compound, various metallic alloys can be used as filler materials. Epoxy resin bonding The parts are joined by an epoxy resin which contains powder of a conductive material. Elastomer bonding An elastomer is used as a filler material, optional with a conductive additive. This bonding method is particularly suited for target compounds which are subject to great mechanical forces, but where electric and thermal conductivity plays a minor role. NanoBond method The target compound is joined with the help of a nano-reactive foil at room temperature. This method allows target compounds to be made of materials with extremely different thermal expansion coefficients. Further, any target shapes can be realised without bonding gaps, even with brittle materials. Photovoltaic & Solar thermal Mo, CuGa, In, TCO, Si, Al, Cr, Ti... Optic Nb, Si, Ti, Cr, Zr, W, Ta, Zn Nb₂O x, SiO₂, TiO₂, ZrO₂, Ta₂O₅, VO₂, ZnO, MgF₂ Semiconductor & MEMS Al, Cu, W, Cr, V, Ta, Ni, noble metals, SiO₂

9 FHR Anlagenbau GmbH Am Hügel 2, Ottendorf-Okrilla (Germany) phone , fax mail: web: Sometimes we have to tread pioneer paths to engineer and manufacture tailor-made solutions for customers individual needs. Please contact us for additional information and to discuss your need. Design & Layout: