How can we Design and Build the Next Generation of MEMS-Based Products? Presented by Coventor and X-FAB December 6, 2017

Transcription

1 How can we Design and Build the Next Generation of MEMS-Based Products? Presented by Coventor and X-FAB December 6, 2017 Moderator: Heidi Hoffman, Sr. Director, SEMI-MSIG

2 About MEMS & Sensors Industry Group A SEMI Strategic Association Partner Connects and champions the MEMS and sensors supply chain in established and emerging markets Provides information and forums to enable better business outcomes for a worldwide membership base Enables the continued commercialization of MEMS and sensors Helps to overcome technology and manufacturing hurdles Established in 2001, MEMS Industry Group (MIG) initially focused on messaging MEMS as reliable and stable in the US Added Sensors to mission in 2015 and became MSIG Integrated operations with SEMI in 2017 to leverage strengths & expand scope to growth areas More than 150 member companies and partners

3 SEMI Connects the Electronics Manufacturing Supply Chain SEMI global platforms, standards, interest groups, committees, conferences, and expositions gather the extended electronics supply chain for comprehension, synchronization, and action. Substrates Materials Components Subassemblies Equipment IP Design Fabless Device Manufacturing Packaging Test System Integration Applications

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5 MEMS & Sensors Technical Congress (MSTC) February 13-14, 2018 Short Course and Welcome reception on February 12 Hyatt Regency Monterey Monterey, CA Strong Program Short Courses Application Keynotes Technology Keynote from Knowles Disruptors & Emerging Markets Materials & Characterizations Applications Co-located with 2018FLEX Visit for more info 5

6 SEMI-MSIG Connects SEMI-MSIG Connects for Member Growth and Prosperity Connect Collaborate Innovate Standards Market Intelligence Advocacy Communities Programs Expositions Interoperability, specifications, safety Manufacturing data, forecasts, insight Issues, public policy, collective action Market segments, special interests Technology, business, issues Business development, market access Connected together, we achieve what cannot be accomplished alone Visit us at MSIG.org and SEMI.org

7 SEMI-MSIG Webinars Interested in delivering a SEMI-MSIG webinar? Send your proposed topic to Heidi Hoffman hhoffman@semi.org Webinar Presentations are a Member-Only Benefit Recordings available at (SEMI.org) of previous webinars Next Webinar is January 24 - MEMS and Sensors Reliability for Devices, Packaging and Interconnects in Wearable Technology Allyson Hartzell, ScM, Veryst Engineering, LLC Questions in the Q&A box at any time Be on the lookout for a Poll We are recording the session

8 Today s Speakers Christine Dufour, MEMS PDK Program Manager, Coventor 20+ years experience in the semiconductor industry Leads PDK development for BiCMOS and CMOS processes Jörg Doblaski, Director of Design Support, X-FAB Leads development of PDKs for analog, digital and ESD IP, design tools and flow Directs customer support at X-FAB

9 How can we Design and Build the Next Generation of MEMS-Based Products? Christine Dufour (Coventor), Joerg Doblaski (X-FAB)

10 Outline About Coventor and X-FAB MEMS design challenges and solutions Coventor MEMS+ PDK and Design Flow Cadence Virtuoso PDK for X-FAB XMB10 process Summary and Outlook 10

11 About Coventor and X-FAB

12 AT A GLANCE MARKET LEADER in 3D modeling and simulation software for semiconductor and MEMS industries Employees Presence Ownership 50%+ PhDs Founded in Offices 5 Countries U.S. HQ Profitable Privately Held Wholly-owned subsidiary of Lam Research MEMS DESIGN AUTOMATION Software platform for MEMS design and integration CUSTOMERS: 50% OF THE Top 30 MEMS companies Top 10 MEMS foundries Top 10 R&D centers SEMICONDUCTOR VIRTUAL FABRICATION Software platform for advanced process development CUSTOMERS: 75% OF THE Top 5 Foundries Top 5 Memory suppliers Top 5 Equipment vendors Top 5 R&D centers 12

13 Coventor MEMS Design Automation Tools CoventorMP MEMS Design Automation Platform CoventorWare Device Design MEMS+ System Optimization MATLAB Simulink Cadence Virtuoso Gold standard accuracy for MEMS physics: Electrostatics, coupled electro-mechanics, Faster time to solution: 100X faster simulations for concept exploration and design optimization Fit MEMS into system and CMOS design flow: Integration with MATLAB and Cadence Supports PDK Design Automation 13

14 The More than Moore Foundry. 25 years of experience in pureplay foundry services for analog/ mixed-signal semiconductor applications Specialty foundry with a comprehensive set of technologies serving various market segments Technologies interfacing the real world Expertise in analog/mixed-signal IC production, MEMS and SiC with a focus on high-growth automotive, medical and industrial end markets with long lifecycles Strong design support to drive customer engagement over the long-term with successful technology leaders Manufacturing excellence 6 wafer fab facilities in Germany, France, Malaysia and US Capacity: 94,000 wafer starts per month (200mm equiv.) All production sites are automotive qualified More than 3,800 employees worldwide 14

15 Germany Erfurt Dresden Itzehoe USA (Texas) Lubbock France Corbeil-Essonnes- Malaysia (Sarawak) Kuching Fabs / Subsidiaries Sales Offices Representatives 15

16 Automotive Automotive quality manufacturing system & methods for high reliability ISO certification for all sites High-temperature characterization (175 C) AEC-Q100 qualified processes (grade 0) First-Time-Right Robust process architectures PDKs with accurate simulation models across a wide operating range Extensive support by Hotline, access to IP and device experts In-depth ESD support incl. ESD Design Check Tool & ESD reviews More than Moore Feature-rich analog/mixed-signal CMOS and SOI technologies Integration of sensors (CMOS or MEMS based) and actuators Embedded non-volatile memory options combined with high-voltage Chip-scale wafer level packaging combining CMOS & MEMS 16

17 Unique combination of analog/mixed-signal, high-voltage, NVM features with sensor and actuator integration SENSORS / ACTUATORS Focus on specialty technologies for Automotive, Medical and Industrial applications CMOS/ SOI X-FAB MEMS Solutions for Mobile Communication and Internet of Things High-volume CMOS, SOI, SiC and MEMS manufacturing Governed by automotive quality system WAFER LEVEL PACKAGING 17

18 0.13 μm 0.18 μm Digital Digital Analog M/S Analog M/S High Voltage High Voltage NVM RF SOI NVM RF Opto SOI High Temp MEMS Broad product range X-FAB owns technology and corresponding IP 0.25 μm Digital Analog M/S NVM Extensive IP offering; ability to customize IP Feature size 0.35 μm Digital Analog M/S High Voltage NVM RF Opto High Temp MEMS Modular approach to tailor to your needs 0.6 μm Digital Analog M/S High Voltage NVM RF Opto SOI High Temp MEMS 0.8 μm Digital Analog M/S High Voltage NVM Opto 1.0 μm Digital Analog M/S High Voltage Analog/mixed-signal roadmap NVM Opto SOI High Temp MEMS Explore X-FAB s large portfolio of CMOS & SOI processes online M/S = Mixed-Signal, NVM = Non Volatile Memory, RF = Radio Frequency, SOI = Silicon On Insulator 18

19 MEMS Design Challenges and Solutions

20 X-FAB inertial sensor processes XMS10 & XMB10 surface micromachined capacitive MEMS foundry process SOI wafer based technology Sensor elements formed by Silicon DRIE process Releasing of movable parts using isotropic Silicon etching Cost effective wafer level packaging by wafer bonding Sensor principle Detection of capacity changes, e.g. caused by inertial forces Feasibility of electrical stimulation, e.g. detection of Coriolis forces (Gyroscopes) Sensor capacity consists of interdigital structures Element moving or finger bending in X-Y-plane 20

21 X-FAB inertial sensor processes XMS10 & XMB10 discrete surface mounted micromachined devices Gyroscopes acceleration sensors XMB10 100% efficient silicon mass triple axis sensing with recessed fingers enabling sensing in Z-direction MEMS components: comb structures, moveable mass anchors, springs, stopper Fixed-to-move transitions bond pads 21

22 Missing PDK support for MEMS processes CMOS EDA tools expect a certain process architecture HV CMOS process device specific process layers only one dielectric layer per stack level polygon shapes with 90 or 135 angles Inertial MEMS sensor process Different structures defined in the same layer Multiple dielectric layers per stack level Circular shapes, fixed width, maximum spacing MEMS EDA tools usually do not support a PDK interface 22

23 Design flow: CMOS vs. MEMS Digital CMOS automated Analog HV CMOS Semi-automated MEMS manual Artwork: The quality strongly depends on the artist [ 23

24 research project Schematic-Based Design of MEMS for Applications in Optics and Robotics, funding initial BMBF F&E 16M3093 Project objective: develop the first ever universal design methodology for MEMS to close the gap between electronics and mechanics design, manufacturing, and subsequent integration into products [1] Project partners: * [1] MEMS2015: Schematic Driven MEMS Design for Applications in Optics and Robotics. (n.d.). Retrieved January 29, 2016, from * Coventor: Associated partner 24

25 25 Similar to CMOS: MEMS PDK components enabling design flow

26 Coventor MEMS+ PDK and Design Flow

27 MEMS Design Flow and PDK Overview Design, model and simulate your MEMS in MEMS+ Import the symbol, netlist and layout in Cadence Virtuoso 27

28 Coventor MEMS+ Library-Based Design: Enabling the Design Flow Technology description Material properties Fabrication process Library of MEMS-specific, parametric components MATLAB Simulink Virtuoso MEMS+ Simulator Assemble Device Exported Verilog-A or Simulink ROM Simulate Visualize in 3D Export GDS2, Cadence PCells 28

29 MPDK Vision, circa 2013: Customize the Component Library MEMS+ Generic Component Library Process Specification Custom Library for MEMS PDK Design Rules Customization steps Limit available components Define layers and material deposit which form the component Set applicable model and default model type Define components intrinsic design rules Lock selected component properties Provide re-usable sub schematics (e.g. suspensions, comb structures ) Custom sub schematics 29

30 Design, Model and Simulation with XMB10 MEMS PDK Coventor MEMS+ XMB10 Component Library Single-Axis Accelerometer Core Assembled with MEMS+ XMB10 Library Simulation in MEMS+ and Cadence Virtuoso Y displacement and output capacitances as a results of the Y acceleration Rigid, movable MASS Solid frame with MECH Combs Anchor Suspensions beams Solid frame without MECH Metal1 Contact 30

31 Expanded Vision for Library-Based MEMS Design Enablement Customer-Assembled Top-Level Design MEMS device(s) Paths, PADs, frame Customer Device IP Foundry Device IP ACC Z ACC X,Y GYRO Z GYRO X,Y Foundry MEMS PDK Custom models Custom Layout Add-Ons TSV Suspension Electrostatic element Path PAD MEMS+ Custom Component Library 31

32 Cadence Virtuoso PDK for X-FAB XMB10 Process

33 Cadence PDK and design flow overview Pcell-based layout finishing Layer operations Routing, connections to bond pads Bonding frame generation for wafer-level packaging Verification DRC, LVS, PEX Simulation with ADE 33

34 XMB10 SKILL pcell library BondPad Bond pad with connection through the glass frit. Signal pads isolated by trench, ground pads not. Crossing Bridges a wire through the MECH layer; isolated by trench Comb Comb with variable finger count and pitch FixedToMove Connection to moveable structures, crossing trench Stopper Small MECH structure to limit the movement of the moveable mass in-plane Frame All sensor surrounding structures required by process technology 34

35 SKILL-based layout helpers XMB10 menu in Virtuoso Layout Editor Finish MEMS+ Layout Changes layers of imported MEMS+ layout according to XMB10 valid design layers Create TCOVER and MECH area Extends the TCOVER and MECH layer from the polygonal TCOVER edge around the sensor to a rectangular shape Cut TCOVER under Crossings Because there is no hole layer for TCOVER, the TCOVER area must be cut open to contact MET1 with MECH Create double chip Creates a new cellview with 2 instances of the original chip, where the second is rotated by 180, and also some other structures. Multipart path for TCOVER edge Creates a path of MECH, TCOVER and MET1 35

36 MEMS+ layers vs. XMB10 PDK layers Some layers cannot be defined in MEMS+ as required by XMB10 specifications: Definition of Cavity Cavity is a hole and cannot be defined in MEMS+ Solid frame in layer NOCAV defines implicit the Cavity Anchor also in layer NOCAV (6.1) Further special cases Holes in MECH as MCHOLE Contacts are in MET1 Replace stoppers by Pcell Solid frame without MECH Solid frame with MECH Anchor Metal1 Contact 36

37 MEMS+ layout finishing Import MEMS-Core Invalid XMB10 layers Imported layout 37

38 Routing area of the sensor Place FixedToMove at sensor contacts MECH/TCOVER Edge as Multipart-Path TCOVER forms a closed ring: Fill TCOVER and MECH to rectangular shape with script 38

39 Routing and Bond Frame Embedding sensor in Frame-Pcell Routing Crossing Pcell 39

40 Verification: DRC Process-specific design rules are implemented within Cadence Assura DRC runset Layer-based design rules Support of design-rule-driven layout Capability to check round structures and structures, which are nonparallel to x- and y-axis Handling of rules with fixed or maximum values 40

41 Verification: LVS MEMS core is considered to be LVS clean Both schematic and layout are generated within Coventor MEMS+ Final LVS after implementation of MEMS surrounding based on the extraction capabilities of CMOS verification tools Extraction of fixed- and movable structures and electrical connections Open-Short-check between layout and schematic 41

42 Summary and Outlook

43 Summary First foundry PDK for Coventor MEMS+ and Cadence Virtuoso available and ready to use Proven, ready-to-use Design Environment and Methodology using MEMS and CMOS design tools with a high level of design automation The parametric environment accelerates the optimization of sensor design parameters for a custom application The model generation enables system simulation and co-simulation with CMOS driver The layout generation of the complete design is simplified thanks to automated flow. Physical verification is supported The MEMS-PDK eases access to the technology for new customers and shortens time to market, by reducing design spins and fab cycles The PDK is the container for all technology information (process parameters, material characteristics, design layers, design rules ) Predefined process-specific components can be used to speed up the design 43

44 MEMS Design Contest MEMS design contest announced at DATE 2016 Many design proposals have been submitted, based on X-FAB XMB10 process and Coventor MEMS+/Cadence Virtuoso PDK and design flow 10 semi-finalists have been selected by the sponsors Active design phase runs until end of winning designs will be presented at CDNLive EMEA 2018 More information: 44

45 Thank you for your attention! Questions and Answers