Reliability Qualification Report ACP R Package

Transcription

1 Reliability Qualification Report ACP R Package January 31, 2013

2 ACP R Reliability Qualification Plan Table of Contents Purpose.3 Background Information..3 Qualification Tests 5 Explanation of Tests.5 Qualification by Similarity...6 Summary...6 Appendix A...7 RJR Polymers, Inc. Reliability Qualification Report, ACP R 2

3 Purpose This reliability plan qualifies the ACP R package. The package is fabricated at RJR Polymers facility in Oakland, California. Background Information The ACP R package is an RF air cavity package (ACP). It is a high performance, low cost, LDMOS plastic package with a high level of design flexibility. It has many applications in technology fields of RF power, wireless, and sensors. The package has a thermally enhanced metal base for microwave and power applications. The qualification consisted of three production lots of lids and side-walls. Each production lot is defined by material produced on a single day, where a process setup/qualification occurred. All lots were fabricated and assembled at RJR Polymers Oakland facility. The reliability stress tests were performed per industry standards (JEDEC, AEC, and MIL-STD-883). Figure 1. Representative drawing of the ACP R package. RJR Polymers, Inc. Reliability Qualification Report, ACP R 3

4 Device Description: Table 1. Detailed device description of the ACP R. Package Assembly Site ACP R Oakland, California Package Size 1230 x 396 mil Lot #1 Lot #2 Lot #3 Lid L1230A A Sidewall SW1230-4R Assembly Lot # WYC1704A WYC1704B WYC1704C Base Sumitomo Reliability Lab RJR Polymers, Inc. RJR Polymers, Inc. Reliability Qualification Report, ACP R 4

5 Qualification Tests and Results The qualification tests were performed per standard test conditions (JEDEC, AEC-101, MIL-STD-883). Sample sizes were chosen per recommended sizes or per Lot Tolerance Percent Defective (LTPD) Sampling based on the Military Standards (Max % Defective = 5%). Stress Abbv. Ref. Conditions Duration/Accept Lot A Lot B Lot C 1 Gross Leak Test GLT Liquid Test 0 Fail 0/80 0/80 0/80 2 Temperature Cycling* TC JESD22- A C to +150 C 500 cycles / 0 Fail 0/80 0/80 0/80 *Temperature Cycling passed 1000 cycles with 0 failures. Explanation of Tests Stress Test/Specification: Gross Leak Test Purpose: The test was performed to detect any gross leaks in a package. Sample Size: 3 Lots, 80 units each Possible Failure Mechanisms/Modes: Cracks, holes, or delamination in the package. Passing Criteria: Pass Gross Leak Testing at time = 0. Stress Test/Specification: Temperature Cycling (TC)/JESD22-A104 Conditions: Ta = -65 C to +150 C; unbiased Read Points: 0, 100, 500, 1000 cycles for information only Sample Size: 3 Lots, 80 units each Purpose: Accelerate failure mechanisms caused by cycling between high and low temperatures. Possible Failure Mechanisms/Modes: Failure mechanisms include fatigue and cracking related failures like broken bonds or cracked die due to stresses caused by thermal mismatches in Coefficients of Thermal Expansion (CTE). Failure modes include degradation of thermal and electrical characteristics and catastrophic failure. Passing Criteria: Conservation of structural integrity. RJR Polymers, Inc. Reliability Qualification Report, ACP R 5

6 Qualification by Similarity The ACP R package is similar to the previously qualified LD803 and relies on that package for High Temperature Storage and Solderability data. The ACP R will also be covered by the LD803 for the Lid Shear and Base Shear results. See Appendix B for associated report. Summary The reliability test results documented herein qualify the ACP R package. The package manufacturing and assembly of the ACP R occurs at the RJR Polymers Oakland facility. RJR Polymers, Inc. Reliability Qualification Report, ACP R 6

7 Appendix A Appendix B. LD803 RJR Reliability Report RJR Polymers, Inc. Reliability Qualification Report, ACP R 7

8 LD803 Reliability Qualification Report Package Qualification October 21, 2011

9 Table of Contents Purpose.3 Background Information..3 Qualification Tests and Results 5 Explanation of Tests.5 Quality Tests and Results....6 Summary

10 This reliability report qualifies the LD803 package. The LD803 consists of RJR Polymers SW A (side wall) and L1230-A (lid). The package is fabricated at RJR Polymers facility in Oakland, California. The LD803 package is an RF LDMOS package. It is a high performance, low cost, air cavity plastic package with a high level of design flexibility. It has many applications in RF power, wireless, and sensor technology applications. The qualification consisted of production lots fabricated at RJR Polymers Oakland facility. The reliability stress tests were performed per industry standards (JEDEC, AEC, and MIL-STD-883). The devices used were mechanical samples. The LD803 packages used for qualification consisted of RJR Polymers SW A (side wall), L1230-A (lid), and a base manufactured by Sumitomo. Figure 1. Package drawing of the LD803. 3

11 Device Description: Table 1. Detailed device description of the LD803. Package Assembly Site Package Size Lid Lid Material Lid Thickness Lid Epoxy Sidewall (SW) SW Material SW Size SW Surface SW Post Plating SW Epoxy Base* Base Material Base Size Base Surface Base Plating Reliability Lab LD803 Oakland, California 1230 mil L1230-A 6115, HTP-1335 NAT (LCP) 1230 x mil RJ4MB-V2, BLK SW A 6115, HTP-1335 NAT (LCP) 1230 x 370 x 46 mil MSL Enhanced Process 30-50u" Au over 100u" Ni(min) RJ4MB-V2, BLK Sumitomo Cu-CuMoCu-Cu 1:4: x 400 x 64 mil Gritblast 100u" Au over 100u" Ni(min) RJR Polymers, Oakland, CA *The Sumitomo Base was used to test package integrity of the Lid and Side Wall. The Base is not sold by RJR Polymers as part of the LD803 package. Table 2. Lot numbers used for this qualification. LD803 JT4040A JT4040B JT4040C JT4040D JT4040E JT4040F JT4041A JT4041B JT4046C JT4055B JT4055C JT4055D 4

12 1 Table 3. Qualification results for the LD803 package. 0/100 0/100 0/ /77 0/77 0/77 0/77 0/77 0/77 Stress Test/Specification: Moisture Level Preconditioning (MSL)/J-STD-020D Purpose: This test is performed to simulate the board mounting process where parts are subjected to a high temperature for a short duration. These tests detect mold compound delamination from the die and leadframe. Conditions: 24hours Bake@125+5/-0 C hours 30 C/60 R.H. + 3 X IR 245 C + 1 X Flux Immersion + DI Rinse Possible Failure Mechanisms/Modes: Failure mechanisms include corrosion, fractures, and cracks. Stress Test/Specification: Temperature Cycling (TC)/JESD22-A104 Conditions: Ta = -65 C to +150 C; unbiased Read Points: 0, 250, 500, and 1000 cycles Sample Size: 3 Lots, 77 units each Purpose: Accelerate failure mechanisms caused by cycling between high and low temperatures. Possible Failure Mechanisms/Modes: Failure mechanisms include fatigue and cracking related failures like broken bonds due to stresses caused by thermal mismatches in Coefficients of Thermal Expansion (CTE). Failure modes include degradation of thermal and catastrophic failure. Stress Test/Specification: High Temperature Storage Life (HTSL)/JESD22-A103 Conditions: 150 C Sample Size: 3 Lots, 77 units each Purpose: A failure mechanisms which are thermally activated through the application of extreme temperature. Possible Failure Mechanisms: Failure mechanisms include mechanical failure. Failure modes include poor package design, assembly, or materials. 5

13 Table 4. Quality tests performed on the LD803 package. 1 Lid Shear 2 Base Shear The reliability test results documented herein qualify the LD803 package. The package manufacturing and assembly of the LD803 occurs at the RJR Polymers Oakland facility. 6

14 Revision History A. Corrected title of Table 4. Minor clarifications. Rick Luevanos 11/11/2011 7