Micro/nanophotonics at VTT
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1 Micro/nanophotonics at VTT Timo Aalto VTT Technical Research Centre of Finland Micro and nanotechnology seminar, St Petersburg, 16 th Nov 2010
2 2 Outline Overview of micro and nanophotonics activities at VTT Fabry-Perot interferometers Fiber optics Ceramic packages for optoelectronics Polymer waveguides Silicon-on-insulator (SOI) waveguide platform Integration and packaging of optoelectronics based on SOI Future visions and collaboration potential
3 3 Bringing photonics from basic science to industrialisation Proof-of-concept demonstrator Proof-of-principle demonstrator Industrialization Technology transfer Support & revisions Proof-of-technology demonstrator Processing and packaging technologies verification Components or modules in lab or field tests Laboratory setup on optical table Modeling and simulations
4 4 VTT's technology platforms for multifunctional integration Precision mechanics, "mirror technology": optics + mechanics; medium-to-high performance optointegration Printable electronics and optics: optics + electronics + fluidics; large area / low cost Plastic integration: optics + mechanics + electronics + fluidics; medium performance system integration Ceramic technology: optics + mechanics + electronics + fluidics, RF; high performance system-on-package Silicon and glass: nano/micro-optics + nano/microelectronics + MEMS + microfluidics; medium-to-high performance chip-scale integration Combinations - Hybrid Technology Platform
5 5 MEMS Microspectometer modules Technology Small and low cost spectrometer modules based on microelectromechanical systems (MEMS) Benefits / features Very low cost, high volumes, vast selection of wavelength ranges ( µm), compact and robust References Used in a product since 1997 by Vaisala (Carbocap ), three new patents pending Customer requirements/applications Process control, sensor networks, handheld inspection tools Concentration measurements of e.g. gases and fuels Color separation
6 6 Fiber optic sensors and specialty fibers Fiber optic sensors Pressure measurements Oil monitoring Water monitoring Specialty fibers Rib fibers etc.
7 7 Fiber optic satellite communication Intra-Satellite Fibre Optic Data Link (SpaceFibre) 1 3 Gbps data link up to 100 m distance with a bit error rate < Harsh environmental requirements: vibration, temperature, mechanical shock, vacuum and radiation LTCC substrates, 850 nm-vcsels, PIN photo diodes and 50/125-µm graded-index fibres with space-qualified connectors Hybrid integrated ADC & DAC modules on LTCC (HADDAC) Optical packet switching technology developed on silicon (OTUS)
8 8 Low temperature co-fired ceramics (LTCC) for optoelectronics packaging Hermetic laser transmitter Fiber pigtailed modules
9 9 Polymer waveguides and diffractive optics Multimode polymer waveguides for e.g. PCBs Singlemode polymer waveguides with thermal or UV nanoimprinting (NIL) Diffractive optical elements with NIL or near field holography (NFH) Optical interconnect demonstration on PCB NFH-patterned grating NIL-patterned SM polymer waveguide
10 10 Outline Overview of micro and nanophotonics activities at VTT Fabry-Perot interferometers Fiber optics Ceramic packages for optoelectronics Polymer waveguides Silicon-on-insulator (SOI) waveguide platform Integration and packaging of optoelectronics based on SOI Future visions and collaboration potential
11 11 Photonic integrated circuits on silicon-on-insulator (SOI) Single mode SOI waveguides: 1 12 µm core thickness, 0.1 db/cm loss Applicable wavelengths µm Small polarisation dependency Multi-step patterning for footprint reduction World's fastest thermo-optic swithing/tuning: 333 kb/s, 700 ns rise/fall time
12 12 Library of photonic circuit elements on SOI Vertical tapers Rib-strip converters Mirrors and tight bends Various couplers (adiabatic,dc, MMI, star) Interferometers and arrayed waveguide gratings (AWGs) Monolithic DC & RF lines Fiber pigtailing Module packaging MZI Excess Loss (db) MMI MMI Adiabatic Wavelength (nm)
13 13 Outline Overview of micro and nanophotonics activities at VTT Fabry-Perot interferometers Fiber optics Ceramic packages for optoelectronics Polymer waveguides Silicon-on-insulator (SOI) waveguide platform Integration and packaging of optoelectronics based on SOI Future visions and collaboration potential
14 14 Heterogeneous III-V integation on SOI "Hybrid Silicon/InP laser (Silase)" project in the PHOREMOST EU Network of Excellence VTT+KTH+TKK InP/GaInAsP laser structure from KTH Cleaved InP chips bonded on SOI Light excited in the quantum wells couples to the Si waveguides SOI InP Excitation (532nm) x Waveguides z Potential new collaboration topic within Finland and with St. Petersburg? MQW region InP Bonding dielectric 500n m DFB grating
15 15 Hybrid integated optoelectronics on SOI Various components have been integrated on SOI: Lasers, SOAs and PDs RF lines for electrical connections Fast, simple and reliable TC bonding: No solder bumps or deep trenches Manual/automated chip alignment Alignment accuracy 100 nm vertically, µm horizontally Collaboration with St. Petersburg? 10 Gb/s PDs on SOI InP laser SOA array
16 16 Application example from space: 100-ch wavelength selector with 1 Tb/s input (OTUS) Functions integrated on a 2x2 cm SOI chip: 3 AWGs 3x11-ch SOA arrays InP PD with an integrated polymer prism RF lines Simplified breadboard demonstrator built to simulate a full packet switch that has 100 EML lasers (100x10 Gb/s) 4 EDFAs Fiber optic couplers and splitters 100 wavelength selectors 1 Tb/s data throughput
17 17 Outline Overview of micro and nanophotonics activities at VTT Fabry-Perot interferometers Fiber optics Ceramic packages for optoelectronics Polymer waveguides Silicon-on-insulator (SOI) waveguide platform Integration and packaging of optoelectronics based on SOI Future visions and collaboration potential
18 18 Vision: SOI modules integrated on PCB Flip-chip integration of optoelectronic chips on SOI Wafer level packaging with a Si cap wafer Through-silicon vias (TSVs) Dicing into Si modules and assembly on a printed circuit board Optical TSVs to connect to waveguides in PCB (or to a receptacle)...or a flexible optical interconnect or a traditional fiber pigtail
19 19 Building blocks to be developed on SOI Vertical coupling Tilted mirrors Lenses Layer transfer & III-V processing on SOI wafers Cap wafer for wafel level packaging Integrated fiber array V-grooves InP or GaAs substrate (removed) VCSEL/PD SOI BOX Si substrate Bond metal (Au) Epi layers (QWs etc.) SOI Tilted mirror
20 20 Potential collaboration topics St Petersburg area VTT/Micronova Optoelectronics Module-level packaging???? New products and business Silicon photonics Flip-chip technology Wafer-level packaging
21 21 New regional/thematic cluster on nano/microtechnology? Regional innovation clusters and national technology platforms are promoted by the EU as an effective mechanism for Research, Development and Innovation (RDI): According to the EU report Finland does not have a national technology platform in photonics or any photonics related innovation clusters A regional/thematic innovation cluster could be formed between Espoo (Micronova) and St Pietersburg (RAS) around a suitable topic, such as Nanofab, Micro and nanotechnology, or Micro and nanophotonics The cluster should Work together under a common development strategy Reduce RDI fragmentation Represent the region/theme nationally and in the EU Consist of industry, research institutes and universities
22 22 VTT creates business from technology
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