Photonics Technology for Optical Access Networks
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1 Photonics Technology for Optical Access Networks Rajeev J. Ram and Randy Kirchain Center for Integrated Photonic Systems Massachusetts Institute of Technology
2 Outline Key Points from Last Time Burst-mode transceivers WDM PON Korea WDM PON Photonic Integration in the ONU/OLT Hardware Costs Projecting the Future
3
4 Corning Broadband Access Models 2003
5 Lucent Economics of Fiber to the Home % Homes Passed Subscribe
6 Lucent Economics of Fiber to the Home % Homes Passed Subscribe
7 Burst-Mode Optics for TDM-PON Typical optical traffic (balanced) Burst-mode traffic Burst mode triplexer optics stays the same need to change the low-frequency cut-off of all of the stabilization circuits need to sense and quickly wake-up receivers and laser drivers If there is an additional cost associated with burst-mode, it is in the electronics
8 Burst-Mode Optics for TDM-PON SCF15530 Lucent (2000) 155 Mbps burst mode ICs laser driver IC, US$25 receiver IC, US$23 clock data recovery IC, US$28 Vitesse (March 2005) 2.5 Gbps IC laser driver + limiting amp VSC7965 $2.25 The burst-mode optics cost has been driven down since 2003
9 Optical Diplexer/Triplexer Sub-Assembly 30% of ONU Cost is the optical front end - Brecht Stubbe, Alcatel, 2002 ONU Cost is approx $100 - OFC/NFOEC 2005 in OPN News
10 WDM PON Architecture - Higher - Less power loss than PONs
11 WDM PON Benefits TDMA
12 CWDM: Low Cost WDM 4-channel optical CWDM as cheap as $300 - OMRAM, Japan 20 nm channel spacing 13 nm channel window 7 nm guard band
13 Comparison of CWDM and DWDM 46% cost of DWDM for 8 ch MUX 66% cost of 2.5 Gbps transponder -Lightwave
14 Thermal Stability of CWDM Splitter Temperature dependence dominated by alignment of microoptics Lightwave March, 2005
15 Athermal DWDM Splitter Silica waveguide + polymer for thermal compensation SiO 2 SiO 2 (P) SiO 2 Si or SiO 2 Temperature dependence dominated by change of index
16 Free Spectral Range of DWDM Splitters λ 1, λ N+1 AWG Two-colors can be routed along the same path by virtue of the periodicity of the wavelength response for an AWG
17 Wavelength Independent ONU Wavelength Independent ONU TDM for Upstream/Downstream Single fiber for upstream/downstream No laser at ONU Provisioning and stabilization all at OLT
18 Wavelength Independent ONU Wavelength Independent ONU WDM for Upstream/Downstream λ 1, λ N+1 AWG ONU Takes advantage of periodicity of AWG type optical MUX
19 Wavelength Independent ONU Wavelength Independent ONU WDM for Upstream/Downstream Simultaneous multicast and unicast transmission
20 Wavelength Independent ONU Wavelength Independent ONU Injection Locked Fabry-Perot Laser
21 Wavelength Independent ONU Injection Locked Fabry-Perot Laser FP-LD automatically emits at correct λ Can employ DWDM multiplexer without detuning loss Separate upstream/downstream using circulator (moderately expensive)
22 Wavelength Independent ONU Wavelength Independent ONU Injection Locked Fabry-Perot Laser
23
24 Korea Telecom WDM PON KT plans to install WDM-PON infrastructure by August this year in its first phase, procuring WDM-PON equipment of Novera Optics that can accommodate 42,000 circuits, worth approximately $13.6 million - Friday, March 25, 2005 Remote node in manhole ONU
25 Korea Telecom WDM PON 16 wavelengths 20 km 125 Mbps bidirectional No power to the remote node (WDM splitter) Wavelength independent ONU 24 ethernet ports per ONU
26 Korea NovaPON
27 Driving Down Diplexer/Triplexer Cost? 30% of ONU Cost is the optical front end - Brecht Stubbe, Alcatel, 2002 ONU Cost is approx $100 - OFC/NFOEC 2005 in OPN News
28 Optically Integrated Triplexers BinOptics Nakajima and Charil, France-Telecom- CNET. France. NOC
29 Radical Solutions: Multiwavelength Sources Simultaneous NRZ Pulse train for 20 channels from ps mode-locked laser Pulses carved in the wavelength domain 10 Gbps Only for DWDM requires power to the field
30
31 The MIT/CTR Optoelectronics Fabrication Model Mimics production from bare substrate through assembly, packaging, and final test Provides full flexibility in building a process flow Captures effect of process derived yields at testing Currently 46 Process Modules Available Surface Treatment Etch Thermal Backend Assembly Growth/Deposition Lithography Test Backend Packaging Process-based Cost Model
32 Process Modules Building Blocks in Product Flow Clean Alignment Bake Incoming Inspec Laser MQW (3x) LP-MOVPE. n-inp Cladding Epi Overgrowth Test Wire Bond Lidding, Lead check Clean PL Test PECVD SiNx Lithography Plasma Etch SiNx Asher. SiO2 Wet Etch PL Test LP-MOVPE (3x) Modulator MQW Auto. Inspec. Wafer Cleaving Laser on Carrier Chip Bond Bench Attach Bench Assembly Package Assembly Test Burn-In Test Fiber w. Grin Lens Attach Sleeve attach Test Temperature cycle Vis. Inspec. RIBE Cure Wirebond Test.
33 Cost Modeling Benefits to Roadmapping 1. Provides a generic platform to discuss the cost of process and product developments 2. Quantifies impact of future scale growth 3. Identifies key cost drivers 4. Quantifies necessary process performance hurdles
34 Quantifying Cost-Sensitivity to Scale Models Derive Cost from Projected Optimal Fab Line $1,200 (Monolithically Integrated Device) $1,000 Unit Cost (USD) $800 $600 $400 $200 $0 Other Fixed 26% Material 24% 0 10,000 20,000 30,000 40,000 50,000 Equipment 35% Other Variable 15%
35 Cost Modeling Benefits to Roadmapping 1. Provides a generic platform to discuss the cost of process and product developments 2. Quantifies impact of future scale growth 3. Identifies cost drivers 4. Quantifies necessary process performance hurdles
36 Identifying Key Cost Drivers Models Provide Unequaled Resolution (Monolithically Integrated Laser-Modulator) Other Fixed 26% Equipment 35% Material 24% Other Variable 15% Unit Cost (USD) $100 $80 $60 $40 $20 $0 Alignment Assembly Test Front-to-Back Chip Bond Fiber Attach Bench Assembly Spin-On Resist Other Fixed Equipment Other Var Materials Visual Test Bench Attach Wirebond (APV 30,000)
37 Identifying Opportunities for Improvement: Unit Cost Elasticity to Yield Yield is key issue for optoelectronics manufacturing cost What processes provide the most leverage? Position in flow Embedded yield Cost elasticity to yield - Identifies process yield impact on aggregate cost Cost Elasticity to Yield Lidding (Monolithically Integrated Device) Alignment Burn-In Chip Bond Wirebond PECVD Metal Liftoff Lapping E-beam MOCVD
38 Cost Modeling Benefits to Roadmapping 1. Provides a generic platform to discuss the cost of process and product developments 2. Quantifies impact of future scale growth 3. Identifies cost drivers 4. Quantifies necessary process performance hurdles
39 Cost Sensitivity to Final Test Yield (Monolithically Integrated Laser-Modulator) 2000 $750-$1000 $1000-$ $500- $ $250- $ Final Test Yield
40 Phase II: Optoelectronics Subassembly Model Initial model development case: 2.5G VSCEL and FP optical subassemblies Current work: 10G DFB and 10G DWDM optical subassembly Upcoming work: Benefits of integration TO Can Build Photodiode Laser Header Lens Optical Subassembly Cap Submounts Housing Fiber
41 Cost Modeling Benefits to Roadmapping 1. Provides a generic platform to discuss the cost of process and product developments 2. Quantifies impact of future scale growth 3. Identifies key cost drivers 4. Quantifies necessary process performance hurdles
42 Phase II: Optoelectronics Subassembly Model How do TOSA/ROSA design & assembly choices effect production cost? Are the cost-optimal development paths different if producing in the U.S. vs. low-wage environments in Asia?
43 Preliminary Results: Sensitivity to Scale (Low-Wage Production Environment) Unit Cost (USD) 2.5G LW FP TOSA 2.5 VCSEL 10G FP TOSA Annual Production Volume
44 Preliminary Results: Cost Breakdown (Low-Wage Production Environment) Unit Cost (USD) Overhead Maintenance Building Tooling Equipment Machine Energy Labor Material 2.5G LW FP TOSA 2.5 VCSEL 10G FP TOSA Estim
45 Early Estimates: U.S. Production LW FP VSCEL Crossover? Unit Cost (USD) 2.5G LW FP TOSA 2.5 VCSEL 10G FP TOSA Annual Production Volume
46 Early Estimates: U.S. vs. Asia Production LW FP VSCEL Crossover? Unit Cost (USD) 2.5G LW FP TOSA (Asia) 2.5 VCSEL (Asia) 2.5G LW FP TOSA (US) 2.5 VCSEL (US) Annual Production Volume
47 Early Estimates: U.S. Cost Breakdown (Labor Dominant in the 2.5G and 10G FP TOSAs) Unit Cost (USD) Overhead Maintenance Building Tooling Equipment Machine Energy Labor Material 2.5G LW FP TOSA 2.5 VCSEL 10G FP TOSA Estim
48 Process Based Cost Modeling for Access Technology Dicrete Diplexer Monolithic Diplexer How does price scale for 1Mparts? Manufacturing cost for various designs?
49 Developing a Roadmap for PON Architectures and Components 100 km at 10 Gbps 20 km at 2.5 Gbps Dramatically different photonic components external vs. direct modulation,etc. Dramatically different architectures Dramatically different network economics
50 Developing a Roadmap for PON Developing a Roadmap for PON Architectures and Components
51 Developing a Roadmap for PON Architectures and Components British Telecom 21 st Century Network ($19b) optical amp
52 Developing a Roadmap for PON Developing a Roadmap for PON Architectures and Components
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