Best-Reliable Ambient Intelligent Nanosensor Systems by Heterogeneous Integration
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1 Best-Reliable Ambient Intelligent Nanosensor Systems by Heterogeneous Integration 3D Workshop ESREF 2012, Cagliari Italy Reinhard Pufall Infineon Technologies AG (page 1)
2 Project Presentation Outline Project resources Project partners (consortium) Project structure (components) Strategic objectives of the project Technological objectives of WP1 and WP2 Innovative applications (WP3) Methodology for Reliability and Robustness Conclusions (page 2)
3 Project history (co-ordinator Infineon) e-cubes Review meeting in Leuven (BE) was presented in Brussels (Mr. Bonas-Villanova) Hearing in Brussels (Francisco IBANEZ GALLARDO) Signed contract EU-Infineon Signed consortium agreement Change of Consortium leader (Werner Weber hands over to Reinhard Pufall) kick-off meeting in Munich (page 3)
4 Project resources IST Best-Reliable Ambient Intelligent Nanosensor Systems by Heterogeneous Integration 20 partners from 9 European countries 8 major European system manufacturers 4 SMEs (small and medium enterprises) 5 large research institutes 3 Universities Total budget is Mio, requested grant 9.86 Mio Project started on 1 st Sept 2010, runs for three years until Aug 2013 (page 4)
5 Initial consortium 21 DMCE (page 5)
6 Project components (page 6)
7 Strategic objectives (1) Integration of heterogeneous technologies (such as CMOS, bipolar, advanced memories, MEMS/NEMS, ) with 3D integration technology High-performance sensor devices Miniaturization Wireless communication Best-reliability Encourage product designers to apply advanced nano technologies (nano must fulfil certain reliability requirement) (page 7)
8 Strategic objectives (2) Enable Heterogeneous integration Use 3D integration wherever possible Enable Nano Sensors for integration Make reliability assessable Use for Ambient Assisted Living Build Wireless Sensor Systems Build Heterogeneous Systems Miniaturization Develop methodology for reliability and robustness. benefits from the established European 3D technology platform of e-cubes (page 8)
9 Expected benefit enabled through heterogeneous integration Innovative Applications of Heterogeneous System Integration TASK3.1 Smart Biosensor Grain 3-5 x Form factor Sensitivity, efficiency Power reduction TASK3.2 Infrared Imager 6 x 2 x 1 x 5 x TASK3.3 Active medical implants TASK3.4 Smart Gas Sensors TASK3.5 Ultrasound Imaging probes for volumetric (3D real time) scanning 16 x 8 cm 3 -> 0.5 cm x 25 x 14 x 6 cm3 -> 1 x 1 x 1 cm3 50 x 250cm³ -> 5cm³ Cost reduction Follow-up cost, drastic reduction 20 x 20 x 200 -> x n.a 4 x (PU from 3000$ to 750$) (page 9)
10 Interaction between technology and heterogeneous integration considering reliability as key factor Requirement & Definition Phase WP1 Heterogeneous Integration WP2 Nano Sensor Devices and Technologies Development Phase Simulation & Implementation Task1.1 3D Integration Technologies Task1.2 3D Integrated Antennae and RF MEMS Task1.3 Simulation, Design and Test Task1.4 Methodology for Reliability and Robustness Test & Validation Phase Task3.1 Smart Biosensor Grain Task3.2 Infrared Imager Task3.3 Active Medical Implants Task3.4 Smart Gas Sensors Task3.5 Ultrasound Imaging probes for volumetric (3D real time) scanning WP3 Innovative Applications of Heterogeneous System Integration Task2.1 Functionalization of Nano Structures for Sensing Task2.2 Nano Structures for Optical Field Manipulation Task2.3 High Efficient Data- and Energy- Management Reliable and Robust Supporting Activities WP4: Scientific Advice & Dissemination & Networking WP5: Project management (page 10) Technology platform
11 Heterogeneous Integration WP1 Task 1.x Sub-Task 1.x.x Task 1.1 3D Integration Technologies Task 1.2 3D Integrated Antennae and RF MEMS Task 1.3 Simulation Design and Test Task 1.4 Methodology for Reliability and Robustness (page 11)
12 Nano Sensor Devices and Technologies WP2 Task 2.x Sub-Task 2.x.x Task 2.1 Functionalization of nano structures for sensing Task 2.2 Nano structures for optical field manipulation Task 2.3 High efficient data- and energy management (page 12)
13 Innovative Applications of Heterogeneous System Integration WP3 Task 3.x Task 3.1 Smart Biosensor Grain Task 3.2 Infrared Imager Task 3.3 Active Medical Implants Task 3.4 Smart Gas Sensors Task 3.5 Ultrasound Imaging probes for volumetric (3D real time) scanning (page 13)
14 Scientific Advice & Dissemination & Networking WP4 Task 4.x Task 4.1 Dissemination and Scientific Advice Task 4.2 Networking Task 4.3 Training (page 14)
15 Heterogeneous Integration WP1 Task 1.x Sub-Task 1.x.x Task 1.1 3D Integration Technologies Task 1.2 3D Integrated Antennae and RF MEMS Task 1.3 Simulation Design and Test Task 1.4 Methodology for Reliability and Robustness (page 15)
16 Interaction between technology and heterogeneous integration Technology Platforms and Applications in Smart Biosensor Grain (MAGNA) Infrared Imager (Sensonor) Active Medical Implant (Sorin/ELA) Air Quality System (SIE) Smart Ultra- Sound Imaging Probe (VERMON) Heterogeneous integration technologies TSV-SLID/ SWACF Low-T IMC or SWACF Bonding (IZM, Tyndall) Layer Transfer Bonding (SINT) TCI/ UTCS Thin Chip Integration (IMEC, IZM, IFX) WDoD Through Polymer Via; Wireless Die on Die (3DPlus) PAECE & Liquid Fill High-Perform. Interposer & 1step wiring (Siemens) Reliability (Infineon, TUC, SIE, IZM) Technology Components High-performance Communication and antennae (IFAT, EPFL) Nano structures Functionalized for sensing (EPFL/SIE/Tyndall/SINT/IQE) For optical field manipulation (SINT/SIE) High-efficient Energy Management (IFAT, DICE) General technological inputs to applications Heterogeneous integration technology inputs to applications Heterogeneous integration technology inputs to general technologies (page 16)
17 Need for methodology for reliability and robustness impact of temperature on product lifetime T Use conditions Cap-Chip (Wafer) Advanced bonding system (Stacking2) Metallisation System 2 IC Device 2 (Technology 2) with TSV Advanced bonding system (Stacking1) Metallisation System 1 T: mean temperature DT: temperature swing grad T: local temperature distribution Temperature depends on time and location Very high impact on thermal mechanical performance (thermal mismatch) (page 17)
18 TASK1.4 Methodology for Reliability and Robustness (IFX) Quantify Adhesion Determine fracture toughness (cohesive and adhesive) 4. point bending Button shear test Simulation for prediction Crack Detection When (0h or after stress) Which feature size for detection necessary Nano sensor technology? Precision Measurement Very good spatial resolution AFM (atomic force X-ray tomography µ-raman spectroscopy Degradation Progress Interdiffusion of metals Ageing of anisotropic films for interconnects Ageing of adhesives polymers glues encapsulants Partners involved Bi-weekly meeting Infineon, TUC, Tyndall IMEC, Siemens, EMFT (page 18)
19 TASK1.4: Methodology for Reliability and Robustness (IFX) is divided into Sub-Tasks Sub-Task 1.4.1: Develop methods to make reliability assessable Sub-Task 1.4.2: Study degradation mechanisms based on physics of failure Sub-Task 1.4.3: Develop lifetime models and simulation models for the prediction of degradation under use conditions Sub-Task 1.4.4: Develop highly accelerated stress tests (i.e. combined tests) to detect weaknesses quickly (page 19)
20 Methodology for Reliability and Robustness Conclusions Encourage product designers to apply advanced nano technologies (nano must fulfil certain reliability requirement) Reliability is the key factor for innovation in new applications (page 20)
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