PRICE LIST 3IT.NANO 2017
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1 This price list is valid from July 1st to December 31,. Rates may be subject to change. LNN AREA - CLEANROOM class 100 Access fee and operator hourly rate LNN access fee Operator hourly rate Equipment hourly rates 3 Substrates bonding (AML Wafer Bonder) Wet benches plating benches Thin film deposition by atomization (Spraycoater) Electrical measurements - Probe station Atomic force microscope (AFM) 4 Ozone surface cleaning (UV-Novascan) Profilometer (Dektak and Fogale) Chemical mechanical planarization (CMP) Thin films deposition by argon plasma (Emitech sputter coater) Plasma etching (DRIE) Samples cleaning by oxygen plasma (Plasmaline) Oxidation, annealing and LPCVD deposition (Tylan furnace) Photolithography (Mask aligner OAI, Spin coater, Development benches) Samples heat treatment (RTA) Scanning electron microscopy (LEO1540XB CrossBeam FIB - SEM mode only) Scanning electron microscopy (SEM FEG Zeiss Supra 55VP) 5 Laser beam photolithograpy (Photoplotter) 6 Deposition of thin dielectric layers (ALD) Plasma Enhanced Chemical Vapor Deposition (PECVD STS) Ion implanter (Varian) Advanced Oxide Etching (AOE) III-V compounds Etching (ICP III-V) Silicon Etching (ASE) Thin films deposition (Vaccum coater Edwards)* Thin films deposition (Sputter deposition SPT320)* QSR5 electro-resin deposition by evaporation (TLI evaporator)* 39 $ / day 39 $ / h 90 $ / h 210 $ / h 144 $ / deposition
2 This price list is valid from July 1st to December 31,. Rates may be subject to change. LNN AREA - CLEANROOM class 100 Training prices LNN general training Ellipsometer - basic training Ellipsometer - advanced training Laminator Optical microscopes Nikon et DMLM Ozone surface cleaning (UV-Novascan) Plasmaline Samples preparation and cleavage Emitech sputter coater Spin coater AFM Electroplating benches Wet benches part I Wet benches part II Wet benches part III Rapid thermal annealing - RTA Plasma etching - RIE Photolithography part II Photolithography part III Dektat profilometer Fogale optical profilometer Probe station Thin film deposition - SPT320 Thin film deposition - Spraycoater Ion beam etching FIB Electronic microscopy part I (Leo Leo VP - FIB) Photolithography part I Photoplotter part I Photoplotter part II Chemical mechanical planarization - CMP Wafer Bonder AML Atomic layer deposition ALD Electronic microscopy part II (Caracterization - Cathodoluminescence and EDX) PECVD STS AOE STS ASE STS ICP III-V 75 $ / user 75 $ / user 150 $ / user 300 $ / user 600 $ / user
3 This price list is valid from July 1st to December 31,. Rates may be subject to change. LCSM AREA - CLEANROOM Access fee and operator hourly rate LCSM access fee Operator hourly rate Equipment hourly rate 3 Characterization of photovoltaix cells (Solar simulator) Biological safety cabinet Femto second laser (Mai Tai / OPO) Surface plasmon resonance measurement (SPR) Hall effect station External quantum efficiency measurement (Station EQE) X-ray diffractometer (DCD Waterloo and HRXRD) Electrochemical Impedance System Measurement in concentration up to 1000 suns (Flash tester station) Plastic injection molding machine Profile projector Annealing and CVD processes (Sentrotech, Vulcan, Carbolite and KILN furnaces) Phototransducer station Substrates bonding (Bonder) Wet benches Samples dicing (Disco dicing saw) Hall effect measurements Electrical measurements (Probe stations HP, HV, HF, heated, DC Wentworth) Holographic microscope Photoluminescence measurements (HIPLM) Epifluorescence microscopy Spectroscopy set-up ihr320 Raman spectroscope Photoluminescence measurements (PL Mapper) Fourier Transform Infrared spectroscopy (FTIR) IR lasers UV lasers Epitaxial growth (CBE reactors)* $ 75 / quarter then $ 3 / h from the 26th hour 15 $ / h 20 $ / h 39 $ / h 60 $ / h 105 $ / h 120 $ / h 2250 $ / jour
4 This price list is valid from July 1st to December 31,. Rates may be subject to change. LCSM AREA - CLEANROOM Training prices General training Room training Profile projector Wet benches Optical microscope Zeiss Infinity Substrates bonding (Bonder) Biological safety cabinet Vulcan furnace Epifluorescence microscope Non cryogenic Hall effect station Plastic injection molding machine Phototransducer station X-ray diffractometer - DCD Waterloo X-ray diffractometer - HRXRD Carbolite furnace Sentrotech furnace Photoluminescence measurements - HIPLM or QSPB-reader Angle contact measurements station Cryogenic Hall effect station Surface plasmon resonance - SPR Probe station DC Wentworth Electrochemical Impedance System - EIS Photoluminescence measurements - PL-Mapper Polishing station FTIR Dicing saw IR and UV lasers Room 1154 Room 1162 Room 1164 Room 1174 Room 1178 Room $ / user 60 $ / user 15 $ / user 15 $ / user 60 $ / user 90 $ / user 100 $ / user 150 $ / user 300 $ / user 450 $ / user 960 $ / user
5 This price list is valid from July 1st to December 31,. Rates may be subject to change. IMDQ AREA Access fee and operator hourly rate IMDQ access fee 8 Operator hourly rate Equipment hourly rate 3 Wire saw Profilometer Wet benches Thermal annealing furnace Gold wire bonder Acoustic microscope Probe station Photoluminescence Photolithography Spin coater Oxygen plasma E-beam evaporator* Sputtering* Ion etching system* 15 $ / day 45 $ / h 90 $ / h 150 $ / deposition
6 Billing terms 2 s include administrative costs. A discount of 33% applies to manufacturers who sign a contract with 3IT. 3 Equipment pricing is degressive and depends on the duration of continuous use of the devices. The decreasing tariff is established as follows: 1 hour or less = 100% of the rate; 1 to 4 hours of continuous use = 60% of the rate; 4 to 8 hours of continuous use = 30% of the rate; More than 8 hours of continuous use = 20% of the rate. The equipment can be booked in 30-minute increments. Equipment marked with an asterisk (*) does not benefit from the decreasing tariff. 4 The purchase of probes is at the expense of the user. 5 A supplement may apply when measuring cathodoluminescence (CL) and / or using cryogenic liquid. 6 For the manufacture of masks, the cost of the blank mask and of mask's development and etching are added. 7 Additional charges for thick layers deposition and/or precious metals may be added. Staff time is extra. 8 The access fee is 5$ per day/per user. This covers expenses related to general consumables (suits, headcovers, sticky carpets, glassware, small tools, etc.) and to class environment services (air filters, DI water supply, nitrogen gas supply, etc.). It also gives access to basic means, such as some optical characterization tools (optical microscopes, ellipsometer) and some wet bench operations (sample cleaning)
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