纳米压印技术最新进展. Obducat Technologies AB., Sweden Gang Luo,

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1 纳米压印技术最新进展 Obducat Technologies AB., Sweden Gang Luo,

2 History 2016 Launch of SINDRE Large Area 2015 Acquire Solarsemi Gmbh 2015 Awarded by NNT for Pioneering NIL into production 2014 Launch and sell SINDRE 400 Gen2 system with UV based process 2013 Launched UV based NIL process for mass-production 2013 Sold the first SINDRE production system for BIO applications 2008 Sold the first SINDRE 400 for LED production and reached an commercial agreement concerning SINDRE HDD development 2007 Epistar place order on the newly launched of SINDRE HVM 2006 Breakthrough order for NIL production system, Samsung launches products with Obducat Inside, SEM Apollo product range is launched 2005 IPS and STU introduced on the market 2004 Completed the development of process for mass-production 2002 First Asian orders for NIL and first NIL into Semiconductor area 2000 Both the first EBR and the first NIL system are sold 1999 Soft Press Key Imprint technology is Patented by Obducat 1997 Listing on the Stock Exchange and first working EBR is produced 1996 Development of Nano Imprint begins together with LTH 1989 Company is founded, aiming at replacing LBR mastering technology with EBR

3 One company - Two locations ~1hr flight Obducat AB (mother company) & Obducat Technologies AB (NIL branch) Solarsemi Gmbh (Coating branch) > 30 employees Application laboratory Class 100 cleanroom Founded 1989 More than 140 world wide patents More than 140 installed systems Located in Lund, Sweden > 40 employees Application laboratory Founded 2009 More than 35 world wide patents More than 300 installed systems Located in Radolfzell, Germany

4 Obducat the Pioneer of NIL industrialization 2016 Obducat celebrate 20 years anniversary for its NIL products! Obducat started developing materials, processes and machinery's 1996 and installed the first sold NIL system already year Since then we have established a leading position in the market of NIL-production with an installation base far exceeding any competitor. More than 140 customer installations world-wide Obducat is the only NIL supplier that have sold NIL systems being used in commercial mass production. Obducat has created the strongest Patent portfolio in the business. More than 140 granted patents Since the start of the NIL product range, Obducat has developed and delivered more NIL projects than any other NIL company. For 20 years Obducat has built knowledge in the up & down stream processes required for successful NIL implementation in real production environment. This competence is available to all our customers! Recently Obducat acquired the company Solarsemi, supplying the highest quality coating equipment in the industry, with the purpose to supply complete and integrated production solutions.

5 Product overview Nano Imprint Equipment Utilizing the IP developed in-house and the knowledge gained from application development projects the last 20 years, Obducat can offer the most comprehensive range of lithography solutions and application support for Nano and Micro patterning in the business Hard Disc Academic R&D Optical Components Lenses Application examples LED Solar cell High density interconnects Display EITRE-Line Manual R&D tools Stand-alone Nanoimprinters - Eitre 3 - Eitre 6 - Eitre 8 (8 x 8 ) SINDRE-Line High degree of customization possible! Fully automated systems Production systems with throughput ~60wph (LED) and cassette handling - Imprint size 4 8 wafers - Other sizes and applications upon request including > Display Sizes Gen 5 EITRE-Line Large Substrates Semiautomatic systems NIL tool for Display standard sizes up to Gen 5. Suitable for both Thermal, UV and STU processes. Semiautomatic Imprint process up to GEN 5 size Consumables Master stamps Silicon, Quartz & Nickel IPS and STU materials Polymer and resist materials with various characteristics that can be tailored for a specific applications

6 Product overview Coating and wet-processing By fully owned subsidiary Solarsemi, Obducat can offer a wide range of fully automatic and semiautomatic lithography equipment solutions for semiconductor, display and substrate processing applications. Priming Spin coating (open bowl or RCCT) Spray coating Baking Developing Applications Etching Cleaning Post CMP cleaning Lift-off Stripping EL-Line (easyline) QS-Line (quickstep) QS-Line (quickstep) Large Substrates MC-Line (microcluster) Manual lab spinner module up to Ø8 (Ø200 mm) Bench mounted & stand-alone spin-coater, spray-coater, developer, wet-process spinner, hot-, cool & HMDSplates for low volume production up to Ø12 (Ø300 mm) Semiautomatic systems Stand-alone spin-coater, spray-coater, developer, wet-process spinner, hot-, cool & HMDS-plates manual or full automatic robotic system up to GEN 5 size Fully automatic production systems Consisting of platforms with robot handling and all lithography processes from coating, baking to development and cleaning application

7 How does Obducat NIL work? All our NIL systems are based on the patented Soft Press Technology. Air Pressure parallelism thin and uniform residual layer! Independent of stamp & substrate thickness variations, bow or waviness Any resist thickness High Imprint depth uniformity Homogenous pressure distribution Possible to print on curved surfaces! Always full area imprint in one shot!

8 Obducat NIL technology: Imprint Technology Stephen Y. Chou et al Nano Lett., Vol. 6, No. 11, 2006

9 Obducat s patented technologies Key words about Obducat s NIL technology: Soft Press technology Obducat s replication technology, using air pressure to ensure a uniform replication with high repeatability wafer-to-wafer. IPS The Intermadiate Polymer Stamp is used as a transfer step to overcome substrate unflatness. Extends stamp lifetime Reduce stamp cost per imprint STU Simultaneous Thermal and UV imprint is applied to the substrate in order create a uniform resist layer and ensure a high throughput. Master stamp Imprint Step 1: UV-transparent polymer Master stamp IPS Imprint Step 2: UV-radiation IPS STU -polymer const. working temperature STU -polymer Substrate IPS

10 Obducat NIL technology: Imprint Technology Traditional Hard Stamp IPS TM Benefits Eliminates halo-defect Hard Stamp Substrate void particle IPS Substrate particle Self-cleaning of stamper Hard Stamp Substrate particle IPS Si-master particle No damage risk to stamp/substrate Increased master stamp lifetime Hard Stamp Substrate particle IPS Substrate particle

11 LED production using NIL

12 The SINDRE tool for mass production Nano Imprint Lithography for High Volume Manufacturing Key specifications and information Throughput up to 60 wph Edge exclusion zone is 500 µm Changeover time between substrate sizes is < 1 hour Changeover time for stamp change is < 30 min NIL Equipment Production Sindre 400 G2 (Up to 4 substrate size) Sindre 600 G2 (Up to 6 substrate size) Sindre 800 G2 (Up to 8 substrate size) General lead time indication is weeks after purchase order

13 NIL quality performance Measurement on 4-inch PSS based on AOI Example Uniformity data on 4- inch substrate Customer uniformity data shows that the Obducat NIL technology gives excellent performance; Top diameter 1.25% Bottom diameter 0.94% Height 1.15%

14 True imprinting to the edge of wafer

15 AOI example data Defect count in FAB environment Measurement after ICP process.

16 Routes for cost reduction - µpss & npss Increased manufacturing efficiency Transition to larger substrates - improves production equipment utilization Higher level of pattern uniformity using NIL instead of optical lithography leads to higher amount of good dies on each wafer and thereby reduced cost Improved device efficiency and reduced cost Transition from µpss to npss offers opportunity to; Increase energy efficiency Increased equipment throughput Lower consumable costs With improved efficiency thermal management issues can be reduced which enables cost reduction in packaging technology

17 Next Generation LEDs e.g nano based PSS To use the verticalization effect for higher light extraction Use a more vertical light path obtained in the moth-eye layer to minimize the number of reflections in LED chips before light escapes and thereby to reduce absorption. Therefore Moth-eye Patterned Sapphire Substrate (MPSS) are suggested to be used instead of micron size patterned Sapphire substrates (PSS) Diffraction at MPSS interface MPSS characteristics Submicron order period structure. Light diffraction - large front luminescence improvement effect. Thin GaN layer lower production cost and less wafer bowing. High reflectance electrode p-layer Emission layer n-layer GaN GaN bottom layer Sapphire MPSS

18 Next Generation LEDs e.g Nano wires The NW s can be produce either by top-down or bottom up approach Irrespective of production approach, NIL is used to place the NW s where you want them. NIL is the most suitable nano patterning method for large areas 75nm Holes printed on wafer for pillar growth

19 Applications: Nanowires pattering for LED The lifted sample can be used for MOCVD growth directly General Overview company presentation presentation Obducat - Obducat AB All CONFIDENTIAL rights reserved

20 Next Generation LEDs e.g Nano wires The efficiency of nanowire based LEDs is expected to be higher compared to conventional µpss and npss LEDs. An even bigger advantage is the expected yield improvment i.e more high performance LEDs from a wafer compared to today which will lead to higher revenues generated from a single wafer

21 Bio / Medical

22 Life Science applications Problems with regard to maintaining the activity level of delivered agents and avoidance of foreign body and immune response can be inhibited by mimicking the cell structure. Drug delivery Drug development Diagnostic sensors Electrochemical sensors 3D scaffold tissue engineering Contact lens for glucose measurement Obducat supplied the pilot production line to Kimberly-Clark for manufacturing of the drug delivery devices in Q

23 Bio / Medical - Transdermal Drug Delivery Obducat supplied the first production line for manufacturing of Nanostructured Transdermal devices in Q

24 Bio /Medical - Bio sensor SEM picture shows topview a Nano-Bio sensor produced by Nano-Imprint lithography by Obducat SEM picture shows topview a Nano-Bio sensor produced by Nano- Imprint lithography supplied by Obducat

25 Bio / Medical - Nano-electrodes for Bio-chemical sensors MATSENS : Lab-on-a-chip platforms based on microfluidic and electrochemical systems. - NIL is used to fabricate nano-electrodes or incorporate nanostructure on the electrodes to go beyond the current level of sensor performance. Obducat

26 Bio / Medical High aspect ratio Imprint on 6 -Silicon 3,6 0,4 Stamper Polymer 18 3,5 m 14 m Silicon SEM picture shows side view of high aspect ratio features etched into Si after NIL patterning by Obducat NO residual layer

27 Displays

28 Displays Three areas where NIL can create improvements Polarizer Color filters TFTs The benefits are; Improved image quality Improved light tranmission Extended battery lifetime Reduced costs Thinner displays

29 Displays various projects since many years Flexible displays EU & Taiwan E-paper displays Japan LCD displays EU, Taiwan & China Wire Grid Polarizers Korea, Japan, Taiwan & China Al gate for organic transistor

30 Large Area NIL Nickel stamp for Flat panel display Industry's first large Nickel stamp for Display applications made 2008 (E-paper)

31 Wire Grid Polarizer function & pitch Smaller Pitch Higher Extinction Currently Display Industry plan for use of 100nm pitch

32 nwgp manufacturing for LCD Metal Deposition Large-area NIL stamp Resist Coating - Thickness< 100 nm over large area NanoImprint - Large-area stamp - Pattern uniformity - Residual layer uniformity - Defect-free demolding 1. Step and repeat tiling 2. Interference lithography Aluminum RIE & Resist Strip - Large-area nanoscale ICP RIE Residual Layer Removal - Uniform O 2 RIE over large-area Stamp Fabrication

33 Large Area NIL - Nano Wire Grid Polarizer SEM picture shows top view of imprinted polarization pattern SEM picture shows Cross section of imprinted polarization pattern

34 Small size example from Customer project SEM images of the final etched Al gratings, section view. 55nm linewidth, 45nm space, 248nm depth

35 Applications: Opto-Electronics Typical lens aperture size: µm Typical lens height: µm General Overview company presentation presentation Obducat - Obducat AB All CONFIDENTIAL rights reserved

36 Optical components

37 Optical components Applications Patterning of lenses for images sensors Manufacturing of DFB lasers Reflective and diffractive patterns Photonic devices Plasmonic devices

38 Applications: sub-wave length grating on InP Overview presentation Obducat AB All rights reserved

39 PhotoVoltaics

40 Routes for improvement Increased manufacturing efficiency Transition to larger substrates - improves equipment utilization Transition to thinner substrates reduce raw material costs Consistent manufacturing quality reduce sorting Improved efficiency Reduced reflectivity by controlled patterning Increase conversion efficiency by modification of PN-junction Increase internal reflection by controlled patterning Thinner conductors to reduce shadowing

41 An example of Emerging technologies cont. The thin film silicon approach The thin film silicon approach enables a reduction of silicon used and thereby reducing manufacturing costs and weight Thin silicon will absorb less light, however, this can be compensated for by using a nanostructured surface In addition, the silicon can be produced directly on the module giving additional cost savings This approach will be developed further in a joint research effort between Obducat and IMEC as well as within EU-project PhotoNVolatics

42 Thank You for Your attention Gang Luo Obducat Technologies AB