Micropatterning and casting PEDOT-PSS /DMSO layers
|
|
|
- Dwayne Barnett
- 6 years ago
- Views:
Transcription
1 Micropatterning and casting PEDOT-PSS /DMSO layers Benoît Charlot, Gilbert Sassine, Alexandra Garraud, Alain Giani, Philippe Combette IES Institut d Electronique du Sud CNRS Université Montpellier II Place&E.&Bataillon,&34095&Montpellier&7&France&
2 Outline Introduction PEDOT:PSS deposition Soft lithography techniques Casting Stamping Shadow masking Lithography techniques Lift off Protection layer Applications Conclusions
3 Introduction PEDOT:PSS is a blend of polymers : PSS : polystyrene sodium sulfonate PEDOT poly(3,4-ethylenedioxythiophene) - Conductive polymer, flexible transparent when deposited in thin film layer - low temperature, low cost process - Often use in organic solar cells - Candidate for the replacement of ITO - Organic electronics, large area display But : - low charge carrier mobility - Sensitive to moisture, water and UV Issues of patterning Ink-jet printing, vapor deposition through shadow masks, soft and hard imprint lithography, and photolithography R= ohm.cm -1 Work function 5.2 ev
4 Bioelectrode PEDOT&PSS(is(a(candidate(material(for(bioelectrode( Improvement(of(the(neural(<ssue&electrode(interface( and(life<me(of(implants( &(highly(electroconduc<ve(( &(hydrophilic(and(biocompa<ble( &(So?ness( silk&thread& coated&with& PEDOT7PSS& Shingo&Tsukada&et&al.&Plos&One& Volume&7,&Issue&4,&April&2012&& Microelectrode&arrays&for&the&capture&of& cardiac&and&neuronal&signals&& Highly&Conformable&ConducTng& Polymer&Electrodes&or&In&Vivo& Recordings& A.Blau&et&al.&Biomaterials& Volume&32,&Issue&7,&March&2011& D.&Khodagholy&&et&al.&Adv.&Mater.& 2011,&23,&H268 H272&&
5 PEDOT:PSS deposition Spincoa<ng( 3000(rpm(Th=100nm((( and(drying(on(hotplate(125 C( WeIng(issue(can(be(solved(by(adding(IPA( Mean Resistivity PEDOT:PSS only : R=6 Ω.cm -1 Additives for increasing conductivity Ethylène glycol C 2 H 6 O 2 Glycerol C 3 H 8 O 3 Sorbitol C 6 H 14 O 6 Dimethyl Sulfoxide DMSO C 2 H 6 OS Erythritol C 4 H 10 O 4 Mean Resistivity PEDOT:PSS / DMSO R= Ω.cm -1 Mean Resistivity PEDOT:PSS / EG R= Ω.cm -1
6 Casting in PDMS Goal : obtaining deformable electrodes in PDMS for large deformations Direct metalization Problems : Inclusion / deposition of metals in PDMS adhesion problems / cracks Cristalliza<on(of(PEDOT:PSS(in(PDMS(grooves( HydrophilisaTon&:&Oxygen&Plasma& Filling,&squeegee:&scrapping&with&a&glass&blade& Hot&plate&cristallizaTon& Repeat & WeNability(issues(in(PDMS,(volume(diminu<on(during(cristalliza<on(((
7 Casting from PDMS Deposition of PEDOT:PSS patterns from a PDMS scaffold Liquid PEDOT:PSS droplet Pressing Hot plate cristallization Residues cleaning : Reactive ion etching
8 PEDOT:PSS selective deposition SelecTve&deposiTon&of&PEDOT:PSS&using& hydrophobic&surfaces& &Jung&Ah&Lim&et&al.&& Appl.&Phys.&Le^.&95,&233509&(2009)&
9 Shadow masking Use of metal shadow mask Need of a perfect contact between mask and substrate Limitation on design (free standing structures and size) Magnetic clamping
10 Lithography Issues( 7&PEDOT:PSS&films&are&damaged&by&aqueous&soluTons,&which&are&standard& developers&in&conventonal&photolithography& 7&acid7sensiTve&photoresists&are&affected&by&the&acidic&PEDOT:PSS.& 3(solu<ons(:(( 7&Lithography&before&PEDOT&deposiTon&&:&Lid&off& 7&ProtecTon&coaTng&on&PEDOT&layer& And&:& 7&Specific&photoresists&Developed&with&hydrofluoroethers& P.&G.&Taylor&et&al.&Adv.&Mater.&2009,& 21,& &
11 Lithography : Lift off 7&S1818&with& chlorobenzene& hardening& 7 &AZ2020& &PEDOT& depositon&and& cristallizaton& Stripping&with& acetone& (S1818)& Or&DMSO& (AZ2020)&& U&shape(structures&
12 Lithography with protection : Parylene Example&&:&use&of&Parylene7C&as& protectve&layer& PEDOTS:PSS&thin&layer& Parylene& Photoresist&& ReacTve&ion&eetching&of&Parylene&and& PEDOT& Peeling(of&parylene&(weak&adhesion)& J.A.&DeFranco&et&Al.&Organic&Electronics&7,&&22 28& Peeling(Parylene(limits(the(shape(of(paNerns(:(con<nuous(structures(
13 Lithography with protection : Aluminum Blend&of&& PEDOT:PSS& IPA& PMMA& &Virginia(Chu(and(Joao(Conde,& INESC&MN,&Lisboa,&Portugal& And&addiTon&of&CNTs&a^ached&by& surface&functonalisaton& Use(of(Aluminium(for(both(( Hard(mask(for(etching(and( Sacrificial(layer( Wet(etching(of(Aluminium( compa<ble(with(pedot:pss( compound((((( P.&M.&Sousa,&APPLIED& PHYSICS&LETTERS&99,& &(2011)&
14 Lithography with protection : Si 3 N 4 Silicon Nitride protection layer PEDOT:PSS deposition SiN x PECVD deposition (200 C) 100nm Lithography RIE selective etching CHF3 for SiN x O 2 for PEDOT:PSS Flat(profile,(but(requires(precise(etching(control&
15 Applications Electrodes for all polymer pyroelectric sensor Carbon Nanotube interface with PEDOT:PSS PEDOT&/&PVDF&/PEDOT& Deformable electrodes for tactile sensor (graphite PDMS force sensor) BioElectrodes for electrophysiology
16 Conclusions PEDOT:PSS is an interesting material for implementation of deformable electrodes in several applications Patterning techniques includes - Soft lithography - standard lithography / RIE etching with process adaptation Potential use in bioelectrodes for neuro interface Further work : Effect of RIE on polymer, degradation? Best gazes for etching CHF 3? CF 4? O 2
Today s Class. Materials for MEMS
Lecture 2: VLSI-based Fabrication for MEMS: Fundamentals Prasanna S. Gandhi Assistant Professor, Department of Mechanical Engineering, Indian Institute of Technology, Bombay, Recap: Last Class What is
Thermal Nanoimprinting Basics
Thermal Nanoimprinting Basics Nanoimprinting is a way to replicate nanoscale features on one surface into another, like stamping copies are made by traditional fabrication techniques (optical/ebeam lith)
Polymer-based Microfabrication
Polymer-based Microfabrication PDMS SU-8 PMMA Hydrogel 1 Soft Lithography Developed by Whitesides, et. al A set of techniques for microfabrication based on the use of lithography, soft substrate materials
Schematic creation of MOS field effect transistor.
Schematic creation of MOS field effect transistor. Gate electrode Drain electrode Source electrode Gate oxide Gate length Page 1 Step 0 The positively doped silicon wafer is first coated with an insulating
Supporting Information
Supporting Information The adhesion circle: A new approach to better characterize directional gecko-inspired dry adhesives Yue Wang, Samuel Lehmann, Jinyou Shao and Dan Sameoto* Department of Mechanical
Fabrication Technology, Part I
EEL5225: Principles of MEMS Transducers (Fall 2003) Fabrication Technology, Part I Agenda: Oxidation, layer deposition (last lecture) Lithography Pattern Transfer (etching) Impurity Doping Reading: Senturia,
Introduction to Micro/Nano Fabrication Techniques. Date: 2015/05/22 Dr. Yi-Chung Tung. Fabrication of Nanomaterials
Introduction to Micro/Nano Fabrication Techniques Date: 2015/05/22 Dr. Yi-Chung Tung Fabrication of Nanomaterials Top-Down Approach Begin with bulk materials that are reduced into nanoscale materials Ex:
Dr. Priyabrat Dash Office: BM-406, Mob: Webpage: MB: 205
Email: dashp@nitrkl.ac.in Office: BM-406, Mob: 8895121141 Webpage: http://homepage.usask.ca/~prd822/ MB: 205 Nonmanufacturing In continuation from last class... 2 Top-Down methods Mechanical-energy methods
EE 5344 Introduction to MEMS. CHAPTER 3 Conventional Si Processing
3. Conventional licon Processing Micromachining, Microfabrication. EE 5344 Introduction to MEMS CHAPTER 3 Conventional Processing Why silicon? Abundant, cheap, easy to process. licon planar Integrated
6.777J/2.732J Design and Fabrication of Microelectromechanical Devices Spring Term Solution to Problem Set 2 (16 pts)
6.777J/2.732J Design and Fabrication of Microelectromechanical Devices Spring Term 2007 By Brian Taff (Adapted from work by Feras Eid) Solution to Problem Set 2 (16 pts) Issued: Lecture 4 Due: Lecture
Nanoimprinting in Polymers and Applications in Cell Studies. Albert F. YEE Chemical Engineering & Materials Science UC Irvine
Nanoimprinting in Polymers and Applications in Cell Studies Albert F. YEE Chemical Engineering & Materials Science UC Irvine Presentation outline Motivation Reversal imprinting Soft inkpad imprinting on
Project Report. 1. Work progress and achievements during the project. Project: (Soft-COM: FP7-PEOPLE-2011-IEF)
Project Report Project: 301028 (Soft-COM: FP7-PEOPLE-2011-IEF) Research Fellow: Shunpu Li Scientist in Charge: Daping Chu The fellow and scientist in charge are very grateful for the support. The outcomes
Review of CMOS Processing Technology
- Scaling and Integration Moore s Law Unit processes Thin Film Deposition Etching Ion Implantation Photolithography Chemical Mechanical Polishing 1. Thin Film Deposition Layer of materials ranging from
Thin. Smooth. Diamond.
UNCD Wafers Thin. Smooth. Diamond. UNCD Wafers - A Family of Diamond Material UNCD is Advanced Diamond Technologies (ADT) brand name for a family of thin fi lm diamond products. UNCD Aqua The Aqua series
Thin. Smooth. Diamond.
UNCD Wafers Thin. Smooth. Diamond. UNCD Wafers - A Family of Diamond Material UNCD is Advanced Diamond Technologies (ADT) brand name for a family of thin fi lm diamond products. UNCD Aqua The Aqua series
Chapter 3 Silicon Device Fabrication Technology
Chapter 3 Silicon Device Fabrication Technology Over 10 15 transistors (or 100,000 for every person in the world) are manufactured every year. VLSI (Very Large Scale Integration) ULSI (Ultra Large Scale
Process steps for Field Emitter devices built on Silicon wafers And 3D Photovoltaics on Silicon wafers
Process steps for Field Emitter devices built on Silicon wafers And 3D Photovoltaics on Silicon wafers David W. Stollberg, Ph.D., P.E. Research Engineer and Adjunct Faculty GTRI_B-1 Field Emitters GTRI_B-2
Electronic Supplementary Information
Electronic Supplementary Material (ESI) for Journal of Materials Chemistry C. This journal is The Royal Society of Chemistry 2015 Electronic Supplementary Information Water stability and orthogonal patterning
CS/ECE 5710/6710. N-type Transistor. N-type from the top. Diffusion Mask. Polysilicon Mask. CMOS Processing
CS/ECE 5710/6710 CMOS Processing Addison-Wesley N-type Transistor D G +Vgs + Vds S N-type from the top i electrons - Diffusion Mask Mask for just the diffused regions Top view shows patterns that make
Microstructure of Electronic Materials. Amorphous materials. Single-Crystal Material. Professor N Cheung, U.C. Berkeley
Microstructure of Electronic Materials Amorphous materials Single-Crystal Material 1 The Si Atom The Si Crystal diamond structure High-performance semiconductor devices require defect-free crystals 2 Crystallographic
Delamination of Thin Films Using Laser Induced Stress Waves
Center for Nanoscale Chemical-Electrical-Mechanical Manufacturing Systems Delamination of Thin Films Using Laser Induced Stress Waves Undergraduate Researcher Angelica Anne Vargas, Research Experience
Advanced Polymers And Resists For Nanoimprint Lithography
Q U A L I T Y A S S U R A N C E MICROSYSTEMS & NANOSYSTEMS SPECIAL REPORT Advanced Polymers And Resists For Nanoimprint Lithography Numerous polymer systems specifically designed for nanoimprint lithography
Macrophase Separation Using Block Copolymer Blends
Macrophase Separation Using Block Copolymer Blends Rachel Philiph 1,2, Kameron Oser 1, Sam Nicaise 1, and Karl Berggren 1 1 Department of Electrical Engineering and Computer Science, Massachusetts Institute
NanoSystemsEngineering: NanoNose Final Status, March 2011
1 NanoSystemsEngineering: NanoNose Final Status, March 2011 The Nanonose project is based on four research projects (VCSELs, 3D nanolithography, coatings and system integration). Below, the major achievements
Micro/Nano Technology Center University of Louisville. Dry Etch Capabilities. NNCI Etch Workshop May 24-25, 2016
Micro/Nano Technology Center University of Louisville Dry Etch Capabilities NNCI Etch Workshop May 24-25, 2016 TRION METAL ETCHER MODEL: MINILOCK-PHANTOM III ICP/RIE Trion etcher uses 7 gasses for chemistry:
Outline. Introduction to the LIGA Microfabrication Process. What is LIGA? The LIGA Process. Dr. Bruce K. Gale Fundamentals of Microfabrication
Outline Introduction to the LIGA Microfabrication Process Dr. Bruce K. Gale Fundamentals of Microfabrication What is LIGA? The LIGA Process Lithography Techniques Electroforming Mold Fabrication Analyzing
Supporting Information for: Bendable Inorganic Thin-Film Battery for Fully Flexible Electronic Systems
Supporting Information for: Bendable Inorganic Thin-Film Battery for Fully Flexible Electronic Systems By Min Koo, Kwi-Il Park, Seung Hyun Lee, Minwon Suh, Duk Young Jeon, Jang Wook Choi, Kisuk Kang, and
Soft Lithography. Jin-Goo Park. Materials and Chemical Engineering Hanyang University, Ansan. Electronic Materials and Processing Lab.
Hanyang University Soft Lithography Jin-Goo Park Materials and Chemical Engineering Hanyang University, Ansan Electronic Materials and Processing Lab. Introduction to Soft Lithography Research Micro- Electro-
Photoresist Coat, Expose and Develop Laboratory Dr. Lynn Fuller
ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING Photoresist Coat, Expose and Develop Laboratory Dr. Lynn Fuller Webpage: http://www.rit.edu/lffeee 82 Lomb Memorial Drive Rochester, NY 14623-5604
A Deep Silicon RIE Primer Bosch Etching of Deep Structures in Silicon
A Deep Silicon RIE Primer Bosch Etching of Deep Structures in Silicon April 2009 A Deep Silicon RIE Primer 1.0) Etching: Silicon does not naturally etch anisotropically in fluorine based chemistries. Si
Roll-to-Roll Nanoimprint - 6 회 -
Roll-to-Roll Nanoimprint - 6 회 - 목차 Click to add Title 1 Roll to Roll nanoimprint Introduction : Continuous Production System (Roll-to-Roll) Fabrication Processes Fabrication of nano roll mold 2 Case study
Semiconductor Manufacturing Process 10/11/2005
Semiconductor Manufacturing Process 10/11/2005 Photolithography Oxidation CVD PVD Photolithography The purpose of photolithography is to imprint the desired pattern of a micro component on a substrate,
High Barrier Multi-Layer Parylene Coating
High Barrier Multi-Layer Parylene Coating Technology overview Surface Technolgy 2018 Company Profile Swiss company founded in 1979 Experts in Parylene coating technology Parylene Equipment Export rate
Lecture 10: MultiUser MEMS Process (MUMPS)
MEMS: Fabrication Lecture 10: MultiUser MEMS Process (MUMPS) Prasanna S. Gandhi Assistant Professor, Department of Mechanical Engineering, Indian Institute of Technology, Bombay, 1 Recap Various VLSI based
applied to Biomedical Instrumentation Microfabrication and Nanofabrication Microtechnology Nanotechnology Biomedical Lecture 9 and
Lecture 9 Biomedical Microtechnology and Nanotechnology Microfabrication and Nanofabrication applied to Biomedical Instrumentation Why Micro/Nano? SCALING OF PARAMETERS The values of various parameters
UV15: For Fabrication of Polymer Optical Waveguides
CASE STUDY UV15: For Fabrication of Polymer Optical Waveguides Master Bond Inc. 154 Hobart Street, Hackensack, NJ 07601 USA Phone +1.201.343.8983 Fax +1.201.343.2132 main@masterbond.com CASE STUDY UV15:
Vertically aligned Ni magnetic nanowires fabricated by diblock-copolymer-directed Al thin film anodization
Vertically aligned Ni magnetic nanowires fabricated by diblock-copolymer-directed Al thin film anodization Researcher: Kunbae (Kevin) Noh, Graduate Student, MAE Dept. and CMRR Collaborators: Leon Chen,
EE C245 ME C218 Introduction to MEMS Design Fall 2011
Lecture Outline EE C245 ME C218 Introduction to MEMS Design Fall 2011 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720
Photolithography. Dong-Il Dan Cho. Seoul National University Nano/Micro Systems & Controls Laboratory
Lecture 9: Photolithography School of Electrical l Engineering i and Computer Science, Seoul National University Nano/Micro Systems & Controls Laboratory Email: dicho@snu.ac.kr URL: http://nml.snu.ac.kr
SUPPLEMENTARY INFORMATION
Large-area, flexible 3D optical negative index metamaterial formed by nanotransfer printing DebashisChanda 1, KazukiShigeta 1, Sidhartha Gupta 1, Tyler Cain 1, Andrew Carlson 1, Agustin Mihi 1, Alfred
Application of sprayed carbon nanotubes to light detectors
Olive Tree (St. Nicholas Church in Bari) Application of sprayed carbon nanotubes to light detectors Valentini A. (1)(2), Melisi D. (1), Valentini M. (1), Nitti M.A. (2), Biagi P.F. (2) (1) INFN Sezione
4/10/2012. Introduction to Microfabrication. Fabrication
Introduction to Microfabrication Fabrication 1 MEMS Fabrication Flow Basic Process Flow in Micromachining Nadim Maluf, An introduction to Microelectromechanical Systems Engineering 2 Thin Film Deposition
Supporting Information. graphene oxide films for detection of low. concentration biomarkers in plasma
Supporting Information Wafer-scale high-resolution patterning of reduced graphene oxide films for detection of low concentration biomarkers in plasma Jinsik Kim a, Myung-Sic Chae a, Sung Min Lee b, Dahye
Metallization deposition and etching. Material mainly taken from Campbell, UCCS
Metallization deposition and etching Material mainly taken from Campbell, UCCS Application Metallization is back-end processing Metals used are aluminum and copper Mainly involves deposition and etching,
Microelectronic Device Instructional Laboratory. Table of Contents
Introduction Process Overview Microelectronic Device Instructional Laboratory Introduction Description Flowchart MOSFET Development Process Description Process Steps Cleaning Solvent Cleaning Photo Lithography
Processing guidelines
Processing guidelines mr-uvcur21 series UV-curable Polymer for UV-based Nanoimprint Lithography Characteristics mr-uvcur21 is a liquid UV-curable polymer system with low viscosity and high curing rate
Controlled Growth, Patterning and Placement of Carbon Nanotube Thin Films
Controlled Growth, Patterning and Placement of Carbon Nanotube Thin Films V. K. Sangwan a,b * #, V. W. Ballarotto b, D. R. Hines b, M. S. Fuhrer a, and E. D. Williams a,b a Center for Nanophysics and Advanced
Surface micromachining and Process flow part 1
Surface micromachining and Process flow part 1 Identify the basic steps of a generic surface micromachining process Identify the critical requirements needed to create a MEMS using surface micromachining
TI 35ES image reversal resist
MicroChemicals TI 35ES technical data sheet revised 10/2003 p. 1 of 11 TI 35ES image reversal resist Technical Data Sheet revised 10/2003 General Information MicroChemicals GmbH Schillerstrasse 18 D-89077
MEMS Fabrication. Beyond Integrated Circuits. MEMS Basic Concepts
MEMS Fabrication Beyond Integrated Circuits MEMS Basic Concepts Uses integrated circuit fabrication techniques to make mechanical as well as electrical components on a single chip. Small size 1µm 1mm Typically
ELEC 3908, Physical Electronics, Lecture 4. Basic Integrated Circuit Processing
ELEC 3908, Physical Electronics, Lecture 4 Basic Integrated Circuit Processing Lecture Outline Details of the physical structure of devices will be very important in developing models for electrical behavior
Screen Printing of Highly Loaded Silver Inks on. Plastic Substrates Using Silicon Stencils
Supporting Information Screen Printing of Highly Loaded Silver Inks on Plastic Substrates Using Silicon Stencils Woo Jin Hyun, Sooman Lim, Bok Yeop Ahn, Jennifer A. Lewis, C. Daniel Frisbie*, and Lorraine
WP7 JRA2 JRA2 Research on High Precision Manufacturing. Investigation of optimum NIL stamp fabrication method to copy sub-10 nm BCP features
DELIVERABLE REPORT WP7 JRA2 JRA2 Research on High Precision Manufacturing D7.1 Investigation of optimum NIL stamp fabrication method to copy sub-10 nm BCP features M18 NFFA-Europe has received funding
Towards scalable fabrication of high efficiency polymer solar cells
Towards scalable fabrication of high efficiency polymer solar cells Hui Joon Park 2*, Myung-Gyu Kang 1**, Se Hyun Ahn 3, Moon Kyu Kang 1, and L. Jay Guo 1,2,3 1 Department of Electrical Engineering and
Micro Fabrication : Soft Lithography
Micro Fabrication : Soft Lithography Last Class: 1. Electrowetting on Dielectric (EWOD) 2. Setup in EWOD 3. Basic Manipulations : Mixing Splitting, Translation 4. Optoelectrowetting (OEW) Today s Contents:
Thomas M. Adams Richard A. Layton. Introductory MEMS. Fabrication and Applications. Springer
Thomas M. Adams Richard A. Layton Introductory MEMS Fabrication and Applications Springer Contents Preface xiü Part I Fabrication Chapter 1: Introduction 3 1.1 What are MEMS? 3 1.2 Why MEMS? 4 1.2.1. Low
Activities in Plasma Process Technology at SENTECH Instruments GmbH, Berlin. Dr. Frank Schmidt
Activities in Plasma Process Technology at SENTECH Instruments GmbH, Berlin Dr. Frank Schmidt The Company Company Private company, founded 1990 80 employees ISO 9001 Location Science & Technology Park,
Transfer Printing of Thermoreversible Ion Gels for Flexible Electronics
Supporting Information Transfer Printing of Thermoreversible Ion Gels for Flexible Electronics Keun Hyung Lee, Sipei Zhang, Yuanyan Gu, Timothy P. Lodge * and C. Daniel Frisbie * Department of Chemical
3. Overview of Microfabrication Techniques
3. Overview of Microfabrication Techniques The Si revolution First Transistor Bell Labs (1947) Si integrated circuits Texas Instruments (~1960) Modern ICs More? Check out: http://www.pbs.org/transistor/background1/events/miraclemo.html
Czochralski Crystal Growth
Czochralski Crystal Growth Crystal Pulling Crystal Ingots Shaping and Polishing 300 mm wafer 1 2 Advantage of larger diameter wafers Wafer area larger Chip area larger 3 4 Large-Diameter Wafer Handling
Amorphous Oxide Transistor Electrokinetic Reflective Display on Flexible Glass
Amorphous Oxide Transistor Electrokinetic Reflective Display on Flexible Glass Devin A. Mourey, Randy L. Hoffman, Sean M. Garner *, Arliena Holm, Brad Benson, Gregg Combs, James E. Abbott, Xinghua Li*,
EECS130 Integrated Circuit Devices
EECS130 Integrated Circuit Devices Professor Ali Javey 9/13/2007 Fabrication Technology Lecture 1 Silicon Device Fabrication Technology Over 10 15 transistors (or 100,000 for every person in the world)
PHYS 534 (Fall 2008) Process Integration OUTLINE. Examples of PROCESS FLOW SEQUENCES. >Surface-Micromachined Beam
PHYS 534 (Fall 2008) Process Integration Srikar Vengallatore, McGill University 1 OUTLINE Examples of PROCESS FLOW SEQUENCES >Semiconductor diode >Surface-Micromachined Beam Critical Issues in Process
Supporting Information
Supporting Information Fast-Response, Sensitivitive and Low-Powered Chemosensors by Fusing Nanostructured Porous Thin Film and IDEs-Microheater Chip Zhengfei Dai,, Lei Xu,#,, Guotao Duan *,, Tie Li *,,
Soft Lithography: MIMIC. Micro Contact Printing. Microtransfer Molding. Soft Lithography: Replica Molding. Soft Lithography.
Can We Measure Everything? Microfabrication Using Polymers Dr. Bruce K. Gale ENGR 494C and 594C Polymers for Microfabrication Examples diverse PDMS PMMA Polyurethane Polyimide Polystyrene Disadvantages
Micro-Electro-Mechanical Systems (MEMS) Fabrication. Special Process Modules for MEMS. Principle of Sensing and Actuation
Micro-Electro-Mechanical Systems (MEMS) Fabrication Fabrication Considerations Stress-Strain, Thin-film Stress, Stiction Special Process Modules for MEMS Bonding, Cavity Sealing, Deep RIE, Spatial forming
Process Integration. NMOS Generic NMOS Process Flow. CMOS - The MOSIS Process Flow
Process Integration Self-aligned Techniques LOCOS- self-aligned channel stop Self-aligned Source/Drain Lightly Doped Drain (LDD) Self-aligned silicide (SALICIDE) Self-aligned oxide gap MEMS Release Techniques
MEMS II: January 23. Lab 1: Pop-up mirror - PolyMUMPS - Thermal actuators - Mirror CoventorWare
MEMS II: January 23 Lab 1: Pop-up mirror - PolyMUMPS - Thermal actuators - Mirror CoventorWare Microelectromechanical Systems (MEMS) Multi-User MEMS Processes (MUMPS) Example Design Anchor hole 2.0 0.5
Major Fabrication Steps in MOS Process Flow
Major Fabrication Steps in MOS Process Flow UV light Mask oxygen Silicon dioxide photoresist exposed photoresist oxide Silicon substrate Oxidation (Field oxide) Photoresist Coating Mask-Wafer Alignment
Fabrication Process. Crystal Growth Doping Deposition Patterning Lithography Oxidation Ion Implementation CONCORDIA VLSI DESIGN LAB
Fabrication Process Crystal Growth Doping Deposition Patterning Lithography Oxidation Ion Implementation 1 Fabrication- CMOS Process Starting Material Preparation 1. Produce Metallurgical Grade Silicon
Chapter 3 CMOS processing technology
Chapter 3 CMOS processing technology (How to make a CMOS?) Si + impurity acceptors(p-type) donors (n-type) p-type + n-type => pn junction (I-V) 3.1.1 (Wafer) Wafer = A disk of silicon (0.25 mm - 1 mm thick),
About Cambridge NanoTech Atomic Layer Deposition (ALD) Selected Applications Manufacturing Considerations ALD Reactors Summary
About Cambridge NanoTech Atomic Layer Deposition (ALD) Selected Applications Manufacturing Considerations ALD Reactors Summary Founded in 2003 by Dr. Jill Becker Located in Cambridge, MA Grew directly
Process Integration. MEMS Release Techniques Sacrificial Layer Removal Substrate Undercut
Process Integration Self-aligned Techniques LOCOS- self-aligned channel stop Self-aligned Source/Drain Lightly Doped Drain (LDD) Self-aligned silicide (SALICIDE) Self-aligned oxide gap MEMS Release Techniques
Multiphoton lithography based 3D micro/nano printing Dr Qin Hu
Multiphoton lithography based 3D micro/nano printing Dr Qin Hu EPSRC Centre for Innovative Manufacturing in Additive Manufacturing University of Nottingham Multiphoton lithography Also known as direct
Figure 6. Rare-gas atom-beam diffraction patterns. These results were obtained by Wieland Schöllkopf and Peter Toennies at the Max-Planck Institute
Figure 6. Rare-gas atom-beam diffraction patterns. These results were obtained by Wieland Schöllkopf and Peter Toennies at the Max-Planck Institute in Göttingen, Germany, using a freestanding, 100nm-period
Manufacturing Technologies for MEMS and SMART SENSORS
4 Manufacturing Technologies for MEMS and SMART SENSORS Dr. H. K. Verma Distinguished Professor (EEE) Sharda University, Greater Noida (Formerly: Deputy Director and Professor of Instrumentation Indian
EXPLORING VACUUM CASTING TECHNIQUES FOR MICRON AND SUBMICRON FEATURES. Campus Ker Lann, av Robert Schumann Bruz, France
EXPLORING VACUUM CASTING TECHNIQUES FOR MICRON AND SUBMICRON FEATURES M. Denoual *, P. Mognol **, B. Lepioufle * * Biomis-SATIE ENS-Cachan antenne de Bretagne, Campus Ker Lann, av Robert Schumann 35170
Manufacturing Process
Digital Integrated Circuits A Design Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic Manufacturing Process July 30, 2002 1 CMOS Process 2 A Modern CMOS Process gate-oxide TiSi 2 AlCu Tungsten
Lab #2 Wafer Cleaning (RCA cleaning)
Lab #2 Wafer Cleaning (RCA cleaning) RCA Cleaning System Used: Wet Bench 1, Bay1, Nanofabrication Center Chemicals Used: H 2 O : NH 4 OH : H 2 O 2 (5 : 1 : 1) H 2 O : HF (10 : 1) H 2 O : HCl : H 2 O 2
Organic Solar Cells. Green River Project
Organic Solar Cells Green River Project Silicon Cells Silicon semiconductors Advantages: Efficiencies Lifetimes Disadvantages: High manufacturing costs Inflexible http://en.wikipedia.org Organic semiconductors
The Physical Structure (NMOS)
The Physical Structure (NMOS) Al SiO2 Field Oxide Gate oxide S n+ Polysilicon Gate Al SiO2 SiO2 D n+ L channel P Substrate Field Oxide contact Metal (S) n+ (G) L W n+ (D) Poly 1 3D Perspective 2 3 Fabrication
Regents of the University of California
Topography Issues Degradation of lithographic resolution PR step coverage, streaking Thickness differences pose problems for reduction steppers Direction of Spin PR PR PR Stringers Problematic when using
Si DRIE APPLICATION In Corial 210IL
Si DRIE APPLICATION In Corial 210IL CORIAL 210IL ICP-RIE equipment for deep Si etching applications Enlarged functionality with capability to deep etch silicon, silicon carbide, glass, sapphire, and quartz
RAFT Polymerization of an Intrinsically Stretchable Water-Soluble Block Copolymer Scaffold for PEDOT
Supporting Information for RAFT Polymerization of an Intrinsically Stretchable Water-Soluble Block Copolymer Scaffold for PEDOT Laure V. Kayser, Madeleine D. Russell, Daniel Rodriquez, Sami N. Abuhamdieh,
Semiconductor Manufacturing Technology. IC Fabrication Process Overview
Semiconductor Manufacturing Technology Michael Quirk & Julian Serda October 00 by Prentice Hall Chapter 9 IC Fabrication Process Overview /4 Objectives After studying the material in this chapter, you
Welcome MNT Conference 1 Albuquerque, NM - May 2010
Welcome MNT Conference 1 Albuquerque, NM - May 2010 Introduction to Design Outline What is MEMs Design General Considerations Application Packaging Process Flow What s available Sandia SUMMiT Overview
Silicon Epitaxial CVD Want to create very sharp PN boundary grow one type layer on other in single crystal form High dopant layers on low dopant
Silicon Epitaxial CVD Want to create very sharp PN boundary grow one type layer on other in single crystal form High dopant layers on low dopant substrate Creates latch up protection for CMOS Buried Epi
Chemical Vapor Deposition
Chemical Vapor Deposition ESS4810 Lecture Fall 2010 Introduction Chemical vapor deposition (CVD) forms thin films on the surface of a substrate by thermal decomposition and/or reaction of gas compounds
Introduction to Lithography
Introduction to Lithography G. D. Hutcheson, et al., Scientific American, 290, 76 (2004). Moore s Law Intel Co-Founder Gordon E. Moore Cramming More Components Onto Integrated Circuits Author: Gordon E.
ECE 659. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, Digital EE141 Integrated Circuits 2nd Manufacturing.
Digital Integrated Circuits A Design Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic Manufacturing Process July 0, 00 1 CMOS Process 1 A Modern CMOS Process gate-oxide TiSi AlCu Tungsten
Alternative MicroFabrication and Applications in Medicine and Biology
Alternative MicroFabrication and Applications in Medicine and Biology Massachusetts Institute of Technology 6.152 - Lecture 15 Fall 2003 These slides prepared by Dr. Hang Lu Outline of Today s Materials
Step and Flash Imprint Lithography for sub-100nm Patterning
Step and Flash Imprint Lithography for sub-100nm Patterning Matthew Colburn, Annette Grot, Marie Amistoso, Byung Jin Choi, Todd Bailey, John Ekerdt, S.V. Sreenivasan, James Hollenhorst, C. Grant Willson
Regents of the University of California
Surface-Micromachining Process Flow Photoresist Sacrificial Oxide Structural Polysilcon Deposit sacrificial PSG: Target = 2 m 1 hr. 40 min. LPCVD @450 o C Densify the PSG Anneal @950 o C for 30 min. Lithography
Fully-integrated, Bezel-less Transistor Arrays Using Reversibly Foldable Interconnects and Stretchable Origami Substrates
Electronic Supplementary Material (ESI) for Nanoscale. This journal is The Royal Society of Chemistry 2016 Fully-integrated, Bezel-less Transistor Arrays Using Reversibly Foldable Interconnects and Stretchable
Micromachining AMT 2505
Micromachining AMT 2505 Shanmuga Raja.B (BVB0912004) Module leader : Mr. Raja Hussain Introduction Micromachining are inherently connected to the evolution of Micro Electro Mechanical Systems (MEMS). Decades
NANOIMPRINTED TRANSPARENT METAL ELECTRODES AND THEIR APPLICATIONS IN ORGANIC OPTOELECTRONIC DEVICES
NANOIMPRINTED TRANSPARENT METAL ELECTRODES AND THEIR APPLICATIONS IN ORGANIC OPTOELECTRONIC DEVICES by Myung-Gyu Kang A dissertation submitted in partial fulfillment of the requirements for the degree
Dow Corning WL-5150 Photodefinable Spin-On Silicone
Dow Corning WL-515 Photodefinable Spin-On Silicone Properties and Processing Procedures Introduction Dow Corning WL-515 is a silicone formulation which can be photopatterned and cured using standard microelectronics
Examples of dry etching and plasma deposition at Glasgow University
Examples of dry etching and plasma deposition at Glasgow University Glasgow has pioneered and established many novel research activities involving the development of new dry etch processes and dry etch
Meso A/SMP Approach. Abstract
Abstract Additive/Subtractive Material Processing for Mesoscopic Parts Yih-Lin Cheng, Jurgen Stampfl, Rudolf Leitgeb, and Fritz B. Prinz Stanford University, Stanford, CA Mesoscopic additive/subtractive
Introduction to CMOS VLSI Design. Layout, Fabrication, and Elementary Logic Design
Introduction to CMOS VLSI Design Layout, Fabrication, and Elementary Logic Design CMOS Fabrication CMOS transistors are fabricated on silicon wafer Lithography process similar to printing press On each