Package Solutions and Innovations

Transcription

1 Package Solutions and Innovations with Compression Molding IEEE SVC CPMT Aug 2015 Presented by C.H. Ang Towa USA Company Profile 1

2 Corporate Overview Company: Towa Corp., Kyoto Japan Established: 1979 Employees: >1000 Average Sales ( ): US$160M/year 3 Core Business Molding Encapsulation Technology Singulation Cutting technology Compression Mold Transfer Mold 660x540mm (Outer Size) Large Panel mm MAP BGA mm MAP QFN 320x320mm Panel Mold Cut Sample LED ECU Module 100x300mm Transfer Mold LED Sample Wafer Level Mold IPM 2

3 Molding Technology Overview 5 Transfer molding with multi-plunger Y System Series Y Series 3

4 TOWA Transfer Molding Multi Plunger Mold Technology game changer became De Facto Standard Conventional Mold 1982 Improve Resin Utilization Shorten Cycle Time Uniform molding quality Easier Mold Operation Multi Plunger Mold 7 Since 2002 Compression Molding FFT, PMC System Series 4

5 Package Trends Advanced Packages Types and Trend Source : Yole Development 5

6 SOP 100X300 IPM Power Module More large LF for Automotive and Power PKG Metal Frame Automotive MEMS QFP QFN 100X300 Thick molding t5mm Full Auto Substrate FC 2.5D H/S 3D Hybrid Memory Cube SiP with Embedded PMC for QFN PMC 2nd Gen Low COO Wafer/Panel Scale PKG Fan-in WLP mm mm FOWLP Embedded 18 (UP TO 20 ) mm 2 nd Gen Large Panel Molding Auto Manual Full for Auto Saw LED Phosphor Mold LCM 3nd Gen. for Low COO LCM 2nd Gen. with Edge Gate 8 WLP Semi-auto Source: 2013 YOLE Developpement 6

7 Compression Molding Solutions, Innovations and Savings Why Compression Mold Technology Advantages: Scales up to wafer and large panel sizes Thinner and Smaller Packages Tight Tolerance requirement (+/- 7 um) Minimize mold compound cost, wastage and storage Enable finer and longer wires Minimum Packing Pressure Minimal process disruption and tool changes 7

8 Compression Mold : Chase Structure VAC MIDDLE PLATE UPPER CHASE MAIN CAVITY BLOCK VAC UPPER CHASE HOLDER O-RING VA C VA C RELEASE FILM RESIN PRODUCT VA C MOLD PRESSURE VA C LOWER CHASE HOLDER FILM CLAMPER LOWER FRAME CLAMP BLOCK MOVE LOWER BASE PLATE LOWER MAIN CAVITY BLOCK Compression Molding Comparison Compression Mold Transfer Mold Compound usage 100% Around 70% Moisture Sensitivity Level Better due to even filler distribution Filler distribution uneven Stress to Die &Wire Mold ability Negligible Stress Stress from resin flow (Thin mold cap and large substrate w/o void) Very good Scalability Limited Flexible Package Thickness Mold recipe change Tool change required Production ratio All information 95% property without of Towa Cleaning Corporation 80 % inc. Cleaning 8

9 Compound usage Transfer Molding Compression Molding Approx. 40~60% resin usage 100% resin usage Improved resin utilization and reduction of waste material and disposal cost 17 Filler Distribution Compression Mold Transfer Mold Filler rich Even Filler distribution Gate Runner Resin rich Effects of uneven filler distribution Warpage and MSL 9

10 Filler Distribution Location Dependency Warpage due to uneven filler spread 10

11 Warpage Effect on MSL Stress to Die & Wire Compression Mold Transfer Mold Gate Runner 11

12 Stress to Die & Wire Mold evaluation example of fine & long Wire MOLDING CONDITION Wire: φ15μm Wire length 5mm Cost down proposal of finer gold wire φ25μm φ15μm Approx. 64% reduction φ22μm φ15μm Approx. 54% reduction Cross-section ratio Molding Pressure Effects Transfer Molding Minimum Packing Pressure 75 kg/cm2 Compression mold minimum pressure -10 kgf/cm2 All information property 24of Towa Corporation 12

13 Moldability Scalable and Thin Cap Transfer molding Compression molding GATE side Longer flow distance Compound flow-free Value and precise performance Concept High quality Molding: Achieved PKG thickness Layout accuracy Specification ±10 μm Liquid Resin Granular Compound Uniform dispense granular compounds. Uneven resin supply Air flow Uneven resin flow Chip off-set Void No travel resin Air flow Travel Resin Filler segregation Uneven No defect Product defects 13

14 Very Large Panel/Wafer Molding Moldability (Module device) Compression Mold Transfer Mold Air trap Memory Power Manager GPS FM NFC Memory Power Manager GPS FM NFC BB/P A/P RF Power AMP Power Manager RF RF BB/P A/P RF Power AMP Power Manager RF RF Gate Runner 14

15 Void Free Molding Transfer molding Compression molding Package Thickness reduction Transfer molding Big Mold gap necessary for compounds flow Compression molding (Filler size coverage ) Minimum Mold Gap 0.1mm over Die 15

16 Mold Flow Effects of Transfer Molding Model Mold Die for MAP BGA Model Mold Die for MAP 20mm 80mm 9mm Cull Test Results (Weld Void) Grade GAP 7730L / 75 m G760 / 55 m 220 m 0/6 0/6 200 m 1/6 0/6 0.6mm 11mm 180 m 2/6 0/6 160 m 6/6 1/6 Simple Tooling Design Transfer Molding Compression Molding - Substrate thickness compensation, - Two-step clamping Not require for substrate thickness compensation 16

17 Mold Tool Flexibility PKG thickness range of 0.3mm within the same Mold PKG thickness mm Upper main cavity PKG thickness mm Upper main cavity Lower Outside cavity Spring a Lower main cavity b Lower Outside cavity Spring a Lower main cavity b 33 Reduction of CMP, back grinding process By reducing CMP, Back grinding process, Reduction of one process and equipment cost CMP, Back grinding process is required CMP/Back grind not required to achieve thin package Minimum Mold Gap over Die Transfer molding Compression molding

18 Summary TOWA s Compression Molding technology with fine molding offers - innovative solutions to advanced package demands - application versatility (IC package, LED, Solar) - scales up to large panel - cost effective ONE MORE THING TOWA USA LAB Morgan Hill, CA ~ TOWA Confidential 18

19 FFT 1030 Manual Compression Molding Strip size: 100x300mm Mold Cavity : 65 x 260 x 0.3 ~1.2 mm Pieces per shot: 1 strip / press Clamp capacity: ~ 294 kn ( ~ 30 tonf) TOWA Confidential CPM1080 Manual Wafer or Panel Molding Large Panel Molding: Panel size: 320 x 320 mm Mold cap: 300 x 300 x 0.3 ~ 1.2 mm Wafer Level Molding: Wafer size: 12 (Diameter 300mm) Mold cap: Ø 290 x 0.3~1.2 mm Pieces per shot: 1 panel or wafer Clamp capacity: 98 ~ 784 kn (10 ~ 80 tonf) 19

20 Thank you for your time and attention! Call us for your package solutions: Websites: General inquiries: Sales inquiries: Towa USA Corporation 350 Woodview Ave. Suite #200 Morgan Hill, Ca, Phone: (408) )