HETEROGENEOUS PACKAGING AND INTEGRATION FOR FUTURE SENSORS OR ELECTRONIC SYSTEMS

Transcription

1 HETEROGENEOUS PACKAGING AND INTEGRATION FOR FUTURE SENSORS OR ELECTRONIC SYSTEMS FRANK ROSCHER, FRAUNHOFER INSTITUTE FOR ELECTRONIC NANO SYSTEMS, CHEMNITZ GERMANY APAC INNOVATION SUMMIT 2017, SMART CITY. CONNECTED CITY. 7-8 SEPTEMBER 2017, HONGKONG Page 1

2 Fraunhofer-Gesellschaft, the largest organization for applied research in Europe 69 institutes and research units 24,500 staff 2.1 billion annual research budget totaling. Of this sum, more than 1.9 billion is generated through contract research Roughly two thirds of this sum is generated through contract research on behalf of industry and publicly funded research projects Roughly one third is contributed by the German federal and Länder governments in the form of base funding Fields of Res earch Production and Supply of Services Health and Env ironm ent Security and Protection Mobility and Trans portation Communication and Know ledge Energy and Res ources Page 2

3 Fraunhofer Worldwide San José East Lansing Plymouth Hamilton London Boston Storrs Newark Gothenburg Stockholm Glasgow Dublin Nijmegen Brussels Enschede Vienna Budapest Bolzano Graz Porto Cairo Lavon Jerusalem Beijing Seoul Ulsan Sendai Tokyo Osaka Bangalore Kuala Lumpur Singapore Salvador Jakarta Campinas São Paulo Santiago de Chile Pretoria Stellenbosch Auckland Subsidiary Center Project Center ICON / Strategic cooperation Representative / Marketing Office Senior Advisor Page 3

4 Facts & Figures FRAUNHOFER ENAS Page 4

5 Fraunhofer INSTITUTE FOR ELECTRONIC NANO SYSTEMS Location Fraunhofer ENAS Founded in 2008 More than 170 employees Bureaus in Paderborn Brazil Japan Shanghai Page 5

6 Fraunhofer ENAS Location Fraunhofer ENAS Founded in 2008 More than 170 employees Bureaus in Paderborn Brazil Japan Shanghai Page 6

7 Fraunhofer ENAS Location Fraunhofer ENAS Founded in 2008 More than 170 employees Bureaus in Paderborn Brazil Japan Shanghai Paderborn Bremen Berlin Hannover Potsdam Magdeburg Teltow Braunschweig Nuthetal Paderborn Oberhausen Cottbus Dortmund Halle Schmallenberg Leipzig Duisburg Schkopau Dresden Sankt Augustin Aachen Ilmenau Jena Euskirchen Chemnitz Saarbrücken Karlsruhe Darmstadt Würzburg Kaiserslautern St. Ingbert Wertheim Pfinztal Itzehoe Lübeck Stuttgart Freiburg München Erlangen Nürnberg Rostock Freising Berlin Chemnitz Efringen- Kirchen Holzkirchen Page 7

8 Fraunhofer ENAS in Chemnitz, Germany Your research partner for smart system integration and MEMS/NEMS International Offices of Fraunhofer ENAS: Since 2001/2005 Since 2012 Since 2002 Since 2007 Tokyo/Sendai, Japan Project-Center in Sendai Shanghai, China Manaus, Brazil Systems integration by using of micro and nano technologies MEMS/NEMS design Development of MEMS/NEMS MEMS/NEMS test System packaging/wafer Back-End of Line technologies for micro and nano electronics Process and equipment simulation Micro and nano reliability Printed functionalities Advanced system engineering Page 8

9 Fraunhofer ENAS Synergetic Campus D C A G I E B H F A Institute of Physics and Center for Microtechnologies B Fraunhofer ENAS G MAIN C Start-up Building H EDC Electronic Design Chemnitz GmbH D Lightweight Structures Engineering I Competence Center IT and Catering E 3D-Micromac AG F Microflex Center Chemnitz Page 9

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11 Sensor Networks where do we need them and what for? Smart cities, Industry 4.0, Smart farming, Smart home, smarter world with less consumption of (natural) resources, less pollution, more wealthy and healthy population Sensing our environment Sensing our body conditions Sensor Network Handling all generated data meaningful Tracking of humans, traffic and animals Analysing the data Sensing our production Enable the right decisions in a timescale from milliseconds to hours, months or years Page 11

12 Sensor Networks enabled by smart system integration Integration & Packaging This has been enabled by the availability (particularly in recent years) of sensors that are Smaller Cheaper and intelligent. MEMS / NEMS Electronic Components Communication Unit These sensors should be equipped with wireless interfaces to enable fully wireless sensor networks Page 12

13 Sensing in a smart world do we have relevant sensors available? High precision 1D and 2D low g accelerometers/inclinometers, wide band vibration sensors and gyroscopes,. Applications: Acceleration measurement Tilt measurement Vibration measurement Condition monitoring Platform stabilization Motion detection (IMU) Gyro compass Picture: Fraunhofer IZM Tunable Fabry Perot Interferometers, MEMS Speaker(concepts), CMUT, Implantable pressure sensors, Applications: Environmental monitoring / alarm systems Spectral gas analysis / Spectral imaging Enhance communication quality in fast changing environment using switch technologies Body condition and patient monitoring Machine Human Interaction (sound, gesture, distance, ) Frank Roscher Slide 13

14 ANALOG/MEMS/SENSORS Some TRENDSETTERS for the SMART WORLD in 2017 Multi Standard Wireless SoC Sulutions RF 2.4GHz transceiver, Bluetooth 4.2, IEEE , Zigbee Situation awareness features by asynchronous pixel sensors Low resolution but low power, high dynamic range SMART FARMING and more 10 year maintenance free sensing and wireless data transfer (temp./moisture/others) by PV energy harvesting Configurable Ics for power management Combine MOSFET, analog and digital circuitry Commercialized piezoelectric MEMS m icrophone Ultra-low noise, high dynamic range Extremely durable Ultrasonic transducers for ges ture recognition Ultra-Low power technology Page 14

15 Electronic Packaging where are we and what will come next From Wafer to Package Wafer Level Processes Wafer Level Bonding/Stacking Dicing Waferlevel and Chiplevel Packaging Methods: Through-hole, surface mount, chip carrier, pin grid, flat packages, small outline and chip scale package, (ew) ball grid arrays, embedded die in PCB, embedded die in laminate,, Materials: metals, plastic, potting, conformal coatings, glop-top, glass, ceramics, PCB, Frank Roscher Slide 15

16 Electronic Packaging where are we and what will come next Source: Yole, 2016, 3DIC and 2.5D TSV Interconnect for Advanced Packaging Frank Roscher Slide 16

17 3D Integration The ultimate 3D solution Source: Web-page Interconnect and Packaging Center, Georgia Institute of Technology Frank Roscher Slide 17

18 Page 18 NEW TECHNOLOGIES

19 3D Integration Fraunhofer ENAS) Through Substrate Vias Monolithic integration Fabrication of MEMS on ASIC wafer Stacking Depending on size of either device Chip to Wafer or Chip to Chip Contacts via TSVs or printing MEMS MEMS Electronics Electroni cs Interposer based Lateral placement of various devices Fine pitch redistribution Integrated passives possible MEMS Interposer Electronics Further Integration will enable electronic systems with higher functionality by having reduced footprint (cost reduction) Page 19

20 Nano Imprint Lithography High Troughput Nanostructures on Waferlevel Master template fabrication by E-Beam lithography Master duplication to working stamps by using polymers UV NIL for fabrication of large-area nanostructures on wafer level Advantages of the technology Parallel working method (batch processing) Nano structuring up to 6 inch round substrates Lateral dimensions: < 50 nm Higher throughput and lower costs than E-Beam Cost reduction to fabricate nanostructures will enable sensors and electronics with reduced footprint and increased functionality Page 20

21 Printed Functionalities Fraunhofer ENAS) Will functional printing influence the way modern electronic systems will be fabricated? Conductive tracks Simple WLAN patch array antenna R2R printed UHF RFID Electrodes on 3D WL Solderpaste on WL micro pump RFID Transponder Coils High performance moisture sensors Printed C2C & C2B Interconnects Complex A fusion of printing technologies and semiconductor processes will enable individualized products in near future Packaging providers will face demands for flexible and stretchable applications Flexible ultrathin battery Page 21

22 Functionalized packages by additive manufacturing Printed multilayer RDL for 3D substrates Combination of printing nanoparticle silver Insulator deposition by room temperature CVD Laser ablation to form vias between conductive layers Scalable and customizable process chain developed and tested Process temperatures < 125 C Suitable for low cost polymers Process flow is transferable to other substrates and geometries Lot size 1 could be realized / design could be changed with each product Reliability investigations show that the combination of Ag nanoparticle Ink and Parylene C enables multilayer mesh approach Functionalized 3D Substrate Page 22

23 Functionalized packages by additive manufacturing Printed multilayer RDL for 3D substrates FIB cross-sections of via area Functionalized 3D Substrate Page 23

24 Ultra Low Impact Chip 2 Chip Interconnection for hybrides Printed Interconnects as alternatives towards wire? 3D capable deposition of conductive nano particle inks to form interconnects between MEMS ELEKTRONICS - BOARD Aerosol-Jet Deposition Nanoparticle Inks for low temperature sintering Realizing short signal and power lines Minimal height impact by interconnects enable direct stacking Page 24

25 System and Die Level encapsulation Die and System level encapsulation at room temperature for more reliable systems Parylene gas phase deposition Parylene layers are extremely thin, pinhole and defect free polymer coatings with a high conformity for a variety of different applications. Properties: Chemically inert, biocompatible / biostable according to FDA and ISO , hydrophobous, excellent barrier against moisture and chemicals, dielectric, optically transparent, thermally stable, low friction coefficient Parylene encapsulated LED in salt water solution Applications: Encapsulation for electronics / PCB against harsh environment Corrosion protection Biocompatible encapsulation for medical implants Flexible substrate Electrical isolation 1 µm Parylene isolation layer in Through silicon via (TSV) Page 25

26 Waferlevel (0 Level) Packaging Chiplevel and Waferlevel General Requirements Low temperatures (< 400 C) Material compatibility Bonding without intermediates layer Permanent wafer Hybrid Bonding with intermediates layer Mechanical stability In most cases: hermetic sealing Minimized frame Direct Surface activated Anodic Metal/oxide Metal/polymer Insulating layer Glass-frit Metal layer Eutectic width Oxide free Adhesive SLID Permanent wafer? Wafer techniques are used in micro-electronics and micro-mechanics to join thin, polished wafers made of different materials together with or without additional intermediate layers. Laser TC Reactive Page 26

27 VIAMOS - Vertically Integrated Array-type Mirau-based OCT System for early diagnostics of skin cancer EU project VIAMOS VIAMOS proposes a miniature, low cost (15 k ), 3D OCT imager combining SS-source OCT detection and MOEMS technologies, providing cross-sectional 3-D tomograms. VIAMOS enables doctors to perform a painless and earlier detection of skin pathologies (i.e. cancer) MOEMS-oriented vertical interconnect technology Wafer level integration of Mirau interferometer by using multi-stack anodic Mirau Interferometer VIAMOS portable OCT system SEM image of a 5 -stack Page 27

28 Waferlevel (0 Level) Packaging Chiplevel and Waferlevel General Requirements Low temperatures (< 400 C) Material compatibility Bonding without intermediates layer Permanent wafer Hybrid Bonding with intermediates layer Mechanical stability In most cases: hermetic sealing Minimized frame Direct Surface activated Anodic Metal/oxide Metal/polymer Insulating layer Glass-frit Metal layer Eutectic width Oxide free Adhesive SLID Permanent wafer? Wafer techniques are used in micro-electronics and micro-mechanics to join thin, polished wafers made of different materials together with or without additional intermediate layers. Laser TC Reactive Page 28

29 Reactive Multilayer Systems Motivation What are irms? irms are nano scale multilayer systems irms are deposited directly onto substrate using PVD or ECD integrated thin films irms are able to generate a selfpropagating heat source internal heating, e.g. for From external towards internal heat source Page 29

30 Room temperature for highly heterogeneous materials Chiplevel and Waferlevel with potential for the Macro world Page 30

31 Room temperature for highly heterogeneous materials Tested Material Combinations and Applications Materials: Aluminum / Silicon Aluminum / Steel Aluminum / Copper Ceramic / Steel Ceramic / Copper Copper / Copper Covar / Silicon GaAs / Silicon Glass / Ceramic Glass / Glass Glass / Silicon LiTaO 3 / Silicon Polymer (PMMA, RMPD) / Si Polymer (PMMA, RMPD) / Glass Si-Foturan Glas-Al 2 O 3 ceramic From CL to 8 WLB Page 31

32 Page 32 NEW MATERIALS

33 New materials that could replace the well known ECD of Aluminum Goal: Development of an ECD process of Al including deposition equipment and evaluation of various demonstrators in the fields of automotive, industry electronics, medical and telecommunication pattern plated test structure onto FeNi seed on ceramic 600 µm via coated with Al 200 µm and 400 µm via coated with Al Deposition temperature = 50 C ECD Pulse plating process established Pattern plating possible Via filling from 800 µm to 200 µm diameter reached suitable for PCB Page 33

34 New materials that could replace the well known Nanoparticle materials Nanoparticle Inks/Pastes Post-treatment and sintering Suspensions of metal particles in solvents and binders Pretreatment for dense layer and electrical conductivity: Drying out solvents, burning out organic shells, sintering Fig 5: Nanoparticle filled Ink, Drying out solvents, burning out organic shells, sintering Sintering without pressure Particle necking due to diffusion effects Time Fig 6: 2 Particle Model [J. I. Frenkel (1945)] Experimental Setup Sintering of Ag Nanoparticles and SEM investigation at different temperature steps 60 C 100 C 200 C 250 C 250 C 300 C SEM Investigation - Sintering of Ag Nanoparticles and grain size at 60 C, 100 C, 200 C, 250 C, 300 C Page 34

35 New materials that could replace the well known Nanoparticle materials Nanoparticle materials and direct additive manufacturing enable new technology possibilities Screen printing and Aerosol-Jet printing explored as deposition methods Intermediate nanoparticle metal layers allows low temperature Waferlevel at 200 C using Ag and Au material New sensor concepts and integration possibilities for 3D integration New challenges in terms of reliability and fundamental research of nanoeffects Page 35

36 ANALOG/MEMS/SENSORS So whats new? Where is the innovation comming from? New concepts/ Build ups Innovation for Sensors and Electronics New Integratio n Technolog ies NEW MATERIAL S Page 36

37 ASTROSE - Power line monitoring system General Sensor system for condition monitoring of high voltage power lines (> 110 kv) Inclination and temperature measurement to obtain sag of conductor (to detect dangerous situations e.g. ice load, broken insulator, broken conductor) Sensor node Wireless communication Base station with integration into control station Benefits Condition monitoring of complete high voltage power line (approximately every 500 m a sensor node) Wireless communication along the sensor chain (no installation of receiver stations at the electricity towers necessary) Maintenance free operation (energy harvested from the electrostatic fringing field) Application scenario Sensor node for mounting on power line Included sensors High resolution MEMS inclination sensor (0.001 resolution), temperature sensor (0.1 C) and current sensor (10 A) Inclination and temperature data from field test Technology Readiness Level: 7 Page 37

38 Conclusion & Summary A huge variety of sensor concepts, electronics, communications units and power supplies will be needed to fulfill the sensing and tracking needs in all different use cases a smart city is demanding Security will be one of the most critical issues to solve if we connect everything New materials, packaging and integration concepts as well as energy sources like energy harvesting could finally enable wireless and autonomous sensor networks. They will give us the needed amount of data to make the right decisions Extensively R&D and collaboration between actors from research, business case developers and industrial players is needed to accelerate the vision of a smarter world Page 38

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40 A systemic approach to urban markets Morgenstadt is an Innovation Network that strives to design the future market for sustainable cities. It comprises of the main stakeholders that plan, finance, build, manage and operate cities, and it is run by the German Fraunhofer-Society. The main purpose of m:ci is to solve urban challenges by translating them into potential innovations and piloting solutions in new consortia. Page 40

41 International Conference & Exhibition on integration issues of miniaturized systems MEMS, MOEMS, ICs and electronic components 12. Conference: April 2018, Dresden, Germany Organizer: Part of the Activities of: Chair: Co-Chair: Prof. Dr. T. Otto, Fraunhofer ENAS Dr. Guenter Lugert, Siemens AG and EPoSS Page 41

42 Thank you for your kind attention Frank Ros cher Fraunhofer ENAS Department System Packaging Mail: Phone:+40 (0) Technologie-Campus Chemnitz Germany Page 42 Fraunhofer ENAS