SEMATECH Surface Preparation and Cleaning Conference 2010
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1 SEMATECH Surface Preparation and Cleaning Conference 2010 Austin, Texas, USA March 2010 ISBN:
2 Printed from e-media with permission by: Curran Associates, Inc. 57 Morehouse Lane Red Hook, NY Some format issues inherent in the e-media version may also appear in this print version. Copyright (2010) by SEMATECH All rights reserved. Printed by Curran Associates, Inc. (2011) For permission requests, please contact SEMATECH at the address below. SEMATECH 2706 Montopolis Drive Austin, Texas Phone: (512) Fax: (512) Additional copies of this publication are available from: Curran Associates, Inc. 57 Morehouse Lane Red Hook, NY USA Phone: Fax: Web:
3 SEMATECH Surface Preparation and Cleaning Conference March 2-24, 2010 Tuesday, March 23 rd KEYNOTE: Creative Collaboration: New Directions for Our Industry Daniel Armbrust (SEMATECH) INVITED: ITRS 2009 FEP Chapter: Upcoming Challenges in Transistor Scaling Jeff Butterbaugh (FSI International) INVITED: Emerging Technology: New Surface Preparation and Clean Challenges Casey Smith (SEMATECH) Dry Etch Processing of Microelectronic Devices with HF/H 2 O/Supercritical CO 2 Kwon Taek Lim (Pukyong National University) Investigation of Wet Etch of sub-nm LaOx Capping Layers for CMOS applications Mohamad Jahanbani (CNSE) Bond pad Surface Quality for Reliable Wire Bonding Martin Knotter (NXP Semiconductors) INVITED: III-V MOSFETs - Opportunities and Challenges Richard Hill (SEMATECH) INVITED: The Next Generation of Metrology: Surface-Sensitive Characterization Techniques for High Mobility Channel Materials Jimmy Price (SEMATECH) INVITED: Water Management on Semiconductor Surfaces Yannick Le Tiec (CEA-LETI) Nanoscale Particle Removal Using Wet Laser Shockwave Cleaning Tae Hoon Kim (Northeastern University) Turning enemies into friends: Controllable Collapsing Bubbles as a Novel Approach for NANO Scale Wafer Cleaning and Surface Preparation Yehiel Gotkis (KaVeNaki)
4 Control Of Sonoluminescence Signal In Di Water Using Carbon Dioxide Sangita Kumari (University of Arizona) Controlled DI Water CO 2 Gasification to Eliminate ESD Effects and Corrosion - Control of Contamination, Development in Equipments Chris Gottschalk (ASTeX GmbH) Atmospheric EHD Cleaning Chamber Yields High PRE Ken Finster (EHD Technology Group) Wednesday, March 24 th INVITED: Opportunities for Recycling and Reclaiming Fab and Assembly Test Facility Wastewaters A Benchmarking Study Michael Frisch (ISMI) Chemical Supply Cost Reduction: Gauging today s Risk in Modern Fabs Byron Palla (Texas Instruments) INVITED: Challenges on BEOL Wafer Cleaning Bob Small (Bob Small Associates) The Effects of Surface Roughness and Chemistry on SiO 2 and Low-k Film Wetting Rick Reidy (University of North Texas) ` INVITED: Cu Post-CMP Cleaners: Why Are Formulated Products Necessary and How Does One Design a Commercially Successful Cu Post-CMP Cleaner? Darryl Peters (Confluense) Additives to Reduce Small Particle Defects in Post-CMP Cleaning Paul Bernatis (EKC) Charge-Induced Attraction of Particles in Post CMP and Megasonic Clean Processes Yuji Yamada (Toshiba) Evaluation of Cleaning Procedure for the Detection of Scratches Formed on Oxide Wafer during CMP Process Jin-Goo Park (Hanyang University)
5 Cold Implanted Resist Modeling Allan Upham (IBM) All-Wet Removal of Post-Etch Photoresist and Sidewall Residues: Electrical Characterization of 90 nm and 30 nm ½ Pitch Structures Quoc Toan Le (IMEC) Thermal Wafer for WETS Optimization Allan Upham (IBM) Upham POR, Upham BKM Pushing the Piranha Chemistry to Strip Higher Dosed Photoresist Dusty Leonhard (Semitool) Post-Etch Sidewall Residues in Metal Hard Mask/Porous Low-k Single Damascene Structures: Characterization and Wet Removal Quoc Toan Le (IMEC) SEMATECH Surface Preparation and Cleaning Conference March 22-24, 2010
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