Delivering Sensor & Microelectronic Solutions Worldwide
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1 Delivering Sensor & Microelectronic Solutions Worldwide Over 500 million die shipped per year
2 Our Vision To put Semefab at the heart of today s life enhancing semiconductor and MEMS sensor products. To be your MEMS & IC foundry. >500 Million die shipped per year
3 An Impressive Record Since 1986 Semefab have an impressive track record of process development, process induction and volume foundry supporting silicon based MEMS, CMOS, ASIC, Bipolar-Linear & Discrete semiconductor device technologies Fab1 Operation 100mm CMOS IC s Bipolar transistors Swiss Watch IC's South Africa Post Office Telephone Dialler IC's CMOS ASICs for Automotive & Security Queen's Award for Export Precision Op Amp foundry JFET for PIR2000 Queen's Award International Trade JFET for PIR MEMS Pressure Fab 2 (MEMS) Operational 100mm MEMS Thermopile MEMS Gas Sensor MNT Award 6.8M DIBiCMOS Foundry Precision Analogue IC's New Fab 2 150mm MEMS Blood Viscosity Fab 3 Operational 150mm ALS for CCTV MEMS Blood Analysis 30th Anniversary USA & China Representation established >500 Million die shipped per year
4 Global Reach, >80% Exports >500 Million die shipped per year
5 Delivering Sensor & Microelectronic Solutions Worldwide Semefab operates 3 wafer fabs on a single site in Glenrothes, UK, across a broad technology base of MEMS sensors and CMOS & Linear IC's, Discrete semiconductor devices. Close liaison with our highly experienced process engineering team ensures a successful outcome to process development/induction and process optimisation leads to high yield, cost effective manufacture. For your semiconductor device or technology requiring fabrication, make Semefab your first call. >500 Million die shipped per year
6 OUR SERVICES MEMS Foundry IC Foundry Discrete Semis Semefab products
7 Extensive Process Portfolio Cantilever Structure Courtesy of: Microvisk Technologies Inc. Limited Illustration much of our foundry portfolio is customer proprietary
8 Fab 3 Fab 1 Fab 2 Probe & Test Our 3 Fabs Single Site
9 Our Strengths We operate in diverse market sectors on a global scale. Stable business - when one sector of region is down it is often compensated for in other areas. Strong track record across diverse sectors. Inc. Automotive, Security, Medical, Industrial, Energy and Consumer sectors. Global customer base. Europe, North America and Far East. Each day, Semefab silicon makes a positive contribution to people s modern lifestyle and improves their environment, security and safety. >500 Million die shipped per year
10 Semefab Overview Commercial Foundry CMOS/Bipolar Foundries 6 & 4 MEMS Foundry 6 & 4 Ship >500 million die/year Design & Development Partnerships Technology Inductions Global Fabrication Player 89% Export Bias >35 Customers Worldwide 13.1M ( $18.0M) T/0 Fcst Employees Established 1986
11 Foundry Operations Fab Operations: Diverse Process Portfolio: Fab 3: 6 MOS/Bipolar to 0.8µm MEMS Si Gate CMOS & Opto CMOS Fab 2: 6 & 4 MEMS to 0.8µm Metal Gate CMOS & PMOS DI Complementary Bipolar Fab 1: 4 MOS/Bipolar to 2.5µm DI BiCMOS Probe & Test Operation Linear Bipolar PiN Photo Diode ISO9001, ISO14001 Lateral FET Low Noise N Channel JFET UL & ESA Approval DMOS RF MOSFET Power Bipolar Fast Recovery Diode
12 Production Capacity Fab 3: 25,000 6 wafers per year capacity, potential 75,000 Fab 2: 25,000 4 /6 wafers per year capacity Fab 1: 50,000 4 wafers per year capacity Probe & Test: Test floor supports wafer test & package test Electrical parametric testing Sensor functional testing e.g. low pressure etc. Assembly: Subcontracted to Far East Final Test: In house or Far East
13 Device Applications Served ASIC & IC Foundry : Opto CMOS ASIC Optical Smoke Detector OptoCMOS ASIC + FILTER Light Sensing & Switching OptoMCMOS Hazard Flasher CMOS ASIC Smoke detector address MCMOS ASIC Garage Door Opener CMOS ASIC Automotive Windscreen Wiper CMOS ASIC Automotive Window Lift CMOS ASIC EC Motor Controller Interface. CMOS Foundry Secure Telecoms DI BICMOS Precision Op-Amps Linear Array Solar battery charger controller
14 Device Applications Served Discretes: JFET PIN DIODE LATERAL MOSFET BIPOLAR POWER FRD RFMOSFET PHOTODIODE ARRAY PIR Motion Sensors Light Sensing Audio Power Amplification Power Devices & Module Power Devices & Module RF Base Stations & PMR Precision Measurement
15 Device Applications Served MEMS Foundry: NO2 & CO detectors Pressure Sensor Pressure Sensor Pressure Sensor mbar Thermopile Liquid Viscosity Sensor Automotive Air Quality 1 Bar Automotive Engine Management Altimeter, Diving, Industrial Medical respiratory Non contact temperature sensing Blood coagulation Gas Thermal conductivity Gas flow measurement
16 Projects in Development Silicon Nanowire sensor MEMS micro hotplate Mid IR Detector array Blood analysis sensor
17 Global Business Distribution
18 Global Business by Region
19 Customer Distribution
20 Fab 3 Mos/Bipolar 150mm
21 Changing area corridor RD WB QTZCLN ems ems LP3 WB ems KS QTZDRY QTZSTR RD insp insp wip wip PE60 PE60 PE50 PE60 insp insp insp DRIE p/t lam 4520 lam 420 lam 960 p/t sts Fab 3 6 CMOS/Bipolar ab ate me nt Spares and tooling comp Implanter comp wip wip insp 1500 m 2 (15850 sq. ft.) Class 100 Photo, Class 10 Implanter c150 NikonNexiV STEPPER STEPPER Photo area insp C&D C&D coat dev Chemical pasthru Trackparts Catchcup chemical chemical Service area 3290 Mrc643 PVD & Metal load insp RD WB Service area WB WB RD RD WB WB Etch Area insp insp Service area Diffusion area TMX Console STACK C STACK B TMX Console TMX Console STACK A Source Cabinet Source Cabinet Source Cabinet Pumps Pumps Pumps Sputer parts
22 Fab3 Process Capability ASML 5500 Stepper to 0.8μm (capable to 0.5μm) Perkin Elmer Projection Alignment to 2.0μm Furnace Stack 1: Oxidation, Oxidation, LPCVD PolySi (in situ Phos dope), Phos deposition Furnace Stack 2: Oxidation, Oxidation, LPCVD Nitride (Std & Low Stress), Boron deposition Furnace Stack 3: Oxidation (SiC), Oxidation, Alloy, LPCVD BP-TEOS Mercury Automated Pre Diffusion Clean System Wet Etch BOE, Metal etch, Solvent strip, PDC SVG8800 Coat / Develop Track LAM 4420 Nitride / Poly Etch LAM 4520 Oxide Etch LAM 9600 Metal Etch Varian 3290 Al/1%Si, Al/1%Cu, TiW Sputter with pre-etch Varian 350DE Ion implanter, B, P,As
23 Probe & Test
24 Probe & Test
25 Probe & Test
26 Fab3 6 CMOS/Bipolar
27 Probe & Test
28 Probe & Test
29 Probe & Test
30 Probe & Test
31 Fab 2 MEMS 100mm & 150mm
32 Fab2 6 & 4 MEMS 800 m 2 (8450 sq. ft.) Class 100 Photo, Class 10
33 Fab 2 Process Capability ASML 2500 Stepper to 0.8µm Double side proximity alignment to 2.0µm Furnace Stack: Oxidation; LPCVD PolySi Wet Etch - PDC, HF, BOE, Al etch, Si Etch, Solvent Strip KOH wet etch Acetone & NMP Lift-off Multi-Metal Sputter Au, TiW, Al, AlSi, AlCu, Ti, Ni, NiCr, Al2O3, Constantan, SiCr, Sn Evaporation Cr, Ni,Pt, Au, Ti, Ta 6 Dry Etch: LAM Rainbow Oxide, Poly/Nitride 4 Dry Etch: LAM Autoetch 490 & 590
34 Fab 2 Process Capability PECVD Thin Films - SiO2, SiN, SiON Wafer-Wafer & Wafer-Glass Bonding - Anodic, Eutectic, Fusion SVG8800 Coat/Develop track bulk dispense SVG8800 Coat/Develop track syringe dispense Polyimide coat & bake XeF2 dry etch release of Polysilicon Deep Reactive Ion Etch (Fab1 Annexe) Resist strip dry etch, Matrix 101 Critical point drying CO2 / IPA
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36 e & Test
37 Probe & Test
38 Probe & Test
39 Probe & Test
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42 Probe & Test
43 Probe & Test
44 DRIE Test Structures
45 Probe & Test
46 Probe & Test Capability 360m 2 (2,691 sq.ft.) Probe & Test Floor Class 100 Operating Environment (Hoods) Reedholm Instruments RI20/RI40 Parametric Tester (3) Tesec 8101TT - Discrete Device Tester (3kV/20A) (1) Multitest SOIC / DIP Handler 40 C to +125 C (5) Electroglas 2001X Wafer Auto-prober (7) Wentworth 1050 Semi-Auto Prober (high-voltage) (1) Thermostream (1)
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49 Newark Road South, Eastfield Industrial Estate, Glenrothes, Fife, Scotland, UK, KY7 4NS T: F: E: W:
50 Semefab Ltd. Newark Road South, Eastfield Industrial Estate, Glenrothes, Fife, Scotland, UK, KY7 4NS T: F: E: W: DRIE Structure: 2mm x 2mm Glasgow Airport Edinburgh Airport
Welcome to. Celebrating 30 years in Semiconductor and Sensor device manufacture!
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